CN210899794U - 3D cooling temperature control copper foil - Google Patents
3D cooling temperature control copper foil Download PDFInfo
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- CN210899794U CN210899794U CN201921319923.8U CN201921319923U CN210899794U CN 210899794 U CN210899794 U CN 210899794U CN 201921319923 U CN201921319923 U CN 201921319923U CN 210899794 U CN210899794 U CN 210899794U
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Abstract
A3D cooling temperature control copper foil comprises a first electrolytic copper layer, a composite material layer, a second electrolytic copper layer and a double-sided tape layer; the composite material layer is formed by mixing chain-shaped conductive nickel powder, graphene and conductive powder, the first copper electrolysis layer, the composite material layer, the second copper electrolysis layer and the double-sided adhesive tape layer are sequentially stacked, a first phase-change mud layer is arranged between the first copper electrolysis layer and the composite material layer, and a second phase-change mud layer is arranged between the second copper electrolysis layer and the double-sided adhesive tape layer; compared with the prior art, the beneficial effects of the utility model reside in that: the first copper electrolysis layer, the second copper electrolysis layer and the composite material can conduct heat and electricity in all directions, so that heat is distributed uniformly, resistance is low, heat productivity can be reduced, heat can be stored through the first phase change mud layer and the second phase change mud layer, and heat dissipation is carried out when the heating body stops heating.
Description
[ technical field ] A method for producing a semiconductor device
The utility model relates to a printed wiring board and heat dissipation technical field, specificly relate to a 3D cooling accuse temperature copper foil.
[ background of the invention ]
Printed circuit boards, also known as printed circuit boards, are providers of electrical connections for electronic components. The circuit board has the main advantages of greatly reducing errors of wiring and assembly, and improving the automation level and the production labor rate. Copper foil, an anionic electrolytic material, is often used on printed circuit boards, and is deposited as a thin, continuous metal foil on the substrate layer of the board, which serves as the electrical conductor of the PCB. It is easy to adhere to the insulating layer, receive the printing protective layer, form the circuit pattern after corroding.
However, the existing copper foil has poor performance, and when the copper foil is applied to a printed circuit board, the copper foil has poor electric conduction and heat dissipation performance, can generate a large amount of heat, has long cooling time and high internal resistance, can also generate a large amount of heat per se, and cannot control the temperature per se.
In view of the above, it is desirable to provide a 3D cooling temperature-controlled copper foil to overcome the deficiencies of the prior art.
[ Utility model ] content
The utility model aims at providing a 3D cooling accuse temperature copper foil, aim at making heat distribution even, the resistance is low, can reduce calorific capacity, can carry out the heat-retaining, when the heat-generating body stops to generate heat, dispels the heat again.
In order to achieve the above object, the utility model provides a 3D cooling accuse temperature copper foil, including first electrolytic copper layer, conductive composite layer, second electrolytic copper layer and double faced adhesive tape layer;
the conductive composite material layer is formed by sequentially stacking the first copper electrolysis layer, the conductive composite material layer, the second copper electrolysis layer and the double-sided adhesive tape layer, a first phase-change mud layer is arranged between the first copper electrolysis layer and the conductive composite material layer, and a second phase-change mud layer is arranged between the second copper electrolysis layer and the double-sided adhesive tape layer.
In a preferred embodiment, the double-sided tape layer is a conductive double-sided tape.
In a preferred embodiment, the double-sided tape layer is an insulating double-sided tape.
In a preferred embodiment, the 3D cooled temperature controlled copper foil is in a roll form.
In a preferred embodiment, the thickness of the first phase-change mud layer and the second phase-change mud layer is 0.1-0.7 mm. Preferably 0.4 mm.
Compared with the prior art, the utility model provides a pair of 3D cools off accuse temperature copper foil's beneficial effect lies in: the first copper electrolysis layer, the second copper electrolysis layer and the composite material can conduct heat and electricity in all directions, so that heat is distributed uniformly, resistance is low, heat productivity can be reduced, heat can be stored through the first phase change mud layer and the second phase change mud layer, and heat dissipation is carried out when the heating body stops heating.
[ description of the drawings ]
Fig. 1 is the structure schematic diagram of the 3D cooling temperature control copper foil provided by the present invention.
Fig. 2 is a perspective view of the 3D cooled temperature controlled copper foil shown in fig. 1.
[ detailed description ] embodiments
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
Referring to fig. 1, the present invention provides a 3D cooling temperature-controlled copper foil 100.
In the embodiment of the present invention, the 3D cooling temperature-controlled copper foil 100 includes a first electrolytic copper layer 10, a conductive composite layer 20, a second electrolytic copper layer 30, and a double-sided tape layer 40.
Specifically, the first copper electrolytic layer 10, the conductive composite layer 20, the second copper electrolytic layer 30 and the double-sided tape layer 40 of the conductive composite layer are sequentially stacked, a first phase change mud layer 50 is arranged between the first copper electrolytic layer 10 and the conductive composite layer 20, and a second phase change mud layer 60 is arranged between the second copper electrolytic layer 30 and the double-sided tape layer 40.
When the 3D cooling temperature control copper foil 100 is used, the 3D cooling temperature control copper foil can be directly pasted on heating bodies such as a circuit board or a battery and the like through the double-sided adhesive tape layer 40, and the first electrolytic copper layer 10, the second electrolytic copper layer 30 and the composite material can conduct heat and electricity in all directions, so that heat is uniformly distributed, the resistance is low, and the heating value can be reduced; when the temperature reaches 37-45 ℃, heat can be stored through the first phase change mud layer 50 and the second phase change mud layer 60, and when the heating body stops heating, heat is dissipated.
In one embodiment, the double-sided tape layer 40 is a conductive double-sided tape. The 3D cooling temperature control copper foil 100 can be used for conducting while achieving temperature reduction, and for example, the 3D cooling temperature control copper foil 100 can be used for conducting heat and grounding while radiating.
In one embodiment, the double-sided tape layer 40 is an insulating double-sided tape. The 3D cooling temperature control copper foil 100 is prevented from conducting through an insulating double-sided adhesive tape, for example, when the 3D cooling temperature control copper foil 100 is attached to a circuit board, short circuit caused by the fact that the 3D cooling temperature control copper foil 100 conducts electricity is prevented.
In one embodiment, referring to fig. 2, the 3D cooled temperature controlled copper foil 100 is in a roll shape.
In one embodiment, the thickness of the first phase-change mud layer 50 and the second phase-change mud layer 60 is 0.1-0.7 mm. Preferably 0.4 mm.
Compared with the prior art, the utility model provides a pair of 3D cools off accuse temperature copper foil's beneficial effect lies in: the first copper electrolysis layer, the second copper electrolysis layer and the composite material can conduct heat and electricity in all directions, so that heat is distributed uniformly, resistance is low, heat productivity can be reduced, heat can be stored through the first phase change mud layer and the second phase change mud layer, and heat dissipation is carried out when the heating body stops heating.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A3D cooling accuse temperature copper foil which characterized in that: comprises a first copper electrolytic layer, a conductive composite material layer, a second copper electrolytic layer and a double-sided adhesive tape layer;
the conductive composite material layer is formed by sequentially stacking the first copper electrolysis layer, the conductive composite material layer, the second copper electrolysis layer and the double-sided adhesive tape layer, a first phase-change mud layer is arranged between the first copper electrolysis layer and the conductive composite material layer, and a second phase-change mud layer is arranged between the second copper electrolysis layer and the double-sided adhesive tape layer.
2. The 3D-cooled temperature controlled copper foil according to claim 1, wherein: the double-sided adhesive tape layer is a conductive double-sided adhesive tape.
3. The 3D-cooled temperature controlled copper foil according to claim 1, wherein: the double-sided adhesive tape layer is an insulating double-sided adhesive tape.
4. The 3D-cooled temperature controlled copper foil according to claim 1, wherein: the 3D cooling temperature control copper foil is in a roll shape.
5. The 3D-cooled temperature controlled copper foil according to claim 1, wherein: the thickness of the first phase change mud layer and the second phase change mud layer is 0.1-0.7 mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201921319923.8U CN210899794U (en) | 2019-08-14 | 2019-08-14 | 3D cooling temperature control copper foil |
Applications Claiming Priority (1)
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CN201921319923.8U CN210899794U (en) | 2019-08-14 | 2019-08-14 | 3D cooling temperature control copper foil |
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CN210899794U true CN210899794U (en) | 2020-06-30 |
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2019
- 2019-08-14 CN CN201921319923.8U patent/CN210899794U/en active Active
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