CN210610138U

CN210610138U - Radiator and protective housing

Info

Publication number: CN210610138U
Application number: CN201921159080.XU
Authority: CN
Inventors: 林欣; 胡涛
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-07-22
Filing date: 2019-07-22
Publication date: 2020-05-22
Anticipated expiration: 2029-07-22

Abstract

The utility model provides a radiator relates to digital product accessory field. The radiator comprises a semiconductor refrigeration sheet. The cold side of the semiconductor refrigeration piece is adjacent to the digital equipment. The semiconductor refrigerating sheet has high refrigerating speed and better refrigerating capacity, and has excellent cooling and radiating effects on the digital equipment. Therefore, the radiator can quickly and efficiently reduce the temperature of the digital equipment, avoid unsmooth operation caused by overhigh temperature of the digital equipment, enable the use experience of users to be better, and avoid the problems of element damage and the like caused by overhigh temperature for a long time. The utility model also provides a protective housing, it includes above-mentioned radiator. This protective housing mainly used installs to digital equipment on, plays the guard action to digital equipment, can also dispel the heat to digital equipment simultaneously.

Description

Radiator and protective housing

Technical Field

The utility model relates to a digital product accessory field particularly, relates to a radiator and protective housing.

Background

Digital equipment such as mobile phones and tablets is an indispensable part of people's work, study and life. When a user uses the mobile phone for a long time, particularly in summer, the mobile phone can generate heat continuously, and the mobile phone can be damaged greatly due to the continuous high temperature: the battery life is shortened, the system operation is blocked, the internal circuit is possibly damaged, the CPU performance is influenced, and even the mobile phone is forced to be shut down. If the mobile phone is naturally cooled, the waiting time is long, and the use of the mobile phone is limited during the waiting time, which is inconvenient. If the mobile phone is not seen to be hot and used continuously, the service life of the mobile phone battery can be seriously shortened, and the mobile phone can become stuck, and even the mobile phone circuit can be damaged and safety accidents can be caused in serious cases.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiator, its temperature that can reduce digital equipment comparatively rapidly, high-efficiently, the component damage, the functioning speed scheduling problem that have avoided the high temperature to lead to slow down.

Another object of the utility model is to provide a protective housing, its mainly used is installed to digital equipment on, plays the guard action to digital equipment, can also dispel the heat to digital equipment simultaneously.

The embodiment of the utility model is realized like this:

a radiator is used for cooling and radiating digital equipment and comprises a semiconductor refrigeration piece, wherein the cold surface of the semiconductor refrigeration piece is adjacent to the digital equipment. The semiconductor refrigerating plate, also called thermoelectric refrigerating plate, is a heat pump. The semiconductor refrigerating chip utilizes the Peltier effect of semiconductor materials (the Peltier effect means that when current passes through a loop formed by different conductors, the irreversible Joule heat is generated, and the heat absorption and heat release phenomena can respectively occur at the joints of the different conductors along with the difference of the current directions), so that the aim of refrigerating is fulfilled. The semiconductor refrigerating sheet has high refrigerating speed and no moving assembly, and is suitable for occasions with limited space, high reliability requirement and no refrigerant pollution. The semiconductor refrigerating sheet can be directly purchased in the market.

In some embodiments of the present invention, the heat sink further comprises a heat dissipating member and a fan. The fan is mounted on the heat sink. The side of the heat dissipation piece far away from the fan is connected with the hot surface of the semiconductor refrigeration piece. The heat dissipation piece cools down the heat dissipation with the fan to the hot face of semiconductor refrigeration piece jointly, avoids the high temperature of the hot face of semiconductor refrigeration piece, causes the component to damage.

In some embodiments of the present invention, the heat sink further includes a protective cover, a bottom plate and an electric control portion. The protective cover is fixed on the bottom plate, the electric control part is installed on the bottom plate, and the bottom plate is used as an installation platform of the radiator. The bottom plate is provided with a first through hole, the shape of the first through hole is matched with the semiconductor refrigeration piece, and after the semiconductor refrigeration piece penetrates through the first through hole, the cold surface of the semiconductor refrigeration piece is adjacent to the digital equipment for cooling and heat dissipation. The heat dissipation part, the fan and the electric control part are all positioned in the protective cover, and the protective cover can protect components in the cover and reduce the interference of external factors on the components in the cover; meanwhile, the user can be prevented from directly contacting the radiating piece, the fan and other components, and the user is prevented from being injured. The electric control part is respectively electrically connected with the semiconductor refrigeration piece and the fan, and can control the operation of the semiconductor refrigeration piece and the fan.

In some embodiments of the present invention, a plurality of ventilation holes are provided in the region of the protective cover corresponding to the fan. The ventilation hole is discharged outside the protection casing as the hot gas that the passageway blows off the fan on the one hand, and on the other hand provides the passageway for the outside air gets into the protection casing, makes the lower air of ambient temperature can get into the protection casing.

In some embodiments of the present invention, an elastic member is disposed between the side of the heat sink away from the semiconductor refrigeration sheet and the protection cover. The elastic member is configured to be always in a compressed state. Therefore, under the action of the elastic piece, the cold surface of the semiconductor refrigeration piece can be better close to or even attached to the digital equipment, and the cooling and radiating effects of the semiconductor refrigeration piece are better guaranteed.

In some embodiments of the present invention, the electric control portion includes an electric connector (1 or more), a controller and a regulating switch. The electric connector and the regulating switch are electrically connected with the controller, and the controller is electrically connected with the fan and the semiconductor refrigerating sheet respectively. The controller simultaneously regulates and controls the rotating speed of the fan and the power of the semiconductor refrigerating sheet according to the gear of the regulating switch, so that the radiator can be suitable for digital equipment with different models and different powers.

In some embodiments of the present invention, the electric control unit further includes a sound box. The sound box is electrically connected with the controller, and the sound box is configured to be selectively connected with the digital equipment under the control of the controller. The user can choose to use the stereo set to play the sound of digital equipment out, promotes user experience effect.

In some embodiments of the present invention, the protective case includes the above-described heat sink.

In some embodiments of the present invention, the protective case further comprises a case main body, the case main body comprising a first buckle, a second buckle and a rear cover. The first buckle is connected with one end of the rear cover, and the second buckle is connected with one end of the rear cover far away from the first buckle. The first buckle and the second buckle are matched to jointly realize the fixation of the protective shell on the digital equipment. The rear cover is connected with the bottom plate. The rear cover is provided with a second through hole, and the semiconductor refrigeration piece penetrates through the second through hole and then is adjacent to the digital equipment.

In some embodiments of the present invention, the first buckle and/or the second buckle are configured to be able to extend and retract in the direction from the first buckle to the second buckle, thereby enabling the protective case to be suitable for digital devices of different sizes.

The embodiment of the utility model provides an at least, have following advantage or beneficial effect:

the utility model provides a radiator, its temperature that can reduce digital equipment comparatively rapidly, high-efficiently has avoided because the operation that digital equipment high temperature caused is not smooth, makes user's use experience better, and has avoided damaging the scheduling problem because of the component that long-time high temperature leads to. The radiator comprises a semiconductor refrigeration sheet. The cold side of the semiconductor refrigeration piece is adjacent to the digital equipment. The semiconductor refrigerating sheet has high refrigerating speed, good refrigerating capacity and excellent cooling and radiating effects on the digital equipment.

