CN210692516U - Integrated device - Google Patents

Abstract

The utility model relates to a circuit board manufacturing technology field, and specifically disclose an integrated device, including device body and hot melt post, the device body includes the circuit board that two intervals set up at least, set up the connector between two circuit boards, the connector includes the insulator, a side that the insulator is close to the circuit board sets up a plurality of electric conductors, a side that the circuit board is close to the insulator is provided with the pad that equals and the position corresponds with electric conductor quantity, the electric conductor realizes the electric conductance with the pad butt and leads to, two electric conductors of the relative both sides face of insulator pass through the electric conductance of conducting medium, run through along its thickness direction on the device body and seted up the through-hole, the hot melt post is installed in the through-hole, the both ends of hot melt post extend to protrusion in the relative both sides face of device body respectively, the. The utility model discloses an integrated device can be dismantled, and the maintenance cost is low, and electric conductivity is good.

Description

Integrated device

Technical Field

The utility model relates to a circuit board makes technical field, especially relates to an integrated device.

Background

In the electronics industry, electronic components such as chips and circuit boards are often connected by solder joints (BGA) or conductive adhesives. Although welding has the advantage of reliable connection, the welding also has the defect that the welding cannot be repeatedly disassembled and assembled, and if the welding process has misoperation or the problems of poor conduction and the like after welding, the welded electronic element only consumes more resources for reworking or is directly scrapped, so that the material waste and the cost are caused; although the conductive adhesive connection is easier to implement and convenient for rework and maintenance compared with soldering, the conductive performance of the conductive adhesive is not stable enough due to some problems of the conductive adhesive itself and the influence of external factors such as weather, aging, stress strain and the like, so that the problem of circuit interruption or signal distortion is easy to occur between electronic elements connected by the conductive adhesive.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides an aim at: the integrated device is detachable, low in maintenance cost and good in electric conductivity.

To achieve the purpose, the embodiment of the present invention adopts the following technical solutions:

providing an integrated device comprising:

the device comprises a device body, wherein the device body at least comprises two circuit boards arranged at intervals, a connector is arranged between the two circuit boards, the connector comprises an insulator, a plurality of electric conductors are arranged on one side surface, close to the circuit boards, of the insulator, one side surface, close to the insulator, of the circuit board is provided with bonding pads which are equal in number and correspond to the electric conductors in position, the electric conductors are abutted against the bonding pads to realize electric conduction, the two electric conductors on the two opposite side surfaces of the insulator are electrically conducted through a conducting medium, and a through hole is formed in the device body in a penetrating mode along the thickness direction of the;

the hot melt post, the hot melt post install in the through-hole, the both ends of hot melt post extend to respectively protrusion in the relative both sides face of device body, the tip hot melt of hot melt post forms spacing portion, two spacing portion presss from both sides tightly the device body.

As a preferred scheme of the integrated device, a limiting protrusion is convexly arranged on the outer wall of the hot-melting column, the limiting protrusion is adjacent to one end of the hot-melting column, and before the hot-melting column forms the limiting part, the limiting protrusion abuts against one side face of the device body in the thickness direction.

As a preferable scheme of the integrated device, the outer wall of the hot melting column is annularly provided with a plurality of limiting protrusions.

As a preferred scheme of the integrated device, an anti-rotation groove is concavely arranged on the wall of the through hole, the anti-rotation groove penetrates through the device body along the thickness direction of the device body, an anti-rotation convex part is convexly arranged on the outer wall of the hot-melting column, and the anti-rotation convex part is in inserted fit with the anti-rotation groove; or the like, or, alternatively,

the anti-rotation groove is concavely arranged on the outer wall of the hot-melting column, the anti-rotation groove penetrates through the hot-melting column along the length direction of the hot-melting column, the anti-rotation convex part is convexly arranged on the hole wall of the through hole, and the anti-rotation convex part is in plug-in fit with the anti-rotation groove.

As a preferable scheme of the integrated device, at least three hot-melting columns are arranged on the device body, and at least three hot-melting columns form a fixed plane.

As a preferred scheme of the integrated device, the device body is rectangular, and the four corners of the device body are provided with the hot melting columns.

As a preferred scheme of the integrated device, the hot melting column is conical, and the through hole is a conical hole matched with the hot melting column.

As a preferable scheme of the integrated device, a glue film layer is arranged between two adjacent electric conductors on the same side face of the insulator, and the glue film layer is bonded with the circuit board.

