CN210956611U - High-speed optical chip substrate with lens - Google Patents
High-speed optical chip substrate with lens Download PDFInfo
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- CN210956611U CN210956611U CN201922164041.5U CN201922164041U CN210956611U CN 210956611 U CN210956611 U CN 210956611U CN 201922164041 U CN201922164041 U CN 201922164041U CN 210956611 U CN210956611 U CN 210956611U
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- lens
- chip
- lens array
- frame
- metal substrate
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Abstract
The utility model provides a take high-speed optical chip base plate of lens, including lens array, metal substrate frame, the metal substrate frame includes lens shaping frame, lens array compression molding in the lens shaping frame. The utility model discloses a lens array adopts the mould pressing method one shot forming in lens one-shot forming frame, replaces traditional lens to aim at the complicated technology that the chip pasted, and assembly process is simpler, has promoted assembly efficiency, has still guaranteed the relative position precision of lens and metal substrate frame simultaneously.
Description
Technical Field
The utility model relates to an optical chip base plate technical field especially relates to a take high-speed optical chip base plate of lens.
Background
With the continuous improvement of the communication rate and resource utilization requirements of the optical communication system, the optical module based on the parallel transmission and wavelength division multiplexing technology is greatly developed. In the prior art, a mode of gluing a lens on a chip substrate is adopted to realize alignment of the lens and a chip, so that the process is complicated and the efficiency is low.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a take high-speed optical chip base plate of lens to solve the loaded down with trivial details and lower problem of efficiency of the technology of gluing lens on traditional chip base plate.
The technical scheme of the utility model is realized like this: the utility model provides a take high-speed optical chip base plate of lens, including lens array, metal substrate frame, the metal substrate frame includes lens shaping frame, lens array compression molding in the lens shaping frame.
Optionally, the metal substrate frame further includes a chip mounting platform, a chip is mounted on the surface of the chip mounting platform, a first groove is formed in a position, corresponding to the light-emitting center of the chip, on the chip mounting platform, and the extending direction of the first groove is parallel to the optical axis of the lens array.
Optionally, the lens forming frame and the chip mounting platform are integrally formed.
Optionally, a protrusion is arranged on the inner wall of the lens forming frame, a second groove is arranged at a position, corresponding to the protrusion, on the lens array, and the protrusion is matched with the second groove.
Optionally, the protrusion is an annular protrusion which surrounds a circle along the inner wall of the lens forming frame.
Optionally, the lens array is made of low-melting-point mold glass.
Optionally, the coefficient of thermal expansion of the metal substrate frame is greater than the coefficient of thermal expansion of the lens array by less than 1.5 × 10E-6.
The utility model discloses a take high-speed optical chip base plate of lens has following beneficial effect for prior art:
(1) the lens array of the utility model is formed in the lens forming frame by one-step molding method, replaces the traditional complex process of pasting the lens alignment chip, has simpler assembly process, improves the assembly efficiency, and simultaneously ensures the relative position precision of the lens and the metal substrate frame;
(2) the first groove of the utility model can be used as a mark line structure to help the image of the automatic chip mounter to align to the light-emitting area of the chip when the chip is mounted, thereby realizing the precise alignment of the light-emitting position of the chip and the optical axis of the lens array;
(3) the utility model discloses when the subassembly experiences high low temperature environment, lens array when the trend that forms the displacement, the arch can form very big hindrance to lens array's displacement trend to lens array deviates from lens shaping frame when can avoiding experiencing high low temperature to change, has improved the stability of subassembly structure under the prerequisite of guaranteeing the gas tightness.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a high-speed optical chip substrate with lens according to the present invention;
FIG. 2 is a schematic structural view of a metal substrate holder according to the present invention;
fig. 3 is a schematic structural diagram of the lens array according to the present invention.
Description of reference numerals:
10-a lens array; 101-a second groove; 20-a metal substrate holder; 201-lens forming frame; 2011-bumps; 202-chip mounting platform; 2021-a first groove; 30-chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work all belong to the protection scope of the present invention.
As shown in fig. 1, in combination with fig. 2, the high-speed optical chip substrate with lens of the present invention includes a lens array 10 and a metal substrate frame 20, the metal substrate frame 20 includes a lens forming frame 201, and the lens array 10 is molded in the lens forming frame 201.
The metal substrate frame 20 further comprises a chip mounting platform 202, a plurality of chips 30 are mounted on the surface of the chip mounting platform 202 in parallel at equal intervals, the metal substrate frame 20 is of an L-shaped structure, the lens array 10, the lens forming frame 201 and the chip mounting platform 202 are all of cuboid structures, and one end of the lens forming frame 201 in the length direction is integrally formed with one end of the chip mounting platform 202 in the length direction, so that the metal substrate frame is convenient to process and stable in structure. The lens forming frame 201 and the chip mounting platform 202 are perpendicular to each other, the chip mounting platform 202 is mounted with a plurality of chips 30 in parallel at equal intervals relative to the inner surface of the L-shaped structure, the extending direction of the lens array 10 is along the thickness direction of the lens forming frame 201, the thickness direction of the lens forming frame 201 is also the width direction of the chip mounting platform 202, and the optical axis of the chip 30 is parallel to the optical axis of the lens array 10.
In the traditional high-speed optical chip base plate with the lens, a single lens is sequentially pasted on the high-speed optical chip base plate in an adhesive mode, and the alignment of the lens and the chip 30 is realized due to the need, namely, the optical axis of the lens is parallel to the optical axis of the chip 30, so that the position of the lens is repeatedly adjusted in the adhesive process, and the process for aligning and pasting the lens is complicated and the assembly efficiency is low.
In this embodiment, the metal substrate frame 20 includes the lens forming frame 201, and the lens array 10 is formed in the lens forming frame 201 by one step using a mold pressing method, so as to replace the conventional complex process of pasting a single lens to a chip, so that the assembly process is simpler, the assembly efficiency is improved, and the relative position accuracy of the lens and the metal substrate frame is also ensured.
Optionally, as shown in fig. 1, a first groove 2021 is formed on the chip mounting platform 202 at a position corresponding to the light emitting center of the chip 30, and an extending direction of the first groove 2021 is parallel to the optical axis of the lens array 10.
Since the plurality of chips 30 are mounted on the inner surface of the chip mounting platform 202 in parallel and at equal intervals, the plurality of first grooves 2021 are also disposed on the chip mounting platform 202 in parallel and at equal intervals, and the plurality of first grooves 2021 correspond to the plurality of chips 30 one to one. In this embodiment, the extending direction of the first groove 2021 is parallel to the optical axis of the lens array 10, and the first groove 2021 can be used as a mark line structure to help the image of the automatic chip mounter to align to the light emitting region of the chip 30 when the chip 30 is mounted, so as to achieve precise alignment between the light emitting position of the chip 30 and the optical axis of the lens array 10.
Optionally, as shown in fig. 2, a protrusion 2011 is disposed on an inner wall of the lens forming frame 201, as shown in fig. 3, a second groove 101 is disposed at a position corresponding to the protrusion 2011 on the lens array 10, and the protrusion 2011 is adapted to the second groove 101.
Specifically, the protrusion 2011 is an annular protrusion that surrounds a circle along the inner wall of the lens forming frame 201, and the second groove 101 that is matched with the annular protrusion also surrounds the lens array 10 for a circle. The plane of the annular protrusion is perpendicular to the extending direction of the lens array 10, i.e. perpendicular to the thickness direction of the lens forming frame 201, and the protrusion 2011 is integrally formed with the body of the lens forming frame 201, so that the lens forming frame is convenient to form and has a stable structure.