The utility model also provides a protective housing, it includes above-mentioned radiator. The protective shell is mainly used for protecting digital equipment, and for example, the protective shell can be a mobile phone shell provided with the radiator. The protective shell can be installed on digital equipment (such as a mobile phone, a tablet and the like), and the probability of damage of the digital equipment due to collision is reduced. Because the protective housing is provided with the radiator, the protective housing can also carry out rapid cooling and heat dissipation on the digital equipment under the condition of not influencing the running of the digital equipment when the temperature of the digital equipment is overhigh, so that the damage of the digital equipment due to overhigh temperature can be avoided, and the normal use of the digital equipment is not influenced. The protective shell can further comprise a telescopic buckle, so that the protective shell can be suitable for digital equipment with different shapes and sizes, and the application range is wider.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a heat sink according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a bottom plate according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a protective cover according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a protective casing according to an embodiment of the present invention;

fig. 5 is a schematic structural diagram of the shell main body when the second buckle provided by the embodiment of the utility model is not extended:

fig. 6 is a schematic structural diagram of the shell main body when the second buckle provided by the embodiment of the present invention is extended.

Icon: 100-a heat sink; 102-semiconductor cooling fins; 104-a backplane; 105-a first via; 106-a heat sink; 108-a fan; 110-an electric control part; 112-a first electrical connector; 114-a second electrical terminal; 116-a controller; 118-a regulation switch; 120-sound equipment; 122-a third electrical connector; 124-protective cover; 125-a vent; 126-a resilient member; 200-protective shell; 210-a housing body; 212-first catch; 214-a second catch; 216-rear cover; 217-second via.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the embodiments of the present invention, it should be noted that if the directions or positional relationships indicated by the terms "inside", "outside", etc. are based on the directions or positional relationships shown in the drawings, or the directions or positional relationships that the products of the present invention are usually placed when using, the description is only for convenience of description and simplification of the present invention, and it is not intended to indicate or imply that the device or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the embodiments of the present invention, "a plurality" means at least 2.

In the description of the embodiments of the present invention, it should be further noted that unless explicitly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

Example 1

Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat sink 100. The present embodiment provides a heat sink 100, which mainly includes a semiconductor cooling plate 102. The heat sink 100 may be used to dissipate heat of a general digital device (e.g., a mobile phone, a tablet, a game machine, etc.). The cold side (not shown) of the semiconductor cooling plate 102 is adjacent to the digital device to cool the digital device quickly.

The radiator 100 is used in combination with a digital device, so that the temperature of the digital device can be reduced very quickly and efficiently, and the problems of component damage, unsmooth operation and the like caused by overhigh temperature are avoided.

In this embodiment, the heat sink 100 mainly uses the semiconductor cooling plate 102 to cool and dissipate heat of the digital device. The semiconductor refrigerating chip is also called refrigerating chip or thermoelectric refrigerating chip, and utilizes the Peltier effect of semiconductor material (the Peltier effect means that when current passes through the loop formed from different conductors, the irreversible Joule heat is produced, and the heat absorption and heat release phenomena can be respectively produced at the joints of different conductors along with the difference of current direction), so as to implement the goal of refrigeration. The refrigerating plate has the advantages of high refrigerating speed, capability of continuously working, no moving assembly and low working noise, and is suitable for occasions with limited space, high reliability requirement and no refrigerant pollution. And the refrigerating sheet can realize high-precision temperature control by controlling the magnitude of the input current.

In this embodiment, the heat sink 100 may further include a bottom plate 104. The bottom plate 104 may provide a support and mounting platform for various components of the heat sink 100, and also facilitate later sale of the heat sink 100 as a single unit. Of course, in other embodiments, the bottom plate 104 may not be provided, and after the heat sink 100 is sold, the user finds a corresponding mounting position on the digital device by himself to mount the heat sink 100.

Referring to fig. 2, fig. 2 is a schematic structural diagram of the bottom plate 104. In this embodiment, the bottom plate 104 is provided with a first through hole 105, and the shape of the first through hole 105 matches with the shape of the semiconductor chilling plate 102. After the semiconductor cooling plate 102 penetrates through the first through hole 105, the cooling surface of the semiconductor cooling plate 102 is adjacent to the digital device (may be in a direct contact state, or may be in a close state with a certain distance), so as to cool and dissipate heat of the digital device.

Please refer to fig. 1 again. In this embodiment, the heat sink 100 further includes a heat dissipating member 106 and a fan 108. The heat dissipation member 106 is provided with a recess (not shown), the fan 108 is an embedded fan, and the fan 108 is mounted in the recess of the heat dissipation member 106 (in other embodiments, the heat dissipation member 106 may not be provided with a recess, and accordingly, the fan 108 may not be an embedded fan, and the fan 108 is mounted on the heat dissipation member 106). The concave part can enlarge the contact area between the heat dissipation member 106 and the air, thereby accelerating the heat transfer rate between the air and the heat dissipation member 106 and enhancing the heat dissipation effect. The concave part is matched with the embedded fan, so that the size and the occupied space of the radiator 100 can be greatly reduced, the portability is higher, and the user experience is good. The side of the heat sink 106 remote from the fan 108 is connected to the hot side (not shown) of the semiconductor cooling plate 102. The heat dissipation member 106 and the fan 108 cool and dissipate the hot surface of the semiconductor cooling plate 102 together, so as to avoid the adverse effect on the digital equipment caused by the overhigh temperature of the hot surface of the semiconductor cooling plate 102. In other embodiments, the heat sink 100 may also adopt other arrangements to cool and dissipate the hot surface of the semiconductor cooling plate 102, such as a heat pipe, as long as the heat of the hot surface of the semiconductor cooling plate 102 can be taken away, so as to avoid damage to each component due to high temperature.

In this embodiment, the semiconductor chilling plate 102 adopts a double-layer semiconductor chilling plate, and the chilling effect is more remarkable. In other embodiments, the semiconductor chilling plate 102 may also adopt a single-layer chilling plate, a plurality of multi-layer chilling plates with the rest number, or a structure formed by stacking a plurality of single-layer chilling plates, as long as the function of quickly cooling and dissipating heat of the digital device can be achieved.

In this embodiment, the hot surface and the cold surface of the semiconductor cooling plate 102 are coated with a heat conductive silicone layer (not shown). The heat-conducting silica gel has excellent cold and heat alternation resistance, aging resistance and electrical insulation performance, and has excellent moisture resistance, shock resistance, corona resistance, electric leakage resistance and chemical medium resistance. The existence of the heat-conducting silica gel layer can reduce the influence of air on heat conduction to the maximum extent, so that the cold surface of the semiconductor refrigeration piece 102 can quickly and effectively reduce the temperature of the digital equipment. Meanwhile, the heat of the hot surface of the semiconductor cooling plate 102 can be quickly transferred to the heat dissipation member 106, and then the temperature is dissipated to the outside air through the fan 108, so that the temperature of the hot surface of the semiconductor cooling plate 102 is reduced. And the heat-conducting silica gel has certain viscosity, so that the cold surface of the semiconductor refrigeration piece 102 can be better contacted with digital equipment, and the hot surface of the semiconductor refrigeration piece 102 is better connected with the heat dissipation piece 106. In other embodiments, other heat conducting devices such as heat conducting silicon tape can be used for the cold side and the hot side of the semiconductor cooling plate 102, as long as they have good heat conducting performance and electrical insulating performance.

In this embodiment, the heat sink 100 may further include an electric control portion 110. The electric control unit 110 is mounted on the base plate 104. The electric control unit 110 is electrically connected to the semiconductor cooling plate 102 and the fan 108, respectively, so as to control the operating states of the semiconductor cooling plate 102 and the fan 108. Of course, in other embodiments, the semiconductor cooling plate 102 and the fan 108 may be directly plugged in for use.

