CN210628304U

CN210628304U - Integrated packaging LED display panel based on chip stacking

Info

Publication number: CN210628304U
Application number: CN201921679651.2U
Authority: CN
Inventors: 梁青; 胡志军
Original assignee: Shenzhen Weiqiaoshun Photoelectric Co ltd
Current assignee: Shenzhen Weiqiaoshun Photoelectric Co ltd
Priority date: 2019-10-09
Filing date: 2019-10-09
Publication date: 2020-05-26
Anticipated expiration: 2029-10-09

Abstract

The utility model discloses an integrated package LED display panel based on chip piles up, including integrated package circuit board, integrated package circuit board is equipped with two at least integrated package lamp pearls, the integrated package lamp pearl of no support pin includes drive IC bare chip, LED bare chip and packaging colloid, LED bare chip piles up at drive IC bare chip upper surface and is connected with drive IC bare chip electricity, drive IC bare chip is connected the back with integrated package circuit board electricity, packaging colloid encapsulates drive IC bare chip and LED bare chip. The utility model provides an integrated encapsulation LED display panel based on chip piles up, multi-functional high integration, no support pin lamp drives the integrated encapsulation of unification pixel, reaches high frivolous no structure dress, high product quality, high display pixel density and high display effect.

Description

Integrated packaging LED display panel based on chip stacking

Technical Field

The utility model relates to a LED technical field, specifically speaking relates to an integrated encapsulation LED display panel based on chip piles up.

Background

The LED display panel of the prior art is manufactured by an SMT (surface mount technology) welding process after packaging of two independent packaging devices with support pins, wherein a drive IC (integrated circuit) bare chip and an LED bare chip are arranged in an SMD packaging device colloid, the spatial position relation of the drive IC bare chip and the LED bare chip is planar horizontal arrangement, and the double-function chip SMD packaging device is packaged and then attached to a circuit board with a plurality of groups of lamp position bonding pads in a matrix or a non-matrix through the SMT welding process.

Such an LED display panel has the following disadvantages:

1. although the driving IC packaging module on the back of the traditional SMD display panel lamp driving integrated PCB lamp bead is implanted into the dual-function chip SMD packaging device in a driving IC bare chip mode, the reliability of the display system is improved to a certain extent, but the improvement range is limited and the efficiency is not large. Because the technology only solves the problem that the support pin of the driving IC packaging module originally placed on the back of the lamp bead of the lamp driving-in-one PCB board is exposed, the problem that the support pin of the double-function chip SMD packaging device is exposed is not solved, the technology is not a complete support-free pin-free packaging technology, the problem that the pixel out-of-control point of the SMD packaging device caused by the support pin is multiple cannot be fundamentally solved, and the technology is essentially a display panel manufacturing technology which cannot break through ten thousand levels, so that the waste of a large amount of high-precision equipment resources and human resources at the packaging end is caused.

2. Another drawback of the package device with the support pins is that the bump resistance of the package device is low, and the soldered pins are easily detached when flexible bending application is performed.

3. The drive IC bare chip is implanted into the dual-function chip SMD packaging device, and the size of the chip is large and the chip and the LED bare chip are arranged on the same horizontal plane, so that the appearance size of the dual-function chip SMD packaging device is large, and the pixel distance of the display panel cannot break through below 3 mm.

4. The size of the drive IC bare chip is large, and a plurality of welding wires are arranged, so that the packaging process difficulty of the dual-function chip SMD is increased.

5. Because the drive IC bare chip has a large volume, the normal light emission of the LED chip can be influenced at certain angles, and the optical display effect of the packaging device is influenced.

6. The packaging technology with the support pins brings an expanded one-time-pass rate problem for the SMT panel welding process of a display panel manufacturing enterprise after packaging, and the problem is not only serious, but also has no solution.

7. The management and control of the production process are complex, and factors influencing the reliability of the display panel product are excessive, so that the development of intelligent production is not facilitated.

8. The two-panel display panel technology results in a double waste of printed circuit board or display panel substrate. The printed circuit board industry is a high-pollution and high-carbon-emission industry, and the environmental protection evaluation value of the display panel technology is low.

9. Low design integration level, low process integration level and low industrial integration level.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide an integrated encapsulation LED display panel based on chip piles up, multi-functional high integration, no support pin lamp drives the integrated encapsulation of unification pixel, reaches high frivolous dress, high yield quality, high display pixel density, high display effect.

The utility model discloses an integrated encapsulation LED display panel based on chip piles up adopts technical scheme is:

the utility model provides an integrated packaging LED display panel based on chip piles up which characterized in that, includes integrated packaging circuit board, integrated packaging circuit board is equipped with two at least integrated packaging lamp pearls, integrated packaging lamp pearl includes drive IC bare chip, LED bare chip and encapsulation colloid, LED bare chip piles up at drive IC bare chip upper surface and is connected with drive IC bare chip electricity, drive IC bare chip is connected the back with integrated packaging circuit board electricity, the encapsulation colloid encapsulates drive IC bare chip and LED bare chip.

Preferably, the LED bare chip comprises at least one of four primary color LED chips, wherein the four primary color LED chips comprise a red R chip, a green G chip, a blue B chip, and a yellow Y chip.

Preferably, the LED bare chip is mounted on the upper surface of the driver IC bare chip by flip-chip mounting.

Preferably, at least one primary color LED chip of the LED bare chip is mounted on the upper surface of the driver IC bare chip in a normal mounting manner.

As a preferred scheme, after the driver IC bare chip is electrically connected with the integrated packaging circuit board, the packaging colloid performs whole-board integrated packaging on the driver IC bare chip, the LED bare chip and the integrated packaging circuit board.

Preferably, the encapsulant is made of a transparent or translucent material.

Preferably, the integrated package circuit board comprises a substrate and a circuit arranged on the substrate, and the substrate is made of a flexible transparent material.

Preferably, the integrated package circuit board comprises a substrate and a circuit arranged on the substrate, and a power supply I/O golden finger and a signal I/O golden finger electrically connected with the circuit are arranged at the end of the substrate.

As a preferred scheme, the packaging colloid carries out single-pixel independent shape packaging and packaging on the electrically connected drive IC bare chip and LED bare chip to obtain a single-pixel lamp bead, and the single-pixel lamp bead is arranged on the integrated packaging circuit board and is electrically connected with the integrated packaging circuit board.

The utility model discloses an integrated encapsulation LED display panel based on chip piles up's beneficial effect is: the LED bare chip is stacked on the upper surface of the drive IC bare chip and is electrically connected with the drive IC bare chip, so that the stacking space layout of the drive IC bare chip and the LED chip in a single pixel is realized, the occupied area of a single integrated packaging lamp bead is reduced, the pixel interval can be smaller, and the problem that light rays emitted by the LED bare chip are shielded by the drive IC bare chip is avoided. The drive IC bare chip and the LED bare chip are packaged through the packaging colloid, a support and pins of an SMD packaging device are omitted, the problems of out-of-pixel failure, poor anti-collision capability and instability of a display system caused by the pins of the support are thoroughly solved, and therefore the display panel can be made to be thinner and can be mounted in a light and thin mode. The packaging of the integrated packaging lamp beads to the manufacturing of the display panel can be completed in the same factory, so that the process is simplified, the driving IC packaging process and the LED chip packaging process are used for completing pixel integrated packaging of chip stacking of different types of functions across industries, the technology of the integrated packaging panel without a support and pins is thoroughly realized, and the million-level is achieved in the aspect of solving the problem of the pixel out-of-control capability of the display panel. And a large amount of high-precision equipment resources wasted in an industrial packaging link can be fully utilized, and an application technical solution of the LED display panel, which is energy-saving, water-saving, material-saving and pollution-discharge-reducing, is provided for the society.

Drawings

FIG. 1 is the utility model discloses integrated package lamp pearl orthographic view structure schematic diagram of integrated package LED display panel based on chip piles up

FIG. 2 is the utility model discloses integrated package lamp pearl of integrated package LED display panel based on chip piles up overlooks the structure sketch map

FIG. 3 is a schematic diagram of the front view structure of the integrated packaged LED display panel based on chip stacking

FIG. 4 is a schematic diagram of the overlooking structure of the integrated packaged LED display panel based on chip stacking

Fig. 5 is another schematic structural diagram of the integrated package LED display panel based on chip stacking according to the present invention.

Detailed Description

The invention will be further elucidated and described with reference to the following embodiments and drawings in which:

referring to fig. 1, 2 and 3, the integrated package LED display panel based on chip stacking includes an integrated package circuit board 10, which is provided with at least two integrated package beads 20 without support pins. The integrated packaging lamp bead 20 without the support pins comprises a drive IC bare chip 22, an LED bare chip 24 and a packaging colloid 26, wherein the LED bare chip 24 is stacked on the upper surface of the drive IC bare chip 22 and is electrically connected with the drive IC bare chip 22, and after the drive IC bare chip 22 is electrically connected with the integrated packaging circuit board 10, the packaging colloid 26 packages the drive IC bare chip 22 and the LED bare chip 24.

The LED bare chip is stacked on the upper surface of the drive IC bare chip and is electrically connected with the drive IC bare chip, so that the stacking space layout of the drive IC bare chip and the LED chip in a single pixel is realized, the occupied area of a single integrated packaging lamp bead is reduced, the pixel interval can be smaller, and the problem that light rays emitted by the LED bare chip are shielded by the drive IC bare chip is avoided. The drive IC bare chip and the LED bare chip are packaged through the packaging colloid, a support and pins of an SMD packaging device are omitted, the problems of out-of-pixel failure, poor anti-collision capability and instability of a display system caused by the pins of the support are thoroughly solved, and therefore the display panel can be made to be thinner and can be mounted in a light and thin mode. The packaging of the integrated packaging lamp beads to the manufacturing of the display panel can be completed in the same factory, so that the process is simplified, the driving IC packaging process and the LED chip packaging process are used for completing pixel integrated packaging of chip stacking of different types of functions across industries, the technology of the integrated packaging panel without a support and pins is thoroughly realized, and the million-level is achieved in the aspect of solving the problem of the pixel out-of-control capability of the display panel. And a large amount of high-precision equipment resources wasted in an industrial packaging link can be fully utilized, and an application technical solution of the LED display panel, which is energy-saving, water-saving, material-saving and pollution-discharge-reducing, is provided for the society.

The drive IC bare chip is correspondingly designed according to the number and the distribution of the LED bare chips, so that a connection scheme with the shortest current conduction path between the drive IC bare chip and the LED bare chip can be obtained, the extra loss of a circuit is reduced, the loss value of the circuit is minimized, and the processing response speed of signals is improved.

Pile up LED bare chip at drive IC bare chip upper surface and with drive IC bare chip electricity and be connected, the spatial layout that piles up between the chip of the inside different functions of single pixel has not only been realized, the corresponding reduction the shared area of single integrated packaging lamp pearl, alright like this with the quantity that improves integrated packaging circuit board unit area installation integrated packaging lamp pearl, improve display panel's pixel density, and the integrated function of single pixel inside lamp drive unification has been realized, rationalization circuit evenly distributed the heat that the single pixel produced, make the single pixel when reaching the same luminance, the heat of production is littleer. And the direct connection of the drive IC bare chip and the integrated packaging circuit board is a direct heat conduction mode, and has short conduction path, low thermal resistance and good heat dissipation effect. Meanwhile, the LED bare chip is stacked on the upper surface of the drive IC bare chip, so that light emitted by the LED bare chip is prevented from being shielded by the drive IC bare chip, the light of the integrated packaging lamp bead is uniform, the light emitting angle is large, and the consistency of the display effect is good.

The utility model discloses a this kind of double chip pile up the encapsulation and can install drive IC bare chip to integrated package circuit board on, then pile up LED bare chip at drive IC bare chip upper surface, drive IC bare chip accessible flip-chip or the mode of just adorning are installed on integrated package circuit board, LED bare chip accessible flip-chip or the mode of just adorning are connected with drive IC bare chip electricity. In another embodiment, the LED die may be stacked on the upper surface of the driver IC die, and then the driver IC die is mounted on the integrated package circuit board.

The utility model discloses a board does not have support pin integrated package mode entirely installs drive IC bare chip to integrated package circuit board on, then seals the glue. The support and the pins of the SMD packaging device are not provided, so that each integrated packaging lamp bead without the support pins is a completely closed micro-circulation system, the problem of failure outside a pixel unit caused by poor welding process of the support pins and a complex application environment can be thoroughly solved, the problem of unstable system work caused by excessive support pins of a display system is solved, the level of failure rate index of ten thousand pixels of the most strict evaluation panel level in the current industry is improved by at least one order of magnitude, the level of one hundred thousand is reached, and the anti-collision capacity of the integrated packaging lamp beads is improved. The board technology reduces the consumption of printed circuit boards, saves energy, water and materials, reduces the discharge of pollution and has obvious social benefit.

