CN210628295U - Graphite heat dissipation film - Google Patents
Graphite heat dissipation film Download PDFInfo
- Publication number
- CN210628295U CN210628295U CN201922394736.2U CN201922394736U CN210628295U CN 210628295 U CN210628295 U CN 210628295U CN 201922394736 U CN201922394736 U CN 201922394736U CN 210628295 U CN210628295 U CN 210628295U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat dissipation
- graphite
- radiating fin
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a graphite heat dissipation membrane, supreme including in proper order is down followed to the heat dissipation membrane: an insulating film protection film layer which is applied on the surface of the electronic component to be cooled; a first metal heat sink attached on the insulating film protective film layer; the second metal radiating fin is of a concave structure, two ends of the second metal radiating fin are bonded with two ends of the first metal radiating fin through heat-conducting adhesive layers, and graphene powder is filled in a gap between the first metal radiating fin and the second metal radiating fin; the heat dissipation cotton layer is of a concave structure and is bonded on the second metal heat dissipation sheet; the first graphite sheet layer is adhered in the groove of the heat dissipation cotton layer; a second graphite sheet layer adhered in the groove of the heat dissipation cotton layer and above the first graphite sheet layer; a film-coating layer applied on the second graphite sheet layer. The utility model provides high thermal conductivity can shorten thermal detention time, has improved thermal efficiency of scattering and disappearing.
Description
Technical Field
The utility model relates to a heat conduction heat dissipation material technical field, especially a graphite heat dissipation membrane.
Background
With the rapid development of modern technologies, the miniaturization of electronic devices, the increasing of the dominant frequency of chips, the increasing of functions, and the gradual increase of the power consumption of a single chip all result in the rapid increase of heat flux density. Studies have shown that over 55% of electronic devices fail due to excessive temperatures, and thus the heat dissipation problem of electronic devices plays a significant role in the development of electronic devices.
At present, partial products in the market conduct heat conduction and heat dissipation through metal materials, particularly copper and aluminum, but the copper is heavy in weight and easy to oxidize, so that the application of the copper is limited, and the heat conduction capability of the aluminum hardly meets the requirements of the existing products on heat conduction and heat dissipation. Graphite materials have a wide range of special properties including high transparency, high electrical conductivity, high thermal conductivity, high strength, etc., but graphite sheets are complex in processing technology, and graphite lacks flexibility and ductility and is easily damaged, and graphite easily falls off and enters the middle of electronic components, possibly causing short circuit or circuit failure of the electronic components.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a can prevent that graphite from droing and getting into on electronic components, graphite heat dissipation membrane that heat dispersion is good.
In order to achieve the above object, the utility model provides a graphite heat dissipation film, supreme including in proper order down is followed to the heat dissipation film:
an insulating film protection film layer which is applied on the surface of the electronic component to be cooled;
the first metal radiating fin is attached to the insulating film protective film layer, the appearance structure of the first metal radiating fin is matched with the surface structure of the electronic component to be radiated, and the first metal radiating fin is completely attached to the surface of the electronic component to be radiated;
the second metal radiating fin is of a concave structure, two ends of the second metal radiating fin are bonded with two ends of the first metal radiating fin through heat-conducting adhesive layers, the distance between the highest point of the second metal radiating fin and the lowest point of the first metal radiating fin is 20-30 microns, and graphene powder is filled in a gap between the first metal radiating fin and the second metal radiating fin;
the heat dissipation cotton layer is of a concave structure and is bonded on the second metal heat dissipation sheet;
the first graphite sheet layer is adhered in the groove of the heat dissipation cotton layer, a plurality of meshes are uniformly distributed on the first graphite sheet layer, and the aperture of each mesh is 0.8-1.5 mm;
the second graphite sheet layer is adhered in the groove of the heat dissipation cotton layer and above the first graphite sheet layer, a copper foil layer is arranged between the second graphite sheet layer and the first graphite sheet layer, a plurality of concave grooves are formed in the upper surface of the second graphite sheet layer, and the grooves are a plurality of strip-shaped grooves distributed in parallel;
a film-coating layer applied on the second graphite sheet layer.
