CN210641072U - Sensor packaging structure and electronic equipment - Google Patents
Sensor packaging structure and electronic equipment Download PDFInfo
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- CN210641072U CN210641072U CN201921833639.2U CN201921833639U CN210641072U CN 210641072 U CN210641072 U CN 210641072U CN 201921833639 U CN201921833639 U CN 201921833639U CN 210641072 U CN210641072 U CN 210641072U
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- 238000009713 electroplating Methods 0.000 claims description 3
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
Abstract
The utility model discloses a sensor packaging structure and electronic equipment. The sensor packaging structure comprises a substrate and a packaging shell arranged on the substrate, wherein a cavity is defined by the substrate and the packaging shell; the MEMS chip is attached to the substrate and positioned in the cavity; wherein the package housing comprises a core layer, and a first conductive layer bonded to an inner surface of the core layer and a second conductive layer bonded to an outer surface of the core layer; the lower end of the first conducting layer is connected with the substrate through a first electric connecting part, and the lower end of the second conducting layer is connected with the substrate through a second electric connecting part; the first conductive layer and the second conductive layer are electrically connected together on the substrate and grounded. The utility model discloses a technological effect does: the radio frequency interference resistance of the product can be effectively improved.
Description
Technical Field
The utility model relates to an electroacoustic technology field, more specifically, the utility model relates to a sensor packaging structure and electronic equipment.
Background
Micro-Electro-Mechanical systems (MEMS) is a miniaturized Mechanical and electromechanical component that is fabricated using microfabrication processes. In use, the sensor package structure is usually packaged with an Integrated Circuit (ASIC) chip in a sensor device such as a microphone by a corresponding technology. Nowadays, a sensor package structure with a built-in MEMS chip can be assembled into different types of electronic devices, such as mobile phones, tablet computers, notebook computers, VR devices, and smart wearable devices, and the application thereof is very wide.
From the prior art, a chip assembly composed of a MEMS chip and an ASIC chip is mounted inside a package structure enclosed by a substrate and a case, and a sound hole for external sound to enter is further provided on the package structure (of course, the sound hole may be designed on the substrate or the case as required). However, in the existing sensor package structure, the housing of the sensor package structure is usually a single-layer structure, and the radio frequency interference (i.e. electromagnetic wave interference) resistance of the sensor package structure is weak, which cannot meet the special design requirements of some electronic products.
Based on this, it is desirable to provide a sensor package structure with good radio frequency interference resistance, so as to solve the problems in the prior art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a sensor packaging structure and electronic equipment's new technical scheme.
According to a first aspect of the present invention, a sensor package structure is provided, which includes a substrate and a package housing disposed on the substrate, wherein the substrate and the package housing form a cavity;
the MEMS chip is attached to the substrate and positioned in the cavity;
the packaging shell comprises a first conducting layer and a second conducting layer, and the surface of the substrate connected with the packaging shell comprises a first electric connection part and a second electric connection part; the lower end of the first conducting layer is electrically connected with the substrate through a first electric connecting part, and the lower end of the second conducting layer is electrically connected with the substrate through a second electric connecting part; an insulating part is arranged between the first electric connection part and the second electric connection part, and the first electric connection part and the second electric connection part are respectively grounded.
Optionally, the package housing further comprises a core layer; the first conductive layer is bonded to the core inner surface and the second conductive layer is bonded to the core outer surface; the core layer is made of an insulating material.
Optionally, the thickness dimension of the core layer is less than or equal to 1 mm.
Optionally, at least one of the first conductive layer and the second conductive layer is formed on the core layer by electroplating; in the alternative, the first and second sets of the first,
at least one of the first conducting layer and the second conducting layer is bonded with the core layer in a bonding mode.
Optionally, a first metalized through hole and a second metalized through hole are arranged on the substrate, the first metalized through hole is connected with the first electrical connection portion, and the second metalized through hole is connected with the second electrical connection portion;
and a grounding shielding layer is arranged at the bottom of the substrate and is respectively connected with the first metalized through hole and the second metalized through hole.
Optionally, a solder resist material is disposed between the first electrical connection and the second electrical connection.
Optionally, the first electrical connection is in a closed loop configuration;
the second electrical connection portion is in a closed annular structure.
Optionally, a sound hole is disposed on the substrate at a position corresponding to the MEMS chip.
Optionally, the MEMS chip includes a substrate having a back cavity, and a diaphragm and a back plate supported on the substrate, the diaphragm being spaced apart from the back plate; the sound hole is communicated with the back cavity.
