CN210909500U - Wafer grinding device of semiconductor packaging structure - Google Patents
Wafer grinding device of semiconductor packaging structure Download PDFInfo
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- CN210909500U CN210909500U CN201921821762.2U CN201921821762U CN210909500U CN 210909500 U CN210909500 U CN 210909500U CN 201921821762 U CN201921821762 U CN 201921821762U CN 210909500 U CN210909500 U CN 210909500U
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Abstract
The utility model discloses a wafer grinding device of a semiconductor packaging structure, which comprises a conveyor belt, wherein the conveyor belt is matched with a rotating wheel around the rotating wheel; the rotating wheel is connected with the bracket through a rotating shaft, and the bottom of the bracket is connected with a base; the top of the bracket is connected with the top plate, and the lower surface of the top plate is connected with a grinding device; the upper surface of the conveyor belt is paved with a plurality of conveying plates connected by wafer boxes and matched with the grinding device. The device grinds the wafer by placing the wafer material in the wafer box integrated with the limiting function and utilizing the grinding device with adjustable height to add the height monitoring device and the thickness control equipment, so that the problem of lower efficiency in the prior art is solved, and the device has the characteristics of simple structure and higher efficiency.
Description
Technical Field
The utility model belongs to the technical field of the semiconductor package processing, concretely relates to semiconductor packaging structure's wafer grinder.
Background
In the packaging of semiconductor materials, one of the important steps is the polishing of the wafer material. The back of the wafer processed by the wafer factory needs to be ground to a proper thickness (8-10 mils). The prior art comprises the steps of firstly pasting an adhesive tape on the front surface of a wafer to protect a circuit area, then grinding the back surfaces one by one, removing the adhesive tape after grinding is finished, and measuring the thickness. The prior art has the problem of low efficiency, cannot grind wafers with equal thickness in batches, has independent procedures of sticking an adhesive tape, removing the adhesive tape and measuring the thickness, needs manual work to finish in steps, and has long working time, high strength and low efficiency.
In summary, it is necessary to design a wafer polishing apparatus that can integrally polish wafers in large quantities, and can ensure uniform thickness without damaging the material itself.
Disclosure of Invention
The utility model aims to solve the technical problem that a semiconductor package structure's wafer grinder is provided, the device utilizes height-adjustable grinder to grind the wafer through placing the wafer material in the wafer box that has assembled limit function to add high monitoring device and thickness control equipment, solved the lower problem of prior art efficiency, had simple structure, the higher characteristics of efficiency.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: a wafer grinding device of a semiconductor packaging structure comprises a conveyor belt, a grinding roller and a grinding roller, wherein the conveyor belt surrounds the grinding roller and is matched with the grinding roller; the rotating wheel is connected with the bracket through a rotating shaft, and the bottom of the bracket is connected with a base; the top of the bracket is connected with the top plate, and the lower surface of the top plate is connected with a grinding device; the upper surface of the conveyor belt is paved with a plurality of conveying plates connected by wafer boxes and matched with the grinding device.
The rotating wheel comprises a driving wheel and a driven wheel, and a rotating shaft of the driving wheel is connected with the output end of the first motor.
The grinding device comprises a first electric push rod, a second motor and a grinding disc; first electric putter is connected with the roof lower surface, and the second motor is connected with first electric putter's output, and the dull polish dish is connected with the output of second motor.
The grinding device further comprises a spray pipe arranged on one side of the first electric push rod, one end of the spray pipe is a conical nozzle, and the other end of the spray pipe is connected with a water pump on the upper surface of the top plate.
The lower surface of the top plate is also connected with a pressing device.
The pressing device comprises a second electric push rod and a pressing head, the pressing head is connected with the output end of the second electric push rod, and a rubber gasket is wrapped on the surface of the pressing head.
The lower surface of the top plate is also connected with a laser ranging sensor.
The wafer box is of a hollow rectangular structure, the upper surface of the wafer box is provided with a rectangular groove, the inner wall of the groove is connected with four arc-shaped spring blocks, and the arc surfaces of the four spring blocks are spliced into a cylindrical groove under the thrust of a spring.
