CN210627119U - Heat radiator for be used for singlechip to seal control module - Google Patents
Heat radiator for be used for singlechip to seal control module Download PDFInfo
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- CN210627119U CN210627119U CN201922211831.4U CN201922211831U CN210627119U CN 210627119 U CN210627119 U CN 210627119U CN 201922211831 U CN201922211831 U CN 201922211831U CN 210627119 U CN210627119 U CN 210627119U
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Abstract
The utility model relates to the technical field of heat dissipation devices, in particular to a heat dissipation device for a closed control module of a single chip microcomputer, which is characterized in that the prior control module generally uses a pure fan to dissipate heat with slow heat dissipation speed, thereby inventing the heat dissipation device for the closed control module of the single chip microcomputer, which comprises a shell, wherein a heat absorption water bin is fixed in the shell, a heat absorption component is fixed on the heat absorption water bin, the heat absorption water bin is communicated with a first communicating pipe and a second communicating pipe, the first communicating pipe is communicated with a heat dissipation component outside the shell, a micro water pump is fixed above the heat dissipation component, the second communicating pipe is communicated with the micro water pump, the heat dissipation component is communicated with the micro water pump through a third communicating pipe, a heat dissipation fan is fixed between the heat dissipation component and the shell, the heat dissipation device realizes the heat dissipation of the closed control module of the single chip microcomputer, the heat dissipation device has the advantages of high heat dissipation speed, good heat dissipation effect and wide application prospect in the technical field of heat dissipation devices.
Description
Technical Field
The utility model belongs to the technical field of the heat abstractor technique and specifically relates to a heat abstractor for singlechip seals control module.
Background
The electrical component generates heat in the use process, and particularly, a central control module part of an electronic component can generate a large amount of heat in the operation process, but high temperature can generate certain influence on the electronic component, and the service life of the electrical component can be seriously influenced by long-time high-temperature work, so that the heat dissipation is very important for the electrical component. At present, a control module usually uses a simple fan for heat dissipation, the heat dissipation speed is low, and the heat dissipation effect is not ideal for electric appliance elements or control modules working for a long time.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems that a control module in the prior art usually uses a fan for heat dissipation and has low heat dissipation speed, the invention provides the heat dissipation device for the singlechip closed control module.
The technical scheme of the utility model be, including the casing, wherein, the casing internal fixation has the heat absorption sump, be fixed with the heat absorption subassembly on the heat absorption sump, heat absorption sump intercommunication has first communicating pipe and second communicating pipe, first communicating pipe communicates outside the casing has radiator unit, the radiator unit top is fixed with miniature pump, second communicating pipe is linked together with miniature pump, radiator unit is linked together through third communicating pipe and miniature pump, be fixed with radiator fan between radiator unit and the casing.
Preferably, the heat absorption assembly comprises a first heat absorption plate and a plurality of second heat absorption plates, the first heat absorption plate is fixed on the end face, close to the fixing control module in the shell, of the heat absorption water bin, the second heat absorption plates are vertically and fixedly connected with the first heat absorption plates, one ends of the second heat absorption plates are arranged in the shell, the other ends of the second heat absorption plates extend into the heat absorption water bin, and a plurality of holes are formed in the end face, at one end in the heat absorption water bin, of the second heat absorption plates.
Preferably, the heat dissipation assembly is formed by communicating a plurality of layers of heat dissipation pipe networks through connecting pipes, each heat dissipation pipe network is a net structure formed by a plurality of mutually perpendicular and communicated water pipes, adjacent heat dissipation pipe networks are communicated through the connecting pipes, a connecting plate is fixed on the outer side of each heat dissipation pipe network, and the lower end of each connecting plate is fixed on the heat dissipation fan.
Preferably, the cooling fan includes a fixing base, a motor, a fan blade and a support rod, the fixing base is provided with a through vent hole, the plurality of support rods are fixed in the vent hole, the motor is fixed on the support rod at the axis of the vent hole, and the fan blade is rotatably connected to a rotating shaft of the motor to form a structure for blowing air to the cooling assembly by the cooling fan.
Adopt the technical scheme of the utility model can reach following beneficial effect: (1) the heat absorption water bin is matched with the heat absorption assembly, so that heat emitted by the control module can be quickly transferred into water in the heat absorption water bin, and the cooling of the closed space of the control module is effectively realized; (2) through the matched use of the first communicating pipe, the second communicating pipe, the third communicating pipe, the heat dissipation assembly and the micro water pump, the circulation of water between the heat absorption water sump and the heat dissipation assembly is realized, so that the heat in the water is quickly dissipated to the outside, and the temperature of a closed space where the control module is located is effectively reduced; (3) the radiating efficiency of the radiating assembly is further accelerated by the matching use of the radiating fan and the radiating assembly, so that the quick radiating of the control module is realized; the technical scheme of the utility model has extensive application prospect in heat abstractor technical field.
Drawings
Fig. 1 is a front view of the heat dissipation device for the closed control module of the single chip microcomputer.
Fig. 2 is an enlarged view of the area a in fig. 1.
Fig. 3 is a top view of the heat dissipation device for the closed control module of the single chip microcomputer.
Fig. 4 is a front view of the heat dissipation fan of the heat dissipation device for the closed control module of the single chip microcomputer.
The heat absorption device comprises a shell, a control module, a heat absorption water sump, a first heat absorption plate, a second heat absorption plate, a mounting port, a first communicating pipe, a second communicating pipe, a heat dissipation pipe network, a connecting pipe, a connecting plate, a miniature water pump, a third communicating pipe, a heat dissipation pipe network, a fixing seat, a vent hole, a supporting rod, a motor, a fan blade, a supporting rod and a fan blade, wherein the shell is 1, the shell is 2, the control module is 3, the heat absorption water.
Detailed Description
The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention, and in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings, and are only for convenience of description of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as limiting the present invention.
Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance throughout the present disclosure, it being understood that unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and can be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The heat dissipation device for the closed control module of the single chip microcomputer shown in fig. 1-4 comprises a shell 1, wherein a control module 2 is arranged in the shell 1 through a screw fixing seat 14, and the control module 2 is prevented from being damaged by direct contact with the outside. The heat absorption water sump 3 is welded in the shell 1 or fixed by screws, so that the heat generated by the control module 2 is absorbed by the water in the heat absorption water sump 3, the temperature in the shell 1 is effectively reduced, the temperature of the control module 2 is further reduced, and the service life of the control module 2 is prolonged. Welded fastening has the heat absorption subassembly on the heat absorption sump 3, is convenient for absorb the heat in the casing 1 more fast through the heat absorption subassembly, and then with in the heat transfer water in the heat absorption sump 3, further improvement heat absorption sump 3 absorbs thermal efficiency. The heat absorption water sump 3 is communicated with a first communicating pipe 7 and a second communicating pipe 8, the first communicating pipe 7 and the second communicating pipe 8 penetrate through the shell 1 and extend out of the shell 1, the first communicating pipe 7 is communicated with a heat dissipation assembly outside the shell 1, a micro water pump 12 is fixed above the heat dissipation assembly, the second communicating pipe 8 is communicated with the micro water pump 12, the heat dissipation assembly is communicated with the micro water pump 12 through a third communicating pipe 13, the heat absorption water sump 3 is convenient to be communicated with the heat dissipation assembly and the micro water pump 12 through the first communicating pipe 7, the second communicating pipe 8 and the third communicating pipe 13, power is provided by the micro water pump 12, a water circulation system is jointly formed, heat carried by water in the heat absorption water sump 3 is convenient to be dissipated out of the shell 1 through the heat dissipation assembly, and the temperature in the shell 1 is effectively reduced. A cooling fan is fixed between the cooling assembly and the shell 1 through screws, so that air can be conveniently blown to the cooling assembly through the cooling fan, the cooling effect of the cooling assembly is matched, the air circulation rate of the cooling assembly is increased, and the cooling efficiency of the cooling assembly is further improved.
As shown in fig. 1-4, the heat sink for the closed control module of the single chip microcomputer includes a first heat absorbing plate 4 and a plurality of second heat absorbing plates 5, a mounting opening 6 is provided on the end surface of the heat absorbing water tank 3 close to the control module 2, the first heat absorbing plate 4 is fixed at the mounting opening 6 by welding in a sealing manner, so that the first heat absorbing plate 4 can absorb heat generated by the control module 2 in time and further transmit the heat to water in the heat absorbing water tank 3. The first heat absorbing plate 4 and the second heat absorbing plate 5 are made of metal or alloy with good heat conductivity, such as copper, aluminum or aluminum alloy with good heat conductivity, so that the heat generated by the control module 2 in the shell 1 can be absorbed quickly through the excellent heat conductivity of the first heat absorbing plate 4 and can be conducted into the water in the heat absorbing water bin 3, and the temperature in the shell 1 can be effectively reduced. Second absorber plate 5 and the perpendicular seal welding fixed connection of first absorber plate 4, and 5 one end of second absorber plate are in casing 1, and the other end extends to in the heat absorption sump 3, be convenient for increase through second absorber plate 5 with casing 1 in the area of contact of air with the water in the heat absorption sump 3, and then further improvement in casing 1 and the heat transfer efficiency in heat absorption sump 3, more effective, reduce the temperature in the casing 1 fast. A plurality of openings are formed in the end face of one end, in the heat absorption water sump 3, of the second heat absorption plate 5, so that water in the heat absorption water sump 3 can rapidly penetrate through the second heat absorption plate 5 when flowing circularly, the circulating speed of the water in the heat absorption water sump 3 is achieved, and the heat on the second heat absorption plate 5 is transferred into the water by the aid of efficiency.
As shown in fig. 1-4, the heat dissipation device for the closed control module of the single chip microcomputer, the heat dissipation assembly is formed by communicating a plurality of layers of heat dissipation pipe networks 9 through a connection pipe 10, each heat dissipation pipe network 9 is a net structure formed by a plurality of mutually perpendicular and communicated water pipes, the heat dissipation pipe network 9 with the net structure is convenient to effectively increase the contact area with air, so that the accelerated heat dissipation of water passing through the heat dissipation pipe network 9 is realized, the temperature of the water passing through the heat dissipation pipe network 9 is reduced, and the temperature in the casing 1 can be effectively reduced. The adjacent heat dissipation pipe networks 9 are communicated through the connecting pipe 10, so that water in the adjacent heat dissipation pipe networks 9 can flow in a circulating mode conveniently, meanwhile, the contact area between the heat dissipation assembly and air is further increased through the heat dissipation assemblies formed by the multiple layers of heat dissipation pipe networks 9, and further the heat dissipation efficiency is improved. The micro-pump 12 is electrically connected with an external power supply through a wire, so that power is conveniently provided for the rotation of the micro-pump 12, and further the circulation of water is conveniently realized. The connecting plate 11 is welded and fixed on the outer side of the heat dissipation pipe network 9, so that the multi-layer heat dissipation pipe networks 9 can be conveniently connected together through the connecting plate 11 to form a heat dissipation assembly, and the phenomenon that the heat dissipation pipe networks 9 on all layers are bent at the connecting rod to influence the circulating flow of water in the heat dissipation pipe networks 9 is avoided. The lower end of the connecting plate 11 is fixed on the heat dissipation fan through screws, so that the heat dissipation assembly and the heat dissipation fan are fixedly connected together, and further connected with the shell 1 to form a whole.
As shown in fig. 1-4, the heat dissipation device for the closed control module of the single chip microcomputer includes a fixing base 14, a motor 17, a fan blade 18 and a support rod 16, wherein the fixing base 14 is fixed on the housing 1 by screws, so that the whole heat dissipation fan is fixedly connected with the housing 1. Set up the air vent 15 that link up on the fixing base 14, welded fastening has a plurality of spinal branch vaulting poles 16 on the inside wall of air vent 15, motor 17 passes through the fix with screw on the bracing piece 16 of the axle center department of air vent 15, motor 17 passes through wire and external power supply electric connection, flabellum 18 rotates and connects in the pivot of motor 17, constitute radiator fan to the structure of radiator unit blast air, be convenient for drive flabellum 18 through motor 17 and rotate, and then to the blast air of radiator unit department, accelerate the circulation of riding is attacked to radiator unit department, and then further improvement radiator unit's radiating efficiency.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (4)
1. A heat abstractor for singlechip closed control module, including casing (1), its characterized in that, casing (1) internal fixation has endothermic sump (3), be fixed with the heat absorption subassembly on endothermic sump (3), endothermic sump (3) intercommunication has first communicating pipe (7) and second communicating pipe (8), first communicating pipe (7) intercommunication has radiator unit outside casing (1), the radiator unit top is fixed with miniature pump (12), second communicating pipe (8) are linked together with miniature pump (12), radiator unit is linked together through third communicating pipe (13) and miniature pump (12), be fixed with radiator fan between radiator unit and casing (1).
2. The heat dissipation device for the closed control module of the single chip microcomputer according to claim 1, wherein the heat absorption assembly comprises a first heat absorption plate (4) and a plurality of second heat absorption plates (5), the first heat absorption plate (4) is fixed on the end surface of the heat absorption water bin (3) close to the fixed control module (2) in the shell (1), the second heat absorption plates (5) are vertically and fixedly connected with the first heat absorption plates (4), one end of each second heat absorption plate (5) is arranged in the shell (1), the other end of each second heat absorption plate extends into the heat absorption water bin (3), and a plurality of openings are formed in the end surface of one end of each second heat absorption plate (5) in the heat absorption water bin (3).
3. The heat dissipation device for the closed control module of the single chip microcomputer according to claim 1, wherein the heat dissipation assembly is formed by communicating a plurality of layers of heat dissipation pipe networks (9) through a connecting pipe (10), the heat dissipation pipe networks (9) are a net structure formed by a plurality of mutually perpendicular and communicated water pipes, the adjacent heat dissipation pipe networks (9) are communicated through the connecting pipe (10), a connecting plate (11) is fixed on the outer side of each heat dissipation pipe network (9), and the lower end of the connecting plate (11) is fixed on a heat dissipation fan.
4. The heat dissipation device for the closed control module of the single chip microcomputer according to claim 1, wherein the heat dissipation fan comprises a fixed seat (14), a motor (17), fan blades (18) and support rods (16), the fixed seat (14) is provided with through vent holes (15), the plurality of support rods (16) are fixed in the vent holes (15), the motor (17) is fixed on the support rods (16) at the axis of the vent holes (15), and the fan blades (18) are rotatably connected to a rotating shaft of the motor (17) to form a structure for the heat dissipation fan to blow air to the heat dissipation assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922211831.4U CN210627119U (en) | 2019-12-11 | 2019-12-11 | Heat radiator for be used for singlechip to seal control module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922211831.4U CN210627119U (en) | 2019-12-11 | 2019-12-11 | Heat radiator for be used for singlechip to seal control module |
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| Publication Number | Publication Date |
|---|---|
| CN210627119U true CN210627119U (en) | 2020-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922211831.4U Active CN210627119U (en) | 2019-12-11 | 2019-12-11 | Heat radiator for be used for singlechip to seal control module |
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| CN (1) | CN210627119U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701158A (en) * | 2021-08-25 | 2021-11-26 | 四川正一环境科技有限公司 | Quick cooling system of plateau domestic waste incinerator |
-
2019
- 2019-12-11 CN CN201922211831.4U patent/CN210627119U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113701158A (en) * | 2021-08-25 | 2021-11-26 | 四川正一环境科技有限公司 | Quick cooling system of plateau domestic waste incinerator |
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