CN210670386U - Transmission system for transmitting DVI signals in long distance by optical fiber - Google Patents
Transmission system for transmitting DVI signals in long distance by optical fiber Download PDFInfo
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- CN210670386U CN210670386U CN201922309179.XU CN201922309179U CN210670386U CN 210670386 U CN210670386 U CN 210670386U CN 201922309179 U CN201922309179 U CN 201922309179U CN 210670386 U CN210670386 U CN 210670386U
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Abstract
The utility model discloses a transmission system of optic fibre remote transmission DVI signal, including first DVI interface, first ESD module, first photoelectric signal conversion chip, the optic fibre line, second photoelectric signal conversion chip, second ESD module and second DVI interface, first DVI interface is connected with first photoelectric signal conversion chip through first ESD module, first photoelectric signal conversion chip passes through the optic fibre line and is connected with second photoelectric signal conversion chip, second photoelectric signal conversion chip passes through second ESD module and second DVI interface connection. The utility model discloses realize the long-range transmission of DVI signal, can support 200 meters transmissions.
Description
Technical Field
The utility model belongs to the technical field of signal transmission structure, especially, relate to a transmission system of optic fibre remote transmission DVI signal.
Background
At present, the rapid development of high-definition digital multimedia interface technology brings diversified demands for multimedia video transmission. In more and more application scenes, such as large-scale medical image systems, high-definition computer monitors, high-definition projectors and other devices, a remote connection to a remote display interface through a DVI interface is required. Dvi (digital Visual interface) transmits digital signals based on TMDS (Transition Minimized Differential Signaling) technology. The TMDS encodes 8-bit data (each base color signal in R, G, B) into 10-bit data (including line-field synchronization information, clock information, data DE, error correction, etc.) by minimum transform using an advanced encoding algorithm, transmits the data by using differential signals after DC balance, and has better electromagnetic compatibility than LVDS and TTL.
At present, the DVI interface cable is suitable for transmitting high-speed video and display EDID information in short distance, but with the increase of the length of the cable, the problems of environmental interference, data loss, signal attenuation, picture distortion and the like of signals are caused during long-distance transmission, and the long distance generally means more than 100 meters.
Therefore, the prior art is to be improved.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a transmission system of optic fibre remote transmission DVI signal to the technical problem who mentions in the solution background art realizes remote transmission through the optic fibre line.
The utility model discloses a transmission system of optic fibre remote transmission DVI signal, including first DVI interface, first ESD module, first photoelectric signal conversion chip, the optic fibre line, second photoelectric signal conversion chip, second ESD module and second DVI interface, first DVI interface is connected with first photoelectric signal conversion chip through first ESD module, first photoelectric signal conversion chip passes through the optic fibre line and is connected with second photoelectric signal conversion chip, second photoelectric signal conversion chip passes through second ESD module and second DVI interface connection.
Preferably, the first ESD module includes a first ESD chip and a second ESD chip, the tenth pin of the first ESD chip is connected to the second pin of the first photoelectric signal conversion chip through a third capacitor, the ninth pin of the first ESD chip is connected to the third pin of the first photoelectric signal conversion chip through a fourth capacitor, the seventh pin of the first ESD chip is connected to the fourth pin of the first photoelectric signal conversion chip through a fifth capacitor, the sixth pin of the first ESD chip is connected to the fifth pin of the first photoelectric signal conversion chip through a sixth capacitor, the tenth pin of the second ESD chip is connected to the sixth pin of the first photoelectric signal conversion chip through a seventh capacitor, the ninth pin of the second ESD chip is connected to the seventh pin of the first photoelectric signal conversion chip through an eighth capacitor, the seventh pin of the second ESD chip is connected to the eighth pin of the first photoelectric signal conversion chip through a ninth capacitor, and the sixth pin of the second ESD chip is connected with the ninth pin of the first photoelectric signal conversion chip through a tenth capacitor.
Preferably, the second ESD module includes a third ESD chip and a fourth ESD chip, a tenth pin on the third ESD chip is connected to the second pin of the second photoelectric signal conversion chip through a thirty-ninth capacitor, a ninth pin on the third ESD chip is connected to the third pin of the second photoelectric signal conversion chip through a forty capacitor, a seventh pin on the third ESD chip is connected to the sixth pin of the second photoelectric signal conversion chip through a forty-eleventh capacitor, a sixth pin on the third ESD chip is connected to the seventh pin of the second photoelectric signal conversion chip through a forty-twelfth capacitor, a tenth pin of the fourth ESD chip is connected to the eighth pin of the second photoelectric signal conversion chip through a forty-thirteenth capacitor, a ninth pin of the fourth ESD chip is connected to the ninth pin of the second photoelectric signal conversion chip through a forty-fourteenth capacitor, and a seventh pin of the fourth ESD chip is connected to the tenth pin of the second photoelectric signal conversion chip through a fifteenth capacitor, and the sixth pin of the fourth ESD chip is connected with the eleventh pin of the second photoelectric signal conversion chip through a sixteenth capacitor.
