CN210517311U

CN210517311U - Heat dissipation structure of pump source

Info

Publication number: CN210517311U
Application number: CN201922088592.8U
Authority: CN
Inventors: 王均伟; 田善文
Original assignee: Taizhou Huajun Photoelectric Technology Co Ltd
Current assignee: Taizhou Huajun Photoelectric Technology Co Ltd
Priority date: 2019-11-28
Filing date: 2019-11-28
Publication date: 2020-05-12
Anticipated expiration: 2029-11-28

Abstract

The utility model provides a pumping source heat radiation structure, be in including aluminium system base plate and setting aluminium system base plate is last to dispel the heat indium piece, and the pumping source setting is kept away from aluminium system base plate one side at the indium piece that dispels the heat, and pumping source screw connection is in on the aluminium system base plate, just heat dissipation indium piece is compressed tightly by the pumping source on the aluminium system base plate. The radiating indium sheet has the advantages of high heat conductivity coefficient, good heat conduction effect, difficult aging and no need of replacement, can effectively and quickly transmit the heat of the electronic equipment, and ensures the safety and the service life of the electronic equipment.

Description

Heat dissipation structure of pump source

Technical Field

The utility model relates to a laser instrument technical field especially relates to a pumping source heat radiation structure.

Background

And when the pumping source is used, the laser working substance is excited, and the excited particles are pumped from the ground state to a high energy level, so that the population inversion is realized. Different excitation modes and excitation devices can be adopted according to different working substances and different laser operating conditions.

The pump source of the laser generates a large amount of heat during operation, and the heat generated by the pump source heats the optical element inside the laser, so that the temperature of the optical element continuously rises. In order to ensure that the laser can work normally, the pump source needs to be radiated, so that the temperature of each optical element in the laser can be within a normal range.

The existing heat dissipation structure of the pump source comprises an aluminum substrate and heat-conducting silicone grease, wherein the pump source is installed on the aluminum substrate, and the heat-conducting silicone grease is located between the pump source and the aluminum substrate. When the heat pump is used, heat generated by the pump source is transferred to the aluminum substrate through the heat-conducting silicone grease, and the aluminum substrate transfers the heat to the outside air.

However, the heat-conducting silica gel is aged along with the increase of the service life, and the heat-conducting silica gel needs to be replaced regularly in order to ensure that the heat-conducting silica gel can effectively dissipate heat of the pumping source. The heat-conducting silica gel is replaced regularly, so that the laser with the pumping source heat dissipation structure is more complicated to use.

SUMMERY OF THE UTILITY MODEL

In view of this, the present invention provides a pump source heat dissipation structure, which does not need to be replaced periodically, so that the laser with the pump source heat dissipation structure can be used more conveniently.

In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a pump source heat radiation structure, is in including aluminium system base plate and setting aluminium system base plate is last dispel the heat indium piece, and the pump source setting is kept away from aluminium system base plate one side at the indium piece that dispels the heat, and pump source screwed connection is in on the aluminium system base plate, just the indium piece that dispels the heat is compressed tightly by the pump source on the aluminium system base plate.

Through the technical scheme, the physical performance and the chemical performance of the heat dissipation indium sheet are not easy to change in the using process, so that the heat dissipation indium sheet does not need to be replaced regularly, and the laser with the pump source heat dissipation structure is convenient to use. Meanwhile, the heat conductivity coefficient of the heat dissipation indium sheet is higher than that of the heat conduction silica gel, so that the heat generated by the pumping source can be more quickly conducted to the aluminum substrate by the heat dissipation indium sheet, the temperature of an optical element in the laser is not easy to rise, and the laser can be normally used. Meanwhile, the heat dissipation indium sheet is tightly pressed on the aluminum substrate through the pumping source, and compared with a heat conduction silica gel smearing process, the heat dissipation indium sheet is simpler and quicker to install.

Preferably, a through hole for a screw to pass through is arranged on the heat dissipation indium sheet in a penetrating mode, and when the screw passes through the through hole, the outer ring of the screw is abutted against the inner hole wall of the through hole.

Through above-mentioned technical scheme, pass the screw that the pump source compresses tightly to be connected on aluminium system base plate from the through-hole, and the inner hole wall conflict of the outer lane of screw and through-hole. The screw can carry on spacingly to the indium piece that dispels the heat for the indium piece that dispels the heat is difficult for taking place the displacement in the use, and the indium piece that dispels the heat can be with the heat that the pump source produced on the aluminium system base plate of quick transmission.

Preferably, the side wall of the heat dissipation indium sheet adjacent to the pumping source is provided with a heat dissipation groove.

Through the technical scheme, the heat dissipation grooves arranged on the side walls of the heat dissipation indium sheets can increase the contact area between the heat dissipation indium sheets and the outside air, so that partial heat in the heat dissipation indium sheets can be quickly transferred to the outside air, the temperature of the heat dissipation indium sheets is reduced, and the heat dissipation efficiency of the heat dissipation indium sheets is improved.

Preferably, a groove is formed in the position, opposite to the heat dissipation indium plate, of the aluminum substrate, one end of the heat dissipation indium plate is located inside the groove, and the outer wall of the heat dissipation indium plate is abutted to the inner groove wall of the groove.

Through above-mentioned technical scheme, the indium piece inlays to be established inside the recess, and the recess can carry on spacingly to the indium piece that dispels the heat for the indium piece that dispels the heat is difficult for taking place the displacement in the use, and the indium piece that dispels the heat can be with the heat that the pump source produced on the aluminium system base plate of transferring fast.

Preferably, a plurality of standing grooves have been seted up to the interior cell wall department of recess, every the standing groove is inside all to be provided with the spring, just the spring with the standing groove is kept away from the interior cell wall fixed connection of recess, the spring is close to be fixed with spacing ball on the tip of recess, the tip protrusion of spacing ball in the notch of standing groove, seted up on the lateral wall of heat dissipation indium piece with the spacing groove one-to-one, work as the spacing groove with the standing groove is relative, spacing ball stretch into to the spacing inslot portion and with the interior cell wall of spacing groove supports tightly.

Through the technical scheme, when one end of the heat dissipation indium sheet is placed into the groove, and the limiting groove in the side wall of the heat dissipation indium sheet is opposite to the placing groove in the aluminum substrate, the limiting ball enters the limiting groove under the pushing of the spring and is tightly abutted to the inner groove wall of the limiting groove, so that the heat dissipation indium sheet is not easy to break away from the aluminum substrate, and the heat generated by a pumping source can be effectively transferred to the aluminum substrate by the heat dissipation indium sheet.

Preferably, a guide post is arranged inside the placing groove, and the guide post penetrates through the middle of the spring.

Through above-mentioned technical scheme, the guide post that passes from the spring middle part can lead to the flexible direction of spring for the spring is difficult for taking place to deflect to the elasticity direction that spacing ball was applyed.

Preferably, one end of the guide post is fixed on the limiting ball, and the other end of the guide post extends into the aluminum substrate and is connected with the aluminum substrate in a sliding manner.

Through above-mentioned technical scheme, the connection of sliding is inside aluminium system base plate and can play spacing effect of direction to the slip of spacing ball with spacing ball fixed connection's guide post for spacing ball can accurately stretch into the spacing inslot portion.

Drawings

FIG. 1 is a schematic structural diagram of an embodiment, which is mainly used for showing the appearance of the embodiment;

fig. 2 is a schematic sectional view of the embodiment, which is mainly used for showing the components of the embodiment.

Reference numerals: 1. an aluminum substrate; 2. a heat-dissipating indium sheet; 3. a pump source; 4. a through hole; 5. a heat sink; 6. a groove; 7. a placement groove; 8. a spring; 9. a limiting ball; 10. a limiting groove; 11. and a guide post.

Detailed Description

The following detailed description of the embodiments of the present invention is made with reference to the accompanying drawings, so that the technical solution of the present invention can be more easily understood and grasped.

A heat dissipation structure of a pump source, as shown in fig. 1 and 2, includes an aluminum substrate 1 and a heat dissipation indium plate 2 disposed on the aluminum substrate 1.

Set up on aluminium system base plate 1 with the recess 6 of pumping source 3 one-to-one, the notch of recess 6 is the rectangle, has all seted up standing groove 7 on every inner tank wall of recess 6, standing groove 7 is parallel with the tank bottom of recess 6. The inside guide post 11 that is provided with of recess 6, guide post 11 extends along standing groove 7's depth direction, guide post 11 deviates from the tip of recess 6 and stretches into in aluminium system base plate 1 and slide with aluminium system base plate 1 and be connected, guide post 11 is fixed with spacing ball 9 on being close to recess 6's the tip, the cover is equipped with spring 8 on the guide post 11, the one end of spring 8 is fixed with the interior cell wall that recess 6 was kept away from to standing groove 7, spring 8's other end fixed connection is on spacing ball 9, when spring 8 is in balanced state, spacing ball 9 protrusion in standing groove 7's notch.

The number of the heat dissipation indium sheets 2 is the same as that of the grooves 6, one ends of the heat dissipation indium sheets 2 extend into the inner walls of the corresponding grooves 6, and the outer walls of the heat dissipation indium sheets 2 are attached to the inner groove walls of the corresponding grooves 6. The side wall of the indium heat dissipation sheet 2 is provided with a limiting groove 10 corresponding to the placing groove 7 one by one, and when the limiting groove 10 is opposite to the placing groove 7, the limiting ball 9 extends into the limiting groove 10 and is tightly abutted to the inner groove wall of the limiting groove 10. The side wall of the indium heat dissipation sheet 2 is provided with a heat dissipation groove 5, and the heat dissipation groove 5 can increase the surface area of the indium heat dissipation sheet 2, so that part of heat in the indium heat dissipation sheet 2 can be rapidly transferred to the outside air. A plurality of through holes 4 are arranged on the heat dissipation indium sheet 2 in a penetrating way, and the through holes 4 are distributed along the edge of the heat dissipation indium sheet 2.

The pumping source 3 is arranged on one side, away from the aluminum substrate 1, of the heat dissipation indium sheet 2, the pumping source 3 is in screwed connection with the aluminum substrate 1, a screw on the pumping source 3 penetrates through the through hole 4, and the outer ring of the screw is abutted to the inner hole wall of the through hole 4.

Of course, the above is only a typical example of the present invention, and besides, the present invention can also have other various specific embodiments, and all technical solutions adopting equivalent replacement or equivalent transformation are all within the scope of the present invention as claimed.

Claims

1. A pump source heat radiation structure is characterized in that: including aluminium system base plate (1) and setting up heat dissipation indium piece (2) on aluminium system base plate (1), pumping source (3) set up and keep away from aluminium system base plate (1) one side in heat dissipation indium piece (2), pumping source (3) screwed connection is in on aluminium system base plate (1), just heat dissipation indium piece (2) are compressed tightly by pumping source (3) on aluminium system base plate (1).

2. The pump source heat dissipation structure of claim 1, wherein: the heat dissipation indium sheet (2) is provided with a through hole (4) for a screw to pass through, and when the screw passes through the through hole (4), the outer ring of the screw is abutted to the inner hole wall of the through hole (4).

3. The pump source heat dissipation structure of claim 1, wherein: and a heat dissipation groove (5) is formed in the side wall of the heat dissipation indium sheet (2) adjacent to the pumping source (3).

4. The pump source heat dissipation structure of claim 1, wherein: the aluminum substrate (1) and the heat dissipation indium sheet (2) are oppositely provided with a groove (6), one end of the heat dissipation indium sheet (2) is located inside the groove (6), and the outer wall of the heat dissipation indium sheet (2) is abutted to the inner groove wall of the groove (6).

5. The pump source heat dissipation structure of claim 4, wherein: a plurality of standing grooves (7) have been seted up to the interior cell wall department of recess (6), every standing groove (7) inside all is provided with spring (8), just spring (8) with the interior cell wall fixed connection of recess (6) is kept away from in standing groove (7), spring (8) are close to be fixed with spacing ball (9) on the tip of recess (6), the tip protrusion of spacing ball (9) in the notch of standing groove (7), seted up on the lateral wall of heat dissipation indium piece (2) with standing groove (7) relative spacing groove (10) one by one works as spacing groove (10) with standing groove (7) are relative, spacing ball (9) stretch into to spacing groove (10) inside and with the interior cell wall of spacing groove (10) supports tightly.

6. The pump source heat dissipation structure of claim 5, wherein: a guide post (11) is arranged inside the placing groove (7), and the guide post (11) penetrates through the middle of the spring (8).

7. The pump source heat dissipation structure of claim 6, wherein: one end of the guide post (11) is fixed on the limiting ball (9), and the other end of the guide post (11) extends into the aluminum substrate (1) and is connected with the aluminum substrate (1) in a sliding manner.