CN210778655U

CN210778655U - SMD LED lamp pearl

Info

Publication number: CN210778655U
Application number: CN201921666656.1U
Authority: CN
Inventors: 唐勇
Original assignee: YLin Electronics Co ltd
Current assignee: YLin Electronics Co ltd; Yonglin Electronics Co Ltd
Priority date: 2019-10-08
Filing date: 2019-10-08
Publication date: 2020-06-16
Anticipated expiration: 2029-10-08

Abstract

The utility model discloses a SMD LED lamp pearl. The LED lamp bead comprises an LED lamp bead body; and the insulating baffle is arranged on the lower end face of the LED lamp bead body, is matched with the PCB and is used for separating solder paste to avoid short circuit of the LED lamp bead body. By adopting the scheme, the lamp bead has the advantages of being convenient to install, fast in heat dissipation, and capable of greatly prolonging the service life of the lamp bead, and meanwhile, the insulating baffle is adopted, so that the problem of short circuit caused by climbing of solder paste is greatly avoided.

Description

SMD LED lamp pearl

Technical Field

The utility model relates to a LED field especially relates to a SMD LED lamp pearl.

Background

The English language of the LED is (light emitting diode), and the LED lamp bead is the English abbreviation of the LED which is called LED for short, which is a popular name.

The working principle is as follows: the terminal voltage of the PN junction forms a certain potential barrier, when a forward bias voltage is applied, the potential barrier is lowered, and most carriers in the P region and the N region diffuse to each other. Since electron mobility is much greater than hole mobility, a large number of electrons will diffuse into the P region, constituting an injection of minority carriers into the P region. These electrons recombine with holes in the valence band and the energy obtained upon recombination is released as light energy. This is the principle of PN junction luminescence.

The general radiating effect of the surface mount type LED lamp beads on the market is poor, more than seventy percent of electric energy is converted into heat energy, and if the heat energy can not be quickly dissipated, the service life of the LED lamp beads can be seriously influenced.

Meanwhile, when the LED lamp beads are fixedly welded with the PCB, the LED lamp beads are small, and solder paste easily climbs to cause short circuit when the solder paste is in a large solder amount.

Therefore, a patch type LED lamp bead capable of solving one or more of the above problems is urgently needed in the market.

SUMMERY OF THE UTILITY MODEL

For solving one or more problems that exist among the prior art, the utility model provides a SMD LED lamp pearl.

The utility model discloses a reach the technical scheme that above-mentioned purpose adopted and be: the utility model provides a SMD LED lamp pearl, SMD LED lamp pearl includes:

an LED lamp bead body; and

the insulating baffle that separates, the insulating baffle setting of separating is in on the terminal surface under the LED lamp pearl body, with PCB board cooperation for separate shelves tin cream, avoid LED lamp pearl body short circuit.

In some embodiments, the LED bead body comprises:

the high-heat-conductivity ceramic base is provided with at least one clamping groove;

the reflecting cup is provided with a bowl-shaped reflecting cavity and two guide plates matched with the high-heat-conductivity ceramic base;

the positive and negative pins are integrally formed on the reflection cup, one end of each positive and negative pin extends into the reflection cavity, and the other end of each positive and negative pin extends to the position below the high-thermal-conductivity ceramic base along the guide plate;

the light-emitting chip is arranged on the high-heat-conductivity ceramic base and is electrically connected with the positive and negative pins; and

the fluorescent glue is encapsulated in the reflection cavity and encapsulates the light-emitting chip;

when the reflection cup is matched with the high-heat-conductivity ceramic base, the positive and negative pins are matched with the clamping grooves and used for limiting the relative motion between the high-heat-conductivity ceramic base and the reflection cup.

In some embodiments, at least one side of the ceramic base with high thermal conductivity is provided with heat dissipation fins for dissipating heat.

In some embodiments, the positive and negative electrode pins comprise:

the first pin is matched with the upper surface of the high-heat-conductivity ceramic base;

the second pin is matched with the side surface of the high-heat-conductivity ceramic base;

the third pin is matched with the bottom surface of the high-heat-conductivity ceramic base; and

and the fourth pin is connected with the third pin, the upper end surface of the fourth pin is matched with the bottom surface of the high-heat-conductivity ceramic base, and the bottom surface of the fourth pin is flush with the bottom surface of the guide plate.

In some embodiments, the number of the clamping grooves is two, and the two clamping grooves are respectively matched with the positive and negative pins.

In some embodiments, after the positive and negative pins are matched with the clamping grooves, the upper end surfaces of the first pins are flush with the upper surface of the high-thermal-conductivity ceramic base.

In some embodiments, the sides of the positive and negative pins are provided with an oblique opening for facilitating the fitting of the reflection cup on the high thermal conductivity ceramic base.

In some embodiments, the reflective chamber interior surface is provided with a high reflectivity coating.

The utility model has the advantages that: the utility model comprises a high heat-conducting ceramic base, wherein at least one clamping groove is arranged on the high heat-conducting ceramic base; the reflecting cup is provided with a bowl-shaped reflecting cavity and two guide plates matched with the high-heat-conductivity ceramic base; the positive and negative pins are integrally formed on the reflection cup, one end of each positive and negative pin extends into the reflection cavity, and the other end of each positive and negative pin extends to the position below the high-thermal-conductivity ceramic base along the guide plate; the light-emitting chip is arranged on the high-heat-conductivity ceramic base and is electrically connected with the positive and negative pins; by adopting the scheme, the lamp bead has the advantages of being convenient to install, fast in heat dissipation, and capable of greatly prolonging the service life of the lamp bead, and meanwhile, the insulating baffle is adopted, so that the problem of short circuit caused by climbing of solder paste is greatly avoided.

Drawings

Fig. 1 is a schematic structural view of a surface mount type LED lamp bead according to a preferred embodiment of the present invention without a light emitting chip and fluorescent glue;

fig. 2 is a cross-sectional view along the direction a-a in fig. 1 of a surface mount type LED lamp bead according to a preferred embodiment of the present invention;

fig. 3 is an exploded view of the surface mounted LED lamp bead with the light emitting chip and the fluorescent glue omitted according to a preferred embodiment of the present invention;

fig. 4 is a schematic view of an assembly structure of a reflection cup and positive and negative pins in a surface mount LED lamp bead according to a preferred embodiment of the present invention;

fig. 5 is a schematic structural view of a patch type LED light bar according to a preferred embodiment of the present invention;

fig. 6 is a cross-sectional view along the direction of a portion B-B in fig. 5 of a surface mount type LED strip according to a preferred embodiment of the present invention.

Detailed Description

In order to make the above objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, as those skilled in the art will be able to make similar modifications without departing from the spirit and scope of the present invention.

Referring to fig. 1-6, the utility model discloses a SMD LED lamp pearl, SMD LED lamp pearl includes:

the high-heat-conductivity ceramic base 10 is provided with at least one clamping groove 11;

the reflecting cup 20 is provided with a bowl-shaped reflecting chamber 21, and the reflecting cup 20 is provided with two guide plates 22 matched with the high-thermal-conductivity ceramic base 10;

the positive and negative pins 30 are integrally formed on the reflection cup 20, one end of each positive and negative pin 30 extends into the reflection chamber 21, and the other end of each positive and negative pin 30 extends to the lower part of the high-thermal-conductivity ceramic base 10 along the guide plate 22;

a light emitting chip (not shown) disposed on the high thermal conductivity ceramic base 10 and electrically connected to the positive and negative leads 30; and

fluorescent glue (not shown) which is encapsulated in the reflection chamber 21 to encapsulate the light emitting chip;

when the reflection cup 20 is matched with the high thermal conductivity ceramic base 10, the positive and negative electrode pins 30 are matched with the clamping grooves 11 to limit the relative movement between the high thermal conductivity ceramic base 10 and the reflection cup 20.

Specifically, in the installation of this embodiment, after the guide block is matched with the high thermal conductivity ceramic base 10, a thrust is applied to the guide block, the whole reflection cup 20 is matched with the high thermal conductivity ceramic base 10, and finally, the positive and negative electrode pins 30 are clamped and fixed with the clamping groove 11, so as to complete the installation of the two.

After the mounting is completed, die bonding is performed on the light emitting chip (not shown in the figure) on the high thermal conductivity ceramic base 10, it should be noted that the light emitting chip (not shown in the figure) and the high thermal conductivity ceramic base 10 are connected by using thermal conductive silicone grease, which is convenient for heat transfer, and after the fixing is completed, the positive and negative electrodes of the light emitting chip (not shown in the figure) are connected with the positive and negative electrode pins 30 by using gold wires, so as to implement circuit connection of the whole diode.

Finally, fluorescent glue is filled and sealed in the reflection chamber 21 of the reflection cup 20, and a light emitting chip (not shown in the figure) is packaged by the fluorescent glue, so that the whole diode is packaged.

This structure, simple to operate not only, simultaneously, the high heat conduction ceramic substrate 10 that is connected with light-emitting chip (not marked in the figure) can take away the heat fast for the heat dissipation of whole lamp pearl has improved the heat dissipation level of LED lamp pearl greatly, improves its life.

In this embodiment, high heat conduction ceramic substrate 10 bottom still is equipped with one and insulates at a distance from baffle 13, is equipped with on the PCB board 40 and insulates at a distance from baffle 13 matched with joint groove 41, during the assembly, first solder joint point tin cream on the PCB board, then place PCB board 40 with LED lamp pearl on, will insulate at a distance from baffle 13 and insert joint groove 41 in, at this moment, even the phenomenon that climbs appears in the tin cream, also hardly cross the insulation and separate the problem that baffle 13 appears breaking circuit. By the mode, the problem of short circuit in the process of re-welding the LED lamp beads is greatly solved.

In some embodiments, at least one side of the ceramic base 10 is provided with heat dissipation fins 12 for dissipating heat.

Specifically, the design of the heat dissipation fins 12 increases the contact surface between the ceramic base 10 with high thermal conductivity and the air, thereby further accelerating the heat dissipation.

In some embodiments, the positive and negative electrode pins 30 include:

the first pins 31 are matched with the upper surface of the high-thermal-conductivity ceramic base 10;

the second pins 32 are matched with the side surfaces of the high-thermal-conductivity ceramic base 10;

the third pin 33 is matched with the bottom surface of the high-thermal-conductivity ceramic base 10; and

and the fourth pin 34, the fourth pin 34 is connected with the third pin 33, the upper end surface of the fourth pin 34 is matched with the bottom surface of the high thermal conductivity ceramic base 10, and the bottom surface of the fourth pin 34 is flush with the bottom surface of the guide plate 22.

Specifically, the fourth pin 34 is designed such that the entire positive and negative electrode pins 30 are flush with the bottom surface of the guide plate 22 after the installation, which is convenient for installation and welding.

In some embodiments, two of the clamping grooves 11 are respectively matched with the positive and negative pins 30.

In some embodiments, after the positive and negative pins 30 are fitted in the clamping grooves 11, the upper end surfaces of the first pins 31 are flush with the upper surface of the high thermal conductivity ceramic base 10.

In some embodiments, the sides of the positive and negative leads 30 are provided with a bevel 35 for facilitating the assembly of the reflector cup 20 to the ceramic submount 10.

Specifically, in the present embodiment, the bevel 35 is further designed on the side edges of the positive and negative pins 30, and the bevel 35 is designed such that when the reflective cup 20 is mounted on the high thermal conductivity ceramic base 10, since the gap between the guide plates 22 is equal to the thickness of the high thermal conductivity ceramic base 10, after the positive and negative pins 30 are designed, the gap between the two positive and negative pins 30 is smaller than the high thermal conductivity ceramic base 10, which results in that the reflective cup 20 is difficult to be mounted on the high thermal conductivity ceramic base 10, but the reflective cup can be smoothly mounted on the high thermal conductivity ceramic base 10 through the bevel 35, and finally is matched with the clamping groove 11 to be fixed.

In some embodiments, the inner surface of the reflective chamber 21 is provided with a high reflectivity coating.

To sum up, the utility model comprises a high thermal conductivity ceramic base 10, wherein at least one clamping groove 11 is arranged on the high thermal conductivity ceramic base 10; the reflecting cup 20 is provided with a bowl-shaped reflecting chamber 21, and the reflecting cup 20 is provided with two guide plates 22 matched with the high-thermal-conductivity ceramic base 10; the positive and negative pins 30 are integrally formed on the reflection cup 20, one end of each positive and negative pin 30 extends into the reflection chamber 21, and the other end of each positive and negative pin 30 extends to the lower part of the high-thermal-conductivity ceramic base 10 along the guide plate 22; the light-emitting chip (not shown) is arranged on the high-thermal-conductivity ceramic base 10 and is electrically connected with the positive and negative electrode pins 30; by adopting the scheme, the lamp bead is convenient to install, fast in heat dissipation and greatly prolonged in service life.

The above-mentioned embodiments only express two embodiments of the present invention, and the description thereof is specific and detailed, but not construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. The utility model provides a SMD LED lamp pearl which characterized in that, SMD LED lamp pearl includes:

an LED lamp bead body; and

2. The surface mount LED lamp bead of claim 1, wherein the LED lamp bead body comprises:

3. The surface-mounted LED lamp bead according to claim 2, wherein at least one side of the ceramic base with high thermal conductivity is provided with heat dissipation fins for dissipating heat.

4. The surface mount LED lamp bead according to claim 2, wherein the positive and negative leads comprise:

5. The SMD LED lamp bead according to claim 4, wherein said two clipping grooves are respectively matched with said positive and negative pins.

6. The surface mount LED lamp bead according to claim 5, wherein after the positive and negative leads are engaged with the snap-in grooves, the upper end surface of the first lead is flush with the upper surface of the high thermal conductivity ceramic base.

7. The surface mount LED lamp bead according to claim 2, wherein the sides of said positive and negative leads are provided with a bevel for facilitating the attachment of said reflector cup to said high thermal conductivity ceramic base.

8. The surface-mounted LED lamp bead according to claim 2, wherein a high reflectivity coating is disposed on the inner surface of the reflective chamber.