CN210736640U

CN210736640U - Dampproofing lamellar structure and have its signal protection device

Info

Publication number: CN210736640U
Application number: CN201921012733.1U
Authority: CN
Inventors: 查道胜; 曹致亚
Original assignee: Beijing Ruida New Material Technology Co ltd
Current assignee: Beijing Ruida New Material Technology Co ltd
Priority date: 2019-07-01
Filing date: 2019-07-01
Publication date: 2020-06-12
Anticipated expiration: 2029-07-01

Abstract

The utility model provides a pair of dampproofing lamellar structure and have its signal protection device belongs to dampproofing material technical field, and dampproofing lamellar structure includes: the isolating layer and the barrier laminating layer are mutually connected through the adhesive layer; the thickness ratio of the separation adhesive layer to the isolation layer is 2.4-54.9, wherein the measurement conditions of the thicknesses of the separation adhesive layer and the isolation layer are that the temperature is 23 ℃ and the relative humidity is 50%; the dynamic shear force of the adhesive layer is greater than 15N/cm at 105 DEG C²The peeling adhesion is more than 5N/15 mm; the utility model discloses a dampproof course structure is satisfying under the condition of the ratio of thickness, at the in-process that uses, can provide with the laminating of signal protection deviceThe firm adhesion force more of in-process avoids breaking away from, splitting, peeling scheduling problem in the use in the future, and on the other hand can provide more superior separation performance, can effectual reduction oxygen, the transmissivity of vapor, guarantees to reach the best dampproofing effect, guarantees communication system's normal work and timely communication.

Description

Dampproofing lamellar structure and have its signal protection device

Technical Field

The utility model relates to a dampproofing material technical field, concretely relates to dampproofing lamellar structure and have its signal protection device.

Background

The antenna housing is an important component of a radar antenna system, has sufficient strength, excellent dielectric property and light weight, and can effectively protect the antenna system from being damaged under extremely severe conditions. In addition, the antenna housing is used as a channel for transmitting and receiving electromagnetic waves, and normal propagation of signals is guaranteed, so that the radar system plays a due role. In order to meet the requirements of various aircrafts and ground communication systems, the radome has become the most critical ring in the overall design of radar systems.

The ceramic material has stable structure, and is the most commonly used material for the antenna housing due to the characteristics of excellent high temperature resistance, lower dielectric constant, small dielectric loss tangent and the like. At present, ceramic antenna covers which are successfully applied at home and abroad mainly comprise quartz ceramic antenna covers, quartz fiber reinforced quartz antenna covers, high silica reinforced phosphate antenna covers and the like. The fiber reinforced composite material overcomes the brittleness of simple substance ceramic and has higher toughness, so the fiber reinforced composite material radome is the most common structure at home and abroad. The cover body consists of a quartz fiber reinforcement body and a silicon dioxide substrate, wherein the silicon dioxide substrate is formed by repeatedly converting silica sol, is porous gas with a silicon-oxygen bond irregular network structure, has the porosity of 20-25 percent and the specific surface area of more than 1000 square meters/g, has a large amount of silicon hydroxyl on the surface of the porous gas, has high surface activity and is a main chemical moisture absorption source. The base structure enables the moisture absorption rate of the cover body which is not subjected to moisture-proof treatment to be as high as 8% -10%, the dielectric property of the cover body is seriously influenced, and the dielectric property of the cover body is changed along with the change of the temperature, the humidity and the like of the natural environment, so that the dielectric property of the cover body is unstable. The inherent hydrophilicity and porosity of the cover body material determine that the cover body material has high water absorption rate, and the water resistance and the air tightness are difficult to improve by continuously improving the composite process conditions. Therefore, moisture protection of the ceramic radome becomes a problem that cannot be ignored.

In order to solve the above problems, chinese patent document CN109321012A discloses an organic-inorganic coating for ceramic radome moisture protection and a preparation method thereof; chinese patent document CN1613824A discloses a radome coating material and a preparation method thereof, wherein the radome coating material is prepared by carrying out infiltration treatment on high-temperature resistant ceramic fiber cloth through coating slurry, then carrying out compression molding, and finally curing, and the radome coating material has certain flexibility, and the deformation can reach 5%; chinese patent document CN102492339A discloses a method for preparing a high-wave-transmission super-hydrophobic moisture-proof coating of an antenna housing material, which adopts micron-level silicon dioxide and fluorine-containing polymer to carry out accumulation and hole sealing, provides a micron surface structure with certain roughness, and adds epoxy resin with good adhesive property in the hole sealing coating to improve the mechanical property of the hole sealing coating.

However, in the process of applying the moisture-proof coating to the surface of the antenna housing, partial waste liquid and waste gas are generated, and the coating process has no way of detecting the internal quality of the coating on line, so that the defect of the coating causes higher rejection rate. The thickness of the coating is not uniform and cracks easily occur during later use, thereby reducing moisture resistance.

SUMMERY OF THE UTILITY MODEL

Therefore, the to-be-solved technical problem of the utility model lies in overcoming the not good defect of dampproofing effect of coating among the prior art to a layer structure that dampproofing effect is good is provided.

The utility model provides a pair of dampproofing lamellar structure, include:

the isolating layer and the barrier laminating layer are mutually connected through the adhesive layer; the thickness ratio of the separation adhesive layer to the isolation layer is 2.4-54.9, wherein the measurement conditions of the thicknesses of the separation adhesive layer and the isolation layer are that the temperature is 23 ℃ and the relative humidity is 50%; the dynamic shear force of the adhesive layer is greater than 15N/cm at 105 DEG C²The peel adhesion is greater than 5N/15 mm.

Preferably, the moisture-proof laminated structure has the water vapor transmission capacity of less than or equal to 2.0 g/(m)²24h), oxygen transmission not more than 2.5 ml/(m)²24 h.0.1 MPa); preferably, the water vapor transmission capacity of the isolating layer is less than or equal to 1.0 g/(m)²24h), oxygen transmission capacity 0.05-2.5 ml/(m)²·24h·0.1MPa)。

Preferably, the thickness ratio of the barrier adhesive layer to the barrier layer is 5.6 to 27.6, and more preferably 8.2 to 20.1.