The wafer box bottom plate is of a sandwich structure, and a pressure sensor is arranged in the sandwich structure; the wafer cassette base plate is coated with an adhesive coating.
The upper surface of the top plate is connected with a controller; first motor, second motor, pressure sensor, first electric putter, second electric putter, water pump and laser rangefinder sensor all with controller electric connection.
A wafer grinding device of a semiconductor packaging structure comprises a conveyor belt, a grinding roller and a grinding roller, wherein the conveyor belt surrounds the grinding roller and is matched with the grinding roller; the rotating wheel is connected with the bracket through a rotating shaft, and the bottom of the bracket is connected with a base; the top of the bracket is connected with the top plate, and the lower surface of the top plate is connected with a grinding device; the upper surface of the conveyor belt is paved with a plurality of conveying plates connected by wafer boxes and matched with the grinding device. The device grinds the wafer by placing the wafer material in the wafer box integrated with the limiting function and utilizing the grinding device with adjustable height, and the height monitoring device and the thickness control equipment are additionally arranged, so that the device is simple in structure and high in efficiency.
In a preferred scheme, the rotating wheel comprises a driving wheel and a driven wheel, and a rotating shaft of the driving wheel is connected with the output end of the first motor. Simple structure, during the use, first motor drive runner rotates, drives the conveyer belt motion, and it is very convenient to operate.
In a preferred scheme, the grinding device comprises a first electric push rod, a second motor and a grinding disc; first electric putter is connected with the roof lower surface, and the second motor is connected with first electric putter's output, and the dull polish dish is connected with the output of second motor. Simple structure, during the use, first electric putter is used for controlling the height of dull polish dish, and second motor control dull polish dish rotates and grinds, and height-adjustable can carry out nimble adjustment according to the operating mode.
In a preferred scheme, the grinding device further comprises a spray pipe arranged on one side of the first electric push rod, one end of the spray pipe is a conical nozzle, and the other end of the spray pipe is connected with a water pump on the upper surface of the top plate. Simple structure, during the use, the shower is used for the grinding in-process to washing and lubricating the face of grinding, can effectively prevent the unsmooth problem of face of grinding.
In a preferred scheme, the lower surface of the top plate is also connected with a pressing device. Simple structure, during the use, closing device is used for compressing tightly the wafer in the wafer box, avoids failing to make wafer and bottom tightly laminate when putting into the wafer box with the wafer in earlier stage to lead to grinding thickness the problem of error, improved the accuracy of equipment greatly.
In the preferred scheme, the pressing device comprises a second electric push rod and a pressing head, the pressing head is connected with the output end of the second electric push rod, and a rubber gasket is wrapped on the surface of the pressing head. The structure is simple, and when the pressure head is used, the rubber gasket on the surface of the pressure head can be used as a buffer in contact, so that the wafer is prevented from being damaged due to overhigh pressure.
In a preferred scheme, the lower surface of the top plate is also connected with a laser ranging sensor. Simple structure, during the use, laser rangefinder sensor sets up in grinder rear for carry out thickness detection to the wafer after grinding, reduced the operation degree of difficulty, alleviateed the manual labor burden.
In the preferred scheme, the wafer box is of a hollow rectangular structure, the upper surface of the wafer box is provided with a rectangular groove, the inner wall of the groove is connected with four arc-shaped spring blocks, and the arc surfaces of the four spring blocks are spliced into a cylindrical groove under the thrust of a spring. The wafer limiting device is simple in structure, when the wafer limiting device is used, a wafer is placed in the wafer box, the arc surfaces of the four spring blocks can be attached to the circular arc edges of the wafer, so that a limiting effect is achieved, and the type with a large elastic coefficient can be selected for the springs; the error caused by shaking in the grinding process is avoided.