As a preferred scheme of the integrated device, a component is disposed on a side surface of the circuit board close to the insulator, and the insulator is provided with a containing hole or a containing groove for containing the component.

As a preferable mode of the integrated device, a bump is provided on the pad and/or the conductor.

As a preferable mode of the integrated device, the convex portion has a regular or irregular solid geometry.

As a preferable mode of the integrated device, the shape of the convex portion is a sharp corner shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape or a block shape.

As a preferable mode of the integrated device, the surface of the convex portion is a regular or irregular arc-shaped surface.

As a preferable embodiment of the integrated device, the surface of the conductive body is a rough surface or a flat surface.

As a preferable mode of the integrated device, the material of the protruding portion is one or a combination of more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

As a preferable scheme of the integrated device, an adhesive film layer is disposed on at least one side surface of the insulator or/and the protrusion, and the protrusion is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.

The utility model discloses beneficial effect does: through setting up the hot melt post, can utilize the hot melt to form and fix the device body in the spacing portion of hot melt post tip, make between circuit board and the connector not need welding and screw connection, the connection reliability of circuit board and connector has been promoted effectively, when components and parts on the circuit board broke down, it can make circuit board and connector separation to get rid of spacing portion, and then maintain and change the operation of components and parts to the circuit board, only need provide new hot melt post after the maintenance is ended and can realize connecting again circuit board and connector, former circuit board and connector still can use, manufacturing and maintenance cost have greatly been reduced.

Drawings

The present invention will be described in further detail with reference to the accompanying drawings and examples.

Fig. 1 is a schematic cross-sectional view of an integrated device according to an embodiment of the present invention.

Fig. 2 is an exploded schematic view of a device body and a hot-melting column according to an embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of an integrated device according to another embodiment of the present invention.

Fig. 4 is a schematic structural diagram of a hot-melting column according to an embodiment of the present invention.

In the figure:

1. a device body; 11. a circuit board; 111. a pad; 12. a connector; 121. an insulator; 122. an electrical conductor; 123. a conductive medium; 124. connecting holes; 13. a through hole;

2. hot melting the column; 21. a limiting part; 22. a limiting bulge;

3. and (5) a film layer.

Detailed Description

In order to make the technical problems, technical solutions and technical effects achieved by the present invention more clear, the embodiments of the present invention will be described in further detail with reference to the accompanying drawings, and obviously, the described embodiments are only some embodiments, not all embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

As shown in fig. 1 and 2, the present invention provides an integrated device, which comprises a device body 1 and a heat-melting column 2, wherein the device body 1 at least comprises two circuit boards 11 arranged at an interval, a connector 12 is arranged between the two circuit boards 11, the connector 12 comprises an insulator 121, a plurality of electric conductors 122 are arranged on one side surface of the insulator 121 close to the circuit board 11, a bonding pad 111 with the same number and corresponding position as the electric conductors 122 is arranged on one side surface of the circuit board 11 close to the insulator 121, the electric conductors 122 are abutted against the bonding pad 111 to realize electric conduction, the two electric conductors 122 on the two opposite side surfaces of the insulator 121 are electrically conducted through a conductive medium 123, a through hole 13 is arranged on the device body 1 along the thickness direction thereof, the heat-melting column 2 is installed on the through hole 13, two ends of the heat-melting column 2 respectively extend to the two opposite side surfaces, the two stopper portions 21 clamp the device body 1. Through setting up hot melt post 2, can utilize the hot melt to form and fix device body 1 in spacing portion 21 of 2 tip of hot melt post, make between circuit board 11 and the connector 12 do not need welding and screw connection, circuit board 11 and connector 12's connection reliability has been promoted effectively, when components and parts on the circuit board 11 broke down, it can make circuit board 11 and connector 12 separation to get rid of spacing portion 21, and then maintain and change the operation of components and parts to circuit board 11, only need provide new hot melt post 2 after the maintenance is ended and can realize the connection again to circuit board 11 and connector 12, former circuit board 11 and connector 12 still can use, manufacturing and maintenance cost have greatly been reduced.

Optionally, at least three heat-melting columns 2 are arranged on the device body 1, and at least three heat-melting columns 2 form a fixed plane. The at least three heat-melting columns 2 arranged in a plane can enhance the connection strength of the connector 12 and the circuit board 11, and improve the structural stability of the integrated device connected into a whole.