When the high-speed optical chip substrate with the lens experiences high and low temperature environments, due to thermal expansion and cold contraction, the lens forming frame 201 and the lens array 10 expand or contract simultaneously, if the forming surfaces of the lens forming frame 201 and the lens array 10 are both flat surfaces, the resistance between the two is insufficient, and the lens array 10 is easy to be separated from the lens forming frame 201, namely, separated along the front-back direction shown in fig. 1. In this embodiment, be equipped with arch 2011 on the lens shaping frame 201 inner wall, be equipped with second recess 101 on the lens array 10, arch 2011 agrees with second recess 101 each other, the gas tightness of subassembly has firstly been ensured, secondly arch 2011 forms a similar gear engagement's cooperation relation with second recess 101, when the subassembly experiences high low temperature environment, lens array 10 is when forming the trend of displacement, arch 2011 can form very big hindrance to the displacement trend of lens array 10, thereby lens array 10 deviates from lens shaping frame 201 when can avoiding experiencing high low temperature change, the stability of subassembly structure has been improved under the prerequisite of guaranteeing the gas tightness. When the protrusion 2011 is an annular protrusion, the blocking effect on the displacement trend of the lens array 10 is large, the effect of preventing the lens array 10 from being separated is better, and the air tightness is stronger.
Optionally, the lens array 10 is made of low melting point molded glass. The low-melting-point mould pressing glass has low processing temperature and is convenient for mass replication.
Optionally, the coefficient of thermal expansion of the metal substrate frame 20 is greater than that of the lens array 10 and the difference between the coefficients of thermal expansion is less than 1.5 × 10E-6.
As described above, the lens array 10 and the metal substrate holder 20 expand or contract simultaneously when subjected to a high-temperature and low-temperature environment, and it is easy to think that the lens array 10 still has a risk of coming off if the metal substrate holder 20 expands more than the lens array 10 or the metal substrate holder 20 contracts less than the lens array 10. In this embodiment, it is verified that when the thermal expansion coefficient of the metal substrate frame 20 is greater than that of the lens array 10 and the difference between the thermal expansion coefficients is less than 1.5 × 10E-6, the pull-out resistance of the lens array 10 can be increased, and the stability of the assembly can be further improved.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. The high-speed optical chip substrate with the lens comprises a lens array (10) and a metal substrate frame (20), and is characterized in that the metal substrate frame (20) comprises a lens forming frame (201), and the lens array (10) is formed in the lens forming frame (201) in a compression molding mode.
2. The high-speed optical chip substrate with lens according to claim 1, wherein the metal substrate frame (20) further comprises a chip mounting platform (202), a chip (30) is mounted on the surface of the chip mounting platform (202), a first groove (2021) is formed on the chip mounting platform (202) at a position corresponding to the light emitting center of the chip (30), and the extending direction of the first groove (2021) is parallel to the optical axis of the lens array (10).
3. The lensed high-speed photonic chip substrate of claim 2, wherein the lens forming frame (201) is integrally formed with the chip mounting platform (202).
4. The high-speed optical chip substrate with lens according to claim 1, wherein a protrusion (2011) is disposed on an inner wall of the lens forming frame (201), a second groove (101) is disposed on the lens array (10) at a position corresponding to the protrusion (2011), and the protrusion (2011) is adapted to the second groove (101).
5. The lensed high speed photonic chip substrate of claim 4, wherein the protrusion (2011) is an annular protrusion that circles around the inner wall of the lens forming frame (201).
6. The lensed high-speed optical chip substrate of claim 1, wherein the lens array (10) is formed of low-melting-point molded glass.
7. The lensed high speed photonic chip substrate of claim 1, wherein the coefficient of thermal expansion of the metal substrate holder (20) is greater than the coefficient of thermal expansion of the lens array (10) by less than 1.5 x 10E "6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922164041.5U CN210956611U (en) | 2019-12-06 | 2019-12-06 | High-speed optical chip substrate with lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922164041.5U CN210956611U (en) | 2019-12-06 | 2019-12-06 | High-speed optical chip substrate with lens |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210956611U true CN210956611U (en) | 2020-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922164041.5U Active CN210956611U (en) | 2019-12-06 | 2019-12-06 | High-speed optical chip substrate with lens |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210956611U (en) |
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2019
- 2019-12-06 CN CN201922164041.5U patent/CN210956611U/en active Active
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