CN210641041U

CN210641041U - Half-in-ear earphone

Info

Publication number: CN210641041U
Application number: CN201921622082.8U
Authority: CN
Inventors: 何亮; 夏波; 孙伟; 詹寿昌
Original assignee: Hunan Guosheng Acoustics Technology Co Ltd Shenzhen Branch; Hunan Voc Acoustic Technology Co ltd
Current assignee: Hunan Guosheng Acoustics Technology Co Ltd Shenzhen Branch; Hunan Voc Acoustic Technology Co ltd
Priority date: 2019-09-26
Filing date: 2019-09-26
Publication date: 2020-05-29
Anticipated expiration: 2029-09-26

Abstract

The embodiment of the utility model discloses half in-ear earphone relates to earphone technical field. Half in-ear earphone includes preceding shell of earphone and earphone backshell, the preceding shell of earphone with the shell covers forms a cavity behind the earphone, is provided with the second loudspeaker of preceding chamber subassembly, high-frequency first loudspeaker and low frequency in the cavity, and preceding chamber subassembly and earphone preceding shell form first cavity, and preceding chamber subassembly and earphone backshell form the second cavity, and first loudspeaker are arranged in first cavity and fix on preceding chamber subassembly, and the second loudspeaker are arranged in the second cavity. This application is first cavity and second cavity through forming two solitary cavitys, and first loudspeaker are located first cavity, and the second loudspeaker are located the second cavity, so the second loudspeaker of low frequency and the first loudspeaker of high frequency just can not produce the audio mixing at the simultaneous sound production, and can realize that low frequency and high frequency are complementary, high frequency extensibility can be better, and sound is more clear and more natural, and sound fidelity is good, very big improvement user's experience sense.

Description

Half-in-ear earphone

Technical Field

The utility model relates to an earphone technical field, in particular to half in-ear earphone.

Background

General half in-ear earphone is because it does not get into the duct and can not sealed contact completely between with the auricle when wearing, therefore its bass experience is not very good, in order to make the user reach the good effect of bass, current generally can improve in the aspect of half in-ear earphone's mechanism and strengthen the bass effect, or current generally designs a bass guide tube in half in-ear earphone rear chamber and improves the effect of bass, through this structural design, half in-ear earphone's low frequency can increase 4 ~ 7dB, but the bass effect still is not especially obvious, or the condition of low frequency and high frequency looks audio mixing appears easily. Moreover, the bandwidth of the conventional half-in-ear earphone is generally narrow, and the fidelity of sound is also poor.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides an aim at provides a half in-ear earphone to it is not good to solve above-mentioned current half in-ear earphone bass effect, and the bandwidth is not wide, leads to whole sound fidelity poor, and user experience feels not good problem.

The utility model provides an above-mentioned technical problem adopted technical scheme as follows:

according to an aspect of the embodiment of the present invention, there is provided a half-in-ear earphone, including earphone front shell and earphone rear shell, the earphone rear shell is located on the earphone front shell, the earphone front shell with the earphone rear shell jointly forms a cavity, be provided with front cavity subassembly, first loudspeaker and second loudspeaker in the cavity, front cavity subassembly with the earphone front shell forms first cavity, front cavity subassembly with the earphone rear shell forms the second cavity, first loudspeaker is located in the first cavity and fixes on the front cavity subassembly, the second loudspeaker is located in the second cavity, wherein, first loudspeaker is high frequency loudspeaker, the second loudspeaker is low frequency loudspeaker.

Wherein the first horn is a high frequency MEMS horn.

The front cavity assembly comprises a fixed table, the outer side edge of the fixed table is matched with the inner shape of the front shell of the earphone, a fixed groove is formed in the fixed table, and the MEMS loudspeaker is arranged in the fixed groove.

The front cavity component further comprises a first sound outlet hole and a second sound outlet hole, one end of each of the first sound outlet hole and the second sound outlet hole is provided with a hole which penetrates through the outer edge of the fixed platform, and one end of the MEMS horn abuts against the first sound outlet hole and the second sound outlet hole.

The earphone front shell is provided with a sound outlet hole, and the first sound outlet hole and the second sound outlet hole are both arranged at the sound outlet hole of the front shell of the earphone front shell.

The low-frequency loudspeaker comprises a support, and the support is abutted to one end face of the fixed table.

The support is characterized in that a positioning groove which is sunken towards one side is formed in one end face of the support, and a magnet is arranged in the positioning groove.

Wherein, one side end face of the bracket is sunken, so that a circular boss is formed on the other side end face of the bracket.

The low-frequency loudspeaker further comprises a tuning net, and the tuning net is arranged on the outer side of the boss.