In this embodiment, the device body 1 is rectangular, and the four corners of the device body 1 are provided with the heat-melting posts 2. The hot melt post 2 that the quadrangle position was arranged is not only fixed stable, can also avoid occupying the middle part region of circuit board 11, avoids hot melt post 2 to obstruct arranging of the components and parts of circuit board 11, and in addition, the mode that hot melt post 2 was arranged to the edge can also reduce the damage probability to the components and parts on the circuit board 11 when the assembly with dismantle. Of course, the heat fusion posts 2 on the device body 1 are not limited to four, nor to four-corner arrangement, and three, five or even more heat fusion posts 2 may be arranged in a triangular, polygonal or irregular manner. In addition, the shape of the device body 1 is not limited to a rectangle, and may be a triangle, a pentagon or a special-shaped structure as required.

The hot melting column 2 can be in the shape of a cylinder, a triangular prism, a square column and the like, correspondingly, the through hole 13 formed in the device body 1 is a round hole, a triangular hole or a square hole, and the length of the hot melting column 2 is greater than the thickness of the device body 1.

In other embodiments, the hot melt column 2 can also be set to be conical, the two ends of the length direction of the hot melt column 2 are respectively a first end and a second end, the first end and the second end both need to be hot melted to form the limiting portion 21, when the hot melt column 2 is not hot melted to form the limiting portion 21, the size of the first end is larger than that of the second end, the shape of the through hole 13 is matched with that of the hot melt column 2, namely, the through hole 13 is a conical hole. The hot melting column 2 with the conical structure is matched with the conical through hole 13, so that the installation is easier, and the manufacturing precision can be reduced.

The shape and size of the circuit board 11 of the device body 1 are consistent with those of the connector 12, so that the edge of the circuit board 11 is flush with that of the connector 12, and each through hole 13 penetrates through all the circuit boards 11 and the connectors 12 to match with the heat-fusible columns 2 to fix the circuit boards 11 and the connectors 12.

As shown in fig. 4 and referring to fig. 1, in order to reduce the difficulty of installing the heat-melting column 2 in the through hole 13 of the device body 1, a limiting protrusion 22 is convexly disposed on the outer wall of the heat-melting column 2, the limiting protrusion 22 is adjacent to one end of the heat-melting column 2, and before the heat-melting column 2 forms the limiting portion 21 by heat melting, the limiting protrusion 22 abuts against one side surface of the device body 1 in the thickness direction. Utilize spacing protruding 22's limiting displacement, hot melt post 2 can be located appointed position after assembling through-hole 13 for the outside of device body 1 is reached to the homoenergetic extension in both ends of hot melt post 2, and the hot melt of being convenient for forms spacing portion 21.

In this embodiment, a plurality of the limiting protrusions 22 are annularly arranged on the outer wall of the heat-melting column 2.

In order to prevent that hot melt post 2 from rotating for device body 1 along the axis of through-hole 13 in through-hole 13, the pore wall of through-hole 13 is concave upward and is equipped with prevents changeing the recess, prevent changeing the recess edge the thickness direction of device body 1 runs through device body 1, the outer wall epirelief of hot melt post 2 is provided with prevents changeing the convex part, prevent changeing the convex part with prevent changeing the recess grafting cooperation. Certainly, prevent changeing the recess and preventing the position of changeing the convex part and can also interchanging, promptly the concave on the outer wall of hot melt post 2 is equipped with prevent changeing the recess, prevent changeing the recess and follow the length direction of hot melt post 2 runs through hot melt post 2, the protrusion is provided with on the pore wall of through-hole 13 prevent changeing the convex part, prevent changeing the convex part with prevent changeing the recess grafting cooperation.

Alternatively, the heat fusible column 2 is a heat fusible plastic, such as the heat fusible column 2 is one or a combination of polyimide, thermoplastic polyimide, modified epoxy, modified acrylic, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polyphenylene, polyvinyl chloride, polysulfone, polyphenylene sulfide, polyether ether ketone, polyphenylene oxide, polytetrafluoroethylene, liquid crystal polymer, polyoxamide. Specifically, the heat stake 2 may be a single component, i.e., one of the above-mentioned various insulating materials, or may be a composite of any of the above-mentioned insulating materials. The material of the insulator 121 of the connector 12 may be the same as that of the heat stake 2.

In order to prevent the connector 12 from colliding with the components on the circuit board 11, a receiving hole or a receiving groove may be formed in the insulator 121 at a position corresponding to the components on the circuit board 11, and the components on the circuit board 11 are placed in the receiving hole or the receiving groove after the connector 12 is assembled with the circuit board 11.

As shown in fig. 3, an adhesive film layer 3 is provided between two adjacent conductors 122 located on the same side of the insulator 121, and the adhesive film layer 3 is bonded to the circuit board 11. Specifically, the adhesive film layers 3 are disposed on two opposite sides of the insulator 121, and the circuit boards 11 on two sides of the insulator 121 are bonded to the corresponding adhesive film layers 3. The adhesive film layer 3 has adhesion, which can make the connection of the integrated device more stable and not easy to loose and separate. Of course, in order to simplify the process, the adhesive film layer 3 in the embodiment of the present invention is directly formed on the entire surface of the connector 12, and thus, the adhesive film layer 3 is also formed on the surfaces of both sides of the insulator 121. The embodiment of the utility model provides an in, the preferred pressure-sensitive adhesive or thermoplastic adhesive of rete 3, nevertheless according to the difference of the actual application condition, rete 3 can also choose for use thermosetting glue etc..

Referring to fig. 3, the conductor 122 of the connector 12 is provided with a protrusion (not shown). The conductive body 122 is provided with the protruding part, so that accurate alignment connection of the two circuit boards 11 can be realized, the assembly precision is higher, and the protruding part arranged on the conductive body 122 can increase the contact area between the conductive body 122 and the bonding pad 111, so that the contact between the connector 12 and the circuit boards 11 is more sufficient, and the problems of circuit interruption or signal distortion and the like of the integrated device can be avoided; meanwhile, the protruding portion can also increase the friction force between the pad 111 and the conductor 122, so that the pad 111 and the conductor 122 are not easy to be dislocated in the assembling process of the integrated device, and the reliability of the electrical connection between the two circuit boards 11 is ensured. Of course, the protrusion is not limited to be provided on the conductor 122, and may be provided on the pad 111 abutting on the conductor 122, or both the conductor 122 and the pad 111 may be provided with the protrusion.

Specifically, the projections have a regular or irregular solid geometry, such as a pointed shape, an inverted cone shape, a granular shape, a dendritic shape, a columnar shape, a block shape, and the like, and the height h of the projections is in the range of 1 to 30 μm, with 2.5 to 15 μm being the most preferable range. On the basis, the surface of the conductor 122 is provided with two or more protrusions, the shape of each protrusion may be the same or different, and the size of each protrusion may also be the same or different, that is, the shape of the two or more protrusions may be one or more of sharp-angled, inverted-cone, granular, dendritic, columnar and blocky, and the size of the two or more protrusions with the same shape may be different; in addition, two or more protrusions are continuously or discontinuously distributed on the surface of the conductor 122, for example, when the two or more protrusions are in a sharp-angled and continuous distribution, a regular and periodic three-dimensional zigzag pattern or an irregular and disordered three-dimensional zigzag pattern may be formed.

Alternatively, in addition to the solid geometry described above, the surface of the protrusions may be a regular or irregular arc, and the shape of each protrusion may be the same or different, and the size of each protrusion may be the same or different, that is, the radian, height, edge profile shape, etc. of each protrusion may be different. On this basis, when two or more protrusions are continuously distributed on the surface of the conductive body 122, the two or more protrusions form a regular, periodic corrugated pattern, or an irregular, disordered corrugated pattern. Of course, only one of them is listed here, and other combinations of similar shapes are also within the scope of protection of the present application, and are not listed here.

Alternatively, the surface of the conductive body 122 may be a flat surface or a rough surface. The flat surface and the rough surface referred to herein mean a surface of the conductor 122 on which the protrusion is located, that is, a reference surface on which the protrusion is located, and are not a plane formed by two or more protrusions. When the surface of the conductive body 122 is rough, it includes concave portions and convex portions, and the convex portions are distributed on both the concave portions and the convex portions; when the convex part is in a regular or irregular solid geometry, the sum of the height H of any convex part and the height H of the convex part on the convex part is 1 to 30 μm, and certainly, the height H of the convex part on the convex part is 1 to 30 μm, so that the sum of the height H of the convex part and the height H of the convex part on the convex part is more than 1 to 30 μm, and the electrical connection performance of the integrated device can be further enhanced.

Alternatively, as shown in fig. 3, an adhesive structure may be additionally added between the connector 12 and the circuit board 11 to facilitate the assembly of the integrated device. Specifically, the protruding portions are provided with the adhesive film layer 3, and for each protruding portion, when the connector 12 is not clamped between the two circuit boards 11, it is hidden in the adhesive film layer 3 or penetrates through the adhesive film layer 3 and is exposed. Based on this, during the assembly process of the integrated device, since the adhesive film layer 3 has fluidity, the bump which has not penetrated the adhesive film layer 3 before all or individually penetrates the adhesive film layer 3 and contacts with the pad 111 together with the bump which has penetrated the adhesive film layer 3 before, so that the connector 12 and the circuit board 11 form a reliable electrical connection, and the integrated device is ensured to have good conductive performance after the adhesive film layer 3 is added.

Optionally, the material of the protruding portion is one or a combination of copper, nickel, lead, chromium, molybdenum, zinc, tin, gold, and silver. Specifically, the bump may be composed of a single component, that is, one of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver, or may be composed of a material selected from copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver as a main component, and then one or more metals other than the main component may be formed on the surface of the main component by one or more methods such as electroplating, electroless plating, physical vapor deposition, and chemical vapor deposition, thereby forming a bump made of a composite material. In the embodiment of the present invention, the protruding portion preferably uses copper as a main body, and one or more metals of nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver are formed on the composite material on the surface of copper, because the protruding portion formed only by copper is easily oxidized or worn, and the nickel, tin, gold, and silver formed on the surface of copper can improve the corrosion resistance and wear resistance of the protruding portion, and further can improve the conductivity of the connector 12, and prolong the service life of the connector 12.

Further, as shown in fig. 1, a connection hole 124 is formed through the insulator 121, one end of the connection hole 124 is connected to the conductor 122 on one side surface of the insulator 121, the other end is connected to the conductor 122 on the other side surface of the insulator 121, and the conductive medium 123 is disposed in the connection hole 124. Specifically, the conductive medium 123 adheres to the wall of the connection hole 124 and forms a conductive hole, which may be a through hole, a buried hole, or a blind hole. Of course, during the formation of the conductive medium 123, an operator may also choose to fill the entire connection hole 124 with the conductive medium 123, i.e., not form the conductive hole, so as to prevent the etching solution from entering the conductive hole and protect the conductive medium 123 from being etched.

Optionally, the conductive medium 123 in the embodiment of the present invention is preferably copper, but other materials with good conductive performance, such as tin, silver, gold, graphite, copper paste, silver paste, tin paste, carbon nanotube, etc. may also be selected for use.

The embodiment of the utility model provides a still disclose the manufacturing method of an integrated device for make the integrated device of above arbitrary embodiment, including following step:

step S100, laminating the circuit board 11 and the connector 12 to form a device body 1;

step S200, inserting the hot-melting column 2 into the through hole 13 of the device body 1, and exposing two ends of the hot-melting column 2 out of the device body 1;

step 300, performing hot melting treatment on two ends of the hot melting column 2 to form a limiting part 21 abutting against the device body 1.

The utility model discloses integrated device's manufacturing method is simple, and production efficiency is high, and can satisfy integrated device and relapse the dismouting, reduces and maintains the degree of difficulty and cost.

In this embodiment, at least three hot-melting columns 2 are arranged on the device body 1, and when the hot-melting columns 2 are installed, the hot-melting columns 2 are automatically installed in the through holes 13 of the device body 1 one by using a manipulator. The mode of manipulator installation can realize automated production, promotes production efficiency and quality, reduces the operation degree of difficulty and intensity.

In other embodiments, all the hot-melting columns 2 can be automatically and simultaneously installed in the through holes 13 corresponding to the device body 1 by using a manipulator, the production efficiency can be greatly improved by the operation, the manipulator can be provided with clamping parts corresponding to the number of the hot-melting columns 2, each clamping part clamps one hot-melting column 2, when the manipulator moves, all the hot-melting columns 2 synchronously move to the specified position of the device body 1, namely, the position of each hot-melting column 2 corresponding to one through hole 13, and then one-step installation is realized.

In the hot melting treatment process, the treatment modes of the hot melting column 2 are at least three as follows:

the first method comprises the following steps: the end parts of the hot melting columns 2 are hot melted one by utilizing heating elements to form the limiting parts 21.

And the second method comprises the following steps: and (3) simultaneously carrying out hot melting on all the end parts of the hot melting columns 2 protruding out of one side surface of the device body 1 by using a heating element, and then simultaneously carrying out hot melting on all the end parts of the hot melting columns 2 protruding out of the other side surface of the device body 1 by using the heating element.

And the third is that: the end parts of the hot melting columns 2 on the two side surfaces of the device body 1 are simultaneously subjected to hot melting by utilizing two oppositely arranged heating elements.

The moving and heating of the heating element can be completed by adopting automatic equipment, manual operation is replaced, and the production efficiency and quality are improved.