Preferably, the isolation layer comprises a base material layer, an inorganic coating layer and a chemical coating layer which are sequentially stacked;

the separation laminating layer is including the first sealing layer, first tie coat, barrier layer, second tie coat and the laminating layer that stack gradually the setting, wherein, chemical coating layer with first sealing layer passes through the adhesive layer is connected.

Preferably, the barrier adhesive layer further comprises a second sealing layer disposed between the second adhesive layer and the adhesive layer;

preferably, the substrate layer is a single layer film or a composite film of two or more layers selected from the group consisting of polyester resin, polyolefin resin, polyphenolic resin, polyamide resin, polymethacrylate resin, polycarbonate resin, ABS resin, polyimide resin and polytetrafluoroethylene resin, and has a thickness of 8-25 μm, a light transmittance of more than 80%, a thickness of 10-20 μm and a light transmittance of more than 85%.

Preferably, the inorganic plating layer is an oxide plating layer, and has a thickness of 1 to 100nm, and further, a thickness of 10 to 30 nm.

Preferably, the chemical coating layer is one or a mixture of two or more of polyacrylic resin, polyurethane resin, polyvinyl alcohol resin, polyester resin, polyvinyl chloride polypropylene resin, polytetrafluoroethylene resin, polyepoxy resin and modified polyolefin resin, and has a thickness of 0.1 to 10 μm, and further has a thickness of 0.5 to 5 μm.

Preferably, the adhesive layer is one or a combination of polyethylene resin, styrene resin, polypropylene resin, thermoplastic polyurethane resin, polyvinyl chloride resin, rosin tackifying resin, C5/C9 petroleum resin, terpene resin, etc., and has a thickness of 25-125 μm and further a thickness of 40-80 μm.

Preferably, the first sealing layer and the second sealing layer are both one or more of polyethylene resin, polypropylene resin and thermoplastic polyurethane resin, and have a thickness of 20-100 μm, and further have a thickness of 30-60 μm.

Preferably, the first bonding layer and the second bonding layer are both one or more of ethylene-vinyl acetate polymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, styrene-butadiene-styrene, styrene-ethylene/butylene-styrene or styrene/propylene-styrene, modified polyethylene, thermoplastic polyurethane and polyamide resin, the thickness is 5-30 μm, and further, the thickness is 10-20 μm.

Preferably, the barrier layer is one or more of polyvinylidene chloride resin, ethylene/vinyl alcohol copolymer and polyvinyl alcohol resin, and has a thickness of 10-60 μm, and further has a thickness of 20-50 μm.

Preferably, the adhesive layer is a hot melt adhesive or a heat activated adhesive, and has a thickness of 1 to 10 μm, and further, a thickness of 2 to 5 μm.

A signal protection device comprising a moisture resistant laminate structure as claimed in any preceding claim, the moisture resistant laminate structure being provided on a body of the signal protection device.

As a preferred scheme, the body of the signal protection device is a radome, specifically a ceramic radome.

The technical scheme of the utility model, have following advantage:

1. the moisture-proof laminated structure provided by the utility model has the determination condition that the temperature is 23 ℃, and the thickness ratio of the separation attaching layer to the separation layer is 2.4-54.9 under the condition that the relative humidity is 50%; meanwhile, the dynamic shear force of the adhesive layer is more than 15N/cm at 105 DEG C²The peel adhesion is greater than 5N/15 mm. Satisfying above-mentioned thickness ratio and adhesive layer and satisfying corresponding condition under, at the in-process of using, this dampproofing lamellar structure can provide with signal protection device laminating in-process firmer adhesion, avoids breaking away from, splitting, skinning scheduling problem in the use in the future, and on the other hand can provide more superior separation performance, can effectually reduce the transmissivity of oxygen, vapor for the vapor permeability is 0.05-2.0g/(m 0 g/(m)²24h), oxygen transmission capacity 0.05-2.5 ml/(m)²24 h.0.1 MPa) to ensure the best results are achievedThereby ensuring that the dielectric constant ε of the whole of the layered structure is 1.0 to 3.0 and the dielectric loss tangent tg б is (1.0 to 8.0). times.10^-3The problem of reduced electromagnetic transmittance in a radar communication system is avoided, and normal work and timely communication of the communication system are guaranteed.

2. The utility model provides a dampproofing lamellar structure, the ratio of thickness is 5.6-27.6, and is further specifically 8.2-20.1 for lamellar structure's vapor transmission capacity 0.1-1.5 g/(m)²24h), oxygen transmission capacity 0.8-1.5 ml/(m)²24 h.0.1 MPa), a dielectric constant ε of 1.5 to 2.5, and a dielectric loss tangent tg δ of (1.5 to 5.0). times.10^-3The moisture-proof effect is further improved.

3. The utility model provides a dampproofing lamellar structure, isolation layer include substrate layer, inorganic cladding material and the chemical coating layer that sets gradually, separation adhesive layer includes the first sealing layer, first tie coat, barrier layer, second tie coat, second sealing layer and the adhesive layer that sets gradually, wherein, the chemical coating layer passes through with the first sealing layer the adhesive layer is connected;

through the layered arrangement of each layer, the prepared moisture-proof layered structure has excellent moisture-proof effect, obvious barrier effect on liquid and gaseous water, good uniformity and good compactness;

through the difference of the materials selected by each layer and the combination of the materials, the moisture-proof laminated structure has good dielectric property, and the wave-transmitting performance of the antenna housing material cannot be reduced; the adhesive has better adhesion with the matrix, and the surface mounting quality is easy to detect; the barrier durability is good, the environment is protected, and no VOC is discharged; the carbon residue rate is low.