The low-frequency loudspeaker further comprises a PCB, the PCB is in a semi-arc shape, the tuning net is in a semi-arc shape, and the PCB and the tuning net are arranged on the outer side of the boss together.

The half-in-ear earphone provided by the embodiment of the utility model is provided with the front cavity component, the first loudspeaker with high frequency and the second loudspeaker with low frequency, the front cavity assembly and the earphone front shell form a first cavity, the front cavity assembly and the earphone rear shell form a second cavity, the first horn is positioned in the first cavity and fixed on the front cavity assembly, the second horn is positioned in the second cavity, thereby forming two independent cavities, namely a first cavity and a second cavity, so that the second horn with low frequency and the first horn with high frequency can not generate sound mixing when sounding simultaneously, and the low-frequency and high-frequency complementation can be realized, the high-frequency extensibility is better, the details are richer, the sound is clearer and more natural, the tone quality is greatly improved compared with that of a common earphone, the sound fidelity is good, and the experience of a user is greatly improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a schematic perspective view of a half-in-ear earphone according to an embodiment of the present invention;

fig. 2 is an exploded schematic view of a half-in-ear earphone according to an embodiment of the present invention;

fig. 3 is an exploded view of a semi-in-ear headphone according to another embodiment of the present invention;

fig. 4 is a cross-sectional view of a half-in-ear headphone structure according to an embodiment of the present invention.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Please refer to fig. 1 and fig. 4, which are schematic structural views of a semi-in-ear earphone according to an embodiment of the present invention. Only the portions related to the present embodiment are shown for convenience of explanation.

Referring to fig. 1 to 3, a half-in-ear earphone 100 provided in an embodiment of the present application includes an earphone front shell 10 and an earphone rear shell 20, where the earphone rear shell 20 is covered on the earphone front shell 10, the earphone front shell 10 and the earphone rear shell 20 are covered to form a cavity, a front cavity assembly 11, a first speaker 12 and a second speaker 13 are disposed in the cavity, the front cavity assembly 11 and the earphone front shell 10 form a first cavity, the front cavity assembly 11 and the earphone rear shell 20 form a second cavity, the first speaker 12 is located in the first cavity and fixed on the front cavity assembly 11, and the second speaker 13 is located in the second cavity.

In one embodiment, the first horn 12 is a high frequency horn, and the second horn 13 is a low frequency horn.

In this embodiment, the first horn 12 is a high frequency MEMS horn, and the second horn 13 is a low frequency horn.

In a specific implementation example, the front cavity assembly 11 includes a fixing platform 111, an outer edge of the fixing platform 111 matches with the inner shape of the front shell 10 of the earphone, the fixing platform 111 is provided with a fixing groove 1111, and the MEMS horn is disposed in the fixing groove 1111.

Preferably, in this embodiment, the front cavity component 11 further includes a first sound emitting hole 112 and a second sound emitting hole 113, one end of the first sound emitting hole 112 and one end of the second sound emitting hole 113 are opened to penetrate through the outer edge of the fixing stage 111, and one end of the MEMS horn abuts against the first sound emitting hole 112 and the second sound emitting hole 113. The front shell of the earphone is characterized in that a front shell sound outlet 101 is formed in the front end of the side of the front shell 10 of the earphone, when the front cavity component 11 is placed in the front shell 10 of the earphone, the first sound outlet 112 and the second sound outlet 113 are in butt joint with the front shell sound outlet 101, and a dust screen is arranged on the front shell sound outlet 101.

According to the embodiment of the application, the front cavity assembly 11 and the earphone front shell 10 form a first cavity, the high-frequency first loudspeaker 12 is located in the first cavity and fixed on the front cavity assembly 11, the front cavity assembly 11 and the earphone rear shell 20 form a second cavity, the low-frequency second loudspeaker 13 is located in the second cavity, so that two independent cavities, namely the first cavity and the second cavity, are formed, therefore, the low-frequency second loudspeaker 13 and the high-frequency first loudspeaker 12 cannot generate sound mixing when sounding at the same time, low-frequency and high-frequency complementation can be realized, the high frequency can be extended to 40KHZ through the ultra-high frequency MEMS loudspeaker in the arrangement of the first cavity, and the sound sensitivity cannot be lower than 80-85 dB; thereby use this application to enable the earphone frequency width wideer, sound is brighter, and high frequency extensibility can be better, and the details are abundanter, and sound is more clear nature, and tone quality obtains great improvement than ordinary earphone, very big improvement user's experience sense.

Referring to fig. 3, in the embodiment of the present invention, the second speaker 13 includes a circular bracket 131, and the bracket 131 abuts against the fixing platform 111; one end surface of the bracket 131 is provided with a plurality of circular sound outlet holes. One end surface of the bracket 131 of the second horn 13 is provided with a circular positioning groove which is concave towards one side, and a magnet 133 is arranged in the positioning groove. One side end surface of the bracket 131 is recessed, so that a circular boss 134 is formed on the other side end surface of the bracket 131.