In the description herein, it is to be understood that the terms "upper" and the like are used in a descriptive sense and based on the orientation or positional relationship shown in the drawings for convenience in description and simplicity of operation, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, configuration and operation in a particular orientation, and therefore should not be construed as limiting the present invention.

In the description herein, references to the description of "an embodiment" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be appropriately combined to form other embodiments as will be appreciated by those skilled in the art.

The technical principle of the present invention is described above with reference to specific embodiments. The description is made for the purpose of illustrating the principles of the invention and should not be construed in any way as limiting the scope of the invention. Based on the explanations herein, those skilled in the art will be able to conceive of other embodiments of the present invention without any inventive effort, which would fall within the scope of the present invention.

Claims (16)

1. An integrated device, comprising:

the device comprises a device body, wherein the device body at least comprises two circuit boards arranged at intervals, a connector is arranged between the two circuit boards, the connector comprises an insulator, a plurality of electric conductors are arranged on one side surface, close to the circuit boards, of the insulator, one side surface, close to the insulator, of the circuit board is provided with bonding pads which are equal in number and correspond to the electric conductors in position, the electric conductors are abutted against the bonding pads to realize electric conduction, the two electric conductors on the two opposite side surfaces of the insulator are electrically conducted through a conducting medium, and a through hole is formed in the device body in a penetrating mode along the thickness direction of the;

the hot melt post, the hot melt post install in the through-hole, the both ends of hot melt post extend to respectively protrusion in the relative both sides face of device body, the tip hot melt of hot melt post forms spacing portion, two spacing portion presss from both sides tightly the device body.

2. The integrated device according to claim 1, wherein a limiting protrusion is convexly disposed on an outer wall of the heat-melting column, the limiting protrusion is adjacent to one end of the heat-melting column, and before the heat-melting column is subjected to heat melting to form the limiting portion, the limiting protrusion abuts against one side surface of the device body in the thickness direction.

3. The integrated device as claimed in claim 2, wherein a plurality of said limiting protrusions are annularly disposed on the outer wall of said heat-fusible column.

4. The integrated device according to claim 1, wherein the wall of the through hole is concavely provided with an anti-rotation groove, the anti-rotation groove penetrates through the device body along the thickness direction of the device body, the outer wall of the hot-melt column is convexly provided with an anti-rotation convex part, and the anti-rotation convex part is in inserted fit with the anti-rotation groove; or the like, or, alternatively,

the anti-rotation groove is concavely arranged on the outer wall of the hot-melting column, the anti-rotation groove penetrates through the hot-melting column along the length direction of the hot-melting column, the anti-rotation convex part is convexly arranged on the hole wall of the through hole, and the anti-rotation convex part is in plug-in fit with the anti-rotation groove.

5. The integrated device of claim 1, wherein at least three of the heat-fusible pillars are disposed on the device body, and at least three of the heat-fusible pillars form a fixed plane.

6. The integrated device of claim 5, wherein the device body is rectangular, and the heat-fusible pillars are disposed at four corners of the device body.

7. The integrated device of claim 1, wherein the heat-fusible pillar is tapered, and the through hole is a tapered hole matching with the heat-fusible pillar.

8. The integrated device according to any one of claims 1 to 7, wherein an adhesive layer is provided between two adjacent conductors on the same side of the insulator, and the adhesive layer is bonded to the circuit board.

9. The integrated device according to any one of claims 1 to 7, wherein a side of the circuit board adjacent to the insulator is provided with a component, and the insulator is provided with a receiving hole or a receiving groove for receiving the component.

10. An integrated device according to any of claims 1 to 7, wherein the pads and/or the conductors are provided with bumps.

11. The integrated device of claim 10, wherein the protrusions have a regular or irregular solid geometry.

12. The integrated device according to claim 11, wherein the shape of the protrusion is a sharp corner, an inverted corner, a grain, a dendrite, a pillar, or a block.

13. The integrated device of claim 10, wherein the surface of the protrusion is a regular or irregular arc-shaped surface.

14. The integrated device of claim 10, wherein the surface of the electrical conductor is a rough surface or a flat surface.

15. The integrated device of claim 10, wherein the material of the protruding portion is one or more of copper, nickel, tin, lead, chromium, molybdenum, zinc, gold, and silver.

16. The integrated device according to claim 10, wherein an adhesive film layer is disposed on at least one side of the insulator and/or the protrusion, and the protrusion is hidden in the adhesive film layer or penetrates through the adhesive film layer and is exposed.

Images