CN210649900U - Circuit board substrate board limit processing equipment - Google Patents
Circuit board substrate board limit processing equipment Download PDFInfo
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- CN210649900U CN210649900U CN201921435804.9U CN201921435804U CN210649900U CN 210649900 U CN210649900 U CN 210649900U CN 201921435804 U CN201921435804 U CN 201921435804U CN 210649900 U CN210649900 U CN 210649900U
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- edge grinding
- edge
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- circuit board
- grinding area
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Abstract
The utility model provides a circuit board substrate board limit processing equipment, which comprises a frame and is characterized in that the frame is provided with a roller conveying mechanism, the roller conveying mechanism is sequentially provided with a first edging area and a second edging area along the material advancing direction, one side of the first edging area is provided with a first pushing mechanism, the first pushing mechanism is connected with a push plate, and the other side of the first edging area is provided with a first edging device; a second pushing mechanism is arranged on one side of the second edge grinding area, the second pushing mechanism is connected with a push plate, and a second edge grinding device is arranged on the other side of the second edge grinding area; a first dust absorption part is arranged between the first edge grinding area and the second edge grinding area; and a second dust suction part is arranged behind the second edge grinding area. The utility model discloses can guarantee the effect of polishing to base plate flange limit both sides, can polish the limit simultaneously and adsorb the piece, avoid polishing the piece and remain at the flange limit, influence the effect of polishing.
Description
Technical Field
The utility model belongs to the technical field of circuit board processing, concretely relates to circuit board base plate board limit processing equipment.
Background
Along with the continuous development and progress of electronic technology, more and more electronic products enter life and work, more and more attention is paid to the quality of the electronic products, and the grinding machine is a tool for grinding circuit board substrates in the electronic products.
The polisher of prior art can produce certain piece dust when using, and the piece dust is detained and has great influence to the effect of polishing at the flange limit, is unfavorable for follow-up processing.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model provides a circuit board limit processing equipment, the utility model discloses can guarantee the effect of polishing to base plate flange limit both sides, can polish the limit simultaneously and adsorb the piece, avoid polishing the piece and remain at the flange limit, influence the effect of polishing.
The technical scheme of the utility model is that:
the board edge processing equipment for the circuit board substrate comprises a rack and is characterized in that the rack is provided with a rolling shaft conveying mechanism, the rolling shaft conveying mechanism is sequentially provided with a first edge grinding area and a second edge grinding area along the advancing direction of materials, one side of the first edge grinding area is provided with a first pushing mechanism, the first pushing mechanism is connected with a push plate, and the other side of the first edge grinding area is provided with a first edge grinding device; a second pushing mechanism is arranged on one side of the second edge grinding area, the second pushing mechanism is connected with a push plate, and a second edge grinding device is arranged on the other side of the second edge grinding area; a first dust absorption part is arranged between the first edge grinding area and the second edge grinding area; and a second dust suction part is arranged behind the second edge grinding area. Particularly, first edging device, second edging device set up respectively in roller bearing transport mechanism's both sides, guarantee to polish to the both sides of base plate.
Through the effect of first push pedal mechanism, second push pedal mechanism, can offset push pedal and base plate and push the edging device to the one side that will polish, guarantee the effect of edging.
Further, first edging device includes the casing, be equipped with the roller bearing of polishing in the casing, the roller bearing of polishing is connected with actuating mechanism, the roller bearing surface of polishing is equipped with the dull polish layer.
Furthermore, the second edge grinding device is consistent with the first edge grinding device in structure.
Furthermore, the first dust suction part is a vacuum dust suction part, and the first dust suction part is connected with a dust collection part which can collect the debris.
Furthermore, the second dust suction part is a vacuum dust suction part, and the second dust suction part is connected with a dust collection part and can collect the debris.
Through the arrangement of the vacuum dust collection part, the dust scraps at the edges of the plate processed by the first edge grinding device can be effectively collected, and the influence of the scraps on the grinding effect is avoided; can guarantee simultaneously that the flange edge dust piece after the processing of second edging device effectively collects, avoid the piece to remain the influence effect of polishing.
Furthermore, the push plate comprises a fixing part, and elastic push blocks are symmetrically arranged on the surface of the fixing part.
Furthermore, the tail end of the elastic pushing block is arc-shaped, so that the base plate can be prevented from being resonated and damaged in the edge grinding process.
Furthermore, the elastic push block is of a double-layer or three-layer structure, so that the stress of the substrate can be ensured to be more uniform in the process of pushing the plate, and the processing stability is ensured.
Through the setting of push pedal, can guarantee to push the edging device with the one side that the base plate needs to polish, guarantee the processing effect of base plate side.
