CN210900214U - Electromagnetic shielding and wave-absorbing shielding combined integrated composite material - Google Patents
Electromagnetic shielding and wave-absorbing shielding combined integrated composite material Download PDFInfo
- Publication number
- CN210900214U CN210900214U CN201922189876.6U CN201922189876U CN210900214U CN 210900214 U CN210900214 U CN 210900214U CN 201922189876 U CN201922189876 U CN 201922189876U CN 210900214 U CN210900214 U CN 210900214U
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- layer
- shielding
- heat
- wave
- heat conduction
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- 239000002131 composite material Substances 0.000 title claims abstract description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000741 silica gel Substances 0.000 claims abstract description 23
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 23
- 239000003292 glue Substances 0.000 claims abstract description 20
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 7
- 239000011358 absorbing material Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract 16
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Abstract
The utility model discloses an electromagnetic shielding and wave-absorbing shielding combined integrated composite material, which belongs to the technical field of integrated composite materials, and comprises a wave-absorbing shielding layer, wherein an electromagnetic shielding layer is bonded on the top of the wave-absorbing shielding layer through a high temperature resistant adhesive layer, a heat insulation layer is bonded on the top of the electromagnetic shielding layer, a shielding layer is bonded on the top of the heat insulation layer, a heat conduction silica gel layer is arranged on the top of the shielding layer, a reverse T-shaped heat conduction block is bonded on the bottom of the heat conduction silica gel layer through heat conduction glue, when in installation, the wave-absorbing shielding layer, the electromagnetic shielding layer, the heat insulation layer and the shielding layer are sequentially inserted, then the heat conduction silica gel layer is fixed on the top of the reverse T-shaped heat conduction block through the heat conduction glue, then the bottom of the reverse T-shaped heat conduction block is bonded on the outer wall of an electronic element through the heat conduction glue layer to conduct, and then back to the electronic component outer wall.
Description
Technical Field
The utility model relates to an integral type combined material technical field specifically is an electromagnetic shield and inhale integral type combined material that ripples shielding combines.
Background
In the use process of a precise electronic element (such as a CPU (Central processing Unit), an external magnetic field, static electricity and noise waves all affect the normal work of the electronic element, and the heat generated by the electronic element during work can reduce the service life of the electronic element when the electronic element works in a high-temperature environment for a long time.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an electromagnetic shield and inhale integral type combined material that ripples shielding combines to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an electromagnetic shield and inhale integral type combined material of ripples shielding combination, is including inhaling the wave shielding layer, it has the electromagnetic shield layer to inhale wave shielding layer top and bond through high temperature resistant glue film, electromagnetic shield layer top leads to bond and has the insulating layer, the insulating layer top bonds and has the shielding layer, the shielding layer top is through being equipped with the heat conduction silica gel layer, heat conduction silica gel layer bottom bonds through heat conduction glue has the type of falling T heat conduction piece, the type of falling T heat conduction piece bottom extends to and inhales wave shielding layer bottom outer wall, just inhale wave shielding layer bottom outer wall and evenly be equipped with and fall T type heat conduction piece bottom complex recess.
Further, the inverted T-shaped heat conduction block comprises a heat conduction block body and a heat insulation film arranged on the circumferential outer wall of the heat conduction block body.
Furthermore, the shielding layer is bonded with the heat-conducting silica gel layer through heat-conducting glue, and the thickness of the heat-conducting glue is half of that of the heat-conducting silica gel layer.
Further, the shielding layer includes waterproof layer, flame retardant coating and dampproofing mould proof layer, and glue bonding is passed through with the insulating layer top in dampproofing mould proof layer bottom.
Further, the distance between the two groups of inverted T-shaped heat conducting blocks is the sum of the lengths of the two groups of inverted T-shaped heat conducting blocks.
Furthermore, the wave-absorbing shielding layer is made of heat-conducting high-frequency wave-absorbing materials, and the electromagnetic shielding layer is made of conductive cloth, conductive foam and the like.
Compared with the prior art, the beneficial effects of the utility model are that: when the installation, at first insert in proper order and inhale ripples shielding layer, the electromagnetic shield layer, the insulating layer, the shielding layer, then glue through the heat conduction and fix heat conduction silica gel layer at type of falling T heat conduction piece top, then glue the bonding at the electronic component outer wall through the heat conduction bottom the type of falling T heat conduction piece, dispel the heat on heat conduction to heat conduction silica gel layer, the heat transmission can be avoided for inhaling ripples shielding layer and electromagnetic shield layer to the heat insulating film of type of falling T heat conduction piece outer wall setting, then pass back the electronic component outer wall.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is the structural schematic diagram of the inverted T-shaped heat conducting block of the present invention.
In the figure: 1. a wave-absorbing shielding layer; 2. an electromagnetic shielding layer; 3. a thermal insulation layer; 4. a shielding layer; 5. a heat conductive silica gel layer; 6. an inverted T-shaped heat conducting block; 61. a heat conducting block body; 62. a heat insulating film.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a technical scheme: an electromagnetic shielding and wave-absorbing shielding combined integrated composite material, please refer to fig. 1, which comprises a wave-absorbing shielding layer 1, an electromagnetic shielding layer 2 is adhered on the top of the wave-absorbing shielding layer 1 through a high temperature resistant glue layer, the wave-absorbing shielding layer 1 is adhered on the outer wall of an electronic element through glue, the bottom of an inverted T-shaped heat conduction block 6 is directly contacted with the outer wall of the electronic element at the moment, heat is conducted to a heat conduction silica gel layer 5 for heat dissipation, a heat insulation layer 3 is adhered on the top of the electromagnetic shielding layer 2, the heat insulation layer 3 can prevent the heat from returning to the electromagnetic shielding layer 2 and the wave-absorbing shielding layer 1, a shielding layer 4 is adhered on the top of the heat insulation layer 3, a heat conduction silica gel layer 5 is arranged on the top of the shielding layer 4, the inverted T-shaped heat conduction block 6 is adhered on the bottom of the heat conduction silica gel layer 5 through the heat conduction glue, the bottom of the, when the installation, insert at first and inhale ripples shielding layer 1, electromagnetic shield layer 2, insulating layer 3, shielding layer 4 in proper order, then fix heat conduction silica gel layer 5 at the 6 tops of type of falling T heat conduction piece through heat conduction glue, then bond the type of falling T heat conduction piece 6 bottoms at the electronic component outer wall through heat conduction glue.
Referring to fig. 2, the inverted T-shaped heat conduction block 6 includes a heat conduction block body 61 and a heat insulation film 62 disposed on the circumferential outer wall of the heat conduction block body 61, and the heat insulation film 62 prevents heat from being transferred to the wave-absorbing shielding layer 1 and the electromagnetic shielding layer 2 and then transferred back to the outer wall of the electronic component;
referring to fig. 1, the shielding layer 4 is bonded to the heat-conducting silica gel layer 5 by a heat-conducting adhesive, and the thickness of the heat-conducting adhesive is half of the thickness of the heat-conducting silica gel layer 5, if the heat-conducting silica gel layer is too thin, the heat-conducting silica gel layer 5 is poor in heat transfer effect and is easy to deform by heating, and the heat is transferred to the heat-conducting silica gel layer 5 for heat dissipation;
referring to fig. 1, the shielding layer 4 includes a waterproof layer, a fireproof layer and a moisture-proof and mildew-proof layer, so that the whole material has good waterproof, moisture-proof and fireproof performances, and the bottom of the moisture-proof and mildew-proof layer is bonded with the top of the heat-insulating layer 3 through glue;
referring to fig. 1, the distance between the two sets of inverted T-shaped heat conducting blocks 6 is the sum of the lengths of the two sets of inverted T-shaped heat conducting blocks 6, and if the two sets of inverted T-shaped heat conducting blocks are densely arranged, the damage to the wave absorption shielding layer 1 and the electromagnetic shielding layer 2 is large, so that the shielding effect is reduced;
referring to fig. 1, the wave-absorbing shielding layer 1 is made of a heat-conducting high-frequency wave-absorbing material and has heat-conducting and wave-absorbing functions, and the electromagnetic shielding layer 2 is made of a conductive cloth, a conductive foam and other materials and has the advantage of static electricity prevention.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an electromagnetic shield and inhale integral type combined material who ripples shielding combination, is including inhaling ripples shielding layer (1), its characterized in that: inhale wave shielding layer (1) top and bond through high temperature resistant glue film and have electromagnetic shield layer (2), electromagnetic shield layer (2) top leads to bond and has insulating layer (3), insulating layer (3) top bonds and has shielding layer (4), shielding layer (4) top is through being equipped with heat conduction silica gel layer (5), heat conduction silica gel layer (5) bottom bonds through heat conduction glue has inverted T type heat conduction piece (6), inverted T type heat conduction piece (6) bottom extends to and inhales wave shielding layer (1) bottom outer wall, just inhale wave shielding layer (1) bottom outer wall and evenly be equipped with inverted T type heat conduction piece (6) bottom complex recess.
2. The integrated composite material combining electromagnetic shielding and wave-absorbing shielding according to claim 1, wherein: the inverted T-shaped heat conducting block (6) comprises a heat conducting block body (61) and a heat insulation film (62) arranged on the circumferential outer wall of the heat conducting block body (61).
3. The integrated composite material combining electromagnetic shielding and wave-absorbing shielding according to claim 1, wherein: the shielding layer (4) is bonded with the heat-conducting silica gel layer (5) through heat-conducting glue, and the thickness of the heat-conducting glue is half of that of the heat-conducting silica gel layer (5).
4. The integrated composite material combining electromagnetic shielding and wave-absorbing shielding according to claim 1, wherein: the shielding layer (4) comprises a waterproof layer, a fireproof layer and a moisture-proof and mildew-proof layer, and the bottom of the moisture-proof and mildew-proof layer is bonded with the top of the heat-insulating layer (3) through glue.
5. The integrated composite material combining electromagnetic shielding and wave-absorbing shielding according to claim 1, wherein: the distance between the two groups of inverted T-shaped heat conducting blocks (6) is the sum of the lengths of the two groups of inverted T-shaped heat conducting blocks (6).
6. The integrated composite material combining electromagnetic shielding and wave-absorbing shielding according to claim 1, wherein: the wave-absorbing shielding layer (1) is made of heat-conducting high-frequency wave-absorbing materials, and the electromagnetic shielding layer (2) is made of conductive cloth, conductive foam and the like.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922189876.6U CN210900214U (en) | 2019-12-07 | 2019-12-07 | Electromagnetic shielding and wave-absorbing shielding combined integrated composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922189876.6U CN210900214U (en) | 2019-12-07 | 2019-12-07 | Electromagnetic shielding and wave-absorbing shielding combined integrated composite material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210900214U true CN210900214U (en) | 2020-06-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922189876.6U Expired - Fee Related CN210900214U (en) | 2019-12-07 | 2019-12-07 | Electromagnetic shielding and wave-absorbing shielding combined integrated composite material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210900214U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939175A (en) * | 2021-10-27 | 2022-01-14 | 吉林大学 | Vehicle electromagnetic shielding system |
-
2019
- 2019-12-07 CN CN201922189876.6U patent/CN210900214U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939175A (en) * | 2021-10-27 | 2022-01-14 | 吉林大学 | Vehicle electromagnetic shielding system |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200630 |
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| CF01 | Termination of patent right due to non-payment of annual fee |