CN210909501U - Semiconductor material grinding device - Google Patents
Semiconductor material grinding device Download PDFInfo
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- CN210909501U CN210909501U CN201921857102.XU CN201921857102U CN210909501U CN 210909501 U CN210909501 U CN 210909501U CN 201921857102 U CN201921857102 U CN 201921857102U CN 210909501 U CN210909501 U CN 210909501U
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Abstract
A semiconductor material grinding processing device comprises a base, wherein a grinding box body is arranged on the base, one side surface of the grinding box body is an opening surface, a strip-shaped opening is arranged on the side surface opposite to the opening surface, a lifting plate capable of moving up and down in the strip-shaped opening is arranged in the strip-shaped opening, a motor is arranged on the lifting plate, a rotating shaft of the motor is vertically arranged downwards, and a grinding wheel is arranged on the rotating shaft of the motor; the base is provided with a stand column and a telescopic rod which are respectively arranged at two sides of the grinding box body, the upper end of the stand column and the upper end of the telescopic rod are respectively hinged with two ends of an adjusting rod, and the middle part of the adjusting rod is connected with one surface of a lifting plate positioned outside the grinding box body; a clamping mechanism is arranged on the base right below the motor. By adopting the structure, the semiconductor material can be effectively clamped and fixed, and after the grinding operation of one surface is finished, the semiconductor material is quickly turned over, the step of manually dismounting the semiconductor material is omitted, and the processing efficiency of the semiconductor material is improved.
Description
Technical Field
The utility model relates to a semiconductor processing field, especially a semiconductor material grinds processingequipment.
Background
Semiconductor materials are a class of electronic materials that have semiconducting properties (electrical conductivity between conductor and insulator, and resistivity in the range of about 1m Ω -cm to 1G Ω -cm) and are useful in the fabrication of semiconductor devices and integrated circuits.
In the semiconductor manufacturing, need to grind semiconductor material, therefore, need use grinder, current grinder presss from both sides tight effect poorly, when grinder grinds semiconductor material, because grinder presss from both sides tight effect poorly, cause the condition that the semiconductor material appears the slip easily, thereby influenced grinder polisher grinds semiconductor material, in addition because the grinding operation should be gone on in two faces, after accomplishing the operation of one face, need manually take off the semiconductor material after the upset material refastening just can carry out the grinding operation of second face, the complex operation is inefficient, repeated installation dismantlement has certain influence and also can cause the condition that the secondary is fixed unstably to semiconductor material.
Disclosure of Invention
The utility model aims to solve the technical problem that a semiconductor material grinds processingequipment is provided, can carry out effective centre gripping to semiconductor material and fix to after the grinding operation of accomplishing the one side, realize semiconductor material's quick upset, save artifical dismouting semiconductor material's step, improved semiconductor material's machining efficiency.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: a semiconductor material grinding processing device comprises a base, wherein a grinding box body is arranged on the base, one side surface of the grinding box body is an opening surface, a strip-shaped opening is arranged on the side surface opposite to the opening surface, a lifting plate capable of moving up and down in the strip-shaped opening is arranged in the strip-shaped opening, a motor is arranged on the lifting plate, a rotating shaft of the motor is vertically arranged downwards, and a grinding wheel is arranged on the rotating shaft of the motor;
the base is provided with an upright post and a telescopic rod which are respectively arranged at two sides of the grinding box body, the upper end of the upright post and the upper end of the telescopic rod are respectively hinged with two ends of an adjusting rod, and the middle part of the adjusting rod is connected with one surface of a lifting plate positioned outside the grinding box body;
and a clamping mechanism is arranged on the base right below the motor.
In the preferred scheme, the lifting plate is an L-shaped plate, the motor is fixedly arranged on the horizontal section of the lifting plate, the two sides of the vertical section of the lifting plate are provided with positioning side edges, and the positioning side edges are matched with groove bodies arranged on the two sides of the strip-shaped opening.
In a preferable scheme, a third pin column is arranged on one surface of the vertical section, which is positioned outside the grinding box body, a second groove is formed in the middle of the adjusting rod, and the third pin column is arranged in the second groove.
In the preferred scheme, one end of the adjusting rod is provided with a first pin, and the first pin realizes the hinge connection between one end of the adjusting rod and the upright column.
In the preferred scheme, the telescopic link wear to establish in the cavity post, the cavity post is fixed on the base, the telescopic link is located and is equipped with first slider on the lower extreme in the cavity post, is equipped with the spring between the bottom surface of first slider and the interior bottom surface of cavity post.
In the preferred scheme, a first open groove is formed in the other end, away from the first pin, of the adjusting rod, a second pin is arranged at the upper end of the telescopic rod, and the second pin is arranged in the first open groove.
In the preferred scheme, fixture include the riser that two symmetries set up, be equipped with the opening on the riser, be equipped with in the opening and follow the gliding second slider of horizontal direction, wear to be equipped with the pivot on the second slider, two pivots are thought to be served and are equipped with "U" shape splint near, are equipped with the cross handle on the other end of two pivots.