Optionally, the sensor package structure further includes an ASIC chip;
the ASIC chip is attached to the substrate; in the alternative, the first and second sets of the first,
the ASIC chip is embedded in the substrate.
Optionally, the sensor package structure further includes a filter device;
the filter device is attached to the substrate; in the alternative, the first and second sets of the first,
the filter device is embedded in the substrate.
According to a second aspect of the present invention, there is provided an electronic device comprising the sensor package structure as described above.
The embodiment of the utility model provides a sensor packaging structure improves its structure of encapsulating the shell, will encapsulate the shell design and be two-layer electromagnetic shield structure to set up the sandwich layer between this two-layer electromagnetic shield structure, this design can obviously promote sensor packaging structure's anti radio frequency interference's ability, avoids the electromagnetic wave to its production influence. Moreover, the double-layer shielding structures are electrically connected together, so that the whole sensor packaging structure can be conveniently assembled in the electronic equipment without additionally arranging excessive bonding pads, and the assembly complexity is not increased. The technical task to be achieved or the technical problems to be solved by the present invention are never thought or not expected by the skilled in the art, so the present invention is a new technical solution.
Other features of the present invention and advantages thereof will become apparent from the following detailed description of exemplary embodiments of the invention, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and together with the description, serve to explain the principles of the invention.
Fig. 1 is a schematic structural diagram of a sensor package structure according to an embodiment of the present invention.
Description of reference numerals:
1-substrate, 101-first metalized through hole, 102-second metalized through hole, 103-sound hole, 2-package shell, 201-first conductive layer, 202-core layer, 203-second conductive layer, 3-MEMS chip, 301-back cavity, 302-diaphragm, 303-back plate, 4-ASIC chip, 5-solder resist material, 6-first electrical connection, 7-second electrical connection.
Detailed Description
Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that: unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
The embodiment of the utility model provides a sensor packaging structure. The sensor package structure may be, for example, a MEMS microphone device, etc., without limitation. The sensor packaging structure can be applied to various electronic products such as mobile phones, notebook computers, tablet computers, VR equipment and intelligent wearable equipment, and is wide in application. The utility model provides a sensor packaging structure has good anti radio frequency interference ability, can effectively shield the electromagnetic wave to the influence of its performance, has overcome current sensor packaging structure's drawback.
The following further describes a specific structure of the sensor package structure provided in the embodiments of the present invention.
An embodiment of the utility model provides a sensor packaging structure, as shown in FIG. 1, its structure is: the packaging structure comprises a substrate 1 and a packaging shell 2 arranged on the substrate 1, wherein the substrate 1 and the packaging shell 2 enclose a cavity. The utility model provides a sensor packaging structure is still including fixed setting MEMS chip 3 on the base plate 1, just MEMS chip 3 is located the inside of cavity can carry out effectual protection to MEMS chip 3 by the cavity. The package housing 2 is a multi-layer composite structure, and includes a core layer 202, a first conductive layer 201 bonded to an inner surface of the core layer 202, and a second conductive layer 203 bonded to an outer surface of the core layer 202. The lower end of the first conductive layer 201 is connected to the substrate 1 through a first electrical connection portion 6. The lower end of the second conductive layer 203 is connected to the substrate 1 through a second electrical connection 7. The first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1 and grounded, and at this time, a complete two-layer electromagnetic shielding structure can be formed.
The embodiment of the utility model provides a sensor packaging structure improves its encapsulation shell 2's structure. Specifically, the package housing 2 is designed to be a two-layer electromagnetic shielding structure, and the core layer 202 is disposed between the two-layer electromagnetic shielding structure, which can significantly improve the radio frequency interference resistance of the sensor package structure, and avoid the influence of electromagnetic waves on the sensor package structure. Of course, the package housing 2 may also be designed to have more layers of electromagnetic shielding structures, and at this time, the core layer 202 may be disposed between two adjacent layers of electromagnetic shielding structures, and those skilled in the art may flexibly adjust the electromagnetic shielding structures according to actual needs. The utility model provides a this design can promote sensor packaging structure's anti radio frequency interference's ability to a great extent, avoids it to receive the interference of electromagnetic wave. Moreover, the double-layer electromagnetic shielding structure, that is, the first conductive layer 201 and the second conductive layer 203 are electrically connected together on the substrate 1, when the whole sensor package structure is assembled in an electronic device, excessive bonding pads do not need to be additionally arranged, the assembly mode is simple, and the assembly complexity is not increased.
The substrate 1 of the present invention may be a circuit board known in the art, for example, a PCB board, etc., without limitation. The circuit design of the sensor packaging structure can be realized by adopting the circuit board as the substrate 1.
The package housing 2 of the present invention, as shown in fig. 1, includes a core layer 202, a first conductive layer 201 and a second conductive layer 203. Wherein the core layer 202 is located in the middle, the first conductive layer 201 is attached to the inner surface of the core layer 202, and the second conductive layer 203 is attached to the outer surface of the core layer 202.
In an alternative example of the present invention, at least one of the first conductive layer 201 and the second conductive layer 203 is formed on the core layer 202 by electroplating.
In another optional example of the present invention, at least one of the first conductive layer 201 and the second conductive layer 203 is bonded to the core layer 202 by adhesion. Specifically, the core layer 202, the first conductive layer 201, and the second conductive layer 203 may be manufactured separately, and then the first conductive layer 201 is bonded to the inner surface of the core layer 202, and the second conductive layer 203 is bonded to the outer surface of the core layer, so that the core layer 202, the first conductive layer 201, and the second conductive layer 203 are bonded together.
The utility model discloses a packaging shell 2, its structure is: as shown in fig. 1, the substrate includes a top portion facing the substrate 1 and a sidewall portion extending from a peripheral edge of the top portion toward the substrate 1, and a semi-enclosed structure is defined by the sidewall portion and the top portion. The substrate 1 is fixedly arranged at the position of the opening end of the packaging shell 2, and a packaging structure with a closed space is formed together. The MEMS chip 3 is encapsulated inside the closed space.
The utility model discloses in, constitute the first conducting layer 201 and the second conducting layer 203 of encapsulation shell 2 can for example choose for use the metal material preparation to form to guarantee that the packaging structure who forms has good electromagnetic shield effect, can ensure that the working property of its inside MEMS chip 3 can not receive external influence, thereby ensure the work that whole sensor packaging structure can be normal. Of course, the package housing 2 may be made of other materials known in the art, and those skilled in the art can adjust the materials according to the needs, which is not limited by the present invention. The core layer 202 constituting the package housing 2 may be made of an insulating material, for example, a resin material.
The utility model discloses a package housing 2 is provided with sandwich layer 202 between first conducting layer 201 wherein and second conducting layer 203. That is, the first conductive layer 201 and the second conductive layer 203 are not directly attached together, but are separated by the core layer 202. In an alternative example of the present invention, the thickness of the core layer 202 is designed to be less than or equal to 1 mm. The sensor packaging structure of the utility model has smaller size, if the thickness of the core layer 202 is designed to be too large, the packaging shell 2 will be oversized, which is not beneficial to the assembly of the sensor packaging structure; alternatively, the size of the first conductive layer 201 located in the inner layer may be too small, so that the size of the cavity enclosed by the package housing 2 and the substrate 1 is too small.
The utility model discloses a sensor packaging structure, as shown in FIG. 1 be provided with first metallized through-hole 101 and second metallized through-hole 102 on the base plate 1 respectively. The first metallized via 101 is connected to the first conductive layer 201 and the second metallized via 102 is connected to the second conductive layer 203. A shielding layer is disposed at the bottom of the substrate 1, and the shielding layer is connected to the first metalized via 101 and the second metalized via 102, respectively. In this case, the shield layer provided on the bottom of the substrate 1 is connected to an external ground pad, and is grounded via the shield layer.
As shown in fig. 1, in the substrate 1 of the present invention, a solder resist material 5 is provided between the first electrical connection portion 6 and the second electrical connection portion 7. That is, the first electrical connection portion 6 and the second electrical connection portion 7 are separated from direct contact by the solder resist material 5. The utility model discloses in first electric connection 6 with set up between second electric connection 7 and hinder and weld material 5, can prevent first conducting layer 201 with second conducting layer 203 hinders this position that welds material 5 and corresponds and switches on each other. The solder resist material 5 may be, for example, an insulating resin material. Of course, the solder resist material 5 may also be made of other insulating materials known to those skilled in the art, and the present invention is not limited thereto.
The first electrical connection 6 of the present invention may be, for example, a closed loop structure. The lower end of the first conductive layer 201 is fixedly connected to the substrate 1 via a first electrical connection 6. Wherein the shape of the first electrical connection 6 should be adapted to the cross-sectional shape of the first conductive layer 201. For example, the cross-sectional shape of the first conductive layer 201 is circular, and the shape of the first electrical connection portion 6 is a closed circular ring structure. For another example, the cross-sectional shape of the first conductive layer 201 is rectangular, and in this case, the shape of the first electrical connection portion 6 is a closed rectangular ring structure.
The second electrical connection portion 7 of the present invention may be a closed annular structure as the first electrical connection portion 6, and the lower end of the second conductive layer 203 is fixedly connected to the substrate 1 through the second electrical connection portion 7.
The utility model discloses a sensor packaging structure, as shown in FIG. 1 correspond on the base plate 1 MEMS chip 3's position is provided with the sound hole 103. The sound hole 103 can allow external sound and air flow to enter the interior of the sensor package structure. Wherein, the skilled person can flexibly adjust the number of the sound holes 103 according to the requirement. For example, the sound hole 103 may be provided as one, and of course, the sound hole 103 may also be provided as a plurality, which is not limited by the present invention. Further, the sound hole 103 may be, for example, a circular hole, a square hole, a rectangular hole, an elliptical hole, a triangular hole, a diamond hole, a parallelogram hole, or the like. The sound hole 103 of multiform all can realize the utility model discloses a technological effect is favorable to manufacturing more, and practicality, reliability are higher.
As shown in fig. 1, the MEMS chip 3 may be mounted on a substrate 1. For example, the MEMS chip 3 is bonded to the substrate 1 with a special adhesive. Of course, the MEMS chip 3 can also be turned on by the circuit pattern in the substrate 1 in a flip-chip manner, which is common knowledge of those skilled in the art, and the present invention is not described in detail herein.
The utility model discloses a MEMS chip 3, its structure is: as shown in fig. 1, includes a substrate having a back cavity 301, and a diaphragm 302 and a back plate 303 supported on the substrate, the diaphragm 302 being spaced apart from the back plate 303. The sound hole 103 is communicated with the back cavity 301, and external sound can directly enter the back cavity 301 of the MEMS chip 3.
In addition to the MEMS chip 3, the sensor package structure of the present invention further includes an ASIC chip 4. In general, the ASIC chip 4 and the MEMS chip 3 are connected together, so that the electrical signal output by the MEMS chip 3 can be transmitted to the ASIC chip 4, processed and output by the ASIC chip 4. The MEMS chip 3 and the ASIC chip 4 may be electrically connected through a metal wire (bonding wire) to achieve conduction therebetween.
In the present invention, the ASIC chip 4 may be attached to the substrate 1. For example, the ASIC chip 4 is bonded to the substrate 1 using a special adhesive.
In addition, the ASIC chip 4 may be embedded in the substrate 1. When the ASIC chip 4 is embedded in the substrate 1, at least one metal layer needs to be provided above and below the ASIC chip 4. The metal layer may be, for example, a copper layer. The metal layer is grounded to act as a shield. A plurality of metallized vias are arranged in the area around the ASIC chip 4, which together with the above-mentioned metal layers form a shielding structure. The design of embedding the ASIC chip 4 into the substrate 1 makes it unnecessary to coat protective glue on the surface of the ASIC chip 4, thus simplifying the process and improving the optical noise resistance of the product. Besides, the ASIC chip 4 is embedded in the substrate 1, and the volume of a cavity formed by the substrate 1 and the packaging shell 2 is reduced.
The sensor package structure of the present invention may further include a filter device (not shown in fig. 1). For example, the filter device may be attached to the substrate 1. For example, the filter device may be embedded in the substrate 1. The utility model discloses a set up the filtering device, can further promote whole sensor packaging structure's anti radio frequency interference ability.
On the other hand, the utility model also provides an electronic equipment. The electronic device comprises a sensor package structure as described above.
Wherein, electronic equipment can be cell-phone, notebook computer, panel computer, VR equipment, intelligent wearing equipment etc. the utility model discloses do not do the restriction to this.
Although certain specific embodiments of the present invention have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the invention. The scope of the invention is defined by the appended claims.
Claims (12)
1. A sensor package structure, characterized by: the packaging structure comprises a substrate and a packaging shell arranged on the substrate, wherein a cavity is formed by the substrate and the packaging shell in a surrounding manner;
the MEMS chip is attached to the substrate and positioned in the cavity;
the packaging shell comprises a first conducting layer and a second conducting layer, and the surface of the substrate connected with the packaging shell comprises a first electric connection part and a second electric connection part; the lower end of the first conducting layer is electrically connected with the substrate through a first electric connecting part, and the lower end of the second conducting layer is electrically connected with the substrate through a second electric connecting part; an insulating part is arranged between the first electric connection part and the second electric connection part, and the first electric connection part and the second electric connection part are respectively grounded.
2. The sensor package structure of claim 1, wherein: the package housing further comprises a core layer; the first conductive layer is bonded to the core inner surface and the second conductive layer is bonded to the core outer surface; the core layer is made of an insulating material.
3. The sensor package structure of claim 2, wherein: the thickness of the core layer is less than or equal to 1 mm.
4. The sensor package structure of claim 2, wherein: at least one of the first conducting layer and the second conducting layer is formed on the core layer in an electroplating mode; in the alternative, the first and second sets of the first,
at least one of the first conducting layer and the second conducting layer is bonded with the core layer in a bonding mode.
5. The sensor package structure of claim 1, wherein: a first metalized through hole and a second metalized through hole are arranged on the substrate, the first metalized through hole is connected with the first electric connection part, and the second metalized through hole is connected with the second electric connection part;
and a grounding shielding layer is arranged at the bottom of the substrate and is respectively connected with the first metalized through hole and the second metalized through hole.
6. The sensor package structure of claim 1, wherein: a solder resist material is disposed between the first electrical connection and the second electrical connection.
7. The sensor package structure of claim 1, wherein: the first electric connection part is of a closed annular structure;
the second electrical connection portion is in a closed annular structure.
8. The sensor package structure of claim 1, wherein: and the substrate is provided with a sound hole corresponding to the MEMS chip.
9. The sensor package structure of claim 8, wherein: the MEMS chip comprises a substrate with a back cavity, and a diaphragm and a back plate which are supported on the substrate, wherein the diaphragm is spaced from the back plate; the sound hole is communicated with the back cavity.
10. The sensor package structure of claim 1, wherein: also includes an ASIC chip;
the ASIC chip is attached to the substrate; in the alternative, the first and second sets of the first,
the ASIC chip is embedded in the substrate.
11. The sensor package structure of claim 1, wherein: the filter device is also included;
the filter device is attached to the substrate; in the alternative, the first and second sets of the first,
the filter device is embedded in the substrate.
12. An electronic device, characterized in that: comprising a sensor package according to any of claims 1-11.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833639.2U CN210641072U (en) | 2019-10-28 | 2019-10-28 | Sensor packaging structure and electronic equipment |
| PCT/CN2019/130228 WO2021082270A1 (en) | 2019-10-28 | 2019-12-31 | Sensor encapsulation structure and electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921833639.2U CN210641072U (en) | 2019-10-28 | 2019-10-28 | Sensor packaging structure and electronic equipment |
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| CN210641072U true CN210641072U (en) | 2020-05-29 |
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| CN201921833639.2U Active CN210641072U (en) | 2019-10-28 | 2019-10-28 | Sensor packaging structure and electronic equipment |
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| CN (1) | CN210641072U (en) |
| WO (1) | WO2021082270A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366187A (en) * | 2020-11-19 | 2021-02-12 | 航天科工微电子***研究院有限公司 | Millimeter wave chip cavity packaging structure and packaging method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080192962A1 (en) * | 2007-02-13 | 2008-08-14 | Sonion Nederland B.V. | Microphone with dual transducers |
| CN204408625U (en) * | 2015-01-21 | 2015-06-17 | 瑞声声学科技(深圳)有限公司 | Mems microphone |
| CN207269267U (en) * | 2017-09-05 | 2018-04-24 | 深圳市艾辰电子有限公司 | A kind of noise control silicon microphone |
| CN209057368U (en) * | 2018-12-25 | 2019-07-02 | 歌尔科技有限公司 | A kind of encapsulating structure and electronic equipment of chip |
-
2019
- 2019-10-28 CN CN201921833639.2U patent/CN210641072U/en active Active
- 2019-12-31 WO PCT/CN2019/130228 patent/WO2021082270A1/en active Application Filing
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366187A (en) * | 2020-11-19 | 2021-02-12 | 航天科工微电子***研究院有限公司 | Millimeter wave chip cavity packaging structure and packaging method |
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| WO2021082270A1 (en) | 2021-05-06 |
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Effective date of registration: 20200612 Address after: 266101 room 103, No. 396, Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266104 Laoshan Qingdao District North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |