CN210551302U

CN210551302U - Wafer carrying manipulator

Info

Publication number: CN210551302U
Application number: CN201921153647.2U
Authority: CN
Inventors: 尹诚诚; 周卫国; 刘冬梅; 王强; 董纯洁
Original assignee: Beijing Reje Automation Co ltd
Current assignee: Beijing Reje Automation Co ltd
Priority date: 2019-07-22
Filing date: 2019-07-22
Publication date: 2020-05-19
Anticipated expiration: 2029-07-22

Abstract

The embodiment of the utility model discloses a wafer carrying manipulator, which comprises a rotary clamping component and a rotary motor for driving the rotary clamping component to rotate, wherein the rotary clamping component comprises a bearing component, and the inner wall of the bearing component is provided with a ball spline; the ball spline comprises a spline shaft and a spline outer barrel which is arranged on the outer wall of the spline shaft in a rolling mode, a rotating motor is used for driving the spline outer barrel to rotate, fixing fingers which synchronously rotate along with the spline outer barrel and are used for supporting the side wall of the inner end of a wafer and clamping fingers used for supporting the side wall of the outer end of the wafer are arranged on the spline outer barrel, and a clamping cylinder used for pushing the clamping fingers to horizontally move is connected onto the spline shaft; and be connected with the encoder on the rotating electrical machines, encoder electric connection has the controller, controller electric connection rotating electrical machines and centre gripping cylinder, the utility model discloses can accomplish the stepless formula of each angle and rotate, adopt the tight transport mode of clamp of non-contact, improve upset precision and stability.

Description

Wafer carrying manipulator

Technical Field

The embodiment of the utility model provides a relate to wafer transport technical field, concretely relates to wafer transport manipulator.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The starting material for the wafer is silicon, while the crust surface has an inexhaustible amount of silicon dioxide. The silicon dioxide ore is refined by an electric arc furnace, chloridized by hydrochloric acid and distilled to prepare high-purity polysilicon.

In the process of producing the wafer, transfer the wafer to another work platform from a work platform, the tradition adopts the manual hand-held wafer mode of carrying more, and is mostly the centre gripping formula with trade prior art, or adsorbs convertible transport. When the wafer is transported, the wafer can be transported horizontally, and the working condition of non-horizontal transportation cannot be met. Or only the adsorption type overturning can be carried out, and the carrying working condition that the surface can not be contacted can not be met. At present, the turnover carrying manipulator on the market mostly adopts a pneumatic driving mode to complete the turnover of fingers, and the defect is obvious:

(1) the carrying form is single: the turnover mechanism can only carry out turnover actions at two positions and cannot complete stepless rotation at all angles;

(2) the upset precision is low, and stability is poor: the conveying working condition with high precision requirement cannot be adapted, the conveying working condition with the surface not contacted cannot be met, and the risk of chip falling is very high; the control system is in full open loop control, cannot monitor the real-time position of the finger in the turning process, easily causes collision of equipment in the movement process, influences the quality of the wafer, leads to the scrapping of the wafer in serious cases, and reduces the yield of wafer production;

(3) the maintenance is inconvenient: the structure and the control are integrated with the manipulator, and the control and the later maintenance are inconvenient;

(4) the substrate with the turnover type carrying manipulator on the market at present has no waterproof function and cannot adapt to a micro-water or multi-water environment;

the above defects all result in low efficiency of transporting the conventional wafer.

SUMMERY OF THE UTILITY MODEL

Therefore, the embodiment of the utility model provides a wafer transport manipulator to solve among the prior art because the transport mode is single, can't deal with the transport operating mode that the surface can not contact, the upset precision is low, poor stability and the problem of inefficiency.

In order to achieve the above object, the embodiment of the present invention provides the following technical solutions:

a wafer carrying manipulator comprises a rotary clamping assembly and a rotary motor for driving the rotary clamping assembly to rotate, wherein the rotary clamping assembly comprises a bearing assembly, and a ball spline is mounted on the inner wall of the bearing assembly; the ball spline comprises a spline shaft and a spline outer barrel which is arranged on the outer wall of the spline shaft in a rolling mode, the rotating motor is used for driving the spline outer barrel to rotate, fixing fingers which rotate synchronously with the spline outer barrel and are used for supporting the inner end side wall of the wafer and clamping fingers used for supporting the outer end side wall of the wafer are arranged on the spline outer barrel, and a clamping cylinder used for pushing the clamping fingers to move horizontally is connected onto the spline shaft; and the rotary motor is connected with an encoder, the encoder is electrically connected with a controller, and the controller is electrically connected with the rotary motor and the clamping cylinder.

The embodiment of the utility model provides a characteristic still lies in, the rotating electrical machines is step motor, step motor's output passes through gear motor and connects rotatory centre gripping subassembly, just the encoder is installed in gear motor's pivot.

The utility model discloses the characteristic still lies in, bearing assembly includes the bearing frame, the inside wall of bearing frame sets up first bearing and second bearing, first bearing is prepressed at the one end lateral wall of spline urceolus, the second bearing is prepressed at the other end lateral wall of spline urceolus.

The utility model discloses the characteristic still lies in, still including the base plate that is used for bearing each mechanism, controller and base plate integrated into one piece, be provided with electric connection on the controller the communication serial ports of encoder, rotating electrical machines and centre gripping cylinder.

The embodiment of the utility model provides a characterized in that still, be provided with waterproof sealing pad between bearing assembly and the ball spline.

The embodiment of the utility model provides a have following advantage:

(1) the utility model utilizes the rotary clamping component to complete multi-angle stepless turnover action, increases the turnover function, and can adapt to more carrying working conditions; the mode that the wafer is clamped by the fixed fingers and the clamping fingers from the two side walls is adopted, non-contact clamping is realized, abrasion damage to the surface of the wafer is reduced, and the yield of the wafer is improved;

(2) the utility model discloses use step motor, through reducing gear after with power transmission for rotatory centre gripping subassembly, drive rotatory centre gripping subassembly and carry out the action of overturning. The stepping motor has the advantages of small volume, high response speed, high positioning precision, flexible control mode and the like. The precision error of the motor is reduced to the minimum by matching with a speed reducing mechanism, and the integral positioning precision is improved;

(3) the controller and the turnover device mechanism of the utility model are integrated, the control panel is provided with a communication serial port which is electrically connected with the power mechanism component and the editor, and the high modular design of the turnover device greatly improves the replacement and maintenance efficiency of the turnover device;

(4) the utility model discloses the structure part junction adopts waterproof sealing washer sealed, realizes waterproof function.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.

The structure, ratio, size and the like shown in the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by people familiar with the technology, and are not used for limiting the limit conditions which can be implemented by the present invention, so that the present invention has no technical essential significance, and any structure modification, ratio relationship change or size adjustment should still fall within the scope which can be covered by the technical content disclosed by the present invention without affecting the efficacy and the achievable purpose of the present invention.

Fig. 1 is a schematic view of an overall structure provided by an embodiment of the present invention;

fig. 2 is a schematic longitudinal sectional view according to an embodiment of the present invention;

fig. 3 is a schematic structural diagram of an editor according to an embodiment of the present invention.

In the figure:

1-rotating the clamping assembly; 2-a rotating electrical machine; 3-a bearing assembly; 4-fixing the finger; 5-ball spline; 6-clamping fingers; 7-a clamping cylinder; 8-an encoder; 9-a controller; 10-a reduction motor; 11-a substrate; 12-a waterproof gasket;

301-bearing seat; 302-a first bearing; 303-a second bearing;

501-spline outer cylinder; 502-spline shaft.

Detailed Description

The present invention is described in terms of specific embodiments, and other advantages and benefits of the present invention will become apparent to those skilled in the art from the following disclosure. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In the present specification, the terms "upper", "lower", "left", "right", "middle", and the like are used for the sake of clarity only, and are not intended to limit the scope of the present invention, and changes or adjustments of the relative relationship thereof are also considered to be the scope of the present invention without substantial changes in the technical content.

The wafer carrying device aims at the problems that the carrying mode of the existing wafer carrying device is single, the carrying working condition that the surface cannot be contacted can not be met, the overturning precision is low, the stability is poor and the efficiency is low. As shown in fig. 1 to 3: the utility model provides a wafer transport manipulator aims at utilizing its multi-angle stepless upset action of accomplishing handling device, adapts to the transport operating mode that the wafer surface can not contact simultaneously to the position at upset in-process place is carried to real time monitoring, ensures the upset precision. Specifically, the method comprises the following steps:

the wafer carrying manipulator comprises a rotary clamping assembly 1 and a rotary motor 2 for driving the rotary clamping assembly 1 to rotate. Preferably, the rotating motor 2 is a stepping motor, the output end of the stepping motor is connected with the rotating clamping assembly 1 through a speed reducing motor 10, and the encoder 8 is installed on the rotating shaft of the speed reducing motor 10. The stepping motor is used, power is transmitted to the rotary clamping assembly 1 after being reduced by the reducing motor 10, and the rotary clamping assembly 1 is driven to turn over. The stepping motor has the advantages of small volume, high response speed, high positioning precision, flexible control mode and the like. And the precision error of the motor is reduced to the minimum by matching with the speed reducing motor 10, so that the overall positioning precision is improved.

In order to realize the compatible functions of clamping and overturning the wafer. The rotating clamp assembly 1 comprises a bearing assembly 3, the inner wall of the bearing assembly 3 being fitted with a ball spline 5. Specifically, the method comprises the following steps:

the ball spline 5 comprises a spline shaft 502 and a spline outer cylinder 501 arranged on the outer wall of the spline shaft 502 in a rolling manner, the rotating motor 2 is used for driving the spline outer cylinder 501 to rotate, and the spline outer cylinder 501 is provided with fixing fingers 4 which rotate synchronously with the spline outer cylinder 501 and are used for supporting the inner end side wall of the wafer and clamping fingers 6 used for supporting the outer end side wall of the wafer. The spline shaft 502 is connected with a clamping cylinder 7 for pushing the clamping fingers 6 to move horizontally.

When a wafer to be transported needs to be clamped, firstly, the clamping finger 6 is driven to be horizontally far away from the fixed finger 4, when the wafer enters a clamping area formed by the clamping blocks at the top ends of the clamping finger 6 and the fixed finger 4, the clamping finger 6 is driven to be horizontally close to the fixed finger 4, so that the wafer is clamped in the clamping area formed by the clamping blocks from the side wall of the end part, and the wafer is prevented from moving. Compared with adsorption clamping, the clamping mode can firstly realize non-contact clamping of the wafer panel, damage to the wafer is reduced, and the yield of wafer processing is improved.

The ball spline 5 is used to realize the horizontal movement of the clamping fingers 6, and the clamping action is realized. The ball spline 5 is mounted on the bearing assembly 3 so as to be compatible in both clamping and tumbling functions.

In order to improve the stability of the connection between the hand bearing assembly 3 and the ball spline 5, the bearing assembly 3 comprises a bearing seat 301, a first bearing 302 and a second bearing 303 are arranged on the inner side wall of the bearing seat 301, the first bearing 302 is pre-pressed on the side wall of one end of the spline outer cylinder 501, and the second bearing 303 is pre-pressed on the side wall of the other end of the spline outer cylinder 501. This way, the tightness of the pre-pressing of the spline outer cylinder 501 by the first bearing 302 and the second bearing 303 can be further improved, and the structural stability is improved.

And be connected with encoder 8 on the rotating electrical machines 2, encoder 8 electric connection has controller 9, and controller 9 electric connection rotating electrical machines 2 and centre gripping cylinder 7. The encoder 8 is matched with the power mechanism assembly, the angular displacement is converted into an electric signal by the encoder 8 and transmitted to the controller 9, and the controller 9 transmits an instruction to the power mechanism assembly after analyzing and processing the electric signal, so that the power of the power mechanism assembly is corrected, the real-time monitoring of the turning position is realized, and the turning precision is ensured.

The round carrying manipulator further comprises a substrate 11 used for bearing each mechanism, a controller 9 and the substrate 11 are integrally formed, and the controller 9 is provided with a communication serial port electrically connected with the encoder 8, the rotating motor 2 and the clamping cylinder 7. The highly modular design of the turnover mechanism greatly improves the replacement and maintenance efficiency of the turnover mechanism.

As a preferred embodiment: at present, the base plate with the turnover type carrying manipulator on the market has no waterproof function and cannot adapt to a micro-water or multi-water environment. The present invention thus provides a waterproof gasket 12 between the bearing assembly 3 and the ball spline 5.

Although the invention has been described in detail with respect to the general description and the specific embodiments, it will be apparent to those skilled in the art that modifications and improvements can be made based on the invention. Therefore, such modifications and improvements are intended to be within the scope of the invention as claimed.

Claims

1. The utility model provides a wafer transport machinery hand, includes rotatory centre gripping subassembly (1) and is used for the drive rotatory centre gripping subassembly (1) pivoted rotating electrical machines (2), its characterized in that:

the rotary clamping assembly (1) comprises a bearing assembly (3), and a ball spline (5) is mounted on the inner wall of the bearing assembly (3); the ball spline (5) comprises a spline shaft (502) and a spline outer barrel (501) arranged on the outer wall of the spline shaft (502) in a rolling mode, the rotating motor (2) is used for driving the spline outer barrel (501) to rotate, fixing fingers (4) which rotate synchronously with the spline outer barrel (501) and are used for supporting the inner end side wall of a wafer and clamping fingers (6) used for supporting the outer end side wall of the wafer are arranged on the spline outer barrel (501), and a clamping cylinder (7) used for pushing the clamping fingers (6) to move horizontally is connected to the spline shaft (502); and an encoder (8) is connected to the rotating motor (2), the encoder (8) is electrically connected with a controller (9), and the controller (9) is electrically connected with the rotating motor (2) and the clamping cylinder (7).

2. The wafer handling robot of claim 1, wherein: the rotary motor (2) is a stepping motor, the output end of the stepping motor is connected with the rotary clamping component (1) through a speed reducing motor (10), and the encoder (8) is installed on the rotating shaft of the speed reducing motor (10).

3. The wafer handling robot of claim 1, wherein: the bearing assembly (3) comprises a bearing seat (301), a first bearing (302) and a second bearing (303) are arranged on the inner side wall of the bearing seat (301), the first bearing (302) is pre-pressed on the side wall of one end of the spline outer cylinder (501), and the second bearing (303) is pre-pressed on the side wall of the other end of the spline outer cylinder (501).

4. The wafer handling robot of claim 1, wherein: still include base plate (11), controller (9) and base plate (11) integrated into one piece, be provided with electric connection on controller (9) the communication serial ports of encoder (8), rotating electrical machines (2) and centre gripping cylinder (7).

5. The wafer handling robot of claim 1, wherein: and a waterproof sealing gasket (12) is arranged between the bearing assembly (3) and the ball spline (5).