CN210928436U - Communication equipment heat abstractor with high-efficient heat dissipation function - Google Patents
Communication equipment heat abstractor with high-efficient heat dissipation function Download PDFInfo
- Publication number
- CN210928436U CN210928436U CN201921850208.7U CN201921850208U CN210928436U CN 210928436 U CN210928436 U CN 210928436U CN 201921850208 U CN201921850208 U CN 201921850208U CN 210928436 U CN210928436 U CN 210928436U
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- China
- Prior art keywords
- heat
- communication equipment
- copper plate
- fan
- heat dissipation
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- Expired - Fee Related
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 238000004891 communication Methods 0.000 title claims abstract description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000000428 dust Substances 0.000 claims abstract description 17
- 238000013016 damping Methods 0.000 claims description 17
- 238000009434 installation Methods 0.000 claims description 7
- 238000001914 filtration Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 239000007788 liquid Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a communication equipment heat abstractor with high-efficient heat dissipation function relates to communication equipment accessory technical field, for solving the relatively poor problem of current radiating effect. The utility model discloses a heat dissipation device, including chip circuit board, heat exchanger, heat transfer pipe, fan, heat dissipation window, dust filter screen, copper plate, water pump, heat exchanger, fan, heat exchanger, heat dissipation window, dust filter screen, fan, heat exchanger, fan, heat dissipation window, heat exchanger, fan, heat exchanger, fan, heat exchanger.
Description
Technical Field
The utility model relates to a communication equipment accessory technical field specifically is a communication equipment heat abstractor with high-efficient heat dissipation function.
Background
In the use of communication equipment, can turn into heat energy with some electric energy, and then make communication equipment temperature rise, if do not carry out the heat dissipation treatment, arouse internal fault easily, through using heat abstractor, to carrying out supplementary heat dissipation to communication equipment that can be fine, and then with internal temperature control at reasonable limit.
However, the heat dissipation efficiency of the existing heat dissipation device for communication equipment is low, and when the communication equipment works at high efficiency, the heat dissipation device for communication equipment cannot effectively dissipate heat and cool the communication equipment, so that the existing requirements are not met, and the heat dissipation device for communication equipment with the high-efficiency heat dissipation function is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a communication equipment heat abstractor with high-efficient heat dissipation function to solve the relatively poor problem of radiating effect who proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a communication equipment heat dissipation device with a high-efficiency heat dissipation function comprises a chip circuit board, wherein a shell is arranged below the chip circuit board, a plurality of damping springs are arranged above the shell, mounting blocks are arranged at the upper ends of the damping springs, a copper plate is arranged inside the shell and is attached to the chip circuit board, a water pump is arranged at one side below the copper plate, a water outlet is formed in one end of the water pump, a heat exchanger is arranged at the other side below the copper plate, a water inlet is formed in one end of the heat exchanger, a coiled pipe is arranged between the water outlet and the water inlet, heat conduction fins are arranged between the coiled pipes and are provided with a plurality of heat conduction fins, a support column is arranged at the middle position below the copper plate, and a driving motor is arranged at the upper end inside the support column, the fan is installed to driving motor's output shaft, the lower extreme of casing is provided with the heat dissipation window, and the heat dissipation window is provided with a plurality of, the inside of heat dissipation window all is installed and is strained the dirt net.
Preferably, a connecting pipe is arranged between the water pump and the heat exchanger and is in sealing connection with the water pump and the heat exchanger, and the coiled pipe is attached to the lower end face of the copper plate.
Preferably, the heat conduction fins are fixedly connected with the copper plate and are attached to the coiled pipe.
Preferably, the support column is fixedly connected with the copper plate, and an output shaft of the driving motor is fixedly connected with the fan.
Preferably, the mounting block is connected with the chip circuit board through a fixing bolt, the fixing bolt is in threaded connection with the mounting block, and the damping spring is fixedly connected with the mounting block and the shell.
Preferably, the dust filter screen is connected with the heat dissipation window through a clamping groove.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model can improve the heat conduction efficiency by attaching the copper plate below the chip circuit board, the copper plate is attached to the chip circuit board in a large area, the water cooling mechanism is arranged below the copper plate and consists of a water pump, a coiled pipe and a heat exchanger, when in use, the liquid in the coiled pipe starts to flow by opening the water pump, and the upper end of the coiled pipe is contacted with the copper plate, so that heat exchange can be generated between the copper plate and the copper plate, the heat of the copper plate is taken away through the liquid and then dissipated, the liquid containing heat enters the heat exchanger through the water inlet and is cooled after entering, so that the proper temperature can be conveniently kept in the subsequent circulation, the heat conduction fin can further conduct the heat absorbed by the copper plate by arranging the heat conduction fin between the coiled pipes, the heat conduction efficiency is accelerated, and simultaneously, because the coiled pipe is contacted with the heat conduction fin, and then can transmit the heat on the heat conduction fin, further improve the radiating effect, through installing the fan in the intermediate position department of copper, through starting driving motor, it is rotatory to drive the fan, discharges the inside heat of casing, under the cooperation of water-cooling mechanism, heat conduction fin and fan, has accelerated heat-conducting efficiency, has improved the radiating effect, satisfies the demand to inside radiating in the efficient work of communication equipment.
2. The utility model discloses an install damping spring between installation piece and casing, during the installation, use fixing bolt to pass chip circuit board and installation piece fixed connection, and then accomplish the installation between heat abstractor and the chip circuit board, because in the use, the high-speed rotation of fan can produce certain vibrations, and damping spring's setting can cushion the vibrations that produce by the fan is rotatory, and then the chip circuit board of protection has improved holistic practicality.
3. The utility model discloses a bottom at the casing is provided with the heat dissipation window, is provided with the dust filter through the inside at the heat dissipation window, can prevent the entering of dust in the use, guarantees that heat abstractor keeps clean at the in-process of work, avoids the too much trouble that arouses of dust, brings unnecessary trouble.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is an overall plan view of the present invention;
fig. 3 is a schematic view of the fan structure of the present invention.
In the figure: 1. a housing; 2. a damping spring; 3. mounting blocks; 4. fixing the bolt; 5. a chip circuit board; 6. a water pump; 7. a water outlet; 8. a serpentine tube; 9. a water inlet; 10. a heat exchanger; 11. a heat conductive fin; 12. a fan; 13. a heat dissipation window; 14. a dust filter screen; 15. a copper plate; 16. a connecting pipe; 17. a support pillar; 18. the motor is driven.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.
Referring to fig. 1-3, the present invention provides an embodiment: a communication equipment heat dissipation device with high-efficiency heat dissipation function comprises a chip circuit board 5, a shell 1 is arranged below the chip circuit board 5, a plurality of damping springs 2 are arranged above the shell 1, mounting blocks 3 are arranged at the upper ends of the damping springs 2, a copper plate 15 is arranged inside the shell 1, the copper plate 15 is attached to the chip circuit board 5, a water pump 6 is arranged at one side below the copper plate 15, a water outlet 7 is arranged at one end of the water pump 6, a heat exchanger 10 is arranged at the other side below the copper plate 15, a water inlet 9 is arranged at one end of the heat exchanger 10, a coiled pipe 8 is arranged between the water outlet 7 and the water inlet 9, heat conduction fins 11 are arranged between the coiled pipes 8, a plurality of heat conduction fins 11 are arranged, a support column 17 is arranged at the middle position below the copper plate 15, and a driving motor 18, fan 12 is installed to driving motor 18's output shaft, and the lower extreme of casing 1 is provided with heat dissipation window 13, and heat dissipation window 13 is provided with a plurality of, and dust filter 14 is all installed to heat dissipation window 13's inside, under the cooperation of water cooling mechanism, heat conduction fin 11 and fan 12 for heat-conducting efficiency has improved the radiating effect, satisfies the demand to inside radiating in the efficient work of communication equipment.
Further, be provided with connecting pipe 16 between water pump 6 and the heat exchanger 10, and connecting pipe 16 and water pump 6 and heat exchanger 10 sealing connection, the lower terminal surface of coiled pipe 8 and copper 15 is laminated mutually, because the upper end of coiled pipe 8 contacts with copper 15, and then can produce heat exchange before 15 with the copper, takes away the heat of copper 15 through liquid, and then dispels the heat to it.
Further, heat conduction fin 11 and copper 15 fixed connection, heat conduction fin 11 and 8 laminating of coiled pipes mutually, heat conduction fin 11 can further conduct the heat that copper 15 absorbed for heat-conducting efficiency.
Further, the supporting columns 17 are fixedly connected with the copper plate 15, an output shaft of the driving motor 18 is fixedly connected with the fan 12, and the driving motor 18 is started to drive the fan 12 to rotate so as to discharge heat in the shell 1.
Further, the mounting block 3 is connected with the chip circuit board 5 through the fixing bolt 4, the fixing bolt 4 is connected with the mounting block 3 through threads, the damping spring 2 is fixedly connected with the mounting block 3 and the shell 1, and the damping spring 2 can buffer the vibration generated by the rotation of the fan 12, so that the chip circuit board 5 is protected.
Furthermore, the dust filter 14 is connected with the heat dissipation window 13 through a clamping groove, and the dust filter 14 can prevent dust from entering in the use process, so that the heat dissipation device is kept clean in the working process, and the fault caused by excessive dust is avoided.
The working principle is as follows: when the heat dissipation device is installed, the fixing bolt 4 penetrates through the chip circuit board 5 to be fixedly connected with the installation block 3, and then the installation between the heat dissipation device and the chip circuit board 5 is completed, the copper plate 15 is attached to the lower portion of the chip circuit board 5, the copper plate 15 is attached to the chip circuit board 5 in a large area, the heat conduction efficiency can be improved, the water cooling mechanism is installed below the copper plate 15 and consists of a water pump 6, a coiled pipe 8 and a heat exchanger 10, when the heat dissipation device is used, liquid in the coiled pipe 8 starts to flow by opening the water pump 6, heat exchange can be generated between the upper end of the coiled pipe 8 and the copper plate 15 due to the contact of the upper end of the coiled pipe 8 and the copper plate 15, the heat of the copper plate 15 is taken away through the liquid, and then the heat dissipation is carried out, the liquid containing the heat enters the heat exchanger 10 through the water, the heat conduction fins 11 are arranged between the coiled pipes 8, the heat conduction fins 11 can further conduct heat absorbed by the copper plate 15, the heat conduction efficiency is accelerated, meanwhile, the coiled pipes 8 are in contact with the heat conduction fins 11, the heat on the heat conduction fins 11 can be further transferred, the heat dissipation effect is further improved, the fan 12 is arranged at the middle position of the copper plate 15, the fan 12 is driven to rotate by starting the driving motor 18, the heat in the shell 1 is discharged, the heat dissipation window 13 is arranged at the bottom of the shell 1, the dust filtering net 14 is arranged in the heat dissipation window 13, dust can be prevented from entering in the use process, the heat dissipation device is kept clean in the working process, the fault caused by excessive dust is avoided, in addition, the damping spring 2 is arranged between the mounting block 3 and the shell 1, and the damping spring 2 can buffer the vibration generated by the rotation of the fan 12, thereby protecting the chip circuit board 5.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. The utility model provides a communication equipment heat abstractor with high-efficient heat dissipation function, includes chip circuit board (5), its characterized in that: the chip packaging structure is characterized in that a shell (1) is arranged below the chip circuit board (5), a damping spring (2) is arranged above the shell (1), the damping spring (2) is provided with a plurality of damping springs, an installation block (3) is arranged at the upper end of each damping spring (2), a copper plate (15) is arranged inside the shell (1), the copper plate (15) is attached to the chip circuit board (5), a water pump (6) is installed on one side below the copper plate (15), a water outlet (7) is arranged at one end of the water pump (6), a heat exchanger (10) is installed on the other side below the copper plate (15), a water inlet (9) is arranged at one end of the heat exchanger (10), a coiled pipe (8) is arranged between the water outlet (7) and the water inlet (9), heat-conducting fins (11) are arranged between the coiled pipes (8), and the heat-conducting, the utility model discloses a fan, including copper (15), copper (17), driving motor (18) are installed to the inside upper end of support column (17), fan (12) are installed to the output shaft of driving motor (18), the lower extreme of casing (1) is provided with radiator window (13), and radiator window (13) are provided with a plurality of, dust filtering net (14) are all installed to the inside of radiator window (13).
2. The heat dissipating device for communication equipment with high heat dissipating function as claimed in claim 1, wherein: a connecting pipe (16) is arranged between the water pump (6) and the heat exchanger (10), the connecting pipe (16) is connected with the water pump (6) and the heat exchanger (10) in a sealing mode, and the coiled pipe (8) is attached to the lower end face of the copper plate (15).
3. The heat dissipating device for communication equipment with high heat dissipating function as claimed in claim 1, wherein: the heat conduction fins (11) are fixedly connected with the copper plate (15), and the heat conduction fins (11) are attached to the coiled pipe (8).
4. The heat dissipating device for communication equipment with high heat dissipating function as claimed in claim 1, wherein: the support column (17) is fixedly connected with the copper plate (15), and an output shaft of the driving motor (18) is fixedly connected with the fan (12).
5. The heat dissipating device for communication equipment with high heat dissipating function as claimed in claim 1, wherein: the mounting block (3) is connected with the chip circuit board (5) through a fixing bolt (4), the fixing bolt (4) is in threaded connection with the mounting block (3), and the damping spring (2) is fixedly connected with the mounting block (3) and the shell (1).
6. The heat dissipating device for communication equipment with high heat dissipating function as claimed in claim 1, wherein: the dust filtering net (14) is connected with the heat dissipation window (13) through a clamping groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921850208.7U CN210928436U (en) | 2019-10-31 | 2019-10-31 | Communication equipment heat abstractor with high-efficient heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921850208.7U CN210928436U (en) | 2019-10-31 | 2019-10-31 | Communication equipment heat abstractor with high-efficient heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210928436U true CN210928436U (en) | 2020-07-03 |
Family
ID=71348072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921850208.7U Expired - Fee Related CN210928436U (en) | 2019-10-31 | 2019-10-31 | Communication equipment heat abstractor with high-efficient heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210928436U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
| CN113946087A (en) * | 2021-09-14 | 2022-01-18 | 上海肆和文化传媒有限公司 | Portable external heat dissipation patch suitable for multiple types of cameras |
-
2019
- 2019-10-31 CN CN201921850208.7U patent/CN210928436U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867231A (en) * | 2020-12-28 | 2021-05-28 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
| CN112867231B (en) * | 2020-12-28 | 2022-03-15 | 安徽展新电子有限公司 | Do benefit to radiating multilayer printed circuit board |
| CN113946087A (en) * | 2021-09-14 | 2022-01-18 | 上海肆和文化传媒有限公司 | Portable external heat dissipation patch suitable for multiple types of cameras |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200703 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |