CN210900077U

CN210900077U - Semiconductor module for PCBs (printed circuit boards) with different thicknesses

Info

Publication number: CN210900077U
Application number: CN201922377171.7U
Authority: CN
Inventors: 戴六华; 胡文文; 孙坤胜
Original assignee: Wuhan Zhongxunda Electronic Co Ltd
Current assignee: Wuhan Zhongxunda Electronic Co Ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-06-30
Anticipated expiration: 2029-12-26

Abstract

The utility model discloses a semiconductor module for PCB board of different thickness in semiconductor module technical field, including the safety cover, the base is installed to the lower part of safety cover, the roof of base is opened there is the draw-in groove, the inner chamber packing of draw-in groove has the encapsulation to glue, the diapire of safety cover is located the inner chamber of draw-in groove, the inner chamber joint of safety cover has the cooling tube, the outer wall about the safety cover is run through respectively at the both ends of cooling tube, safety cover inner chamber roof bonds there is the bracing piece, buffer spring has been cup jointed to the outer wall of bracing piece, the outer wall joint of bracing piece has fly leaf and locating piece, buffer spring's both ends respectively with the inner chamber roof of safety cover and the roof contact of fly leaf, fly leaf and locating piece fixed connection, the diapire of bracing piece bonds there is the limiting plate, this device simple structure, high durability.

Description

Semiconductor module for PCBs (printed circuit boards) with different thicknesses

Technical Field

The utility model discloses a semiconductor module for PCB board of different thickness specifically is semiconductor module technical field.

Background

And the semiconductor module is connected with an external driving and controlling circuit through the PCB. Different manufacturers may not be designed to match the thickness of the PCB board to which the low power semiconductor module is to be mated, depending on the application and the environment in which it is to be used. For the PCBs with different thicknesses, the protection covers with different sizes are required to be packaged, and for the protection covers with different sizes, the protection covers with different sizes are required to be manufactured by mold opening and injection molding, so that the cost of the semiconductor module is increased linearly.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor module for PCB board of different thickness to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor module for PCB board of different thickness, includes the safety cover, the base is installed to the lower part of safety cover, the roof of base is opened there is the draw-in groove, the inner chamber packing of draw-in groove has the encapsulation to glue, the diapire of safety cover is located the inner chamber of draw-in groove, the inner chamber joint of safety cover has the cooling tube, the both ends of cooling tube run through the safety cover outer wall about respectively, safety cover inner chamber roof bonds there is the bracing piece, buffer spring has been cup jointed to the outer wall of bracing piece, the outer wall joint of bracing piece has fly leaf and locating piece, buffer spring's both ends respectively with the inner chamber roof of safety cover and the roof contact of fly leaf, fly leaf and locating piece fixed connection, the.

Preferably, the outer wall of the radiating pipe is welded with radiating fins.

Preferably, the cross section of the inner cavity of the clamping groove is trapezoidal.

Preferably, the cross section of the positioning block is hemispherical.

Preferably, the cross-sectional length value of the movable plate is greater than the diameter value of the PCB fixing hole.

Compared with the prior art, the beneficial effects of the utility model are that:

1) the device is provided with the clamping groove and the packaging adhesive, when the bottom wall of the protective cover is clamped with the clamping groove, the packaging adhesive is filled, and after the packaging adhesive is solidified, a fixing block with an inverted trapezoid cross section is formed, so that the connecting strength between the clamping groove and the base is improved;

2) this device sets up bracing piece, buffer spring, fly leaf and locating piece, the fixed orifices joint of locating piece and PCB board, and the locating piece adopts the hemisphere locating piece, is applicable to the fixed orifices joint in locating piece and different apertures, and when PCB board thickness increased, locating piece, fly leaf rose along the bracing piece outer wall, and the buffer spring atress compression, this device simple structure, convenient to use effectively improves the joint strength between draw-in groove and base, is applicable to the semiconductor module of the PCB board of different thickness specifications.

Drawings

Fig. 1 is a schematic front view of a semiconductor module according to the present invention;

fig. 2 is a front cross-sectional view of the semiconductor module of the present invention;

fig. 3 is a schematic front view of the positioning block of the present invention.

In the figure: 100 protective covers, 200 bases, 300 radiating pipes, 210 clamping grooves, 211 packaging glue, 300 radiating pipes, 310 radiating fins, 400 supporting rods, 410 buffer springs, 420 movable plates and 430 positioning blocks.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a semiconductor module for PCB boards with different thicknesses, which effectively improves the connection strength between a clamping groove and a base, is suitable for the semiconductor module for PCB boards with different thickness specifications, please refer to fig. 1 and fig. 2, and comprises a protective cover 100;

referring to fig. 1 and fig. 2 again, a base 200 is installed at the lower part of the protection cover 100, a clamping groove 210 is formed on the top wall of the base 200, an inner cavity of the clamping groove 210 is filled with an encapsulation adhesive 211, the bottom wall of the protection cover 100 is located in the inner cavity of the clamping groove 210, the clamping groove 210 is used for clamping the bottom wall of the protection cover 100, and the encapsulation adhesive 211 is used for connecting the protection cover 100 and the base 200;

referring to fig. 1 and 2 again, the heat dissipation pipe 300 is fastened to the inner cavity of the protective cover 100, two ends of the heat dissipation pipe 300 respectively penetrate through the left and right outer walls of the protective cover 100, and the heat dissipation pipe 300 is used for dissipating heat of the semiconductor module;

referring to fig. 2 and 3, a supporting rod 400 is bonded to a top wall of an inner cavity of the protective cover 100, a buffer spring 410 is sleeved on an outer wall of the supporting rod 400, a movable plate 420 and a positioning block 430 are clamped to an outer wall of the supporting rod 400, two ends of the buffer spring 410 are respectively in contact with the top wall of the inner cavity of the protective cover 100 and the top wall of the movable plate 420, the movable plate 420 is fixedly connected with the positioning block 430, a limiting plate is bonded to a bottom wall of the supporting rod 400, the supporting rod 400 is used for bearing the buffer spring 410, the movable plate 420 and the positioning block 430, and the buffer spring 410 is used for enabling;

referring to fig. 2, the outer wall of the heat dissipating tube 300 is welded with heat dissipating fins 310, so as to increase the contact area between the heat dissipating tube 300 and hot air and increase the heat dissipating efficiency of the heat dissipating tube 300;

referring to fig. 2 again, the cross section of the inner cavity of the clamping groove 210 is trapezoidal, so that the packaging adhesive 211 is solidified to form a trapezoidal block, and the connection strength between the base 200 and the protective cover 100 is improved;

referring to fig. 2 again, the cross section of the positioning block 430 is hemispherical, so that the positioning block 430 can conveniently enter the positioning holes of the PCB, and the hemispherical shape is suitable for clamping the positioning holes with different inner diameters;

referring to fig. 3, the cross-sectional length of the movable plate 420 is greater than the diameter of the PCB fixing hole, so as to prevent the movable plate 420 from entering the PCB fixing hole.

While the invention has been described above with reference to certain embodiments, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the various features of the various embodiments disclosed herein can be used in any combination with one another, and the description of such combinations that is not exhaustive in this specification is merely for brevity and resource saving. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims

1. A semiconductor module for PCBs of different thicknesses, comprising a protective cover (100), characterized in that: the protective cover is characterized in that a base (200) is installed at the lower part of the protective cover (100), a clamping groove (210) is formed in the top wall of the base (200), packaging glue (211) is filled in an inner cavity of the clamping groove (210), the bottom wall of the protective cover (100) is located in the inner cavity of the clamping groove (210), a radiating pipe (300) is clamped in the inner cavity of the protective cover (100), two ends of the radiating pipe (300) penetrate through the left outer wall and the right outer wall of the protective cover (100) respectively, a supporting rod (400) is bonded on the top wall of the inner cavity of the protective cover (100), a buffer spring (410) is sleeved on the outer wall of the supporting rod (400), a movable plate (420) and a positioning block (430) are clamped on the outer wall of the supporting rod (400), two ends of the buffer spring (410) are in contact with the top wall of the, and a limiting plate is bonded on the bottom wall of the supporting rod (400).

2. A semiconductor module for PCB boards of different thickness according to claim 1, wherein: the outer wall of the radiating pipe (300) is welded with radiating fins (310).

3. A semiconductor module for PCB boards of different thickness according to claim 1, wherein: the cross section of the inner cavity of the clamping groove (210) is trapezoidal.

4. A semiconductor module for PCB boards of different thickness according to claim 1, wherein: the cross section of the positioning block (430) is hemispherical.

5. A semiconductor module for PCB boards of different thickness according to claim 1, wherein: the cross section length value of the movable plate (420) is larger than the diameter value of the PCB fixing hole.