CN210868559U

CN210868559U - Mobile phone radiator

Info

Publication number: CN210868559U
Application number: CN201921848120.1U
Authority: CN
Inventors: 刘国维
Original assignee: Shenzhen Maige Technology Co ltd
Current assignee: Shenzhen Maige Technology Co ltd
Priority date: 2019-10-30
Filing date: 2019-10-30
Publication date: 2020-06-26
Anticipated expiration: 2029-10-30

Abstract

The utility model discloses a mobile phone radiator, it includes fan, shell, heat conduction bottom, semiconductor cooler, heat dissipation aluminium pig, heat conduction cushion, sucking disc, circuit board, connector and pilot lamp. When the mobile phone cover is used, the mobile phone cover can be quickly adsorbed and positioned on the back of a mobile phone through the sucking disc, the fit clearance between the heat conduction bottom cover and the back of the mobile phone can be fully filled through the heat conduction rubber pad, the fit effect of the heat conduction bottom cover and the back of the mobile phone is improved, the fit is tight, and the heat conduction effect is good; the semiconductor refrigerator can rapidly absorb the heat of the mobile phone which is transmitted through the heat-conducting rubber pad and the heat-conducting bottom cover in sequence to generate heat exchange, so that the mobile phone can achieve the purpose of rapid cooling, and the normal operation of the mobile phone is ensured; in the process of continuous heat exchange, the heat generated by the semiconductor refrigerator can be rapidly expanded to the heat dissipation aluminum block to be dissipated, and meanwhile, the active heat dissipation mode of the fan is matched, so that the heat dissipation speed of the heat dissipation aluminum block is further accelerated, and the heat dissipation effect is good.

Description

Mobile phone radiator

Technical Field

The utility model relates to a cell-phone accessory technique, in particular to cell-phone radiator.

Background

Along with the rise of smart phones, the dominant frequency of chips is higher and higher, especially the requirement of game mobile phones on the running speed, a large amount of heat can be generated, if the heat can not be dissipated in time, the thermal sensation of heat source parts is strong, the comfort is influenced when the mobile phones generate heat, the performance and the running speed of the mobile phones are influenced when the mobile phones generate heat, and hardware can be burnt out. When the mobile phone operates, the battery outputs current, heat can be generated when the battery passes through each part, and the heat generated by the operation of the mobile phone is mainly led out through the back. The main parts of the mobile phone generating heat are a CPU, an electric plate, a battery and the like, and the reasons for overheating the mobile phone mainly include three aspects: firstly, the resistance of the component is too large; secondly, heat conduction is insufficient, heat dissipation is unreasonable, heat is accumulated in the mobile phone, and a certain part of the mobile phone is overheated; thirdly, the CPU runs for a long time and the power is increased. The heat generated by the components is guided into the interlayer with large heat capacity by the radiating fins and then is radiated out through the mobile phone shell and the radiating holes, so that the back of the mobile phone is heated when the mobile phone is used, the mobile phone is uncomfortable to hold, the performance of the mobile phone is seriously influenced, the running speed is obviously slowed down, and the problems of the dead halt of the mobile phone, the explosion of a battery and the like are caused when the mobile phone is seriously used, so that the service life of the mobile phone is influenced.

SUMMERY OF THE UTILITY MODEL

To the above, the utility model aims to provide a structural design is ingenious, reasonable, cell-phone radiator that the radiating effect is good.

The utility model discloses a realize above-mentioned purpose, the technical scheme that provides is: a mobile phone radiator comprises a fan, a shell, a heat conduction bottom cover, a semiconductor refrigerator, a heat dissipation aluminum block, a heat conduction rubber pad and a sucker, wherein the bottom surface of the shell is provided with an opening, a high heat dissipation sheet group and a low heat dissipation sheet group are distributed on the upper surface of the heat dissipation aluminum block, a concave position matched with the outline of the fan is formed on the upper surface of the low heat dissipation sheet group, the heat dissipation aluminum block is installed in the shell through a first screw and fixes the fan on the concave position in a positioning manner, a top surface ventilation hole is formed in the top surface of the shell corresponding to the position of the fan, a side surface ventilation hole is formed in the side wall of the shell, at least two limiting blocks are arranged on the bottom surface of the heat dissipation aluminum block, an accommodating cavity for placing the semiconductor refrigerator is formed between the two limiting blocks, the heat conduction bottom cover is fixed on the limiting blocks through a second screw, the opening of the shell is closed, the heat-conducting rubber pad is arranged on the bottom surface of the heat-conducting bottom cover, and the suckers are arranged at the peripheral position of the heat-conducting bottom cover.