In a preferable scheme, a bearing is arranged on the second sliding block, and the rotating shaft penetrates through the bearing.
The utility model provides a centre gripping positioner for semiconductor processing through adopting above-mentioned structure, has following beneficial effect:
(1) the grinding wheel can be moved by simply pressing down one end of the adjusting rod, so that the grinding operation can be conveniently and rapidly carried out, and the operation of the device is simpler;
(2) through fixture, under the prerequisite of guaranteeing the tight fixed purpose of clamp to semiconductor material, can realize the purpose of overturning fast, avoid dismouting semiconductor material repeatedly to lead to the influence to grinding work efficiency.
Drawings
The invention will be further explained with reference to the following figures and examples:
fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the structure of the lifting plate of the present invention.
Fig. 3 is a schematic view of the structure of the adjusting rod of the present invention.
Fig. 4 is a schematic structural view of the clamping mechanism of the present invention.
In the figure: the grinding machine comprises a base 1, a grinding box body 2, a strip-shaped opening 201, a lifting plate 3, a horizontal section 301, a vertical section 302, a positioning side 303, a motor 4, a grinding wheel 401, a clamping mechanism 5, an adjusting rod 6, a stand column 7, a first pin 8, a telescopic rod 9, a hollow column 10, a first sliding block 11, a spring 12, a first open groove 13, a second pin 14, a third pin 15, a second open groove 16, a vertical plate 17, an opening 171, a second sliding block 18, a rotating shaft 19, a bearing 20, a U-shaped clamping plate 21 and a cross handle 22.
Detailed Description
As shown in fig. 1-4, a semiconductor material grinding device comprises a base 1, wherein a grinding box 2 is arranged on the base 1, one side surface of the grinding box 2 is an open surface, a strip-shaped opening 201 is arranged on the side surface opposite to the open surface, a lifting plate 3 capable of moving up and down in the strip-shaped opening 201 is arranged in the strip-shaped opening 201, a motor 4 is arranged on the lifting plate 3, a rotating shaft of the motor 4 is vertically arranged downwards, and a grinding wheel 401 is arranged on the rotating shaft of the motor 4;
the grinding box is characterized in that the base 1 is provided with an upright post 7 and a telescopic rod 9, the upright post 7 and the telescopic rod 9 are respectively arranged at two sides of the grinding box body 2, the upper end of the upright post 7 and the upper end of the telescopic rod 9 are respectively hinged and connected with two ends of an adjusting rod 6, and the middle part of the adjusting rod 6 is connected with one surface of the lifting plate 3 positioned outside the grinding box body 2;
and a clamping mechanism 5 is arranged on the base 1 right below the motor 4.
In the preferred scheme, the lifting plate 3 is an L-shaped plate, the motor 4 is fixedly arranged on the horizontal section 301 of the lifting plate 3, positioning side edges 303 are arranged on two sides of the vertical section 302 of the lifting plate 3, and the positioning side edges 303 are matched with groove bodies formed in two sides of the strip-shaped opening 201.
In a preferable scheme, a third pin 15 is arranged on one surface of the vertical section 302, which is positioned outside the grinding box body 2, a second slot 16 is arranged in the middle of the adjusting rod 6, and the third pin 15 is arranged in the second slot 16.
In the preferred scheme, one end of the adjusting rod 6 is provided with a first pin 8, and the first pin 8 realizes the hinge joint between one end of the adjusting rod 6 and the upright post 7.
In the preferred scheme, the telescopic rod 9 is arranged in the hollow column 10 in a penetrating manner, the hollow column 10 is fixed on the base 1, the lower end of the telescopic rod 9, which is positioned in the hollow column 10, is provided with a first sliding block 11, and a spring 12 is arranged between the bottom surface of the first sliding block 11 and the inner bottom surface of the hollow column 10.
In a preferable scheme, a first open slot 13 is formed in the other end, away from the first pin 8, of the adjusting rod 6, a second pin 14 is arranged at the upper end of the telescopic rod 9, and the second pin 14 is arranged in the first open slot 13.
In a preferable scheme, the clamping mechanism 5 comprises two symmetrically arranged vertical plates 17, an opening 171 is arranged on each vertical plate 17, a second sliding block 18 capable of sliding along the horizontal direction is arranged in each opening 171, a rotating shaft 19 penetrates through each second sliding block 18, a U-shaped clamping plate 21 is arranged at one end, close to each rotating shaft 19, of each rotating shaft 19, and a cross handle 22 is arranged at the other end of each rotating shaft 19.
In a preferred scheme, a bearing 20 is arranged on the second sliding block 18, and the rotating shaft 19 is arranged through the bearing 20.
