CN210519310U - LED circuit board with temperature compensation function - Google Patents

LED circuit board with temperature compensation function Download PDF

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Publication number
CN210519310U
CN210519310U CN201921283649.3U CN201921283649U CN210519310U CN 210519310 U CN210519310 U CN 210519310U CN 201921283649 U CN201921283649 U CN 201921283649U CN 210519310 U CN210519310 U CN 210519310U
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China
Prior art keywords
circuit board
temperature compensation
board body
temperature
heat
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CN201921283649.3U
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Chinese (zh)
Inventor
欧阳剑
陈庆生
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Shanghai Wanxu Electronic Technology Co Ltd
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Shanghai Wanxu Electronic Technology Co Ltd
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Abstract

The utility model discloses a LED circuit board with temperature compensation function, including circuit board body, mount pad and temperature compensation system, the surface that is located the mount pad of circuit board body, the mount pad is vertical central line symmetric distribution about the circuit board body, the installation cavity has been seted up on the surface of mount pad, be equipped with temperature compensation system in the installation cavity, temperature compensation system includes microprocessor, memory, temperature sensor, heating resistor silk and power module, microprocessor is connected with memory, temperature sensor, heating resistor silk and power module respectively, the even fixed connection of temperature sensor is in the inside of installation cavity, the fixed surface of heating resistor silk is connected with the heat-conducting plate. The utility model discloses a be equipped with temperature compensation system in the inside of installation cavity, the convenience is to circuit board body heating, improves circuit board body operational environment's temperature, makes the normal work of electronic component on circuit board body surface.

Description

LED circuit board with temperature compensation function
Technical Field
The utility model relates to an electronic component technical field specifically is a LED circuit board with temperature compensation function.
Background
The LED circuit board is a short for printed circuit board, the LED aluminum substrate and the FR-4 glass fiber circuit board both belong to the same PCB, and in different terms, the LED aluminum substrate and the FR-4 glass fiber circuit board are only taken for comparison, the LED aluminum substrate is printed on a plane of aluminum material with better heat conductivity, and then an electronic element is welded on the plane.
At present, the common research directions of LED circuit boards in the market have two main large directions such as dustproof, heat dissipation, and through continuous research and improvement, the current technology is mature, but the LED circuit board works in the environment that the temperature is too low, leads to some electronic components to work normally easily, causes phenomena such as LED circuit board work malfunction. For this reason, a new technical solution needs to be designed for solution.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED circuit board with temperature compensation function is equipped with temperature compensation system through the inside at the installation cavity, conveniently heats the circuit board body, improves circuit board body operational environment's temperature, makes the normal work of electronic component on circuit board body surface.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a LED circuit board with temperature compensation function, includes circuit board body, mount pad and temperature compensation system, the surface that is located the mount pad of circuit board body just embeds in the mount pad, the mount pad is vertical central line symmetric distribution about the circuit board body, the installation cavity has been seted up on the surface of mount pad, be equipped with temperature compensation system in the installation cavity, temperature compensation system includes microprocessor, memory, temperature sensor, heating resistor silk and power module, microprocessor is connected with memory, temperature sensor, heating resistor silk and power module respectively, the even fixed connection of temperature sensor is in the inside of installation cavity, the fixed surface of heating resistor silk is connected with the heat-conducting plate.
As an improvement of the technical scheme, the middle part of the mounting cavity is fixedly connected with a supporting column, and the upper surface of the supporting column is fixedly connected with a rubber pad and is provided with a threaded hole.
As an improvement of the technical scheme, a fixing bolt penetrating through the circuit board body is arranged on the surface of the circuit board body and is connected with a threaded hole in the surface of the supporting column.
As an improvement of the technical scheme, the upper surface of the heat conducting plate is pasted with heat conducting silica gel, the lower surface of the heat conducting plate is provided with a strip-shaped groove, and the heating resistance wire is embedded in the strip-shaped groove.
As an improvement of the technical scheme, the mounting seat is integrally made of carbon fiber materials, and fixing holes are formed in four corners of the surface of the mounting seat.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a be equipped with temperature compensation system in the inside of installation cavity, conveniently heat the circuit board body, improve circuit board body operational environment's temperature, make the electronic component normal work on circuit board body surface to be equipped with microprocessor and temperature sensor, make things convenient for the temperature of circuit board body to carry out real-time supervision, thereby compensate the temperature of circuit board body, avoid circuit board body high temperature and influence the working life of electron unit ware.
Drawings
Fig. 1 is a schematic view of a top view structure of an LED circuit board with temperature compensation function according to the present invention;
fig. 2 is a schematic side sectional view of the LED circuit board with temperature compensation function according to the present invention;
FIG. 3 is a schematic side view of the support pillar of the present invention;
fig. 4 is a schematic structural diagram of the temperature compensation system of the present invention.
In the figure: the circuit board comprises a circuit board body-1, a mounting seat-2, a temperature compensation system-3, a mounting cavity-4, a microprocessor-5, a memory-6, a temperature sensor-7, a heating resistance wire-8, a power supply module-9, a heat conducting plate-10, a supporting column-11, a rubber pad-12, a threaded hole-13, a fixing bolt-14, heat conducting silica gel-15, a strip groove-16 and a fixing hole-17.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Please refer to fig. 1-4, the present invention provides a technical solution: the utility model provides a LED circuit board with temperature compensation function, includes circuit board body 1, mount pad 2 and temperature compensation system 3, the surface that is located mount pad 2 of circuit board body 1 and embedded in mount pad 2, mount pad 2 is vertical central line symmetric distribution about circuit board body 1, installation cavity 4 has been seted up on the surface of mount pad 2, be equipped with temperature compensation system 3 in the installation cavity 4, temperature compensation system 3 includes microprocessor 5, memory 6, temperature sensor 7, heating resistor silk 8 and power module 9, microprocessor 5 is connected with memory 6, temperature sensor 7, heating resistor silk 8 and power module 9 respectively, the even fixed connection of temperature sensor 7 is in the inside of installation cavity 4, the fixed surface of heating resistor silk 8 is connected with heat-conducting plate 10.
Further improved, as shown in fig. 3, the middle fixedly connected with support column 11 of the installation cavity 4, the upper surface fixedly connected with rubber pad 12 of the support column 11 and the threaded hole 13 are provided, the circuit board body 1 in the installation cavity 4 is conveniently fixed through the middle fixedly connected with support column 11 of the installation cavity 4, and the surface of the circuit board body 1 is prevented from being damaged through the upper surface fixedly connected with rubber pad 12 of the support column 11.
In a further improvement, as shown in fig. 1, a fixing bolt 14 penetrating through the circuit board body 1 is arranged on the surface of the circuit board body 1, the fixing bolt 14 is connected with a threaded hole 13 on the surface of the supporting column 11, and the fixing bolt 14 penetrating through the circuit board body 1 is arranged on the surface of the circuit board body 1, so that the circuit board body 1 is conveniently fixed on the surface of the installation cavity 4, and the connection stability between the circuit board body 1 and the installation seat 2 is improved.
Further improved ground, as shown in fig. 2, the upper surface paste of heat-conducting plate 10 has heat conduction silica gel 15, bar groove 16 has been seted up to the lower surface of heat-conducting plate 10, the heating resistor silk 8 is embedded in bar groove 16, has heat conduction silica gel 15 through the upper surface paste at heat-conducting plate 10, conveniently fills the clearance between heat-conducting plate 10 and the circuit board body 1, is convenient for evenly transmit the heat to the surface of circuit board body 1, utilizes the bar groove 16 of the lower surface of heat-conducting plate 10, avoids the heat diffusion of heating resistor silk 8, improves the efficiency of heat-transferring.
Specifically, as shown in fig. 1, the mounting base 2 is integrally made of a carbon fiber material, the fixing holes 17 are formed in the four corners of the surface of the mounting base 2, the mounting base 2 is made of the carbon fiber material, the structural strength of the mounting base 2 is improved, and the weight of the mounting base 2 is reduced.
The utility model discloses a circuit board body-1, mount pad-2, temperature compensation system-3, installation cavity-4, microprocessor-5, memory-6, temperature sensor-7, heating resistor silk-8, power module-9, heat-conducting plate-10, support column-11, rubber pad-12, screw hole-13, fixing bolt-14, heat-conducting silica gel-15, bar groove-16, fixed orifices-17, the part is general standard component or the part that technical staff in the field knows, its structure and principle all can all be known or can be known through the conventional experimental approach for this technical staff, this microprocessor specifically is STM32F103 microprocessor, this memory specifically is AT24C02DIP-8 memory, this temperature sensor specifically is DS18B20TO-92 temperature sensor, this power module specifically is LM2596 step-down module, the utility model discloses a be equipped with temperature compensation system 3 in the inside of installation cavity 4, conveniently heat circuit board body 1, improve circuit board body 1 operational environment's temperature, make the electronic component on circuit board body 1 surface normally work to be equipped with microprocessor 5 and temperature sensor 7, make things convenient for the temperature of circuit board body 1 to carry out real-time supervision, thereby compensate circuit board body 1's temperature, avoid circuit board body 1 high temperature and influence the life of electron unit ware.
When the utility model works, the power module is connected with the power supply (lithium battery or transformer), the temperature sensor 7 detects the temperature of the surface of the circuit board body 1, and transmits the detected data to the microprocessor 5, the microprocessor 5 compares and analyzes the data with the data in the memory 6, when the surface temperature of the circuit board body 1 is lower than the preset normal working temperature, the microprocessor 5 controls the power module 9 to supply power to the heating resistance wire 8, when the surface temperature of the circuit board body 1 reaches the normal working temperature, the microprocessor 5 controls the power module 9 to supply power to keep the heating resistance wire 8 at a constant temperature, and along with the heat generated by the electronic elements on the surface of the circuit board body 1 during working, the surface temperature of the circuit board body 1 is continuously increased, when the surface temperature of the circuit board body 1 is higher than the normal working temperature, the heating resistance wire 8 stops heating.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (5)