4. The utility model provides a moisture-proof laminated structure, the substrate layer has certain heat resistance, certain mechanical strength, certain characteristic of obstructing oxygen and water vapor; the total light transmittance of the substrate layer is set to be more than 80%, and more preferably more than 85%, so that the contraposition equipment can more accurately adjust the distance between the placement material with the moisture-proof laminated structure and the ceramic three-dimensional porous structural member in the placement process, namely, the more transparent the substrate layer is, the more accurate the attaching process is; the thickness of the substrate layer is 8-25 μm, preferably 10-20 μm, and in this thickness range, the substrate layer can provide sufficient mechanical strength and heat resistance, thereby avoiding the problems of damage, fracture and the like of the moisture-proof laminated structure in the mounting process.

The inorganic coating can provide regular atomic arrangement, and a compact structural layer is used for making up high permeability of water vapor and oxygen brought by gaps of organic materials of the substrate layer.

And the chemical coating layer is arranged on the protective surface of the inorganic coating and is used for protecting the stability of the inorganic coating.

And the adhesive layer is arranged between the isolation layer and the barrier laminating layer, so that the overall strength of the layered structure and the cohesion of each layer are enhanced.

The first sealing layer is connected with the adhesive layer, the second sealing layer is arranged between the second bonding layer and the attaching layer, and the first sealing layer and the second sealing layer maintain firm bonding by improving reliable and stable mechanical strength.

The first tie coat sets up between first sealing layer and barrier layer for bond first sealing layer and barrier layer, and the second tie coat sets up between barrier layer and second sealing layer for bond second sealing layer and barrier layer.

The barrier layer is arranged in the middle of the barrier laminating layer and is mainly used for blocking permeation of water vapor and oxygen, and performance indexes of the moisture-proof laminated structure are improved.

The laminating layer is arranged on the outermost layer of the barrier laminating layer and is pasted with the signal protection device under the heating and pressurizing conditions, so that the laminating strength of the laminated structure on the signal protection device is not lower than 15N/15 mm.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of a moisture barrier laminate structure of the present invention;

FIG. 2 is a schematic diagram of a signal protection device;

description of reference numerals:

1. a substrate layer; 2. an inorganic plating layer; 3. a chemical coating layer; 4. an adhesive layer; 5. a first sealing layer; 6. a first adhesive layer; 7. a barrier layer; 8. a second adhesive layer; 9. a second sealing layer; 10. laminating layers; 100. a moisture-resistant layered structure; 200. a ceramic three-dimensional cellular structure.

Detailed Description

The technical solution of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

As shown in fig. 1, the moisture-proof layered structure provided by the present invention comprises an isolation layer, a barrier lamination layer, and an adhesive layer 4 connecting the isolation layer and the barrier lamination layer; the isolation layer sequentially comprises a substrate layer 1, an inorganic coating layer 2 and a chemical coating layer 3; the barrier laminating layer comprises a first sealing layer 5, a first bonding layer 6, a barrier layer 7, a second bonding layer 8, a second sealing layer 9 and a laminating layer 10 which are sequentially arranged, wherein the chemical coating layerAnd a sealing layer connected by the adhesive layer; the thickness ratio of the separation adhesive layer to the isolation layer is 2.4-54.9, wherein the measurement conditions of the thicknesses of the separation adhesive layer and the isolation layer are that the temperature is 23 ℃ and the relative humidity is 50%; the dynamic shear force of the adhesive layer is greater than 15N/cm at 105 DEG C²The peel adhesion is greater than 5N/15 mm.

The base material layer 1 is made of one or a mixture of more than two of polyester resin, polyolefin resin, polyphenolic resin, polyamide resin, polymethacrylate resin, polycarbonate resin, ABS resin, polyimide resin and polytetrafluoroethylene resin; from the viewpoint of improving mechanical strength and heat resistance, a polyamide-based resin is preferable, and a nylon resin is more preferable.

The substrate layer 1 may be formed of a single-layer film of the above-mentioned materials, or may be a composite material of two or more films, and may be stretched or in an initial state as a form of a film.

The thickness of the substrate layer 1 is 8 to 25 μm, preferably 10 to 20 μm. When the thickness of the substrate layer is between the upper limit value and the lower limit value, enough mechanical strength and heat resistance can be provided, so that the problems that the moisture-proof laminated structure is damaged and broken in the mounting process and the like are solved.

The total light transmittance of the substrate layer 1 is set to be more than 80%, and more preferably more than 85%, so that in the mounting process of the flexible mounting material made of the moisture-proof laminated structure and the ceramic three-dimensional porous structural member, whether the counterpoint equipment can adjust the distance between the flexible mounting material and the ceramic three-dimensional porous structural member with more accurate precision can be given, and a more optimal mounting effect is realized. In other words, the more transparent the substrate layer, the more precise the mounting process, and the higher the yield of the wave-transparent structure. The upper limit of the total transmittance of the base material layer is not particularly limited, and may be 100% or less in particular. The total transmittance of the base material layer can be measured in accordance with GB/T2410.

The inorganic coating 2 is providedBetween the substrate layer and the chemical coating layer, the inorganic coating layer is oxide (such as SiO)_x、TiO_x、AlO_x、TaO_xEtc.), but not limited to oxides, but may also be other inorganic materials, such as inorganic nitrides; however, the inorganic plating layer cannot be selected from metal plating layers, including silver, aluminum, tin alloy or a combination of the foregoing, so as not to obstruct the passage of electromagnetic waves;

the inorganic coating 2 can provide regular atomic arrangement, and a compact structural layer is used for making up high permeability of water vapor and oxygen brought by gaps of organic materials of the substrate layer. Any desired inorganic plating thickness may be used, for example, 1 to 100nm, more preferably 5 to 50nm, and still more preferably 10 to 30 nm. The utility model discloses set up the thickness index as above required, nevertheless generally speaking lower or higher index's numerical range is also the utility model discloses a protection category.