As an improvement of the utility model, it still includes circuit board, connector and pilot lamp, the circuit board is fixed in the shell, connector and pilot lamp are fixed on this circuit board, the connector respectively with pilot lamp, fan and semiconductor refrigerator are connected, be equipped with on the shell and let the exerted socket of connector and let the exerted demonstration mouth of pilot lamp.

As an improvement of the utility model, the both ends of circuit board are equipped with the mounting hole.

As an improvement of the utility model, the stopper is the hexagonal copper post, and the upper end riveting of this hexagonal copper post is equipped with the screw hole on the lower terminal surface of this hexagonal copper post on the heat dissipation aluminium pig.

As an improvement of the utility model, the head of first screw is spacing to the left and right sides position of semiconductor refrigerator, the stopper is spacing to the front and back position of semiconductor refrigerator.

As an improvement of the present invention, the side vent hole is a long strip.

As an improvement of the utility model, the heat conduction bottom is aluminum plate.

As an improvement of the utility model, the appearance profile of heat conduction bottom is square, the quantity of sucking disc is four, is located respectively four bight positions of heat conduction bottom.

As an improvement of the utility model, the corner of the heat-conducting rubber mat is provided with an arc-shaped clearance.

As an improvement of the utility model, the lower surface of the semiconductor refrigerator is a refrigerating surface and is closely attached to the upper surface of the heat-conducting bottom cover; the upper surface of the semiconductor refrigerator is a heating surface and is tightly attached to the lower surface of the heat dissipation aluminum block.

The utility model has the advantages that: the utility model has the advantages of ingenious and reasonable structural design, when in use, the mobile phone can be quickly adsorbed and positioned on the back of the mobile phone through the sucker, and the fit clearance between the heat conduction bottom cover and the back of the mobile phone can be fully filled through the heat conduction rubber pad, so that the laminating effect of the heat conduction bottom cover and the back of the mobile phone is improved, the fit is tight, and the heat conduction effect is good; the semiconductor refrigerator can rapidly absorb the heat of the mobile phone which is transmitted through the heat-conducting rubber pad and the heat-conducting bottom cover in sequence to generate heat exchange, so that the mobile phone can achieve the purpose of rapid cooling, and the normal operation of the mobile phone is ensured; in the process of continuous heat exchange, the heat generated by the semiconductor refrigerator can be rapidly expanded to the heat dissipation aluminum block to be dissipated, and meanwhile, the active heat dissipation mode of the fan is matched, so that the heat dissipation speed of the heat dissipation aluminum block is further accelerated, and the heat dissipation effect is good.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of an exploded structure of the present invention.

Fig. 3 is a schematic diagram of an exploded structure of the present invention.

Detailed Description

Example (b): referring to fig. 1, 2 and 3, the present embodiment provides a heat sink for a mobile phone, which includes a fan 1, a housing 2, a heat conductive bottom cover 3, a semiconductor cooler 4, a heat dissipation aluminum block 5, a heat conductive rubber pad 6, a suction cup 7, a circuit board 8, a connector 9 and an indicator light 10. In this embodiment, the heat conductive bottom cover 3 is preferably an aluminum plate, and in other embodiments, the heat conductive bottom cover 3 may also be a copper plate or other plate with high heat conductive efficiency. The connector 9 may be a Mini-USB, Micro USB, Type-C or other connector having a connection function.