Please refer to fig. 1 and fig. 2. In this embodiment, the electric control portion 110 includes a first electric connector 112, a second electric connector 114, a controller 116 and an adjusting switch 118. The first electrical connector 112, the second electrical connector 114 and the adjustment switch 118 are disposed on the bottom plate 104. The first electrical connector 112, the second electrical connector 114 and the adjustment switch 118 are electrically connected to the controller 116, and the controller 116 is electrically connected to the semiconductor cooling plate 102 and the fan 108, respectively. The controller 116 regulates and controls the rotation speed of the fan 108 and the power of the semiconductor chilling plate 102 at the same time according to the gear of the adjusting switch 118, so that the rotation speed of the fan 108 can be always matched with the power of the semiconductor chilling plate 102 (for example, when the chilling power of the semiconductor chilling plate 102 is 1 watt, the rotation speed of the fan 108 is 3000 revolutions per minute), heat dissipation can be performed on the hot surface of the semiconductor chilling plate 102 in time, meanwhile, the radiator 100 can be suitable for digital equipment with different models and powers, and the energy is utilized more reasonably. It should be noted that in other embodiments, the fan 108 and the semiconductor cooling plate 102 can be adjusted by different switches, but this may result in more switches, which may reduce the hand-holding comfort of the user when the user uses the digital device with the heat sink 100 installed therein. Meanwhile, the fan 108 and the semiconductor chilling plate 102 are respectively adjusted through different switches, a user cannot make a correct judgment on which power the fan 108 at which rotating speed should be matched with the semiconductor chilling plate 102, and after adjustment, the hidden danger that the rotating speed of the fan 108 is low and heat emitted from the hot surface of the semiconductor chilling plate 102 cannot be taken away in time may exist, so that heat accumulation and temperature rise are finally caused, and damage is caused to the digital equipment and the radiator 100.

The first electrical connector 112 is used for connecting an external power source, thereby providing power to the heat sink 100. Second electricity connects 114 can utilize external charging wire and digital equipment electric connection to charge for digital equipment, promote user experience.

In other embodiments, the electric control unit 110 may further include an electric storage unit, and the electric storage unit may be rechargeable (in which case, the electric control unit 110 may be provided with the first electric connector 112) or non-rechargeable (in which case, the electric control unit 110 may not be provided with the first electric connector 112). As long as it can supply power to the heat sink 100 and charge the digital device.

In this embodiment, the controller 116 may adopt a PLC control system. The PLC control system has the advantages of low cost, wide source and easy installation and use. The model number may be Siemens brand S7-200CN, which is convenient for commercial purchase. In other embodiments, the controller 116 may adopt other types of PLC control systems, or may adopt a single chip microcomputer, as long as it can control the operating states of the semiconductor cooling fins 102 and the fan 108.

In this embodiment, the electric control portion 110 further includes a sound box 120 and a third electric connector 122. The speaker 120 is fixed to the base plate 104, and the third electrical connector 122 is disposed on the base plate 104. The controller 116, the sound box 120 and the third electrical connector 122 are electrically connected in sequence. The third electric connector 122 can be electrically connected with the digital device through an external data line, and the sound box 120 can receive the audio signal of the digital device and play the audio signal under the control of the controller 116, so that the use experience of a user is improved. In other embodiments, the audio output device in other modes, such as bluetooth audio (when bluetooth audio is used, the third electrical connector 122 may not be provided), may be used as the audio output device 120, as long as the function of receiving and outputting the audio signal of the digital device can be completed.

Referring to fig. 1 and 3, fig. 3 is a schematic structural diagram of the protective cover 124. In this embodiment, the heat sink 100 further includes a protective cover 124. The protective cover 124 is fastened to the base plate 104 (in other embodiments, the protective cover 124 and the base plate 104 may be connected by other detachable connection methods such as bolt connection, or may be connected by fixed connection methods such as welding and bonding, as long as the protective cover 124 can be fixed to the base plate 104, so that the protective cover 124 can protect the components in the protective cover 124). The heat sink 106, the fan 108, the controller 116, and the audio 120 are all located within a protective enclosure 124, and the first electrical connector 112, the second electrical connector 114, the adjustment switch 118, and the third electrical connector 122 are all located outside the protective enclosure 124. The protective cover 124 can provide protection for the components in the cover, and reduce the interference of external factors on the components in the cover; meanwhile, the user can be prevented from directly contacting the heat dissipation member 106, the fan 108 and other components, and the user is prevented from being injured.

In this embodiment, a plurality of vents 125 are disposed on the shield 124 in the area corresponding to the fan 108. The ventilation holes 125 serve as a passage for discharging hot air blown by the fan 108 to the outside of the shield 124, and provide a passage for outside air to enter the shield 124, so that air with a low outside temperature can enter the shield 124 for cooling.

In this embodiment, two elastic members 126 are symmetrically disposed between the side of the heat dissipation member 106 away from the semiconductor cooling plate 102 and the protective cover 124 (in other embodiments, the number of the elastic members 126 may be one, or three or more, as long as the heat dissipation member 106 can receive a force in a direction away from the protective cover 124 and the force is balanced). The elastic member 126 is configured to be always in a compressed state. Therefore, under the action of the elastic member 126, the cold surface of the semiconductor chilling plate 102 can be well adjacent to or even attached to the digital device, so that the cooling and heat dissipation effects of the semiconductor chilling plate 102 are better ensured.

In this embodiment, the elastic member 126 is a spring. The spring has wide source, low price, low market purchase difficulty and convenient installation. In other embodiments, the elastic element 126 may also be made of other elastic structures, such as elastic columns, etc., as long as it can apply a force to the heat dissipation element 106 in a direction away from the protective cover 124 and balance the force applied to the heat dissipation element 106.

The working principle of the heat sink 100 is:

the first electrical connector 112 is connected to an external power source to supply power to the heat sink 100. The user selects the gear position through the adjusting switch 118, and the controller 116 controls the rotation speed of the fan 108 and the power of the semiconductor cooling fins 102 according to the gear position of the adjusting switch 118. The cooling and heat dissipation process is as follows: the temperature of the cold surface of the semiconductor refrigeration piece 102 is reduced, so that the digital equipment is cooled and radiated, the heat of the hot surface of the semiconductor refrigeration piece 102 is conducted to the heat dissipation piece 106, the fan 108 rotates to drive the air to flow, and the temperature of the heat dissipation piece 106 is reduced. The heat-absorbed air is exhausted from the hood 124 through the ventilation holes 125 of the hood 124, and the air having a lower external temperature enters the hood 124 through the ventilation holes 125.

The user can be through external charging wire with second electric connector 114 and digital equipment electric connection to charge for digital equipment. The user can electrically connect the third electrical connector 122 with the digital device through the external data line, so that the audio 120 receives and plays the audio signal of the digital device.

Example 2

Referring to fig. 4, fig. 4 is a schematic structural view of the protective shell 200. The present embodiment provides a protective case 200, which is mainly configured with a case main body 210 and the heat sink 100. The protective case 200 can be mounted on the digital device, reducing the possibility of damage to the digital device due to collision. Meanwhile, the protective shell 200 can also rapidly cool and dissipate the digital device without affecting the operation of the digital device when the temperature of the digital device rises, so that the digital device can be prevented from being damaged due to overhigh temperature, and the normal use of the digital device is not affected. The protective case 200 may be designed to be a retractable structure, so that it is suitable for digital devices of different shapes and sizes, and the application range is wider.

Referring to fig. 4 and 5, when the second latch 214 shown in fig. 5 is not extended, the structure of the housing main body 210 is schematically illustrated. In this embodiment, the housing body 210 mainly includes a first latch 212, a second latch 214 and a rear cover 216. The first catch 212 is connected to an end of the rear cover 216, and the second catch 214 is connected to an end of the rear cover 216 away from the first catch 212. The first catch 212 and the second catch 214 cooperate to secure the protective case 200 to the digital device.

In this embodiment, the bottom plate 104 of the heat sink 100 may be directly and fixedly mounted on the rear cover 216 (the bottom plate 104 is not shown in fig. 4), and in case the bottom plate 104 is not provided, the rest of the components of the heat sink 100 may also be directly mounted on the rear cover 216 at a suitable position. In other embodiments, the bottom plate 104 of the heat sink 100 and the rear cover 216 may be detachably connected by a snap connection, as long as the function of fixing the heat sink 100 to the rear cover 216 is achieved.

The rear cover 216 is provided with a second through hole 217, and the semiconductor chilling plate 102 penetrates through the second through hole 217 and is adjacent to the digital device (in a direct contact state or in a close state with a certain distance), so as to cool and dissipate heat of the digital device.

Referring to fig. 5 and 6, fig. 6 is a schematic structural view of the housing main body 210 when the second buckle 214 is extended. In this embodiment, the first buckle 212 is not retractable, and the second buckle 214 is retractable in the direction from the first buckle 212 to the second buckle 214, so that the size of the protective case 200 can be adjusted, the protective case 200 can be suitable for digital devices of different shapes and sizes, and the application range of the protective case 200 is enlarged. In other embodiments, the first buckle 212 and the second buckle 214 may be alternatively or both telescopic, as long as the size of the protective shell 200 can be adjusted. Its flexible setting can have multiple selection, can select to utilize for example at the inside spring that sets up of back lid 216, buckle and spring coupling, the tensile of the tensile spring that drives of buckle makes the buckle and digital equipment's matching more stable.

The working principle of the protective case 200 is:

the second latch 214 is extended and then slowly retracted until the protective case 200 is stably secured to the digital device.

The user can electrically connect the second electrical connector 114 with the digital device, thereby charging the digital device. The user can electrically connect the third electrical connector 122 with the digital device, so that the audio device 120 receives the audio signal of the digital device and plays the audio signal.

The above is only a preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes will occur to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A radiator is used for cooling and radiating digital equipment and is characterized by comprising a semiconductor refrigeration piece, wherein the cold surface of the semiconductor refrigeration piece is adjacent to the digital equipment.

2. The heat sink of claim 1, further comprising a heat sink member and a fan, wherein the fan is mounted to the heat sink member, and wherein a side of the heat sink member remote from the fan is connected to the hot side of the semiconductor cooling fins.

3. The heat sink according to claim 2, further comprising a protective cover, a bottom plate and an electric control portion, wherein the protective cover is fixed to the bottom plate, the electric control portion is mounted on the bottom plate, the bottom plate is provided with a first through hole, the first through hole is matched with the semiconductor refrigeration piece in shape, the semiconductor refrigeration piece penetrates through the first through hole, the heat dissipation member, the fan and the electric control portion are located in the protective cover, and the electric control portion is electrically connected with the semiconductor refrigeration piece and the fan respectively.

4. The heat sink as claimed in claim 3, wherein a plurality of ventilation holes are formed in the shield at a region corresponding to the fan.

5. The heat sink of claim 4, wherein an elastic member is disposed between a side of the heat dissipating member away from the semiconductor cooling fins and the protective cover, the elastic member being configured to be always in a compressed state.

6. The heat sink as claimed in claim 5, wherein the electric control portion comprises an electric connector, a controller and a regulating switch, the electric connector and the regulating switch are electrically connected to the controller, the controller is electrically connected to the fan and the semiconductor chilling plate respectively, and the controller regulates and controls the rotation speed of the fan and the power of the semiconductor chilling plate simultaneously according to the position of the regulating switch.

7. The heat sink as recited in claim 6, wherein said electronic control unit further comprises a speaker, said speaker being electrically connected to said controller, said speaker being configured to be selectively connected to said digital device under the control of said controller.

8. A protective case comprising a heat sink according to any one of claims 3 to 7.

9. The protective case of claim 8, further comprising a case body, wherein the case body comprises a first buckle, a second buckle and a rear cover, the first buckle is connected with one end of the rear cover, the second buckle is connected with one end of the rear cover, the end of the rear cover, which is far away from the first buckle, the first buckle and the second buckle are matched to fix the protective case on the digital device, the rear cover is connected with the bottom plate, the rear cover is provided with a second through hole, and the semiconductor refrigeration piece penetrates through the second through hole and then is close to the digital device.

10. The protective case of claim 9, wherein the first catch and/or the second catch are configured to be retractable in a direction from the first catch to the second catch.