The utility model discloses the technique of piling up that the creation was adopted is bare chip level of non-encapsulation, and the chip that is the different functions of drive IC chip and LED chip belong to different trades piles up moreover to it piles up the disposable integrated panel level encapsulation of back to be the multicore piece. Therefore, the method is an Integrated packaging panel technology after multi-functional non-packaging bare Chip stacking across industries, and should be a Chip Integrated Package technology, which is called CoCIP packaging technology for short. The utility model discloses this kind of CoCIP panel manufacturing technology that the creation was adopted is the panel level packaging technology who removes the support completely and does not have the pin, and this kind of technique is in to the biggest contribution of trade, has firstly obviously promoted display system's job stabilization nature. And secondly, the back surface of the display panel is free of devices, and the application field of unstructured direct-attached display can be expanded.

The circuit connection among the chips is realized in the packaging colloid, the standard standardization of the electronic packaging device packaging body is not needed, the display panel with special requirements can be customized for a customer, the display panel is produced in batch according to the customized program, and the nonstandard production flexibility which is not possessed by the standard standardization is realized.

The shape mode of the packaging colloid after packaging the integrated packaging lamp bead without the support pin can be single-pixel independent shape packaging and packaging, and can also be whole-plate glue packaging. The packaging colloid carries out single-pixel independent shape packaging and packaging on the electrically connected drive IC bare chip and the LED bare chip to obtain a single-pixel lamp bead, and the single-pixel lamp bead is arranged on the integrated packaging circuit board and is electrically connected with the integrated packaging circuit board. The appearance shape of the single-pixel lamp bead can be any, for example, the single-pixel lamp bead can be a cube, a cuboid, a polygon, a semi-sphere, a spherical crown body and the like.

Referring to fig. 4 and 5, after a plurality of stacked pixels, in which LED dies are stacked on the upper surface of a driver IC die, are mounted on an integrated package circuit board, the driver IC die and the LED dies are packaged by a package colloid. The integrated packaging lamp beads can be arranged in an equidistant matrix manner, can also be arranged in a non-equidistant matrix manner, and can also be arranged in a non-matrix manner. The encapsulant may be a transparent or translucent material, and in another embodiment, the driver IC die chip, the LED die chip, and the integrated package circuit board may all be integrally packaged by the encapsulant.

Before the packaging colloid is packaged, the whole-board function test needs to be carried out on the unpackaged integrated packaging lamp beads on the integrated packaging circuit board. And if unqualified integrated packaging lamp beads which are not packaged yet need to be repaired until the non-packaged integrated packaging lamp beads on the whole integrated packaging circuit board pass the test, and then sealing glue.

The integrated packaging circuit board comprises a substrate and a circuit arranged on the substrate, wherein the substrate is made of materials such as an epoxy resin substrate, a transparent material substrate, a flexible material substrate, an aluminum substrate, a ceramic substrate and a copper substrate. When the substrate is made of flexible transparent materials, the substrate is high in bending deformation capability due to the fact that the support and the pins are not arranged, the problem of desoldering does not exist, and the overall reliability of the system is remarkably improved. And can expand the unstructured direct-mounted display application field, such as the ultra-light thin unstructured small-spacing display field and the unstructured micro-spacing display field, such as the ultra-light thin high-definition transparent glass-mounted application, the ultra-light, simple and easy-to-maintain brightening display application of a glass curtain wall, the vehicle-mounted glass unstructured surface-mounted display application, the ultra-light thin flexible transparent glass-mounted application, the civil home decoration wall-mounted display application, the commercial display surface-mounted application and other fields. The display panel is thinner and lighter, can be directly adhered to all fixed or non-fixed places such as walls, table tops, vehicle bodies and the like, is free of structure and is simple, convenient and fast to install.