In a specific implementation example, the second speaker 13 further includes a tuning net, and the tuning net is disposed outside the boss 134. Loudspeaker still include PCB board 132, PCB board 132 is the semiarc shape, the tuning net is the semiarc shape, PCB board 132 with the tuning net constitutes convex setting together and is in the outside of boss 134.

Compared with the prior art, this application embodiment is through setting up two independent cavitys in the earphone cavity, and set up the MEMS loudspeaker of super high frequency in first cavity, set up low frequency loudspeaker in the second cavity, thereby form two solitary cavitys first cavity and second cavity, so low frequency loudspeaker and high frequency MEMS loudspeaker just can not produce the audio mixing when the simultaneous sound production, and can realize that low frequency and high frequency are mutually complemented can and enable half in-ear earphone's frequency width wideer, high frequency extension performance is better, the details are abundant, sound is more clear nature, can effectively improve the fidelity of sound, user experience feels and obtains very big promotion.

The embodiment of the utility model provides a half in-ear earphone 100, owing to be provided with the second loudspeaker of antetheca subassembly, high-frequency first loudspeaker and low frequency in half in-ear earphone 100, the antetheca subassembly with the earphone front shell forms first cavity, the antetheca subassembly with the earphone backshell forms the second cavity, first loudspeaker are located in the first cavity and fix on the antetheca subassembly, the second loudspeaker are located in the second cavity to form two solitary cavities, first cavity and second cavity, so the second loudspeaker of low frequency and the first loudspeaker of high frequency just can not produce the audio mixing at the simultaneous sound production, and can realize that low frequency and high frequency are complementary, can make the high frequency extend to 40KHZ through the super high frequency MEMS loudspeaker in first cavity setting, and the sound sensitivity then can not be less than 80 ~ 85 dB; thereby use this application to enable the earphone frequency width wideer, sound is brighter, and high frequency extensibility can be better, and the details are abundanter, and sound is more clear nature, and tone quality obtains great improvement than ordinary earphone, very big improvement user's experience sense.

The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, without thereby limiting the scope of the invention. Any modification, equivalent replacement and improvement made by those skilled in the art without departing from the scope and spirit of the present invention should be within the scope of the claims of the present invention.

Claims

1. The utility model provides a half in-ear earphone, includes casing and earphone backshell before the earphone, a serial communication port, the cap is located behind the earphone on the casing before the earphone, the casing before the earphone with the cap forms a cavity behind the earphone, be provided with antechamber subassembly, first loudspeaker and second loudspeaker in the cavity, antechamber subassembly with the casing forms first cavity before the earphone, antechamber subassembly with the earphone backshell forms the second cavity, first loudspeaker are located just fix in the first cavity on the antechamber subassembly, the second loudspeaker are located in the second cavity, wherein, first loudspeaker are high frequency loudspeaker, the second loudspeaker are low frequency loudspeaker.

2. The half-in-ear headphone of claim 1, wherein the first horn is a high frequency MEMS horn.

3. The headphone of claim 2 wherein the front cavity assembly comprises a mounting platform, the outer edge of the mounting platform conforms to the inner shape of the front housing of the headphone, the mounting platform having mounting slots, the MEMS horn being mounted in the mounting slots.

4. The half-in-ear headphone of claim 3, wherein the front cavity component further comprises a first sound outlet and a second sound outlet, one end of the first sound outlet and the second sound outlet is opened through the outer edge of the fixed stage, and one end of the MEMS horn abuts against the first sound outlet and the second sound outlet.

5. The half-in-ear headphone of claim 4, wherein the headphone front shell is provided with sound outlet holes, and the first sound outlet hole and the second sound outlet hole are both provided at the front shell sound outlet hole of the headphone front shell.

6. A half-in-ear headphone as claimed in claim 4, wherein the low frequency speaker comprises a cradle that abuts an end face of the fixed stage.

7. The half-in-ear headphone as claimed in claim 6, wherein a positioning groove depressed toward one side is provided on one end surface of the holder, and a magnet is provided in the positioning groove.

8. The half-in-ear headphone according to claim 6, wherein one side end face of the holder is recessed so that a circular boss is formed on the other side end face of the holder.

9. The half-in-ear headphone of claim 8, wherein the low frequency horn further comprises a tuning mesh disposed outside the boss.

10. The half-in-ear headphone of claim 9, wherein the low frequency speaker further comprises a PCB board, the PCB board being in a half-arc shape, the tuning net being in a half-arc shape, the PCB board being disposed outside the boss together with the tuning net.