CN210491167U

CN210491167U - Earphone set

Info

Publication number: CN210491167U
Application number: CN201922120977.8U
Authority: CN
Inventors: 刘佳
Original assignee: Dongguan Yuda Communication Technology Co Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-05-08
Anticipated expiration: 2029-11-29

Abstract

An earphone includes a housing, an active speaker, and a passive radiator. The shell is provided with a sound outlet hole, and the shell is internally provided with an accommodating space. The active speaker is arranged in the accommodating space, and the accommodating space is divided into a first accommodating space and a second accommodating space by the active speaker. The sound outlet hole is communicated with the first accommodating space. The passive radiator is arranged in the second accommodating space and divides the second accommodating space into a first subspace and a second subspace. The first subspace is adjacent to the active loudspeaker compared to the second subspace. The first subspace is formed by at least an active loudspeaker and a passive radiator. The passive radiator is additionally arranged in the second accommodating space, and at least the active loudspeaker and the passive radiator form a closed first subspace. Therefore, the sound waves which are not emitted towards the sound outlet hole in the active loudspeaker can be reused and emitted towards the sound outlet hole again, and the low-frequency effect of the earphone is further improved.

Description

Earphone set

Technical Field

The application belongs to the technical field of electronic products, and particularly relates to an earphone.

Background

In many occasions, users usually choose to wear earphones to listen to sound played in electronic products, and therefore users have higher requirements for the sound quality of the earphones. However, the sound quality of the current earphone is still poor, and especially in the frequency band of lower frequency, the sound quality still cannot meet the requirements of users.

SUMMERY OF THE UTILITY MODEL

In view of this, the present application provides a headset, characterized in that the headset comprises:

the sound outlet hole is formed in the shell, and an accommodating space is formed in the shell;

the active loudspeaker is arranged in the accommodating space, the accommodating space is divided into a first accommodating space and a second accommodating space by the active loudspeaker, and the sound outlet hole is communicated with the first accommodating space; and

the passive radiator is arranged in the second accommodating space and divides the second accommodating space into a first subspace and a second subspace; a first subspace is adjacent to the active speaker compared to the second subspace, the first subspace being formed by at least the active speaker and the passive radiator.

The earphone provided by the application is characterized in that the passive radiator is additionally arranged in the second accommodating space, and the first enclosed sub-space is at least formed by the active loudspeaker and the passive radiator. Therefore, the sound waves which are not emitted towards the sound outlet hole in the active loudspeaker can be reused and emitted towards the sound outlet hole again, and the low-frequency effect of the earphone is further improved.

Drawings

In order to more clearly explain the technical solution in the embodiments of the present application, the drawings that are required to be used in the embodiments of the present application will be described below.

Fig. 1 is a schematic partial structure diagram of an earphone according to a first embodiment of the present application.

Fig. 2 is a schematic partial structure diagram of an earphone according to a second embodiment of the present application.

Fig. 3 is a schematic partial structure diagram of an earphone according to a third embodiment of the present application.

Fig. 4 is a schematic partial structure diagram of an earphone according to a fourth embodiment of the present application.

Fig. 5 is a schematic partial structure diagram of an earphone according to a fifth embodiment of the present application.

Fig. 6 is a schematic partial structure diagram of an earphone according to a sixth embodiment of the present application.

Fig. 7 is a schematic partial structure diagram of an earphone according to a seventh embodiment of the present application.

Fig. 8 is a schematic partial structure diagram of an earphone according to an eighth embodiment of the present application.

Fig. 9 is a schematic partial structure diagram of an earphone according to a ninth embodiment of the present application.

Fig. 10 is a schematic partial structure diagram of an earphone according to a tenth embodiment of the present application.

Fig. 11 is a schematic partial structure diagram of an earphone according to an eleventh embodiment of the present application.

Description of the drawings:

the earphone comprises an earphone-1, a shell-10, a sound outlet-11, a containing space-12, a first containing space-13, a second containing space-14, a first subspace-141, a second subspace-142, a baffle-15, a first sub-shell-16, a first step part-161, a second sub-shell-17, a second step part-171, an active loudspeaker-20, a passive radiator-30, a vibrating part-31, a connecting part-32, a skirt edge-33, a folded ring part-34, a folded ring-341, a weight increasing part-35, a through hole-36, a dustproof net-40, a sound adjusting hole-41, a processor-50, a wire-60, a sealing part-70 and a channel-80.

Detailed Description

The following is a preferred embodiment of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Referring to fig. 1, fig. 1 is a schematic partial structure diagram of an earphone according to a first embodiment of the present application. In the present embodiment, the earphone 1 includes a housing 10, an active speaker 20, and a passive radiator 30. The casing 10 is provided with a sound outlet 11, and the casing 10 is provided with an accommodating space 12 therein. The active speaker 20 is disposed in the accommodating space 12, and the active speaker 20 divides the accommodating space 12 into a first accommodating space 13 and a second accommodating space 14. The sound outlet hole 11 communicates with the first receiving space 13. The passive radiator 30 is disposed in the second accommodating space 14, and the passive radiator 30 divides the second accommodating space 14 into a first subspace 141 and a second subspace 142. The first subspace 141 is adjacent to the active loudspeaker 20 compared to the second subspace 142. The first subspace 141 is formed by at least the active speaker 20 and the passive radiator 30.

The headset 1 provided in the present application may be understood as a headset 1 that is currently available to users on the market, such as a neck headset, a TWS headset, a wired headset, a wireless headset (bluetooth headset), etc. The above-described headset 1 should be within the scope of the present application. Optionally, the application is illustrated with a wired headset.