The end of the substrate is arranged with a power I/O gold finger 12 and a signal I/O gold finger 14(I is input and O is output). The power input I terminal supplies power to the display panel, and the power output O terminal can be connected to the power input I terminal of the next display panel. The signal input end I is connected with the driving IC chips in all the integrated packaging lamp beads without the support pins through a circuit on the display panel, the R, G, B, Y chips of the LEDs in each integrated packaging lamp bead without the support pins are independently controlled to be lightened by the driving IC chips through control signals, a perfect video picture is played, and the signal output end O is connected with the signal input end I of the next display panel to be integrated into a larger display picture. The golden finger can be arranged on the surface of the integrated packaging circuit board without the packaging lamp beads, and can also be arranged on the side surface of the display panel and the surface with the packaging lamp beads.

The LED bare chip at least comprises one of four primary color chips of a red R chip, a green G chip, a blue B chip and a yellow Y chip. The display panel can be used as a single primary color display panel, a double primary color display panel, an RGB three primary color display panel and an RGBY four primary color display panel. Meanwhile, the RGBY four-primary-color pixel display mode is adopted, and compared with the RGB full-color pixel display mode, the display panel can ensure that the picture color reduction of the display panel has higher tension.

When the LED bare chip is stacked on the upper surface of the driver IC bare chip, at least one of the primary color chips may be mounted on the upper surface of the driver IC bare chip in a face-up manner, and the other primary color chips may be mounted on the upper surface of the driver IC bare chip in an upside-down manner, or may be mounted on the upper surface of the driver IC bare chip in an upside-down manner. Typically, only one of each four primary color chip is provided.

The packaging process of the integrated packaging circuit board and the integrated packaging lamp beads is simplified, the reliability of the whole display system is improved, the efficiency of the production process is improved, and more convenient feasibility is provided for intelligent manufacturing. The packaging of the integrated packaging lamp beads and the manufacturing of the display panel can be completed in the same factory, so that the process is simplified, the packaging of the driving IC chip and the packaging of the LED chip are combined, and the manufacturing technology of the display panel with high integration level, such as process integration, industrial integration and cross-industry packaging technology integration, is realized.

It should be finally noted that the above embodiments are only intended to illustrate the technical solutions of the present invention, and not to limit the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solutions of the present invention can be modified or replaced with equivalents without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. The utility model provides an integrated packaging LED display panel based on chip piles up which characterized in that, includes integrated packaging circuit board, integrated packaging circuit board is equipped with two at least integrated packaging lamp pearls, integrated packaging lamp pearl includes drive IC bare chip, LED bare chip and encapsulation colloid, LED bare chip piles up at drive IC bare chip upper surface and is connected with drive IC bare chip electricity, drive IC bare chip is connected the back with integrated packaging circuit board electricity, the encapsulation colloid encapsulates drive IC bare chip and LED bare chip.

2. The chip stack based integrally packaged LED display panel of claim 1, wherein said LED die chips comprise at least one of four primary LED chips comprising a red R chip, a green G chip, a blue B chip, and a yellow Y chip.

3. The integrated package LED display panel based on chip stack of claim 2, wherein the LED die is flip-chip mounted on the upper surface of the driver IC die.

4. The integrated package LED display panel based on chip stack as claimed in claim 2, wherein at least one of the primary LED chips is mounted on the upper surface of the driver IC die by means of a positive mounting method.

5. The integrated packaging LED display panel based on chip stacking as claimed in claim 1, wherein the packaging colloid performs integrated packaging of the whole driving IC die chip, the LED die chip and the integrated packaging circuit board after the driving IC die chip is electrically connected with the integrated packaging circuit board.

6. The integrated package LED display panel based on chip stack of claim 1, wherein the encapsulant is made of a transparent or translucent material.

7. The integrated package LED display panel based on chip stack of claim 1, wherein the integrated package circuit board comprises a substrate and a trace disposed on the substrate, the substrate being made of a flexible transparent material.

8. The integrated package LED display panel based on chip stack as claimed in claim 1, wherein the integrated package circuit board comprises a substrate and a circuit disposed on the substrate, and the substrate is provided at its end with a power I/O gold finger and a signal I/O gold finger electrically connected to the circuit.

9. The integrated packaging LED display panel based on chip stacking as claimed in claim 1, wherein the packaging colloid carries out single-pixel independent outline packaging on the electrically connected driver IC die and LED die to obtain single-pixel lamp beads, and the single-pixel lamp beads are arranged on and electrically connected with the integrated packaging circuit board.