The preferred scheme is as follows: the first metal radiating fin and the second metal radiating fin are made of aluminum alloy.
The preferred scheme is as follows: the film pasting layer is an insulating PET film layer.
The preferred scheme is as follows: the insulation film protection film layer, the first metal radiating fins, the second metal radiating fins and the radiating cotton layer are bonded through the heat conducting adhesive layer.
The preferred scheme is as follows: the thickness of the first graphite sheet layer and the thickness of the second graphite sheet layer are 15-45 mu m.
The preferred scheme is as follows: the thickness of the heat-conducting adhesive layer is 3-6 mu m.
The preferred scheme is as follows: the insulating film protective film layer is made of a thermosetting resin material or a high polymer resin material.
The preferred scheme is as follows: the distance between the meshes is 5-8 mu m.
The utility model has the advantages that:
1. the utility model discloses it is filled with graphite alkene powder to fill between first metal fin and second metal fin, prevents that graphite from taking place the damage because of lacking pliability and ductility, and graphite drops easily and gets into in the middle of the electronic components, may cause the short circuit or the circuit trouble of electronic components;
2. the utility model embeds the first graphite sheet layer and the second graphite sheet layer in the heat radiation cotton, which prevents the graphite powder and graphite particles of the graphite sheet from falling off, thereby avoiding the short circuit of the circuit and the electric influence on the circuit board, and simultaneously, the heat conduction can be carried out through the heat radiation foam cotton;
3. the utility model is provided with the first metal heat dissipation layer, the second metal heat dissipation layer, the first graphite sheet layer and the second graphite sheet layer, thereby improving the heat conduction performance, shortening the detention time of heat and improving the heat dissipation efficiency;
4. the utility model discloses be provided with the mesh on first graphite lamella, increase the heat diffusion area effectively, ventilative and heat dissipation shape can be directly to the better radiating effect of heat source formation.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
The utility model provides a graphite heat dissipation membrane, supreme including in proper order is down followed to the heat dissipation membrane: the insulating film protection film layer is attached to the surface of the electronic component to be radiated, is in contact with the electronic component, can well contact and transfer heat, and prevents electric power and static electricity from passing through; the first metal radiating fin 1 is attached to the insulating film protective film layer, the appearance structure of the first metal radiating fin 1 is matched with the surface structure of the electronic component to be radiated and is completely attached to the surface of the electronic component to be radiated, and the first metal radiating fin 1 is completely attached to the electronic component to be radiated so as to better radiate the electronic component; the second metal radiating fin 2 is of a concave structure, two ends of the second metal radiating fin 2 are bonded with two ends of the first metal radiating fin 1 through heat-conducting adhesive layers, the distance between the highest point of the second metal radiating fin 2 and the lowest point of the first metal radiating fin 1 is 20-30 microns, and graphene powder 3 is filled in a gap between the first metal radiating fin 1 and the second metal radiating fin 2; the heat dissipation cotton layer 4 is of a concave structure, and the heat dissipation cotton layer 4 is bonded on the second metal heat dissipation sheet 2; the first graphite sheet layer 5 is adhered in the groove of the heat dissipation cotton layer 4, a plurality of meshes are uniformly distributed on the first graphite sheet layer 5, the aperture of each mesh is 0.8-1.5 mm, and the distance between every two meshes is 5-8 mu m; the second graphite sheet layer 6 is adhered in the groove of the heat dissipation cotton layer 4 and above the first graphite sheet layer 5, a copper foil layer 7 is arranged between the second graphite sheet layer 6 and the first graphite sheet layer 5, a plurality of concave grooves 8 are arranged on the upper surface of the second graphite sheet layer 6, the grooves 8 are a plurality of strip-shaped grooves which are distributed in parallel, the grooves 8 are arranged on the second graphite sheet layer 6, the heat dissipation area is increased, the technical problem that the heat dissipation effect of the graphite heat dissipation fin in the prior art is poor is effectively solved, the copper foil layer 7 is arranged between the first graphite sheet layer 5 and the second graphite sheet layer 6, the toughness of the whole heat dissipation fin is improved, the fracture phenomenon is reduced, and the heat dissipation effect cannot be weakened; and a film pasting layer pasted on the second graphite sheet layer 6.
The utility model is filled with graphene powder 3 between the first metal radiating fin 1 and the second metal radiating fin 2, which prevents the graphite from being damaged due to lack of flexibility and ductility, and the graphite is easy to fall off and enter the middle of the electronic component, which may cause short circuit or circuit fault of the electronic component; the utility model embeds the first graphite sheet layer 5 and the second graphite sheet layer 6 in the heat radiation cotton, which prevents the graphite powder and graphite particles of the graphite sheet from falling off, thereby avoiding the short circuit of the circuit and the electric influence on the circuit board, and simultaneously, the heat conduction can be carried out through the heat radiation foam 4; the utility model is provided with the first metal heat dissipation layer 1, the second metal heat dissipation layer 2, the first graphite sheet layer 5 and the second graphite sheet layer 6, thereby improving the heat conduction performance, shortening the detention time of heat and improving the heat dissipation efficiency; the utility model discloses be provided with the mesh on first graphite lamella 5, increase the heat diffusion area effectively, ventilative and heat dissipation shape can be directly to the better radiating effect of heat source formation.
In another embodiment, the first metal heat sink 1 and the second metal heat sink 2 are made of aluminum alloy, which is a low-density light-weight metal with good heat conductivity and easy shaping;
in another embodiment, the film-pasting layer is an insulating PET film layer, and the insulating PET film has the advantages of high heat resistance, high bending strength, fatigue resistance, friction resistance, strong flexibility, good electrical insulation performance, small temperature influence and low price.
In another embodiment, the insulating film protective film layer, the first metal heat sink 1, the second metal heat sink 2 and the heat sink cotton layer 4 are bonded together through a heat conducting adhesive layer, wherein the thickness of the heat conducting adhesive layer is 3-6 μm.
In another embodiment, the thickness of the first graphite sheet layer 5 and the second graphite sheet layer 6 is 15 to 45 μm.
In another embodiment, the insulating film protection film layer is a thermosetting resin material or a polymer resin material.
While the embodiments of the invention have been described above, it is not intended to be limited to the details shown, or described, but rather to cover all modifications, which would come within the scope of the appended claims, and all changes which come within the meaning and range of equivalency of the art are therefore intended to be embraced therein.
Claims (8)
1. Graphite heat dissipation membrane, its characterized in that, the heat dissipation membrane includes from supreme down in proper order:
an insulating film protection film layer which is applied on the surface of the electronic component to be cooled;
the first metal radiating fin is attached to the insulating film protective film layer, the appearance structure of the first metal radiating fin is matched with the surface structure of the electronic component to be radiated, and the first metal radiating fin is completely attached to the surface of the electronic component to be radiated;
the second metal radiating fin is of a concave structure, two ends of the second metal radiating fin are bonded with two ends of the first metal radiating fin through heat-conducting adhesive layers, the distance between the highest point of the second metal radiating fin and the lowest point of the first metal radiating fin is 20-30 microns, and graphene powder is filled in a gap between the first metal radiating fin and the second metal radiating fin;
the heat dissipation cotton layer is of a concave structure and is bonded on the second metal heat dissipation sheet;
the first graphite sheet layer is adhered in the groove of the heat dissipation cotton layer, a plurality of meshes are uniformly distributed on the first graphite sheet layer, and the aperture of each mesh is 0.8-1.5 mm;
the second graphite sheet layer is adhered in the groove of the heat dissipation cotton layer and above the first graphite sheet layer, a copper foil layer is arranged between the second graphite sheet layer and the first graphite sheet layer, a plurality of concave grooves are formed in the upper surface of the second graphite sheet layer, and the grooves are a plurality of strip-shaped grooves distributed in parallel;
a film-coating layer applied on the second graphite sheet layer.