Preferably, the photoelectric conversion device further comprises a first I2C module connected with the first photoelectric signal conversion chip.
Preferably, the optical fiber connector further comprises a first tail fiber, a first MPO adapter, a second MPO adapter and a second tail fiber, the first DVI interface is connected with one end of the first MPO adapter through the first tail fiber, the second DVI interface is connected with one end of the second MPO adapter through the second tail fiber, and the other end of the first MPO adapter is connected with the other end of the second MPO adapter through an optical fiber line.
Preferably, the photoelectric conversion device further comprises a first direct current circuit connected with the first photoelectric signal conversion chip.
Preferably, the photoelectric conversion device further comprises a second direct current circuit connected with the second photoelectric signal conversion chip.
Preferably, a second I2C module connected to the second electrical signal conversion chip is also included.
The utility model discloses a transmission system of DVI signal of optic fibre remote transmission has realized DVI signal remote transmission TMDS signal, EDID and HPD signal, and transmission process does not have decay, noiselessness, lossless, low-power consumption, high reliability, and transmission distance maximum is 200 meters.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic block diagram of a transmission system for long-distance transmission of DVI signals over optical fibers;
FIG. 2 is a schematic diagram of the physical structure of a transmission system for DVI signals transmitted over long distances via optical fibers;
fig. 3 is a schematic circuit connection diagram of a first optical-electrical signal conversion chip, a first ESD module, and a first I2C module in a transmission system for DVI signal long-distance transmission through an optical fiber;
fig. 4 is a schematic circuit connection diagram of a second optical-to-electrical signal conversion chip, a second ESD module, and a second I2C module in a transmission system for DVI signals transmitted from a long distance through an optical fiber.
The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It is noted that relative terms such as "first," "second," and the like may be used to describe various components, but these terms are not intended to limit the components. These terms are only used to distinguish one component from another component. For example, a first component could be termed a second component, and, similarly, a second component could be termed a first component, without departing from the scope of the present invention. The term "and/or" refers to a combination of any one or more of the associated items and the descriptive items.
As shown in fig. 1, fig. 2, fig. 3 and fig. 4, fig. 1 is a schematic block diagram of a transmission system for DVI signal transmission over long distances through optical fibers; FIG. 2 is a schematic diagram of the physical structure of a transmission system for DVI signals transmitted over long distances via optical fibers; fig. 3 is a schematic circuit connection diagram of a first optical-electrical signal conversion chip, a first ESD module, and a first I2C module in a transmission system for DVI signal long-distance transmission through an optical fiber; fig. 4 is a schematic circuit connection diagram of a second optical-to-electrical signal conversion chip, a second ESD module, and a second I2C module in a transmission system for DVI signal long-distance transmission through an optical fiber; the utility model discloses a transmission system of optic fibre remote transmission DVI signal, including first DVI interface 10, first ESD module, first photoelectric signal conversion chip U2, optic fibre line 30, second photoelectric signal conversion chip U30, second ESD module and second DVI interface 20, first DVI interface is connected with first photoelectric signal conversion chip through first ESD module, first photoelectric signal conversion chip passes through optic fibre line 30 and is connected with second photoelectric signal conversion chip, second photoelectric signal conversion chip passes through second ESD module and second DVI interface connection. The first DVI interface is used for receiving DVI signals; the first photoelectric signal conversion chip U2 is used for converting DVI signals into optical signals, and the optical signals are transmitted to the second photoelectric signal conversion chip U30 through the optical fiber line 30 to be converted into DVI signals to be output; the utility model discloses a transmission system of DVI signal of optic fibre remote transmission has realized DVI signal remote transmission TMDS signal, EDID and HPD signal, and transmission process does not have decay, noiselessness, lossless, low-power consumption, high reliability, and transmission distance maximum is 200 meters.