The novel working principle is as follows:
the semiconductor material is clamped and fixed through two U-shaped clamping plates 21, then a motor 4 is started to enable a grinding wheel 401 to rotate at a high speed, then one end of an adjusting rod 6 close to a telescopic rod 9 is manually pressed down to enable a lifting plate 3 to move down to enable the grinding wheel 401 to be in contact with the semiconductor material, so that the grinding operation of one surface of the semiconductor material can be completed, after the grinding operation of one surface is completed, the adjusting rod 6 is loosened, the lifting plate 3 moves up under the action of a spring 12, a cross handle 22 is rotated by 180 degrees, the bottom surface of the semiconductor material on a clamping mechanism 5 is turned upwards, and then one end of the adjusting rod 6 is pressed down again to complete the grinding of the other surface.
By adopting the structure, the grinding wheel can be moved by simply pressing down one end of the adjusting rod, so that the grinding operation can be conveniently and rapidly carried out, and the operation of the device is simpler; through fixture, under the prerequisite of guaranteeing the tight fixed purpose of clamp to semiconductor material, can realize the purpose of overturning fast, avoid dismouting semiconductor material repeatedly to lead to the influence to grinding work efficiency.
Claims (8)
1. The utility model provides a semiconductor material grinds processingequipment, includes base (1), characterized by: the grinding box body (2) is arranged on the base (1), one side face of the grinding box body (2) is an opening face, a strip-shaped opening (201) is arranged on the side face opposite to the opening face, a lifting plate (3) capable of moving up and down in the strip-shaped opening (201) is arranged in the strip-shaped opening (201), a motor (4) is arranged on the lifting plate (3), a rotating shaft of the motor (4) is vertically arranged downwards, and a grinding wheel (401) is arranged on the rotating shaft of the motor (4);
the grinding machine is characterized in that a stand column (7) and a telescopic rod (9) are arranged on the base (1), the stand column (7) and the telescopic rod (9) are respectively arranged on two sides of the grinding box body (2), the upper end of the stand column (7) and the upper end of the telescopic rod (9) are respectively hinged and connected with two ends of an adjusting rod (6), and the middle part of the adjusting rod (6) is connected with one surface of the lifting plate (3) which is positioned outside the grinding box body (2);
and a clamping mechanism (5) is arranged on the base (1) right below the motor (4).
2. The semiconductor material polishing apparatus according to claim 1, wherein: the lifting plate (3) is an L-shaped plate, the motor (4) is fixedly arranged on a horizontal section (301) of the lifting plate (3), positioning side edges (303) are arranged on two sides of a vertical section (302) of the lifting plate (3), and the positioning side edges (303) are matched with groove bodies formed in two sides of the strip-shaped opening (201).
3. The semiconductor material polishing apparatus according to claim 2, wherein: the vertical section (302) is provided with a third pin column (15) on one surface outside the grinding box body (2), the middle part of the adjusting rod (6) is provided with a second slot (16), and the third pin column (15) is arranged in the second slot (16).
4. The semiconductor material polishing apparatus according to claim 1, wherein: one end of the adjusting rod (6) is provided with a first pin column (8), and the first pin column (8) realizes the hinge joint between one end of the adjusting rod (6) and the upright post (7).
5. The semiconductor material polishing apparatus according to claim 1, wherein: the telescopic rod (9) is arranged in the hollow column (10) in a penetrating mode, the hollow column (10) is fixed on the base (1), the lower end, located in the hollow column (10), of the telescopic rod (9) is provided with a first sliding block (11), and a spring (12) is arranged between the bottom surface of the first sliding block (11) and the inner bottom surface of the hollow column (10).
6. The semiconductor material polishing apparatus according to claim 4, wherein: the other end of the adjusting rod (6) far away from the first pin column (8) is provided with a first open slot (13), the upper end of the telescopic rod (9) is provided with a second pin column (14), and the second pin column (14) is arranged in the first open slot (13).
7. The semiconductor material polishing apparatus according to claim 1, wherein: the clamping mechanism (5) comprises two symmetrically-arranged vertical plates (17), an opening (171) is formed in each vertical plate (17), a second sliding block (18) capable of sliding in the horizontal direction is arranged in each opening (171), a rotating shaft (19) penetrates through each second sliding block (18), a U-shaped clamping plate (21) is arranged at one end, close to each rotating shaft (19), of each rotating shaft, and a cross handle (22) is arranged at the other end of each rotating shaft (19).
8. The apparatus for grinding and processing a semiconductor material as recited in claim 7, wherein: the second sliding block (18) is provided with a bearing (20), and the rotating shaft (19) penetrates through the bearing (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921857102.XU CN210909501U (en) | 2019-10-31 | 2019-10-31 | Semiconductor material grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921857102.XU CN210909501U (en) | 2019-10-31 | 2019-10-31 | Semiconductor material grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210909501U true CN210909501U (en) | 2020-07-03 |
Family
ID=71350384
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921857102.XU Active CN210909501U (en) | 2019-10-31 | 2019-10-31 | Semiconductor material grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210909501U (en) |
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2019
- 2019-10-31 CN CN201921857102.XU patent/CN210909501U/en active Active
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