2. The graphite heat spreading film according to claim 1, wherein the first and second metal fins are made of an aluminum alloy.
3. The graphite heat dissipation film of claim 1, wherein the film-coating layer is an insulating PET film layer.
4. The graphite heat dissipation film of claim 1, wherein the insulating film protection film layer, the first metal heat dissipation sheet, the second metal heat dissipation sheet, and the heat dissipation cotton layer are bonded together by a heat conductive adhesive layer.
5. The graphite heat spreading film of claim 1, wherein the first and second graphite sheet layers have a thickness of 15 to 45 μm.
6. The graphite heat dissipation film according to claim 4, wherein the thickness of the thermal conductive adhesive layer is 3-6 μm.
7. The graphite heat dissipation film according to claim 1, wherein the insulating film protection film layer is a thermosetting resin material or a polymer resin material.
8. The graphite heat dissipation film according to claim 1, wherein the meshes are spaced from each other by a distance of 5 to 8 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922394736.2U CN210628295U (en) | 2019-12-26 | 2019-12-26 | Graphite heat dissipation film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922394736.2U CN210628295U (en) | 2019-12-26 | 2019-12-26 | Graphite heat dissipation film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210628295U true CN210628295U (en) | 2020-05-26 |
Family
ID=70752342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922394736.2U Active CN210628295U (en) | 2019-12-26 | 2019-12-26 | Graphite heat dissipation film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210628295U (en) |
-
2019
- 2019-12-26 CN CN201922394736.2U patent/CN210628295U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9222735B2 (en) | Compliant multilayered thermally-conductive interface assemblies | |
| US20060263570A1 (en) | Thermal lamination module | |
| KR20150015900A (en) | Led chip-on-board type rigid flexible pcb and rigid flexible heat spreader sheet pad and heat-sink structure using the same | |
| JP3128955U (en) | Electric circuit board structure with heat dissipation sheet | |
| CN205902314U (en) | Compound graphite radiating sheet | |
| CN207942773U (en) | A kind of heat dissipation graphite flake | |
| CN203912425U (en) | Thin type heat dissipating sheet and thermoelectricity device thereof | |
| CN210628295U (en) | Graphite heat dissipation film | |
| CN210607231U (en) | Novel composite heat dissipation material | |
| JP3128948U (en) | Electric circuit board structure with heat dissipation layer | |
| CN208402321U (en) | A kind of compound graphite radiating chip architecture | |
| CN107396618A (en) | A kind of fin of good insulating | |
| JP2020061482A (en) | Heat dissipation structure | |
| US20170176113A1 (en) | Heat Sink and Case Having the Same | |
| CN215222884U (en) | Graphite radiating fin for electronic product | |
| CN206432253U (en) | Semiconductor devices | |
| CN216292005U (en) | High-efficient heat dissipation type graphite flake | |
| JP2016036002A (en) | Metal plate resistor | |
| TWM461036U (en) | Heat dissipation case | |
| KR20190126987A (en) | Flexible heat dissipation sheet using artificial graphite sheet and manufacturing method thereof | |
| CN212677591U (en) | Heat-conducting sheet and electronic device | |
| CN209824292U (en) | High heat conduction heat dissipation graphite flake | |
| CN216005739U (en) | High-temperature-resistant copper foil conductive adhesive tape | |
| CN210610139U (en) | Carbon fiber filled high-thermal-conductivity and electric-conductivity composite material | |
| CN216650336U (en) | Graphite sheet with electromagnetic shielding function |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |