CN210956722U - Independently driven multi-chip LED aluminum nitride ceramic support - Google Patents
Independently driven multi-chip LED aluminum nitride ceramic support Download PDFInfo
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- CN210956722U CN210956722U CN201922498522.XU CN201922498522U CN210956722U CN 210956722 U CN210956722 U CN 210956722U CN 201922498522 U CN201922498522 U CN 201922498522U CN 210956722 U CN210956722 U CN 210956722U
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Abstract
The utility model discloses an independently driven multi-chip LED aluminum nitride ceramic bracket, which comprises an aluminum nitride substrate; the end face of the aluminum nitride substrate is provided with a positive copper column and a negative copper column; the front surface of the aluminum nitride substrate is provided with a die bonding platform and an electrode; the die bonding table is connected with the anode copper column and is provided with a light-emitting chip; the electrode is connected with the negative copper column; and the positive electrode welding leg and the negative electrode welding leg are arranged on the back surface of the aluminum nitride substrate, and a radiating fin is arranged in the middle of the aluminum nitride substrate. The device adopts the aluminium nitride ceramic substrate that coefficient of heat conductivity is great as the substrate to be equipped with the copper post and couple solid brilliant platform, pad and corresponding leg, need not to bury the hole, needn't additionally increase equipment, solved from the source because various problems and all aspects that the hole caused bury the hole and drop into. The utility model discloses with low costs, heat dispersion is good, product structure is accurate, the use is nimble, is particularly useful for the signal lamp and the large-scale outdoor screen of various use occasions.
Description
Technical Field
The utility model relates to a LED ceramic support field especially relates to a multichip LED aluminium nitride ceramic support with circuit precision is high, electric current capacity is big, heat dispersion is good, independent drive.
Background
With the continuous development of high-power electronic devices, the novel electronic ceramic material aluminum nitride ceramic is considered to be the most ideal substrate material due to the advantages of excellent heat conductivity (the highest heat conductivity coefficient can reach 320W/m.K), mechanical strength, no toxic or side effect, matching of expansion coefficient with semiconductor materials such as silicon, germanium and the like, and is gradually and widely applied to the fields of high-power LEDs, lasers, high-power transistor integrated circuits and the like.
For the aluminum nitride ceramic support with two-sided conduction, laser drilling is usually adopted, and then a buried hole is plated or a conductive polymer material is plugged, so as to form a two-sided circuit interconnection channel. Although the method can save the space of the plate surface, the size of the aperture and the process of filling the aperture directly influence the performance of the aluminum nitride ceramic bracket: (1) no matter the electroplating hole filling or the high polymer material hole filling is adopted, a special production line such as a pulse electroplating line, a grinding line or a vacuum hole filling line is required to be added, so that the investment in all aspects is increased, the process is complex and tedious, and the cost and the processing working hour of the product are greatly improved; (2) for the high polymer material hole plugging process, once the aluminum nitride ceramic circuit board is in a high-temperature environment, the high polymer material is heated to generate spalling and even charring, so that the circuit is seriously damaged, the circuit is disconnected or short-circuited, and serious potential safety hazards are generated; (3) for electroplating via filling: the size of the via hole is large, so that the process difficulty and the processing time of buried hole electroplating can be greatly improved; the small size of the via hole inevitably reduces the current load capacity of the interconnection channel, and the current overload is easy to occur, thereby causing 'board burning'.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides an independently driven multi-chip LED aluminum nitride ceramic bracket, which comprises an aluminum nitride substrate; an anode groove is formed in the end face of one end of the aluminum nitride substrate and used for mounting an anode copper column; a negative electrode groove is formed in the end face of the other end of the aluminum nitride substrate and used for mounting a negative electrode copper column;
a die bonding table is arranged on one side of the front surface of the aluminum nitride substrate, and an electrode is arranged on the other side of the front surface of the aluminum nitride substrate; the die bonding table is connected with the positive copper column; a light-emitting chip is arranged on the die bonding table; the electrode is connected with the negative copper column;
a positive electrode welding foot is arranged on one side edge of the back surface of the aluminum nitride substrate, a negative electrode welding foot is arranged on the other side edge of the back surface of the aluminum nitride substrate, and a radiating fin is arranged in the middle of the aluminum nitride substrate; the positive electrode welding foot is connected with the positive electrode copper column; the negative electrode welding leg is connected with the negative electrode copper column;
the number of the positive electrode groove, the negative electrode groove, the positive electrode copper column, the negative electrode copper column, the die bonding table, the light-emitting chip, the electrode, the positive electrode welding foot and the negative electrode welding foot is the same, and is at least 2.
As a preferable technical solution, the colors of the light emitting chips are different from each other.
As a preferable technical solution, the aluminum nitride substrate is made of aluminum nitride ceramic.
As a preferable technical scheme, the thermal conductivity of the aluminum nitride ceramic is 170-260W/(m.K).
As a preferred technical scheme, the die bonding table, the positive copper column and the positive welding leg are integrally connected.
As a preferred technical scheme, the electrode, the negative copper column and the negative welding leg are integrally connected.
As a preferable technical solution, the connection mode between the die bonding stage and the light emitting chip is soldering.
As a preferable technical solution, the light emitting chip and the electrode are connected by a gold wire.
Has the advantages that: the utility model adopts the aluminum nitride ceramic substrate with larger heat conductivity coefficient as the substrate and is provided with the copper columns to connect the die bonding platform and the bonding pad with the corresponding welding feet, so that the hole does not need to be filled and the equipment does not need to be additionally added, and various problems and various aspects of investment caused by filling and burying the hole are solved from the source; the side surface interconnection mode is adopted, the load capacity of the current is ensured, and the overload risk is effectively avoided; when the bracket is used, each chip can combine light of various colors according to different driving signals, so that the application range of the bracket is expanded. The utility model discloses with low costs, heat dispersion is good, product structure is accurate, the use is nimble, is particularly useful for the signal lamp and the large-scale outdoor screen of various use occasions.
Drawings
To further illustrate the beneficial effects of an independently driven multi-chip LED aluminum nitride ceramic mount provided in the present invention, it should be noted that the drawings provided in the present invention are only selected examples of all drawings, and are not intended as limitations of the claims, and all other corresponding diagrams obtained through the drawings provided in the present application should be considered within the scope of protection of the present application.
Fig. 1 is a schematic structural diagram of an aluminum nitride substrate according to an embodiment of the present invention.
Fig. 2 is a schematic front structural diagram of an embodiment of the present invention.
Fig. 3 is a schematic back structure diagram of an embodiment of the present invention.
Reference numerals: 10-aluminum nitride substrate, 101-first anode groove, 102-first cathode groove, 103-second anode groove, 104-second cathode groove, 105-third anode groove, 106-third cathode groove, 107-fourth anode groove, 108-fourth cathode groove, 21-first die bonding table, 22-first electrode, 23-second die bonding table, 24-second electrode, 25-third die bonding table, 26-third electrode, 27-fourth die bonding table, 28-fourth electrode, 31-first light emitting chip, 32-second light emitting chip, 33-third light emitting chip, 34-fourth light emitting chip, 41-first anode copper column, 42-first cathode copper column, 43-second anode copper column, 44-second cathode copper column, 45-third positive electrode copper column, 46-third negative electrode copper column, 47-fourth positive electrode copper column, 48-fourth negative electrode copper column, 51-first positive electrode welding foot, 52-first negative electrode welding foot, 53-second positive electrode welding foot, 54-second negative electrode welding foot, 55-third positive electrode welding foot, 56-third negative electrode welding foot, 57-fourth positive electrode welding foot, 58-fourth negative electrode welding foot and 60-radiating fin.
Detailed Description
The present invention may be further understood by reference to the following detailed description of preferred embodiments of the invention and the accompanying drawings. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. To the extent that a definition of a particular term disclosed in the prior art is inconsistent with any definitions provided herein, the definition of the term provided herein controls.
As used herein, a feature that does not define a singular or plural form is also intended to include a plural form of the feature unless the context clearly indicates otherwise. It will be further understood that the term "comprises," "comprising," and/or "includes" and/or "including," as used herein, when used in this specification, specify the presence of stated features, components, articles, or devices, but do not preclude the presence or addition of one or more other features, components, articles, or devices. Further, when describing embodiments of the present application, the use of "preferred", "more preferred", etc. refers to embodiments that may provide certain benefits under certain circumstances. However, other embodiments may be preferred, under the same or other circumstances. In addition, the recitation of one or more preferred embodiments does not imply that other embodiments are not useful, nor is it intended to exclude other embodiments from the scope of the invention.
The meaning of "and/or" in the present invention means that they exist individually or both at the same time.
The meaning of "inside and outside" in the present invention means that the direction of the inside of the pointing device is inside and vice versa for the device itself, rather than being specifically limited to the mechanism of the device of the present invention.
The utility model discloses in the meaning of "left and right" indicate that the reader is just when the drawing, the left side of reader is left promptly, and the right of reader is right promptly, and is not right the utility model discloses a specific limited of device mechanism.
The term "connected" as used herein may mean either a direct connection between elements or an indirect connection between elements through other elements.