In a preferred scheme, the wafer box bottom plate is of a sandwich structure, and a pressure sensor is arranged in the sandwich structure; the wafer cassette base plate is coated with an adhesive coating. The structure is simple, and when the adhesive coating is used, the adhesive coating is used for limiting and protecting the circuit structure on the front side; the pressure sensor of bottom plate is used for detecting whether the wafer closely bonds with the bottom plate, if not receiving pressure signal, then control closing device compresses tightly unusual wafer box, compresses tightly the wafer in the bottom, has avoided grinding the error.
In a preferred scheme, the upper surface of the top plate is connected with a controller; first motor, second motor, pressure sensor, first electric putter, second electric putter, water pump and laser rangefinder sensor all with controller electric connection. Simple structure, during the use, electric component passes through sensor feedback control, greatly reduced artifical intensity of labour, improved work efficiency.
In a preferred scheme, the controller adopts an 80C51 singlechip; the pressure sensor is selected from a loose DP-102A model; the electric push rod is of a model of JS-TGZ-U1; the laser ranging sensor is a DIMETIX laser ranging sensor EDS-C30.
A wafer grinding device of a semiconductor packaging structure comprises a conveyor belt, a grinding roller and a grinding roller, wherein the conveyor belt surrounds the grinding roller and is matched with the grinding roller; the rotating wheel is connected with the bracket through a rotating shaft, and the bottom of the bracket is connected with a base; the top of the bracket is connected with the top plate, and the lower surface of the top plate is connected with a grinding device; the upper surface of the conveyor belt is paved with a plurality of conveying plates connected by wafer boxes and matched with the grinding device. The device grinds the wafer by placing the wafer material in the wafer box integrated with the limiting function and utilizing the grinding device with adjustable height to add the height monitoring device and the thickness control equipment, so that the problem of lower efficiency in the prior art is solved, and the device has the characteristics of simple structure and higher efficiency.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a front view of the middle ceiling portion of the present invention.
Fig. 3 is a schematic structural diagram of the wafer cassette of the present invention.
Fig. 4 is a schematic front view of the bottom of the wafer box of the present invention.
Fig. 5 is a logic diagram of the controller portion of the present invention.
The reference numbers in the figures are: the automatic grinding device comprises a conveyor belt 1, a driving wheel 11, a driven wheel 12, a first motor 13, a support 2, a base 3, a top plate 4, a controller 41, a grinding device 5, a first electric push rod 51, a second motor 52, a grinding disc 53, a spray pipe 54, a water pump 55, a wafer box 6, a spring block 61, an interlayer structure 62, a pressure sensor 63, a conveying plate 7, a pressing device 8, a second electric push rod 81, a pressure head 82 and a laser ranging sensor 9.
Detailed Description
As shown in fig. 1 to 5, a wafer polishing apparatus for semiconductor package structure comprises a conveyor belt 1, wherein the conveyor belt 1 surrounds a rotating wheel and is matched with the rotating wheel; the rotating wheel is connected with the bracket 2 through a rotating shaft, and the bottom of the bracket 2 is connected with a base 3; the top of the bracket 2 is connected with a top plate 4, and the lower surface of the top plate 4 is connected with a grinding device 5; the upper surface of the conveyor belt 1 is paved with a plurality of transport plates 7 connected by wafer boxes 6 and matched with the grinding device 5. The device utilizes height-adjustable grinder 5 to grind the wafer in placing the wafer material in wafer box 6 that has gathered limit function to add height monitoring device and thickness control equipment, simple structure, efficiency is higher.
In a preferred scheme, the rotating wheel comprises a driving wheel 11 and a driven wheel 12, and the rotating shaft of the driving wheel 11 is connected with the output end of a first motor 13. Simple structure, during the use, first motor 13 drive runner rotates, drives conveyer belt 1 motion, and it is very convenient to operate.
In a preferred scheme, the grinding device 5 comprises a first electric push rod 51, a second motor 52 and a grinding disc 53; the first electric push rod 51 is connected with the lower surface of the top plate 4, the second motor 52 is connected with the output end of the first electric push rod 51, and the sanding disc 53 is connected with the output end of the second motor 52. Simple structure, during the use, first electric putter 51 is used for controlling the height of dull polish dish 53, and second motor 52 control dull polish dish 53 is rotatory to be ground, and height-adjustable can carry out nimble adjustment according to the operating mode.
In a preferred embodiment, the grinding device 5 further includes a spraying pipe 54 on one side of the first electric push rod 51, one end of the spraying pipe 54 is a conical nozzle, and the other end is connected to a water pump 55 on the upper surface of the top plate 4. Simple structure, during the use, shower 54 is used for the grinding in-process to washing and lubricating the face of grinding, can effectively prevent the unsmooth problem of face of grinding.
In a preferred scheme, a pressing device 8 is further connected to the lower surface of the top plate 4. Simple structure, during the use, closing device 8 is used for compressing tightly the wafer in the wafer box 6, avoids failing to make wafer and bottom tightly laminate when putting into wafer box 6 with the wafer in earlier stage to lead to grinding the problem that thickness error appears, improved the accuracy of equipment greatly.
In a preferred scheme, the pressing device 8 comprises a second electric push rod 81 and a pressing head 82, the pressing head 82 is connected with the output end of the second electric push rod 81, and a rubber gasket is wrapped on the surface of the pressing head 82. The structure is simple, and when the pressure head is used, the rubber gasket on the surface of the pressure head 82 can be used as a buffer during contact, so that the damage to a wafer caused by overhigh pressure intensity is avoided.
In a preferred scheme, the lower surface of the top plate 4 is also connected with a laser ranging sensor 9. Simple structure, during the use, laser rangefinder sensor 9 sets up in grinder 5 rear for carry out thickness detection to the wafer after grinding, reduced the operation degree of difficulty, alleviateed the hand labor burden.
In the preferred scheme, the wafer box 6 is a hollow rectangular structure with a rectangular groove formed in the upper surface, the inner wall of the groove is connected with four arc-shaped spring blocks 61, and the arc surfaces of the four spring blocks 61 are spliced into a cylindrical groove under the thrust of a spring. The wafer box has a simple structure, when in use, the wafer is placed in the wafer box 6, the cambered surfaces of the four spring blocks 61 can be attached to the circular cambered edges of the wafer, so that the limiting effect is achieved, and the type with a larger elastic coefficient can be selected as the spring; the error caused by shaking in the grinding process is avoided.
In a preferred scheme, the bottom plate of the wafer box 6 is a sandwich structure 62, and a pressure sensor 63 is arranged in the sandwich structure 62; the wafer cassette 6 bottom plate is coated with an adhesive coating. The structure is simple, and when the adhesive coating is used, the adhesive coating is used for limiting and protecting the circuit structure on the front side; the pressure sensor 63 of the bottom plate is used for detecting whether the wafer is tightly adhered to the bottom plate, and if no pressure signal is received, the pressing device 8 is controlled to press the abnormal wafer box 6, so that the wafer is pressed at the bottom, and the grinding error is avoided.
In a preferred scheme, the controller 41 is connected to the upper surface of the top plate 4; the first motor 13, the second motor 52, the pressure sensor 63, the first electric push rod 51, the second electric push rod 81, the water pump 55 and the laser ranging sensor 9 are all electrically connected with the controller 41. Simple structure, during the use, electric component passes through sensor feedback control, greatly reduced artifical intensity of labour, improved work efficiency.
In the preferred scheme, the controller 41 is an 80C51 single chip microcomputer; the pressure sensor 63 is of a model DP-102A; the electric push rod is of a model of JS-TGZ-U1; the laser distance measuring sensor 9 is a DIMETIX laser distance measuring sensor EDS-C30.
When the wafer grinding device with the semiconductor packaging structure is installed and used, the conveyor belt 1 surrounds the rotating wheel and is matched with the rotating wheel; the rotating wheel is connected with the bracket 2 through a rotating shaft, and the bottom of the bracket 2 is connected with a base 3; the top of the bracket 2 is connected with a top plate 4, and the lower surface of the top plate 4 is connected with a grinding device 5; the upper surface of the conveyor belt 1 is paved with a plurality of transport plates 7 connected by wafer boxes 6 and matched with the grinding device 5. The device utilizes height-adjustable grinder 5 to grind the wafer in placing the wafer material in wafer box 6 that has gathered limit function to add height monitoring device and thickness control equipment, simple structure, efficiency is higher.
When the conveying belt is used, the rotating wheel comprises a driving wheel 11 and a driven wheel 12, a rotating shaft of the driving wheel 11 is connected with the output end of a first motor 13, the first motor 13 drives the rotating wheel to rotate, the conveying belt 1 is driven to move, and the operation is very convenient.
In use, the grinding device 5 comprises a first electric push rod 51, a second motor 52 and a grinding disc 53; first electric putter 51 is connected with roof 4 lower surface, and second motor 52 is connected with first electric putter 51's output, and dull polish disc 53 is connected with second motor 52's output, and first electric putter 51 is used for controlling dull polish disc 53's height, and second motor 52 control dull polish disc 53 is rotatory to be ground, and height-adjustable can carry out nimble adjustment according to the operating mode.
During the use, grinder 5 still includes the shower 54 of first electric putter 51 one side, and shower 54 one end is the toper spout, and the other end is connected with the water pump 55 of roof 4 upper surface, and shower 54 is used for the grinding in-process to wash and lubricate the grinding face, can effectively prevent the problem that the grinding face is not smooth.
During the use, 4 lower surfaces of roof still are connected with closing device 8, and closing device 8 is used for compressing tightly the wafer in the wafer box 6, avoids failing to make wafer and bottom tightly laminate when putting into wafer box 6 with the wafer in earlier stage to lead to grinding the problem that the thickness error appears, improved the accuracy of equipment greatly.
During the use, closing device 8 includes second electric putter 81 and pressure head 82, and pressure head 82 is connected with second electric putter 81's output, and pressure head 82 surface coating has the rubber packing ring, and the buffering when the rubber packing ring on pressure head 82 surface can regard as the contact avoids damaging the wafer because of the pressure is too high.
During the use, roof 4 lower surface still is connected with laser rangefinder sensor 9, and laser rangefinder sensor 9 sets up in grinder 5 rear for carry out thickness detection to the wafer after grinding, reduced the operation degree of difficulty, alleviateed the manual labor burden.
When the wafer box is used, the wafer box 6 is of a hollow rectangular structure, the upper surface of the wafer box is provided with a rectangular groove, the inner wall of the groove is connected with four arc-shaped spring blocks 61, the arc surfaces of the four spring blocks 61 are spliced into a cylindrical groove under the thrust of a spring, a wafer is placed into the wafer box 6, the arc surfaces of the four spring blocks 61 can be attached to the circular arc edge of the wafer, so that the limiting effect is achieved, and the type with a large elastic coefficient can be selected for the spring; the error caused by shaking in the grinding process is avoided.
When in use, the bottom plate of the wafer box 6 is of a sandwich structure 62, and a pressure sensor 63 is arranged in the sandwich structure 62; the bottom plate of the wafer box 6 is coated with an adhesive coating which is used for limiting and protecting the circuit structure on the front surface; the pressure sensor 63 of the bottom plate is used for detecting whether the wafer is tightly adhered to the bottom plate, and if no pressure signal is received, the pressing device 8 is controlled to press the abnormal wafer box 6, so that the wafer is pressed at the bottom, and the grinding error is avoided.
When in use, the upper surface of the top plate 4 is connected with a controller 41; first motor 13, second motor 52, pressure sensor 63, first electric putter 51, second electric putter 81, water pump 55 and laser range sensor 9 all with controller 41 electric connection, electric component passes through sensor feedback control, greatly reduced the intensity of hand labor, improved work efficiency.
When in use, the controller 41 adopts an 80C51 singlechip; the pressure sensor 63 is of a model DP-102A; the electric push rod is of a model of JS-TGZ-U1; the laser distance measuring sensor 9 is a DIMETIX laser distance measuring sensor EDS-C30.
The above embodiments are merely preferred technical solutions of the present invention, and should not be considered as limitations of the present invention, and the features in the embodiments and the examples in the present application may be arbitrarily combined with each other without conflict. The protection scope of the present invention shall be defined by the claims and the technical solutions described in the claims, including the technical features of the equivalent alternatives as the protection scope. Namely, equivalent alterations and modifications within the scope of the invention are also within the scope of the invention.
Claims (7)
1. A wafer grinding device of a semiconductor packaging structure is characterized in that: the conveying belt comprises a conveying belt (1), wherein the conveying belt (1) surrounds a rotating wheel and is matched with the rotating wheel; the rotating wheel is connected with the bracket (2) through a rotating shaft, and the bottom of the bracket (2) is connected with a base (3); the top of the bracket (2) is connected with a top plate (4), and the lower surface of the top plate (4) is connected with a grinding device (5); a plurality of transport plates (7) connected by wafer boxes (6) are laid on the upper surface of the conveyor belt (1), and the wafer boxes (6) are matched with the grinding device (5); the rotating wheel comprises a driving wheel (11) and a driven wheel (12), and a rotating shaft of the driving wheel (11) is connected with the output end of the first motor (13); the wafer box (6) is of a hollow rectangular structure, the upper surface of the wafer box is provided with a rectangular groove, the inner wall of the groove is connected with four arc-shaped spring blocks (61), and the arc surfaces of the four spring blocks (61) are spliced into a cylindrical groove under the thrust of a spring; the bottom plate of the wafer box (6) is of a sandwich structure (62), and a pressure sensor (63) is arranged in the sandwich structure (62); the wafer cassette (6) bottom plate is coated with an adhesive coating.
2. The apparatus of claim 1, wherein: the grinding device (5) comprises a first electric push rod (51), a second motor (52) and a grinding disc (53); the first electric push rod (51) is connected with the lower surface of the top plate (4), the second motor (52) is connected with the output end of the first electric push rod (51), and the sanding disc (53) is connected with the output end of the second motor (52).
3. The apparatus of claim 1, wherein: the grinding device (5) further comprises a spray pipe (54) arranged on one side of the first electric push rod (51), one end of the spray pipe (54) is a conical nozzle, and the other end of the spray pipe is connected with a water pump (55) on the upper surface of the top plate (4).
4. The apparatus of claim 1, wherein: the lower surface of the top plate (4) is also connected with a pressing device (8).
5. The apparatus of claim 4, wherein: the pressing device (8) comprises a second electric push rod (81) and a pressing head (82), the pressing head (82) is connected with the output end of the second electric push rod (81), and a rubber gasket is wrapped on the surface of the pressing head (82).
6. The apparatus of claim 1, wherein: the lower surface of the top plate (4) is also connected with a laser ranging sensor (9).
7. The apparatus of claim 1, wherein: the upper surface of the top plate (4) is provided with a controller (41); the first motor (13), the second motor (52), the pressure sensor (63), the first electric push rod (51), the second electric push rod (81), the water pump (55) and the laser ranging sensor (9) are all electrically connected with the controller (41).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921821762.2U CN210909500U (en) | 2019-10-28 | 2019-10-28 | Wafer grinding device of semiconductor packaging structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201921821762.2U CN210909500U (en) | 2019-10-28 | 2019-10-28 | Wafer grinding device of semiconductor packaging structure |
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| CN210909500U true CN210909500U (en) | 2020-07-03 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560962A (en) * | 2021-07-28 | 2021-10-29 | 安徽鸿海新材料股份有限公司 | Preparation method of copper-clad plate with excellent thickness range |
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2019
- 2019-10-28 CN CN201921821762.2U patent/CN210909500U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560962A (en) * | 2021-07-28 | 2021-10-29 | 安徽鸿海新材料股份有限公司 | Preparation method of copper-clad plate with excellent thickness range |
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