When the inorganic plating layer 2 is deposited on the base material layer 1, the better the flatness of the base material layer surface, the easier it is than when it is deposited. Otherwise "pinholes" with little or no inorganic material may be deposited. These pinholes may not only block water vapor and oxygen but also enlarge the permeability of the base material layer, thereby reducing the overall barrier properties. The surface of the substrate layer is subjected to corona treatment or plasma treatment or flame treatment or primary coating treatment, so that the deposition of the inorganic coating is facilitated, the coating is easier, and the risk of pinholes is reduced or eliminated.

The processing technology of the inorganic plating layer 2 comprises the following steps: evaporation boat resistance heating evaporation, crucible heating evaporation, magnetron sputtering, electron beam evaporation, and plasma enhanced chemical vapor deposition method, wherein the inorganic coating is made of ALO_xThe coating is formed by adopting an evaporation boat resistance type heating evaporation or crucible heating evaporation as a processing technology; if the inorganic coating is made of SiO_xThe coating is formed by a processing technology which adopts a vapor deposition method of magnetron sputtering, electron beam evaporation and plasma enhanced chemistry. If the inorganic coating is made of SiO_xWith SiO_xThe binary plating layer is formed by magnetron sputtering and electron beamEvaporation is performed.

The chemical coating layer 3 is provided on the inorganic plating layer protection surface, and since the inorganic plating layer is a relatively rigid material, if the substrate layer is bent, twisted or kneaded after being bonded to the substrate layer, the inorganic plating layer attached to the surface of the substrate layer may have problems such as cracks or even peeling, and thus the chemical coating layer is added to protect the stability of the inorganic plating layer.

As a material constituting the chemical coating layer 3, one or a mixture of two or more of polyacrylic resin, polyurethane resin, polyvinyl alcohol resin, polyester resin, polyvinyl chloride polypropylene resin, polytetrafluoroethylene resin, polyepoxy resin, modified polyolefin resin, and the like can be used. In the process of processing the resin, the resin can be completely or partially solid, wherein the production can be smoother due to the partial solid; part of the solid content can be water as a diluent or a solvent type as a diluent, and the solvent generally comprises one or a combination of ethanol, isopropanol, ethyl acetate, toluene, xylene, cyclohexane, butyl ester and the like.

The thickness of the chemical coating layer 3 is 0.1 to 10 μm, more preferably 0.2 to 8 μm, and still more preferably 0.5 to 5 μm.

The inorganic plating layer surface is subjected to a dust point removal treatment, and then a solution resin is applied to the surface by a method such as a roll coating method, gravure coating, dipping method, reverse coating method, spray coating method, or spin coating method, to form a chemical coating layer.

The adhesive layer 4 is arranged between the isolation layer and the barrier laminating layer, can enhance the overall strength of the moisture-proof laminated structure and the cohesion of each layer, and has a temperature of 105 deg.C higher than 15N/cm²And an adhesive having a peel adhesion greater than 5N/15 mm.

The adhesive layer 4 may be any type of adhesive as long as the conditions of dynamic shear force and peel adhesion are satisfied: in general, the adhesive is selected from hot melt adhesives or heat activated adhesives, among which the commonly used hot melt adhesives are ethylene-vinyl acetate polymers, ethylene-methyl acrylate copolymers, ethylene-acrylic acid copolymers and polyolefins (e.g., styrene-butadiene-styrene, styrene-ethylene/butylene-styrene or styrene/propylene-styrene, modified polyethylene, thermoplastic polyurethane, polyamide resins, etc.).

The hot melt adhesive layer is prepared and coated by the following operations: the compositions are weighed together in proportion and mechanically mixed for several hours to disperse the materials until uniform dispersion is achieved. The treated granules were then extruded using a twin screw extruder. The processing temperature is set to generate a binder melt temperature of about 200 ℃ to 290 ℃. The adhesive is then pumped through a die with a melt pump and is thrown at a set thickness onto the release layer film backing, followed by superimposing the barrier-conforming layer with the release layer in a hot state.

The adhesive layer 4 may also be a pressure sensitive adhesive. Pressure sensitive adhesives include, but are not limited to, acrylates, silicones, polyisobutylenes, ureas, and combinations thereof.

The adhesive layer 4 may also be a two-or multi-component, cross-linkable cured resin including, but not limited to, acrylate, urethane combinations. Crosslinking can be achieved by any method known in the art, including by using actinic radiation (e.g., ultraviolet light and electron beam). In the case of photochemically induced crosslinking, the process may be aided by the use of photoinitiators and other known catalysts. Crosslinking can also occur by thermal curing or by a combination of any of the different crosslinking methods disclosed herein and known in the art.

The above resins include full solid content and partial solid content in the processing process, wherein the processing process of partial solid content is smoother, the partial solid content can be water as a diluent or a solvent type as a diluent, and the solvent generally comprises one or a combination of ethanol, isopropanol, ethyl acetate, toluene, xylene, cyclohexane, butyl ester and the like.

The inorganic plating layer 2 is subjected to a dust point removal treatment, and then a solution resin is applied to the surface by a method such as a roll coating method, a gravure coating method, a dipping method, a reverse coating method, a spray coating method, a spin coating method, or the like, and a binder layer is formed on the surface by passing through a drying facility at 30 ℃ to 100 ℃.

The thickness of the adhesive layer 4 is 1 to 10 μm, more preferably 2 to 7 μm, and still more preferably 2 to 5 μm.

The adhesive layer 10 is arranged on the outermost layer of the barrier adhesive layer, and is attached to the signal protection device under the conditions of heating and pressurizing, and the adhesive strength of the adhesive layer is not lower than 15N/15 mm.

The material of the adhesive layer may be one or a combination of several of polyethylene resin, styrene resin, polypropylene resin, thermoplastic polyurethane resin, polyvinyl chloride resin, rosin tackifying resin, C5/C9 petroleum resin, terpene resin, etc., and as an option, polyethylene resin, and further polyethylene resin added with rosin and petroleum resin may be used, so that the peel strength is improved.