As shown in fig. 3, preferably, the first ESD module includes a first ESD chip U3 and a second ESD chip U15, the tenth pin OUTPUT1 of the first ESD chip is connected to the second pin Data Channel2+ of the first photoelectric signal conversion chip through a third capacitor C3, the ninth pin OUTPUT2 of the first ESD chip is connected to the third pin Data Channel 2-of the first photoelectric signal conversion chip through a fourth capacitor C4, the seventh pin OUTPUT3 of the first ESD chip is connected to the fourth pin Data Channel1+ of the first photoelectric signal conversion chip through a fifth capacitor C5, the sixth pin OUTPUT4 of the first ESD chip is connected to the fifth pin Data 1-of the first photoelectric signal conversion chip through a sixth capacitor C6, the tenth pin OUTPUT1 of the second ESD chip is connected to the sixth pin Data Channel 0-of the first photoelectric signal conversion chip through a seventh capacitor C7, the eighth pin OUTPUT 6342 of the second ESD chip is connected to the ninth pin Data Channel0+ of the first photoelectric signal conversion chip through a fifth capacitor C8, the seventh pin OUTPUT3 of the second ESD chip is connected to the eighth pin Clock + of the first photoelectric signal conversion chip through a ninth capacitor C9, and the sixth pin OUTPUT4 of the second ESD chip is connected to the ninth pin Clock-of the first photoelectric signal conversion chip through a tenth capacitor C10. The preferred embodiment performs specific circuit definition for the first ESD module; and transmitting the DVI signal received from the first DVI interface to the first photoelectric signal conversion chip, and protecting the data. The model of the first ESD chip U3 and the model of the second ESD chip U15 are RClamp 0524P; the model of the first photoelectric signal conversion chip is TX 06.
As shown in fig. 4, preferably, the second ESD module includes a third ESD chip U9 and a fourth ESD chip U16, a tenth pin OUTPUT1 on the third ESD chip is connected to a second pin Data Channel2+ of the second photoelectric signal conversion chip U30 through a third nineteenth capacitor C39, a ninth pin OUTPUT2 on the third ESD chip is connected to a third pin Data Channel 2-of the second photoelectric signal conversion chip through a forty capacitor C40, a seventh pin OUTPUT3 on the third ESD chip is connected to a sixth pin Data Channel1+ of the second photoelectric signal conversion chip through a fourth eleventh capacitor C41, a sixth pin OUTPUT4 on the third ESD chip is connected to a seventh pin Data Channel 2-ESD of the second photoelectric signal conversion chip through a fourth twelfth capacitor C42, a tenth pin 1 of the fourth ESD chip is connected to a second pin Data Channel2 of the fourth photoelectric signal conversion chip through a thirteenth capacitor C42, and a fourteenth pin Data Channel 638 on the fourth photoelectric signal conversion chip is connected to a fourteenth pin Data Channel2 through a ninth capacitor C638 + of the fourth photoelectric signal conversion chip Connection, the seventh pin OUTPUT3 of the fourth ESD chip is connected to the tenth pin Clock + of the second optical-to-electrical signal conversion chip through a forty-fifth capacitor C45, and the sixth pin OUTPUT4 of the fourth ESD chip is connected to the eleventh pin Clock-of the second optical-to-electrical signal conversion chip through a forty-sixteenth capacitor C46. The preferred embodiment performs specific circuit definition for the first ESD module; the second photoelectric signal conversion chip converts the optical signal transmitted by the optical fiber line into a DVI signal and transmits the DVI signal to the third ESD chip and the fourth ESD chip so as to output the DVI signal to the second DVI interface; the third ESD chip and the fourth ESD chip play a role in protecting data; the model U9 of the third ESD chip and the model U16 of the fourth ESD chip are RClamp 0524P; the model of the second photoelectric signal conversion chip is RX 06.
As shown in fig. 3, it is preferable that a first I2C module connected to the first photoelectric signal conversion chip is further included; the first I2C module includes a first I2C chip U1, model P82B 96; the first pin SCL2 of the first I2C chip U1 is connected to the tenth pin SCL of the first photoelectric signal conversion chip; the second pin SDA2 of the first I2C chip U1 is connected to the eleventh pin SDA of the first photoelectric signal conversion chip; the realization is as follows: I2C data pass-through function and DDC communication function support function.
As shown in fig. 4, it is preferable that a second I2C module connected to the second photoelectric signal conversion chip is further included, and the second I2C module includes a second I2C chip U7; the first pin SCL2 of the second I2C chip U7 is connected to the fourth pin SCL of the second photoelectric signal conversion chip; the second pin SDA2 of the second I2C chip U7 is connected to the fifth pin SDA of the second photoelectric signal conversion chip; the data transparent transmission function of I2C and the DDC communication function are realized.
As shown in fig. 2, it preferably further includes a first pigtail 51, a first MPO adapter 52, a second MPO adapter 53, and a second pigtail 54, where the first DVI interface is connected to one end of the first MPO adapter through the first pigtail, the second DVI interface is connected to one end of the second MPO adapter through the second pigtail, and the other end of the first MPO adapter is connected to the other end of the second MPO adapter through the fiber line 30. The preferred embodiment specifically limits the optical fiber line, the second photoelectric signal conversion chip and the first photoelectric signal conversion chip in terms of physical structure, and realizes that the DVI signal is firstly converted into the optical signal and then is converted into the DVI signal.
As shown in fig. 3, it is preferable that a first direct current circuit connected to the first photoelectric signal conversion chip is further included, the first direct current circuit including a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, and a tenth resistor R10; the first direct current circuit is connected with the power supply end and provides stable voltage; as shown in fig. 4, it is preferable that the photoelectric conversion device further includes a second dc circuit connected to the second photoelectric signal conversion chip, the second dc circuit includes a second inductor L2, a third inductor L3, a fourth inductor L4, a fifth inductor L5, a sixth inductor L6, a seventh inductor L7, an eighth inductor L8, and a ninth inductor L9, and the second dc circuit is connected to the power supply terminal to provide a stable voltage to the second photoelectric signal conversion chip.
As shown in fig. 1, 3 and 4; the number of the optical fiber lines is six, and the twelfth pin avss1 of the first photoelectric signal conversion chip is connected with the thirteenth pin VCSEL2 of the first photoelectric signal conversion chip through a sixteenth vertical cavity surface emitting laser D16; the twelfth pin PD <2> of the second photoelectric signal conversion chip is connected with the thirteenth pin FIT <2> of the second photoelectric signal conversion chip through a twelfth photodiode D22; the above preferred embodiment is implemented such that the sixteenth vertical cavity surface emitting laser D16 transmits an optical signal to the twenty-second photodiode D22 through one optical fiber line; similarly, the fourteenth pin avss2 of the first optical-to-electrical signal conversion chip is connected to the fifteenth pin VCSEL1 of the first optical-to-electrical signal conversion chip through the seventeenth vertical cavity surface emitting laser D17; the fourteenth pin PD <1> of the second photoelectric signal conversion chip is connected with the fifteenth pin FIT <1> of the second photoelectric signal conversion chip through a thirteenth photodiode D23; the sixteenth pin avss3 of the first photoelectric signal conversion chip is connected to the seventeenth pin VCSEL0 of the first photoelectric signal conversion chip through the eighteenth vertical cavity surface emitting laser D18; the sixteenth pin PD <0> of the second photoelectric signal conversion chip is connected with the seventeenth pin FIT <0> of the second photoelectric signal conversion chip through a twenty-fourth photodiode D24; the eighteenth pin avss4 of the first photoelectric signal conversion chip is connected to the nineteenth pin VCSEL < clk > of the first photoelectric signal conversion chip through a nineteenth vertical cavity surface emitting laser D19; the eighteenth pin PD _ clk of the second photoelectric signal conversion chip is connected to the nineteenth pin FIT _ clk of the second photoelectric signal conversion chip through a twenty-fifth photodiode D25; the twentieth pin avss5 of the first photoelectric signal conversion chip is connected to the twenty-first pin VCSEL < SCL/SDA > of the first photoelectric signal conversion chip through the twentieth vertical cavity surface emitting laser D20; the twentieth pin PD _ SCL/SDA of the second photoelectric signal conversion chip is connected to the twenty-first pin av33 of the second photoelectric signal conversion chip through the twenty-sixth photodiode D26; the twenty-second pin avss6 of the first photoelectric signal conversion chip is connected with the twenty-third pin PD < SCL/SDA/HPD > of the first photoelectric signal conversion chip through the twenty-first photodiode D21; the twenty-second pin VCSEL _ SCL/SDA/HPD of the second optical-to-electrical signal conversion chip is connected to the twenty-third pin avss of the second optical-to-electrical signal conversion chip through the twenty-seventh vertical-cavity surface-emitting laser D27. The above preferred embodiment realizes optical signal transmission between the first photoelectric signal conversion chip and the second photoelectric signal conversion chip by 6 optical fiber lines.
The above is only the preferred embodiment of the present invention, and not the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings or the direct or indirect application in other related technical fields are included in the patent protection scope of the present invention.
Claims (8)
1. The utility model provides a transmission system of long-range transmission DVI signal of optic fibre, a serial communication port, including first DVI interface, first ESD module, first photoelectric signal conversion chip, the optic fibre line, second photoelectric signal conversion chip, second ESD module and second DVI interface, first DVI interface is connected with first photoelectric signal conversion chip through first ESD module, first photoelectric signal conversion chip passes through the optic fibre line and is connected with second photoelectric signal conversion chip, second photoelectric signal conversion chip passes through second ESD module and second DVI interface connection.
2. The transmission system of DVI signals over a long distance by optical fiber according to claim 1, wherein the first ESD module includes a first ESD chip and a second ESD chip, the tenth pin of the first ESD chip is connected to the second pin of the first optical-to-electrical signal conversion chip through a third capacitor, the ninth pin of the first ESD chip is connected to the third pin of the first optical-to-electrical signal conversion chip through a fourth capacitor, the seventh pin of the first ESD chip is connected to the fourth pin of the first optical-to-electrical signal conversion chip through a fifth capacitor, the sixth pin of the first ESD chip is connected to the fifth pin of the first optical-to-electrical signal conversion chip through a sixth capacitor, the tenth pin of the second ESD chip is connected to the sixth pin of the first optical-to-electrical signal conversion chip through a seventh capacitor, the ninth pin of the second ESD chip is connected to the seventh pin of the first optical-to-electrical signal conversion chip through an eighth capacitor, the seventh pin of the second ESD chip is connected to the eighth pin of the first photoelectric signal conversion chip through a ninth capacitor, and the sixth pin of the second ESD chip is connected to the ninth pin of the first photoelectric signal conversion chip through a tenth capacitor.
3. The transmission system of DVI signals over long distances via optical fibers according to claim 1, wherein the second ESD module includes a third ESD chip and a fourth ESD chip, a tenth pin of the third ESD chip is connected to the second pin of the second optical-to-electrical signal conversion chip via a thirty-ninth capacitor, a ninth pin of the third ESD chip is connected to the third pin of the second optical-to-electrical signal conversion chip via a forty-fourth capacitor, a seventh pin of the third ESD chip is connected to the sixth pin of the second optical-to-electrical signal conversion chip via a forty-eleventh capacitor, a sixth pin of the third ESD chip is connected to the seventh pin of the second optical-to-electrical signal conversion chip via a forty-twelfth capacitor, a tenth pin of the fourth ESD chip is connected to the eighth pin of the second optical-to-electrical signal conversion chip via a forty-thirteenth capacitor, and a ninth pin of the fourth ESD chip is connected to the ninth pin of the second optical-to-electrical signal conversion chip via a forty-fourth capacitor, the seventh pin of the fourth ESD chip is connected to the tenth pin of the second photoelectric signal conversion chip through a fifteenth capacitor, and the sixth pin of the fourth ESD chip is connected to the eleventh pin of the second photoelectric signal conversion chip through a sixteenth capacitor.
4. The transmission system for DVI signals over long distances using optical fibers according to claim 1, further comprising a first I2C module connected to the first optical-to-electrical signal conversion chip.
5. The transmission system of a DVI signal transmitted over a long distance by an optical fiber according to claim 1, further comprising a first pigtail, a first MPO adapter, a second MPO adapter, and a second pigtail, the first DVI interface being connected to one end of the first MPO adapter through the first pigtail, the second DVI interface being connected to one end of the second MPO adapter through the second pigtail, the other end of the first MPO adapter being connected to the other end of the second MPO adapter through an optical fiber line.
6. The transmission system for DVI signals over long distances using optical fibers according to claim 1, further comprising a first dc circuit connected to the first photoelectric signal conversion chip.
7. The transmission system for DVI signals over long distances via optical fibers according to claim 1, further comprising a second dc circuit connected to the second optical-to-electrical signal conversion chip.
8. The transmission system for DVI signals over long distances using optical fibers according to claim 1, further comprising a second I2C module connected to the second electrical signal conversion chip.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922309179.XU CN210670386U (en) | 2019-12-20 | 2019-12-20 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922309179.XU CN210670386U (en) | 2019-12-20 | 2019-12-20 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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| CN210670386U true CN210670386U (en) | 2020-06-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182277A (en) * | 2019-12-20 | 2020-05-19 | 深圳市巨潮科技股份有限公司 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111182277A (en) * | 2019-12-20 | 2020-05-19 | 深圳市巨潮科技股份有限公司 | Transmission system for transmitting DVI signals in long distance by optical fiber |
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Address after: 518000 517, building 7, Hengda fashion Huigu building (East District), Fulong Road, Tongsheng community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN BIGTIDE TECHNOLOGY Co.,Ltd. Address before: 518000 705, building a, Zhongan science and Technology Park, 117 Huaning Road, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BIGTIDE TECHNOLOGY Co.,Ltd. |