The bottom surface of the housing 2 has an opening 23. The upper surface of the heat dissipation aluminum block 5 is provided with a high heat dissipation sheet group 51 and a low heat dissipation sheet group 52, a concave 53 matched with the outline of the fan 1 is formed on the low heat dissipation sheet group 52, the heat dissipation aluminum block 5 is installed in the shell 2 through a first screw, and the fan 1 is positioned and fixed on the concave 53 through the clamping force between the heat dissipation aluminum block 5 and the inner wall of the shell 2. Set up fan 1 through concave position 53, the cooperation is compact, reduces occupation space, and attenuate thickness promotes the convenience of use. Preferably, the four corners of the fan 1 are provided with through holes, and the first screws pass through the through holes and are screwed into the housing 2, so that the fixing stability of the fan 1 can be further improved.

The top surface of the housing 2 is provided with a top surface vent 21 corresponding to the position of the fan 1, and the side wall of the housing 2 is provided with a side vent 22, in this embodiment, the side vent 22 is in a long strip shape, and in other embodiments, the side vent 22 may also be in a mesh shape, etc.

The bottom surface of the heat dissipation aluminum block 5 is at least provided with two limiting blocks 54, an accommodating cavity for placing the semiconductor refrigerator 4 is formed between the two limiting blocks 54, in this embodiment, the limiting blocks 54 are hexagonal copper columns, the upper ends of the hexagonal copper columns are riveted on the heat dissipation aluminum block 5, and the lower end surfaces of the hexagonal copper columns are provided with threaded holes. In other embodiments, the stop block 54 may also be a boss, and a threaded hole is formed on the surface of the boss.

The heat conducting bottom cover 3 is fixed on the limiting block 54 through a second screw, and positions the semiconductor refrigerator 4 on the accommodating cavity and closes the opening 23 of the shell 2. Specifically, the lower surface of the semiconductor refrigerator 4 is a refrigerating surface and is tightly attached to the upper surface of the heat-conducting bottom cover 3; the upper surface of the semiconductor refrigerator 4 is a heating surface and is closely attached to the lower surface of the heat dissipation aluminum block 5. Preferably, the head of the first screw is used for limiting the positions of the left side and the right side of the semiconductor refrigerator 4, and the limiting block 54 is used for limiting the front position and the rear position of the semiconductor refrigerator 4, so that the positioning effect is good.

The heat-conducting rubber pad 6 is arranged on the bottom surface of the heat-conducting bottom cover 3, and the suckers 7 are arranged at the peripheral position of the heat-conducting bottom cover 3. Specifically, the outline of the heat-conducting bottom cover 3 is square, and the number of the suction cups 7 is four, and the four suction cups are respectively located at four corner positions of the heat-conducting bottom cover 3. The heat-conducting rubber pad 6 is preferably a heat-conducting silica gel pad which is fully distributed on the bottom surface of the heat-conducting bottom cover 3, wherein the corner of the heat-conducting rubber pad 6 is provided with an arc-shaped vacancy-avoiding position 61, so that interference and blocking of the sucker 7 and an open hole for installing the sucker 7 on the heat-conducting bottom cover 3 are avoided.

The both ends of circuit board 8 are equipped with the mounting hole, pass the mounting hole through the screw and fix in shell 2, connector 9 and pilot lamp 10 are fixed on this circuit board 8, connector 9 respectively with pilot lamp 10, fan 1 and semiconductor refrigerator 4 are connected, be equipped with on shell 2 and let connector 9 exposed socket 24 and let pilot lamp 10 exposed demonstration mouth 25.

When using, the utility model discloses cell-phone radiator passes through sucking disc 7 can adsorb the location fast at the back of cell-phone, can fully fill the fit clearance between the heat conduction bottom 3 and the cell-phone back through heat conduction cushion 6, promotes the laminating effect at the heat conduction bottom 3 and the cell-phone back, and the cooperation is inseparable. The power plug is connected with the connector 9 to realize the purpose of providing power. After the power supply is switched on, the indicator lamp 10 is turned on, the fan 1 rotates and the semiconductor refrigerator 4 starts to refrigerate, the heat of the mobile phone which is transmitted through the heat-conducting rubber pad 6 and the heat-conducting bottom cover 3 in sequence can be rapidly absorbed through the semiconductor refrigerator 4 to generate heat exchange, so that the purpose of rapidly cooling the mobile phone can be achieved, and the normal operation of the mobile phone is ensured; in the process of continuous heat exchange, the heat generated by the semiconductor refrigerator 4 can be rapidly expanded to the heat dissipation aluminum block 5 to be dissipated, and meanwhile, the active heat dissipation mode of the fan 1 is matched, so that the heat dissipation speed of the heat dissipation aluminum block 5 is effectively accelerated, and the heat dissipation effect is good.

Variations and modifications to the above-described embodiments may occur to those skilled in the art, in light of the above teachings and teachings. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and some modifications and changes to the present invention should fall within the protection scope of the claims of the present invention. In addition, although specific terms are used in the specification, the terms are used for convenience of description and do not limit the present invention, and other heat sinks similar or identical to the terms are also within the scope of the present invention.

Claims

1. A mobile phone radiator comprises a fan and is characterized by further comprising a shell, a heat-conducting bottom cover, a semiconductor refrigerator, a heat-radiating aluminum block, a heat-conducting rubber pad and a sucker, wherein the bottom surface of the shell is provided with an opening, a high heat-radiating sheet group and a low heat-radiating sheet group are distributed on the upper surface of the heat-radiating aluminum block, a concave position matched with the outline of the fan is formed on the upper surface of the low heat-radiating sheet group, the heat-radiating aluminum block is installed in the shell through a first screw and fixedly fixes the fan on the concave position in a positioning manner, a top surface ventilation hole is formed in the top surface of the shell corresponding to the position of the fan, a side surface ventilation hole is formed in the side wall of the shell, at least two limiting blocks are arranged on the bottom surface of the heat-radiating aluminum block, an accommodating cavity for placing the semiconductor refrigerator is formed between, and the semiconductor refrigerator is positioned on the accommodating cavity, the opening of the shell is sealed, the heat-conducting rubber pad is arranged on the bottom surface of the heat-conducting bottom cover, and the sucker is arranged at the peripheral position of the heat-conducting bottom cover.

2. The heat sink for mobile phone as claimed in claim 1, further comprising a circuit board, a connector and an indicator light, wherein the circuit board is fixed in the housing, the connector and the indicator light are fixed on the circuit board, the connector is respectively connected with the indicator light, the fan and the semiconductor refrigerator, and the housing is provided with a socket for exposing the connector and a display port for exposing the indicator light.

3. The heat sink for mobile phone according to claim 2, wherein the circuit board has mounting holes at both ends.

4. The mobile phone radiator of claim 1, wherein the limiting block is a hexagonal copper cylinder, the upper end of the hexagonal copper cylinder is riveted on the radiating aluminum block, and the lower end face of the hexagonal copper cylinder is provided with a threaded hole.

5. The mobile phone radiator according to claim 1 or 4, wherein the head of the first screw limits the left and right positions of the semiconductor refrigerator, and the limiting blocks limit the front and rear positions of the semiconductor refrigerator.

6. The heat sink of claim 1, wherein said side vents are elongated.

7. The heat sink of claim 1, wherein the thermally conductive bottom cover is an aluminum plate.

8. The heat sink for cellular phone as claimed in claim 1 or 7, wherein the heat conductive bottom cover has a square shape, and the number of the suction cups is four, respectively located at four corners of the heat conductive bottom cover.

9. The heat sink for mobile phone as claimed in claim 7, wherein the corner of the thermal pad is provided with an arc-shaped space.

10. The heat radiator for the mobile phone according to claim 1, wherein the lower surface of the semiconductor refrigerator is a refrigerating surface and is closely attached to the upper surface of the heat-conducting bottom cover; the upper surface of the semiconductor refrigerator is a heating surface and is tightly attached to the lower surface of the heat dissipation aluminum block.