CN210628286U - 封装结构及具有其的封装体 - Google Patents
封装结构及具有其的封装体 Download PDFInfo
- Publication number
- CN210628286U CN210628286U CN201921749923.1U CN201921749923U CN210628286U CN 210628286 U CN210628286 U CN 210628286U CN 201921749923 U CN201921749923 U CN 201921749923U CN 210628286 U CN210628286 U CN 210628286U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- passive component
- flexible circuit
- chip
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921749923.1U CN210628286U (zh) | 2019-10-18 | 2019-10-18 | 封装结构及具有其的封装体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921749923.1U CN210628286U (zh) | 2019-10-18 | 2019-10-18 | 封装结构及具有其的封装体 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210628286U true CN210628286U (zh) | 2020-05-26 |
Family
ID=70751199
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201921749923.1U Active CN210628286U (zh) | 2019-10-18 | 2019-10-18 | 封装结构及具有其的封装体 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210628286U (zh) |
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2019
- 2019-10-18 CN CN201921749923.1U patent/CN210628286U/zh active Active
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Xi'an yisiwei Material Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Beijing yisiwei Material Technology Co.,Ltd. Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Beijing yisiwei Material Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Beijing yisiwei Technology Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20210625 Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Hefei Qizhong Sealing Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee after: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee after: Hefei Qizhong Technology Co.,Ltd. Address before: 215000 No.166, Fengli street, Suzhou Industrial Park, Jiangsu Province Patentee before: CHIPMORE TECHNOLOGY Corp.,Ltd. Patentee before: Hefei Qizhong Sealing Technology Co.,Ltd. |