CN210754608U

CN210754608U - Be used for mould on SIM draw-in groove with skew positioning mechanism

Info

Publication number: CN210754608U
Application number: CN201921492074.6U
Authority: CN
Inventors: 覃建程
Original assignee: Hongmao Technology Zhuhai Co ltd
Current assignee: Hongmao Technology Zhuhai Co ltd
Priority date: 2019-09-09
Filing date: 2019-09-09
Publication date: 2020-06-16
Anticipated expiration: 2029-09-09

Abstract

The utility model discloses an offset positioning mechanism for an upper die of an SIM clamping groove, which comprises a lower die holder, a guide post, a guide sleeve and an upper die holder, wherein the inner wall of the lower half part of the guide sleeve is provided with an oil groove through machining, the upper end part and the lower end part of the guide sleeve are fixedly connected with dustproof sealing rings through joints, the bottom part of the outer wall of the guide sleeve is fixedly connected with a compressed air pipe through a joint, and the outer wall of the guide sleeve corresponds to the compressed air pipe and is fixedly connected with a circulating cooling water pipe through a joint with the bottom surface of the upper die holder, the utility model ensures the temperature stability in the operation of the guide post and the guide sleeve through the arranged oil groove, the circulating cooling water pipe and the compressed air pipe, ensures the positioning precision of the guide post and the guide sleeve, and realizes the filtering of dust on the guide post through the dustproof sealing rings when the guide post moves up and down in the guide sleeve, prevent that the dust from getting into the interior positioning accuracy that influences the guide post guide pin bushing of guide pin bushing.

Description

Be used for mould on SIM draw-in groove with skew positioning mechanism

Technical Field

The utility model relates to a positioning mechanism technical field specifically is a be used for mould on SIM draw-in groove to use skew positioning mechanism.

Background

The SIM card slot is one of important mobile phone parts, the volume is small, the production precision is high, the material is plastic steel, plastic, aluminum alloy, stainless steel, plastic and the like, when the SIM card slot made of the stainless steel is generated, the stainless steel plate needs to be subjected to punch forming, external force is applied to the plate, the strip, the pipe, the section and the like by a press machine and a die to cause the plate, the strip, the pipe, the section and the like to generate plastic deformation or separation, so that the workpiece with the required shape and size is obtained.

However, the conventional upper mold for the SIM card slot has some disadvantages in the use process, such as:

1. mould carries out guide positioning for the movable mould relies on the guide pillar guide pin bushing in traditional SIM draw-in groove, when reciprocating at the upper die high speed and carrying out the blanking, because the clearance between the guide pillar guide pin bushing is less, the temperature of guide pillar guide pin bushing can rise, and the direction precision of guide pillar guide pin bushing descends, causes the mould to take place the skew, appears scrapping when the SIM draw-in groove blanking, influences the production beat.

2. When mould location carries out guiding orientation with the guide pillar guide pin bushing on traditional SIM draw-in groove, the guide pillar carries into the guide pin bushing with external dust impurity easily when the guide pillar up-and-down motion in the guide pin bushing in for guide pillar guide pin bushing wearing and tearing accelerate, and the direction precision reduces.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a be used for mould on the SIM draw-in groove with skew positioning mechanism to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: an offset positioning mechanism for an upper die of a SIM card slot comprises a lower die holder, a guide post, a guide sleeve and an upper die holder, the four corner areas of the upper surface of the lower die base are fixedly connected with guide posts through clamping, the four corner areas of the lower surface of the upper die base are correspondingly and fixedly connected with guide sleeves through clamping, the guide sleeve is connected with the guide post in a clearance fit manner, an oil groove is formed on the inner wall of the lower half part of the guide sleeve through machining, two oil grooves are arranged, an oil filling hole is arranged at the position of one side of the guide sleeve corresponding to the oil groove above the guide sleeve, the upper end and the lower end of the guide sleeve are fixedly connected with a dustproof sealing ring through clamping, the bottom of the outer wall of the guide sleeve is fixedly connected with a compressed air pipe through clamping, the bottom of the blank pipe is fixedly connected with a tuyere through a pipe joint, and the outer wall of the guide sleeve corresponds to the blank pipe and is fixedly connected with a circulating cooling water pipe through a clamping connection between the blank pipe and the bottom surface of the upper die base.

Furthermore, one end of the circulating cooling water pipe, which extends out of the upper die base, is fixedly connected with a circulating water pump through a pipe joint for circulating cooling.

Furthermore, each air compression pipe is provided with four air nozzles, the air nozzles on each air compression pipe are obliquely arranged, and air outlets of the air nozzles point to the central line of the guide pillar and are used for cooling the guide pillar through compressed air blown out of the air nozzles and removing dust adhered to the guide pillar.

Further, oil groove one end is kept away from to the oil filler point has sealed lid through joint fixed mounting for prevent that lubricating oil from spilling from the oil filler point.

Furthermore, the inner diameter of the dustproof sealing ring is the same as the outer diameter of the guide pillar, so that lubricating oil is prevented from leaking, and meanwhile, dust attached to the guide pillar is prevented from entering the guide sleeve.

Furthermore, one end of the compressed air pipe, which is far away from the guide sleeve, is fixedly connected with an electromagnetic valve through a pipe joint, and the electromagnetic valve is used for controlling the on-off of the compressed air pipe.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses an oil groove, recirculated cooling water pipe and the blank pipe that sets up have realized that the guide pillar reduces the friction of guide pillar guide pin bushing through the lubricating oil in the oil groove when reciprocating in the guide pin bushing at a high speed, and recirculated cooling water pipe carries out the heat exchange to the heat on the guide pin bushing, cools down to the guide pillar through the compressed air in the blank pipe, and the temperature is stable in the operation of having guaranteed guide pillar guide pin bushing, has guaranteed the positioning accuracy of guide pillar guide pin bushing.

2. The utility model discloses a dust sealing washer, blank pipe and tuyere that set up have realized when the guide pillar up-and-down motion in the guide pin bushing, filter the dust on the guide pillar through dust sealing washer, blow off the dust of adhesion on the guide pillar through blank pipe and tuyere, prevent that the dust from getting into the guide pin bushing in the influence guide pin bushing's positioning accuracy.

Drawings

FIG. 1 is a schematic sectional view of the overall front view structure of the present invention;

FIG. 2 is a schematic sectional view of the overall left-side view structure of the present invention;

FIG. 3 is a schematic sectional view of the overall top view structure of the present invention;

fig. 4 is an enlarged schematic view of a portion of the structure of fig. 1 according to the present invention.

In FIGS. 1-4: 1-a lower die holder; 2-guide pillar; 3-compressing the air pipe; 4-circulating cooling water pipes; 5-oil hole; 6-guide sleeve; 7-dustproof sealing ring; 8-blast nozzle; 9-oil groove; 10-upper die holder.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: an offset positioning mechanism for an upper die of an SIM clamping groove comprises a lower die holder 1, guide pillars 2, guide sleeves 6 and an upper die holder 10, wherein the four corners of the upper surface of the lower die holder 1 are fixedly connected with the guide pillars 2 through clamping, the four corners of the lower surface of the upper die holder 10 are fixedly connected with the guide sleeves 6 through clamping corresponding to the upper parts of the guide pillars 2, the guide sleeves 6 are connected with the guide pillars 2 through clearance fit for positioning an upper die, the inner wall of the lower half part of each guide sleeve 6 is provided with an oil groove 9 through machining for lubricating between the guide pillars and the guide sleeves and reducing friction, the number of the oil grooves 9 is two, one side of each guide sleeve 6 is provided with an oil filling hole 5 corresponding to the position of the oil groove 9 positioned above and used for adding lubricating oil into the oil groove 9, the upper end part and the lower end part of each guide sleeve 6 are fixedly connected with dustproof, the bottom of the compressed air pipe 3 is fixedly connected with a tuyere 8 through a pipe joint for blowing off dust attached to the guide pillar 2 and cooling the guide pillar 2, and the outer wall of the guide sleeve 6 corresponds to the space between the compressed air pipe 3 and the bottom surface of the upper die base 10 and is fixedly connected with a circulating cooling water pipe 4 through clamping connection for cooling the guide sleeve 6.

Recirculated cooling water pipe 4 extends 10 one end of upper die base and passes through coupling fixedly connected with circulating water pump, be used for the circulation cooling, respectively there are four tuyeres 8 on every compressed air pipe 3, tuyeres 8 on every compressed air pipe 3 are the slope installation, the directional guide pillar 2 central line of tuyeres 8 air outlet, a dust that is used for getting rid of adhesion on the guide pillar 2 simultaneously is cooled down to guide pillar 2 through the compressed air that tuyeres 8 blew out, oil groove 9 one end is kept away from to oil filler point 5 has sealed lid through joint fixed mounting, be used for preventing lubricating oil from spilling from oil filler point 5, dustproof sealing ring 7 internal diameter is the same with guide pillar 2 external diameter, be used for preventing lubricating oil from spilling, prevent simultaneously that the subsidiary dust from getting into in guide pin bushing 6 on the guide pillar 2, compressed air pipe 3 keeps away from 6 one end of guide pin.

The working principle is as follows: when the punching die is used, an SIM clamping groove punching lower die and a punching upper die are respectively installed on the upper surface of a lower die holder 1 and the bottom surface of an upper die holder 10 through screws, the installed dies are fixed on a press, when the punching is started, the lower die is not moved as a fixed die, the upper die is moved up and down to punch under the action of the press as a movable die, a guide pillar 2 moves up and down in a guide sleeve 6 to position the upper die, when the upper die holder 10 descends or ascends, lubricating oil in an oil groove 9 in the guide sleeve 6 lubricates the guide pillar 2 to reduce friction force, meanwhile, cooling water in a circulating cooling water pipe 4 is driven by a circulating water pump to continuously perform heat exchange with the guide sleeve 6 to take away heat of the guide sleeve 6, compressed air in a pressure hollow pipe 3 is blown to the guide pillar 2 through a blast nozzle 8 to cool the guide pillar 2, meanwhile, dust attached to the guide pillar 2 is removed, and meanwhile, the temperature constancy of the guide pillar 2 and the guide sleeve 6 in the high-speed up-and-down movement process is ensured, and meanwhile, the dust on the guide pillar 2 is prevented from entering the guide sleeve 6, so that the positioning accuracy of the guide pillar 2 and the guide sleeve 6 is ensured.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a be used for mould skew positioning mechanism on SIM draw-in groove, includes die holder (1), guide pillar (2), guide pin bushing (6) and upper die base (10), die holder (1) upper surface four corners is regional through joint fixedly connected with guide pillar (2), upper die base (10) lower surface four corners is regional to correspond guide pillar (2) top through joint fixedly connected with guide pin bushing (6), its characterized in that: guide pin bushing (6) are connected through clearance fit with guide pillar (2), oil groove (9) have been seted up through machine tooling to guide pin bushing (6) lower half inner wall, oil groove (9) have two, oil filler point (5) have been seted up to guide pin bushing (6) one side correspondence oil groove (9) position that is located the top, both ends are through joint fixedly connected with dust seal circle (7) about guide pin bushing (6), guide pin bushing (6) outer wall bottom has blank pressing pipe (3) through joint fixed connection, blank pressing pipe (3) bottom has tuyere (8) through coupling fixedly connected with, through joint fixedly connected with recirculated cooling water pipe (4) between guide pin bushing (6) outer wall correspondence blank pressing pipe (3) and upper die base (10) bottom surface.

2. The offset positioning mechanism for a mold on a SIM card slot of claim 1, wherein: one end of the circulating cooling water pipe (4) extending out of the upper die base (10) is fixedly connected with a circulating water pump through a pipe joint.

3. The offset positioning mechanism for a mold on a SIM card slot of claim 1, wherein: each air compression pipe (3) is provided with four air nozzles (8), each air nozzle (8) on each air compression pipe (3) is installed in an inclined mode, and the air outlet of each air nozzle (8) points to the central line of the guide pillar (2).

4. The offset positioning mechanism for a mold on a SIM card slot of claim 1, wherein: oil groove (9) one end is kept away from in oil filler point (5) has sealed lid through joint fixed mounting.

5. The offset positioning mechanism for a mold on a SIM card slot of claim 1, wherein: the inner diameter of the dustproof sealing ring (7) is the same as the outer diameter of the guide pillar (2).

6. The offset positioning mechanism for a mold on a SIM card slot of claim 1, wherein: one end of the pressure hollow pipe (3) far away from the guide sleeve (6) is fixedly connected with an electromagnetic valve through a pipe joint.