The material constituting the adhesive layer may be a single-layer film of the above-mentioned material, and may be stretched or in an initial state as a film form. The production process can be casting by an extruder, film blowing or multilayer coextrusion.

The thickness of the adhesive layer is 25 to 125. mu.m, more preferably 30 to 100. mu.m, and still more preferably 40 to 80 μm.

The first sealing layer is connected with the adhesive layer on one side of the separation attaching layer, the second sealing layer is arranged between the second bonding layer and the attaching layer, and the bonding firmness between the second bonding layer and the attaching layer is maintained by improving the reliable and stable mechanical strength.

The first sealing layer and the second sealing layer are made of the same material and production process, the material can be one or combination of polyethylene resin, polypropylene resin, thermoplastic polyurethane resin and the like, the polyethylene resin with good sealing strength can be used, and the density can be 0.91-0.94g/cm³Linear low density polyethylene or one or two of low density polyethylene with melting point of 100-110 deg.c and melt index of 0.1-20g/10 min.

The material constituting the first sealant layer and the second sealant layer may be formed of a single-layer film of the above-mentioned material, and may be stretched or in an initial state as a film form. The production process can be casting by an extruder, film blowing or multilayer coextrusion.

The thickness of the first sealing layer 5 and the second sealing layer 9 is 20 to 100 μm, more preferably 25 to 80 μm, and still more preferably 30 to 60 μm.

The first bonding layer 4 and the second bonding layer 8 are arranged on two sides of the barrier layer and are made of materials for bonding the barrier layer and the first sealing layer and the second sealing layer, the materials for the first bonding layer and the second bonding layer are the same as the production procedures, the materials can be one or a combination of more of ethylene-vinyl acetate polymer, ethylene-methyl acrylate copolymer, ethylene-acrylic acid copolymer, styrene-butadiene-styrene, styrene-ethylene/butylene-styrene, styrene/propylene-styrene, modified polyethylene, thermoplastic polyurethane, polyamide resin and the like, and the modified ethylene-vinyl acetate polymer is specifically selected to improve the bonding force. Wherein, the modification method comprises maleic anhydride grafting modification, SIS elastomer blending modification, butyl rubber blending modification and the like.

The thickness of the first adhesive layer 4 and the second adhesive layer 8 is 5 to 30 μm, more preferably 7 to 25 μm, and still more preferably 10 to 20 μm.

The barrier layer 7 is arranged in the middle of the barrier laminating layer and mainly used for preventing water vapor and oxygen from penetrating to influence the overall moisture-proof performance of the laminated structure. One or more of polyvinylidene chloride resin, ethylene/vinyl alcohol copolymer, polyvinyl alcohol resin, etc. The material constituting the barrier layer may be a single-layer film of the above-mentioned materials, and may be stretched or in an initial state as a film form. The production process can be casting by an extruder, blow molding or multilayer coextrusion.

The thickness of the barrier layer 7 is 10 to 60 μm, more preferably 15 to 55 μm, and still more preferably 20 to 50 μm.

First sealing layer, second sealing layer, first tie coat, second tie coat, barrier layer and binding layer have constituted separation binding layer, and these several layers of materials are the structural layout of symmetrical formula, enable whole separation binding layer more even, more smooth application. Each layer of material in the barrier laminating layer can be formed by casting or film blowing after on-line coextrusion, or can be formed by laminating each layer after forming.

In the following examples, the material composition and thickness specifications of each layer used in the production of the moisture-proof layered structure will be described.

Substrate layer:

a biaxially oriented nylon film 1-1, 15 μm thick, EMBLM ON-15, manufactured by NITIKA;

biaxially oriented nylon film 1-2, 20 μm thick, EMBLM ON-20, manufactured by NITIKA, Japan.

Inorganic plating:

inorganic coating 1-1, AL₂O₃The thickness is 10 nm;

inorganic coating 1-2, SiO₂The thickness is 10 nm;

inorganic coating 1-3, AL₂O₃-SiO₂And the thickness is 10 nm.

Chemical coating layer:

1-1 part of acrylic resin,

DSM manufacturing;

acrylic resin 1-2, Alberdingk

Manufactured by ALBERDINGK BOLEY;

diluent water: 3-isopropyl alcohol: 1.

adhesive layer: 1 two-component polyurethane resin with the thickness of 4 mu m, and is made of Liofol LA 2550-21/curing agent LA 5001 and Henkel;

diluent agent: and (3) ethyl acetate.

First and second sealing layers: low density polyethylene resin 1, 35 μm thick,

manufactured by PRIME POLYMER.

First and second adhesive layers:

acid-modified ethylene acrylate resin 1, Bynel 2100 series 21E781, manufactured by DUPONT;

the SEBS resin 1 is used for preparing the epoxy resin,

koteng manufacturing;

the thickness is 15 μm.

Barrier layer: polyvinylidene chloride resin PVDC resin 1,

PVS 815, SOLVAY;

the thickness was 40 μm.

Laminating layer:

the low-density polyethylene resin 1 is a low-density polyethylene resin,

DOW production;

the rosin resin is 1, and the rosin resin,

guangdong Ke maolin production;

petroleum resin 1, Escorez 5637, manufactured by ExxonMobil;

the thickness is 50 μm.

The above-mentioned component materials and evaluation results are summarized in tables 1 and 2 below:

TABLE 1

TABLE 2

Substrate layer:

a biaxially oriented nylon film 2 having a thickness of 15 μm, manufactured by EMBLM ON-15, manufactured by NITIKA;

inorganic plating: AL₂O₃And the thickness is 10 nm.

Chemical coating layer: acrylic resin, with a thickness of 7 μm,

DSM manufacturing;

diluent water: 3-isopropyl alcohol: 1.

adhesive layer: 2-1 of double-component polyurethane resin, 2-1 of Liofol LA 2550-21/curing agent LA 5001 manufactured by Henkel;

diluent agent: ethyl acetate;

2-2 parts of EVA resin,

WESTLAKE CHEMICAL, manufacturing;

initiator: LUPEROX F40P, manufactured by ARKEMA;

acrylic resin 2-3, PURELAM 6000, manufactured by ASHLAND; ACRYDIC ZHP-1234, DIC manufacture;

petroleum resin: REGALREZ 1018, manufactured by EASTMAN;

the diluent is: ethyl acetate: 1:1 of toluene;

the thickness is 5 μm.

First and second sealing layers: the low-density polyethylene resin 2 is a low-density polyethylene resin,

manufactured by PRIMEPOLYMER;

thickness: example 7, 20 μm; example 8, 25 μm; example 9, 45 μm.

First and second adhesive layers: acid-modified ethylene acrylate resin 2, Bynel 2100 series 21E781, manufactured by DUPONT;

the SEBS resin 2 is used for preparing the epoxy resin,

koteng manufacturing;

thickness: example 7, 25 μm; example 8, 10 μm; example 9, 30 μm.

Barrier layer: polyvinylidene chloride resin PVDC resin 2,

PVS 815, SOLVAY;

thickness: example 7, 50 μm; example 8, 10 μm; example 9, 40 μm.

Laminating layer:

the low-density polyethylene resin 2 is a low-density polyethylene resin,

DOW production;

the rosin resin 2 is prepared by mixing the rosin resin,

guangdong Ke maolin production;

petroleum resin 2, Escorez 5637, manufactured by ExxonMobil;

the thickness is 50 μm.

The above-mentioned references summarize the above-mentioned component materials and evaluation results in table 3 below:

TABLE 3

Substrate layer: biaxially oriented nylon film 3 having a thickness of 20 μm, made by EMBLM ON-15, manufactured by NITIKA.

Inorganic plating: inorganic coating 3, AL₂O₃And the thickness is 10 nm.

Chemical coating layer: the acrylic resin 3 is a mixture of acrylic resin,

DSM manufacturing;

the diluent is: water: 3-isopropyl alcohol: 1.

adhesive layer: two-component polyurethane resin 3, Liofol LA 2550-21/curing agent LA 5001, made by Henkel;

diluent agent: ethyl acetate;

the thickness was 3 μm.

First and second sealing layers: a low-density polyethylene resin 3 which is,

manufactured by PRIME POLYMER;

thickness: example 10, 80 μm; example 11, 75 μm; example 12, 70 μm; example 13, 60 μm.

First and second adhesive layers:

acid-modified vinyl acrylate resin 3, Bynel 2100 series 21E781, manufactured by DUPONT;

the SEBS resin 3 is used for preparing the epoxy resin,

koteng manufacturing;

thickness: example 10, 5 μm; example 11, 10 μm; example 12, 15 μm; example 13, 25 μm.

Barrier layer:

polyvinylidene chloride resin PVDC resin 3-1,

PVS 815, SOLVAY;

ethylene/vinyl alcohol copolymer EVOH 3-2, EVAL^TMSP434A manufactured by Kuraray;

thickness: example 10, 20 μm; example 11, 30 μm; example 12, 40 μm; example 13, 50 μm.

Laminating layer:

3-1 parts of low-density polyethylene resin,

DOW production;

3-1 parts of rosin resin,

guangdong Ke maolin production;

petroleum resin 3-1, Escorez 5637, manufactured by ExxonMobil;

modified polyolefin resin 3-2, ADMER^TMNE827, manufactured by MITSUI CHEMICALS;

ADMER^TMSE810, manufactured by MITSUI CHEMICALS;

elastomer 3-2, TAFMER^TMDF740, DF9200, MITSUI CHEMICALS;

thickness: example 10, 20 μm; example 11, 30 μm; example 12, 40 μm; example 13, 60 μm.

The above-mentioned component materials and evaluation results are summarized in the following table 4:

TABLE 4

Example 14

The moisture-proof laminated structure comprises a base material layer, an inorganic coating layer, a chemical coating layer, an adhesive layer, a first sealing layer, a first bonding layer, a blocking layer, a second bonding layer, a second sealing layer and a laminating layer which are sequentially arranged from top to bottom. Wherein the content of the first and second substances,

substrate layer: the thickness is 8 μm; biaxially oriented nylon film, EMBLM ON-15, manufactured by NITIKA, Japan.

Inorganic plating: the thickness is 10 nm; AL₂O₃。

Chemical coating layer: the thickness is 0.1 μm; an acrylic resin, a resin containing at least one of a vinyl group,

DSM manufacturing; diluent water: 3-isopropyl alcohol: 1.

adhesive layer: 3 μm thick, two-component polyurethane resin, Liofol LA 2550-21/curing agent LA 5001, made by Henkel;

diluent agent: and (3) ethyl acetate.

A first sealing layer: a thickness of 100 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a second sealing layer: a thickness of 100 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a first adhesive layer: the thickness is 8 μm; acid-modified ethylene acrylate resins, Bynel 2100 series 21E781, manufactured by DUPONT;

a second adhesive layer: the thickness is 8 μm; acid-modified ethylene acrylate resins, Bynel 2100 series 21E781, manufactured by DUPONT;

a barrier layer with a thickness of 60 μm; polyvinylidene chloride resin PVDC resin,

PVS 815; manufactured by SOLVAY;

the thickness of the laminating layer is 125 mu m; a low-density polyethylene resin, a high-density polyethylene resin,

DOW production;

the thickness ratio is: 54.9.

example 15

substrate layer: the thickness is 25 μm; biaxially oriented nylon film, EMBLM ON-15, manufactured by NITIKA, Japan;

inorganic plating: the thickness is 100 nm; SiO 2₂；

Chemical coating layer: the thickness is 10 μm; acrylic resins, Alberdingk

Manufacture of AlberdingKBOLEY

Adhesive layer: 5 μm thick, two-component polyurethane resin, Liofol LA 2550-21/curing agent LA 5001, made by Henkel;

diluent agent: ethyl acetate

A first sealing layer: a thickness of 20 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a second sealing layer: a thickness of 20 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a first adhesive layer: the thickness is 5 μm; an SEBS resin is used for preparing the epoxy resin,

koteng manufacturing;

a second adhesive layer: the thickness is 5 μm; an SEBS resin is used for preparing the epoxy resin,

koteng manufacturing;

barrier layer: the thickness is 10 μm; polyvinylidene chloride resin PVDC resin,

PVS 815; manufactured by SOLVAY;

laminating layer: the thickness is 25 μm; the rosin resin is prepared by the steps of mixing rosin resin,

guangdong Ke maolin production;

wherein, the thickness ratio of isolation layer and separation laminating layer is: 2.4.

example 16

substrate layer: the thickness is 10 μm; biaxially oriented nylon film, EMBLM ON-15, manufactured by NITIKA, Japan;

inorganic plating: the thickness is 10 nm; AL₂O₃-SiO₂；

Chemical coating layer: the thickness is 0.5 μm; acrylic resins, Alberdingk

Manufacture of AlberdingKBOLEY

Adhesive layer: 7 μm thick, two-component polyurethane resin, Liofol LA 2550-21/curing agent LA 5001, made by Henkel;

diluent agent: ethyl acetate

A first sealing layer: 60 μm in thickness, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a second sealing layer: 60 μm in thickness, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a first adhesive layer: the thickness is 20 μm; an SEBS resin is used for preparing the epoxy resin,

koteng manufacturing;

a second adhesive layer: the thickness is 20 μm; an SEBS resin is used for preparing the epoxy resin,

koteng manufacturing;

a barrier layer with a thickness of 50 μm; polyvinylidene chloride resin PVDC resin,

PVS 815; manufactured by SOLVAY;

the thickness of the laminating layer is 80 mu m; petroleum resin, Escorez 5637, manufactured by ExxonMobil;

wherein, the thickness ratio of isolation layer and separation laminating layer is: 27.6.

example 17

The moisture-proof laminated structure comprises a base material layer, an inorganic coating layer, a chemical coating layer, an adhesive layer, a first sealing layer, a first bonding layer, a barrier layer, a second bonding layer and a laminating layer which are sequentially arranged from top to bottom. Wherein the content of the first and second substances,

inorganic plating: the thickness is 10 nm; AL₂O₃-SiO₂；

Chemical coating layer: the thickness is 0.5 μm; acrylic resins, Alberdingk

Manufacture of AlberdingKBOLEY

diluent agent: ethyl acetate

A first sealing layer: 60 μm in thickness, a low density polyethylene resin,

manufactured by PRIME POLYMER;

koteng manufacturing;

koteng manufacturing;

PVS 815; manufactured by SOLVAY;

laminating layer: the thickness is 80 μm; petroleum resin, Escorez 5637, manufactured by ExxonMobil;

wherein, the thickness ratio of isolation layer and separation laminating layer is: 21.9.

the above-mentioned component materials and evaluation results are summarized in the following table 5:

TABLE 5

In the above embodiment:

the thickness of each layer was measured in accordance with GB/T6672 and, in μm.

The peel adhesion was measured according to the peel adhesion measured according to GB/T8808 and has the unit N/15 mm.

Dynamic shear force was measured according to GBT 33332 and has a unit of N/cm²。

The water vapor transmission amount was measured in accordance with GB/T1037 and the unit is g/(m)²·24h)。

The oxygen transmission capacity was determined in accordance with GB/T1038 and, in addition, in ml/(m)²·24h·0.1MPa)。

The dielectric constant ε and the dielectric loss tangent tg б were measured in accordance with GB/T12636.

Compared with the comparative example and the embodiment, the moisture-proof laminated structure can provide firmer bonding force and more excellent barrier property, and can effectively reduce the permeability of oxygen and water vapor.

Comparative example

inorganic plating: the thickness is 5 nm; SiO 2₂；

Chemical coating layer: the thickness is 10 μm; acrylic resins, Alberdingk

Manufacture of AlberdingKBOLEY

diluent agent: ethyl acetate

A first sealing layer: a thickness of 10 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

a second sealing layer: a thickness of 10 μm, a low density polyethylene resin,

manufactured by PRIME POLYMER;

koteng manufacturing;

koteng manufacturing;

barrier layer: the thickness is 5 μm; polyvinylidene chloride resin PVDC resin,

PVS 815; manufactured by SOLVAY;

laminating layer: the thickness is 20 μm; the rosin resin is prepared by the steps of mixing rosin resin,

guangdong Ke maolin production;

wherein, the thickness ratio of isolation layer and separation laminating layer is: 1.6

The above-mentioned component materials and evaluation results are summarized in table 6 below:

TABLE 6

Test example 1

The use method and the principle are as follows: as shown in fig. 2, the moisture-proof layered structure 100 obtained in example 6 was used as a mounting material for preventing moisture on the surface of the ceramic three-dimensional porous structure 200, and was directly mounted on the surface of the ceramic three-dimensional porous structure 200. The moisture-proof layered structure 100 has a water vapor transmission of 0.4 g/(m)²24h), oxygen transmission of 0.7 ml/(m)²24 h.0.1 MPa), a dielectric constant ε of 2.1, and a dielectric loss tangent tg б of 2.5X 10^-3。

Generally, the moisture-proof laminated structure 100 can be attached to one side of a surface, or attached to both sides of the surface and the inner side, so as to achieve a more desirable moisture-proof effect. Specifically, the moisture-proof laminated structure 100 is seamlessly attached to the surface of the ceramic three-dimensional porous structure 200 in a specific mold under a heated and pressurized state, cooled to room temperature, and trimmed to remove the excess portions, thereby forming a complete ceramic wave-transparent structure module. The ceramic wave-transparent structure module is finally installed in a radar communication system to work.

The moisture resistant layered structure 100 may be in the form of a sheet, a plate, a roll, or even a wound disc, and is designed according to the size of the radar communication system.

The ceramic wave-transparent structure module can meet the requirements under the conditions of normal temperature of 25 ℃ and relative humidity of 50%, the ceramic wave-transparent structure module can be placed for 2.5 years, and the weight gain is not more than 0.2%. Under the conditions that the temperature is 38 ℃ and the relative humidity is 90%, the ceramic wave-transparent structure module can meet the requirement that the weight is increased by not more than 0.35% after the ceramic wave-transparent structure module is placed for 6 months.

Test example 2

The moisture-proof laminated structures prepared in the embodiments are respectively used as mounting materials for moisture protection of the surfaces of the ceramic three-dimensional porous structural members, and are directly mounted on the inner and outer surfaces of the ceramic three-dimensional porous structural members for corresponding performance tests, and the test results are as follows: (1) the ceramic wave-transparent structure module can meet the requirements under the conditions of normal temperature of 25 ℃ and relative humidity of 50%, the ceramic wave-transparent structure module can be placed for 2.5 years, and the weight gain is not more than 0.2%; (2) under the conditions that the temperature is 38 ℃ and the relative humidity is 90%, the ceramic wave-transparent structure module can meet the requirement, the ceramic wave-transparent structure module is placed for 6 months, and the weight is increased by not more than 0.35%; (3) the bonding strength is more than or equal to 15N/15 mm; (4) the moisture-proof effect is maintained for more than 10 years.

It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications can be made without departing from the scope of the invention.

Claims

1. A moisture resistant laminate structure comprising:

the isolating layer and the barrier laminating layer are mutually connected through the adhesive layer; the thickness ratio of the barrier laminating layer to the isolating layer is 2.4-54.9.

2. The moisture resistant laminate structure of claim 1 wherein the ratio of the thickness of the barrier adhesive layer to the barrier layer is from 5.6 to 27.6.

3. The moisture resistant laminate structure of claim 2 wherein the ratio of the thickness of the barrier adhesive layer to the barrier layer is from 8.2 to 20.1.

4. The moisture-resistant layered structure as claimed in any one of claims 1 to 3, wherein the separation layer comprises a substrate layer, an inorganic plating layer and a chemical coating layer, which are sequentially stacked;

5. The moisture resistant laminate structure of claim 4 wherein the barrier laminate layer further comprises a second sealing layer disposed between the second adhesive layer and the laminate layer.

6. The moisture-proof laminate structure as claimed in claim 4, wherein the substrate layer is a single layer film or a composite film of two or more layers of polyester resin, polyolefin resin, polyphenol resin, polyamide resin, polymethacrylate resin, polycarbonate resin, ABS resin, polyimide resin and polytetrafluoroethylene resin, and has a thickness of 8-25 μm and a light transmittance of more than 80%.

7. The moisture resistant laminate structure in accordance with claim 6 wherein the substrate layer has a thickness of 10-20 μm and a light transmission of greater than 85%.

8. The moisture resistant laminate structure in accordance with claim 4 wherein the inorganic coating is an oxide coating having a thickness of 1-100 nm.

9. The moisture resistant laminate structure of claim 8 wherein the inorganic coating has a thickness of 10-30 nm.

10. The moisture resistant laminate structure in accordance with claim 4 wherein the chemical coating layer is one of polyacrylic resin, polyurethane resin, polyvinyl alcohol resin, polyester resin, poly chlorinated polypropylene resin, polytetrafluoroethylene resin, polyepoxy resin and modified polyolefin resin and has a thickness of 0.1 to 10 μm.

11. The moisture resistant laminate structure of claim 10 wherein the chemical coating has a thickness of 0.5-5 μm.

12. The moisture resistant layered structure of claim 4 wherein the adhesive layer is one of polyethylene resin, styrene resin, polypropylene resin, thermoplastic polyurethane resin, polyvinyl chloride resin, rosin tackifying resin, C5/C9 petroleum resin, terpene resin, etc., and has a thickness of 25-125 μm.

13. The moisture resistant laminate structure of claim 12 wherein the conformable layer has a thickness of 40-80 μm.

14. The moisture resistant laminate structure of claim 5 wherein the first and second sealant layers are each one of a polyethylene resin, a polypropylene resin and a thermoplastic polyurethane resin and have a thickness of 20-100 μm.

15. The moisture resistant laminate structure of claim 14 wherein the first and second sealing layers each have a thickness of 30-60 μm.

16. The moisture resistant laminate structure of claim 4 wherein the first and second tie layers are each one of an ethylene vinyl acetate polymer, an ethylene methyl acrylate copolymer, an ethylene acrylic acid copolymer, a styrene butadiene styrene, a styrene ethylene butylene styrene or a styrene propylene styrene, a modified polyethylene, a thermoplastic polyurethane and a polyamide resin and have a thickness of 5-30 μm.

17. The moisture resistant laminate structure of claim 16 wherein the first and second adhesive layers each have a thickness of 10-20 μm.

18. The moisture resistant laminate structure in accordance with claim 4 wherein the barrier layer is one of a polyvinylidene chloride resin, an ethylene/vinyl alcohol copolymer and a polyvinyl alcohol resin and has a thickness of 10-60 μm.

19. The moisture resistant laminate structure of claim 18 wherein the barrier layer has a thickness of from 20 to 50 μm.

20. The moisture resistant laminate structure of claim 1 wherein the adhesive layer is a hot melt adhesive or a heat activated adhesive and has a thickness of 1 to 10 μm.

21. The moisture resistant laminate structure of claim 20 wherein the adhesive layer has a thickness of 2 to 5 μm.

22. A signal protection device comprising a moisture resistant laminate structure as claimed in any one of claims 1 to 21, the moisture resistant laminate structure being provided on a body of the signal protection device.

23. The signal protection device of claim 22, wherein the body of the signal protection device is a radome.

24. The signal protection device of claim 23, wherein the radome is a ceramic radome.