1. The utility model provides a LED circuit board with temperature compensation function, includes circuit board body (1), mount pad (2) and temperature compensation system (3), its characterized in that: the circuit board body (1) is positioned on the surface of the mounting seat (2) and embedded in the mounting seat (2), the mounting seats (2) are longitudinally and symmetrically distributed around the central line of the circuit board body (1), the surface of the mounting seat (2) is provided with a mounting chamber (4), a temperature compensation system (3) is arranged in the mounting chamber (4), the temperature compensation system (3) comprises a microprocessor (5), a memory (6), a temperature sensor (7), a heating resistance wire (8) and a power module (9), the microprocessor (5) is respectively connected with the memory (6), the temperature sensor (7), the heating resistance wire (8) and the power module (9), the temperature sensors (7) are uniformly and fixedly connected in the installation chamber (4), and the surface of the heating resistance wire (8) is fixedly connected with a heat-conducting plate (10).
2. The LED circuit board with the temperature compensation function according to claim 1, wherein: the middle part of the mounting chamber (4) is fixedly connected with a supporting column (11), and the upper surface of the supporting column (11) is fixedly connected with a rubber pad (12) and is provided with a threaded hole (13).
3. The LED circuit board with the temperature compensation function according to claim 2, wherein: the surface of the circuit board body (1) is provided with a fixing bolt (14) penetrating through the circuit board body (1), and the fixing bolt (14) is connected with a threaded hole (13) in the surface of the supporting column (11).
4. The LED circuit board with the temperature compensation function according to claim 1, wherein: the upper surface paste of heat-conducting plate (10) has heat conduction silica gel (15), strip groove (16) have been seted up to the lower surface of heat-conducting plate (10), embedded in strip groove (16) heating resistor silk (8).
5. The LED circuit board with the temperature compensation function according to claim 1, wherein: the mounting seat (2) is integrally made of carbon fiber materials, and fixing holes (17) are formed in four corners of the surface of the mounting seat (2).
CN201921283649.3U 2019-08-09 2019-08-09 LED circuit board with temperature compensation function Active CN210519310U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921283649.3U CN210519310U (en) 2019-08-09 2019-08-09 LED circuit board with temperature compensation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921283649.3U CN210519310U (en) 2019-08-09 2019-08-09 LED circuit board with temperature compensation function

Publications (1)

Publication Number Publication Date
CN210519310U true CN210519310U (en) 2020-05-12

Family

ID=70588930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921283649.3U Active CN210519310U (en) 2019-08-09 2019-08-09 LED circuit board with temperature compensation function

Country Status (1)

Country Link
CN (1) CN210519310U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112783227A (en) * 2020-12-30 2021-05-11 盐城工学院 Electrical assembly system with temperature compensation piece

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112783227A (en) * 2020-12-30 2021-05-11 盐城工学院 Electrical assembly system with temperature compensation piece
CN112783227B (en) * 2020-12-30 2022-02-08 盐城工学院 Electrical assembly system with temperature compensation piece

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