The utility model discloses can guarantee the effect of polishing to base plate flange limit both sides, can polish the limit simultaneously and adsorb the piece, avoid polishing the piece and remain at the flange limit, influence the effect of polishing.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of a partial structure of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Examples
The board edge processing equipment for the circuit board substrate comprises a rack 10 and is characterized in that the rack is provided with a roller conveying mechanism 1, the roller conveying mechanism is sequentially provided with a first edge grinding area 11 and a second edge grinding area 12 along the advancing direction of materials, one side of the first edge grinding area is provided with a first pushing mechanism 1, the first pushing mechanism is connected with a push plate 2, and the other side of the first edge grinding area is provided with a first edge grinding device 3; a second pushing mechanism 4 is arranged on one side of the second edge grinding area, the second pushing mechanism is connected with a push plate 2, and a second edge grinding device 5 is arranged on the other side of the second edge grinding area; a first dust absorption part 6 is arranged between the first edge grinding area and the second edge grinding area; and a second dust suction part 7 is arranged behind the second edging area. Particularly, first edging device, second edging device set up respectively in roller bearing transport mechanism's both sides, guarantee to polish to the both sides of base plate.
Further, the first edge grinding device 3 comprises a shell 31, a grinding roller 32 is arranged in the shell, the grinding roller is connected with a driving mechanism (not marked), and a grinding layer (not marked) is arranged on the surface of the grinding roller.
Furthermore, the second edge grinding device is consistent with the first edge grinding device in structure.
Further, the first dust suction part is a vacuum dust suction part, and the first dust suction part is connected with a dust collection part (not labeled).
Further, the second dust suction part is a vacuum dust suction part, and the second dust suction part is connected with a dust collection part (not labeled).
Through the arrangement of the vacuum dust collection part, the dust scraps at the edges of the plate processed by the first edge grinding device can be effectively collected, and the influence of the scraps on the grinding effect is avoided; can guarantee simultaneously that the flange edge dust piece after the processing of second edging device effectively collects, avoid the piece to remain the influence effect of polishing.
Further, the push plate 2 comprises a fixing portion 21, and elastic push blocks 22 are symmetrically arranged on the surface of the fixing portion.
Furthermore, the tail end of the elastic pushing block is arc-shaped, so that the base plate can be prevented from being resonated and damaged in the edge grinding process.
Furthermore, the elastic push block is of a double-layer or three-layer structure, so that the stress of the substrate can be ensured to be more uniform in the process of pushing the plate, and the processing stability is ensured.
Through the setting of push pedal, can guarantee to push the edging device with the one side that the base plate needs to polish, guarantee the processing effect of base plate side.
The utility model discloses can guarantee the effect of polishing to base plate flange limit both sides, can polish the limit simultaneously and adsorb the piece, avoid polishing the piece and remain at the flange limit, influence the effect of polishing.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art. It should be noted that the technical features not described in detail in the present invention can be implemented by any prior art.
Claims (8)
1. The board edge processing equipment for the circuit board substrate comprises a rack and is characterized in that the rack is provided with a rolling shaft conveying mechanism, the rolling shaft conveying mechanism is sequentially provided with a first edge grinding area and a second edge grinding area along the advancing direction of materials, one side of the first edge grinding area is provided with a first pushing mechanism, the first pushing mechanism is connected with a push plate, and the other side of the first edge grinding area is provided with a first edge grinding device; a second pushing mechanism is arranged on one side of the second edge grinding area, the second pushing mechanism is connected with a push plate, and a second edge grinding device is arranged on the other side of the second edge grinding area; a first dust absorption part is arranged between the first edge grinding area and the second edge grinding area; and a second dust suction part is arranged behind the second edge grinding area.
2. The apparatus for processing edges of circuit board substrates according to claim 1, wherein the first edge grinding device comprises a housing, a grinding roller is disposed in the housing, and a grinding layer is disposed on a surface of the grinding roller.
3. The apparatus of claim 2, wherein the second edge grinding device is structurally identical to the first edge grinding device.
4. The apparatus for processing edges of circuit board substrates as claimed in claim 1, wherein the first dust suction part is a vacuum dust suction part, and a dust collection part is connected to the first dust suction part.
5. The apparatus of claim 1, wherein the second dust suction portion is a vacuum dust suction portion, and the second dust suction portion is connected to a dust collection portion.
6. The apparatus for processing the edge of the circuit board substrate according to claim 1, wherein the push plate comprises a fixing portion, and the surface of the fixing portion is symmetrically provided with elastic push blocks.
7. The apparatus for processing the edge of the circuit board substrate according to claim 6, wherein the end of the elastic pushing block is arc-shaped.
8. The apparatus for processing the edge of the circuit board substrate according to claim 6 or 7, wherein the elastic push block has a double-layer or triple-layer structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921435804.9U CN210649900U (en) | 2019-08-31 | 2019-08-31 | Circuit board substrate board limit processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921435804.9U CN210649900U (en) | 2019-08-31 | 2019-08-31 | Circuit board substrate board limit processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210649900U true CN210649900U (en) | 2020-06-02 |
Family
ID=70845268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921435804.9U Active CN210649900U (en) | 2019-08-31 | 2019-08-31 | Circuit board substrate board limit processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210649900U (en) |
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2019
- 2019-08-31 CN CN201921435804.9U patent/CN210649900U/en active Active
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