In order to solve the problems, the utility model provides an independently driven multi-chip LED aluminum nitride ceramic bracket, which comprises an aluminum nitride substrate; an anode groove is formed in the end face of one end of the aluminum nitride substrate and used for mounting an anode copper column; a negative electrode groove is formed in the end face of the other end of the aluminum nitride substrate and used for mounting a negative electrode copper column;
a die bonding table is arranged on one side of the front surface of the aluminum nitride substrate, and an electrode is arranged on the other side of the front surface of the aluminum nitride substrate; the die bonding table is connected with the positive copper column; a light-emitting chip is arranged on the die bonding table; the electrode is connected with the negative copper column;
a positive electrode welding foot is arranged on one side edge of the back surface of the aluminum nitride substrate, a negative electrode welding foot is arranged on the other side edge of the back surface of the aluminum nitride substrate, and a radiating fin is arranged in the middle of the aluminum nitride substrate; the positive electrode welding foot is connected with the positive electrode copper column; the negative electrode welding leg is connected with the negative electrode copper column;
the number of the positive electrode groove, the negative electrode groove, the positive electrode copper column, the negative electrode copper column, the die bonding table, the light-emitting chip, the electrode, the positive electrode welding foot and the negative electrode welding foot is the same, and is at least 2.
In some preferred embodiments, the number of the positive electrode groove, the negative electrode groove, the positive electrode copper column, the negative electrode copper column, the die bonding table, the light emitting chip, the electrode, the positive electrode fillet and the negative electrode fillet is 4.
In some preferred embodiments, the light emitting chips are different in color from each other.
In some preferred embodiments, the aluminum nitride substrate is made of aluminum nitride ceramic.
In some preferred embodiments, the thermal conductivity of the aluminum nitride ceramic is 170 to 260W/(m.K).
In some preferred embodiments, the die bonding stage, the positive copper pillar and the positive solder leg are integrally connected.
In some preferred embodiments, the electrode, the negative copper pillar and the negative solder leg are integrally connected.
In some preferred embodiments, the connection mode between the die bonding table and the light emitting chip is soldering.
In some preferred embodiments, the light emitting chip and the electrode are connected by gold wires.
The utility model adopts the aluminum nitride ceramic substrate with larger heat conductivity coefficient as the substrate, and the substrate is provided with the groove, the copper column is arranged in the groove, the die bonding platform and the electrode are connected with the corresponding welding leg, thus avoiding the operations of drilling, filling holes and the like in the prior art; the side surface interconnection mode is adopted, the load capacity of the current is ensured, and the overload risk is effectively avoided; when the bracket is used, each chip can combine light of various colors according to different driving signals, so that the application range of the bracket is expanded; the design of the large-area radiating fins ensures the normal work of multiple chips, and the service life of the device is prolonged. The utility model discloses with low costs, heat dispersion is good, product structure is accurate, the use is nimble, is particularly useful for the signal lamp and the large-scale outdoor screen of various use occasions.
Examples
The technical solution of the present invention is described in detail below with reference to the embodiments and the accompanying drawings, but the scope of the present invention is not limited to the embodiments and the accompanying drawings.
The embodiment provides an independently driven multi-chip LED aluminum nitride ceramic support, as shown in fig. 1, including an aluminum nitride substrate 10; a first positive electrode groove 101, a second positive electrode groove 103, a third positive electrode groove 105 and a fourth positive electrode groove 107 are arranged on the end face of one end of the aluminum nitride substrate 10, and a first negative electrode groove 102, a second negative electrode groove 104, a third negative electrode groove 106 and a fourth negative electrode groove 108 are arranged on the end face of the other end.
A first anode copper column 41, a second anode copper column 43, a third anode copper column 45 and a fourth anode copper column 47 are respectively arranged in the first anode groove 101, the second anode groove 103, the third anode groove 105 and the fourth anode groove 107;
the first negative electrode groove 102, the second negative electrode groove 104, the third negative electrode groove 106 and the fourth negative electrode groove 108 are respectively provided with a first negative electrode copper column 42, a second negative electrode copper column 44, a third negative electrode copper column 46 and a fourth negative electrode copper column 48.
The aluminum nitride substrate is made of aluminum nitride ceramics; the thermal conductivity of the aluminum nitride ceramic is 180W/(m.K).
As shown in fig. 2, a first die bonding stage 21, a second die bonding stage 23, a third die bonding stage 25 and a fourth die bonding stage 27 are disposed on one side of the front surface of the aluminum nitride substrate 10, and a first electrode 22, a second electrode 24, a third electrode 26 and a fourth electrode 28 are disposed on the other side;
the first die bonding table 21, the second die bonding table 23, the third die bonding table 25 and the fourth die bonding table 27 are respectively connected with a first positive copper column 41, a second positive copper column 43, a third positive copper column 45 and a fourth positive copper column 47 on one end face of the aluminum nitride substrate 10 (not shown);
a first light-emitting chip 31 is arranged on the first die bonding table 21; a second light-emitting chip 32 is arranged on the second die bonding table 23; a third light-emitting chip 33 is arranged on the third die bonding table 25; a fourth light-emitting chip 34 is arranged on the fourth die bonding table 27;
the first light-emitting chip 31, the second light-emitting chip 32, the third light-emitting chip 33 and the fourth light-emitting chip 34 are respectively connected with the first electrode 22, the second electrode 24, the third electrode 26 and the fourth electrode 28 through gold wires;
the first electrode 22, the second electrode 24, the third electrode 26, and the fourth electrode 28 are respectively connected to a first negative copper pillar 42, a second negative copper pillar 44, a third negative copper pillar 46, and a fourth negative copper pillar 48 on the other end face of the aluminum nitride substrate 10.
As shown in fig. 3, the first positive copper pillar 41, the second positive copper pillar 43, the third positive copper pillar 45, and the fourth positive copper pillar 47 are respectively connected to a first positive electrode fillet 51, a second positive electrode fillet 53, a third positive electrode fillet 55, and a fourth positive electrode fillet 57 on one side edge of the back surface of the aluminum nitride substrate 10;
the first negative copper pillar 42, the second negative copper pillar 44, the third negative copper pillar 46 and the fourth negative copper pillar 48 are respectively connected with a first negative electrode solder foot 52, a second negative electrode solder foot 54, a third negative electrode solder foot 56 and a fourth negative electrode solder foot 58 (not shown) on the other side edge of the back of the aluminum nitride substrate 10;
the aluminum nitride substrate 10 is provided with a heat sink 60 at a middle position on the back surface thereof.
In this embodiment, the die bonding stage and the light emitting chip are connected by soldering, and the other components are connected integrally.
The above embodiments are preferred embodiments of the present invention, and various changes and modifications may be made without departing from the spirit and scope of the invention, and these changes and modifications are intended to fall within the scope of the claimed invention.
Claims (8)
1. An independently driven multi-chip LED aluminum nitride ceramic bracket is characterized by comprising an aluminum nitride substrate; an anode groove is formed in the end face of one end of the aluminum nitride substrate and used for mounting an anode copper column; a negative electrode groove is formed in the end face of the other end of the aluminum nitride substrate and used for mounting a negative electrode copper column;
a die bonding table is arranged on one side of the front surface of the aluminum nitride substrate, and an electrode is arranged on the other side of the front surface of the aluminum nitride substrate; the die bonding table is connected with the positive copper column; a light-emitting chip is arranged on the die bonding table; the electrode is connected with the negative copper column;
a positive electrode welding foot is arranged on one side edge of the back surface of the aluminum nitride substrate, a negative electrode welding foot is arranged on the other side edge of the back surface of the aluminum nitride substrate, and a radiating fin is arranged in the middle of the aluminum nitride substrate; the positive electrode welding foot is connected with the positive electrode copper column; the negative electrode welding leg is connected with the negative electrode copper column;
the number of the positive electrode groove, the negative electrode groove, the positive electrode copper column, the negative electrode copper column, the die bonding table, the light-emitting chip, the electrode, the positive electrode welding foot and the negative electrode welding foot is the same, and is at least 2.
2. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the light emitting chips are different colors from each other.
3. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the aluminum nitride substrate is made of aluminum nitride ceramic.
4. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 3, wherein the aluminum nitride ceramic has a thermal conductivity of 170-260W/(m-K).
5. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the die attach stage, the positive copper pillar, and the positive solder fillet are integrally connected.
6. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the electrodes, negative copper posts, and negative fillets are integrally connected.
7. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the die attach stage is attached to the light emitting chip by soldering.
8. The independently driven multi-chip LED aluminum nitride ceramic mount of claim 1, wherein the light emitting chips and the electrodes are connected by gold wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922498522.XU CN210956722U (en) | 2019-12-31 | 2019-12-31 | Independently driven multi-chip LED aluminum nitride ceramic support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922498522.XU CN210956722U (en) | 2019-12-31 | 2019-12-31 | Independently driven multi-chip LED aluminum nitride ceramic support |
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| Publication Number | Publication Date |
|---|---|
| CN210956722U true CN210956722U (en) | 2020-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922498522.XU Active CN210956722U (en) | 2019-12-31 | 2019-12-31 | Independently driven multi-chip LED aluminum nitride ceramic support |
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| Country | Link |
|---|---|
| CN (1) | CN210956722U (en) |
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- 2019-12-31 CN CN201922498522.XU patent/CN210956722U/en active Active
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