The active speaker 20, which may be understood as a horn, is typically comprised of a cone, a voice coil, and a driver magnet. Active speaker 20 typically needs to be electrically connected to processor 50, and processor 50 sends an audio signal to active speaker 20, and active speaker 20 generates a sound based on the received audio signal. In addition, the active speaker 20 is disposed in the accommodating space 12 and divides the accommodating space 12 into a first accommodating space 13 and a second accommodating space 14, the first accommodating space 13 is communicated with the sound outlet hole 11, that is, the sound emitted from the active speaker 20 is emitted from the sound outlet hole 11 for the user to listen. And the second receiving space 14 is used for mounting other components. Optionally, the present application adds the baffle 15 to the housing 10 and connects with the active speaker 20 to reduce the volume of the first receiving space 13, so that the sound can be emitted from the sound emitting hole 11 more intensively, and the sound quality of the earphone 1 is improved.

However, in the related art, the active speaker 20 emits sound waves all around to form sound, but generally only the sound waves emitted toward the sound emitting hole 11 are received by the user, while the sound waves emitted toward other directions are wasted and cannot be received by the user, which results in the sound quality of the earphone 1 being degraded, especially in the lower frequency band. Therefore, the passive radiator 30 is added to the second housing space 14. The passive radiator 30, also called a passive speaker, is usually formed by only one cone. The passive radiator 30 cannot receive an electric signal and cannot actively generate sound, and it must receive another sound wave and generate sound by using the other sound wave. The passive radiator 30 is disposed in the second accommodating space 14, and the passive radiator 30 divides the second accommodating space 14 into a first sub-space 141 and a second sub-space 142. The first subspace 141 is adjacent to the active speaker 20 compared to the second subspace 142. The active speaker 20, the passive radiator 30 and the housing 10 form a closed first subspace 141. Thus, when active speaker 20 generates sound, it compresses air in all directions to generate sound waves. The sound waves emitted toward the sound emitting hole 11 can be directly listened by the user, and the sound waves emitted toward the direction away from the sound emitting hole 11 can further drive the passive radiator 30 to vibrate in the sealed first subspace 141, so that the sound waves emitted toward the sound emitting hole 11 can be formed for the user to listen. The superposition of the two sound waves can effectively improve the sound quality of the earphone 1, especially at low frequencies. In addition, the passive radiator 30 can also be used to eliminate the disturbance of the air flow in the accommodating space 12 and alleviate the problem of compressing the stroke of the speaker unit caused by the high-speed movement of the air flow when the technical solution of the related art is added with an inverter tube.

In addition, the first subspace 141 is formed by at least the active speaker 20 and the passive radiator 30. The first subspace 141 may be formed in various manners. For example, referring to fig. 1, the first subspace 141 is formed by only the active speaker 20 and the passive radiator 30. Specifically, the passive radiator 30 is disposed on the active speaker 20 by a cover to form a closed first subspace 141.

Alternatively, please refer to fig. 2 together, and fig. 2 is a schematic partial structure diagram of an earphone according to a second embodiment of the present application. The structure of the earphone 1 according to the second embodiment of the present invention is substantially the same as the structure of the earphone 1 according to the first embodiment of the present invention, and in this embodiment, at least some or all of the following differences are included, and the first subspace 141 is formed by the active speaker 20, the passive radiator 30, and the housing 10; the active speaker 20 and the passive radiator 30 are connected to the housing 10, respectively.

In another implementation of the present application, the first subspace 141 is formed by the active speaker 20, the passive radiator 30 and the enclosure 10. Specifically, the active speaker 20 is connected to the housing 10, and the passive radiator 30 is also connected to the housing 10, so that the active speaker 20, the passive radiator 30 and the housing 10 can enclose a first enclosed sub-space 141. In addition, the size of the volume of the first subspace can be increased through the method, so that the sound output effect is improved, and the quality of the earphone is improved.

Alternatively, the passive radiator 30 has elasticity, and for example, the passive radiator 30 may be made of rubber. Further alternatively, passive radiator 30 may be disposed at an angle to active speaker 20 to reduce assembly difficulties. Alternatively, the passive radiator 30 may be disposed in parallel with the active speaker 20, so that the sound waves are better emitted toward the sound emitting hole 11, thereby further improving the sound quality of the headset 1.

Referring to fig. 3, fig. 3 is a schematic partial structure diagram of an earphone according to a third embodiment of the present application. The structure of the earphone 1 provided in the third embodiment of the present application is substantially the same as the structure of the earphone 1 provided in the first embodiment of the present application, and in this embodiment, at least the following differences are included, and the housing 10 includes a first sub-housing 16 and a second sub-housing 17, the first sub-housing 16 is provided with a first step portion 161, and the second sub-housing 17 is provided with a second step portion 171. The first step 161 and the second step 171 cooperate with each other to connect the first sub-housing 16 to the second sub-housing 17.

The shell 10 can be provided as a split structure, that is, the shell 10 includes the first sub-shell 16 and the second sub-shell 17, so that the installation and the detachment of the shell 10 can be facilitated, and the installation and the detachment of the shell 10 can be realized through the mutual matching of the first sub-shell 16 and the second sub-shell 17. Optionally, the first sub-housing 16 is provided with a first step portion 161, the second sub-housing 17 is provided with a second step portion 171, and the first step portion 161 connects the second step portion 171 to connect the first sub-housing 16 with the second sub-housing 17. Further alternatively, the first step portion 161 and the second step portion 171 have magnetism, so that the first step portion 161 and the second step portion 171 can be connected together by magnetic connection. Alternatively, the first step portion 161 and the second step portion 171 can be connected together by a snap connection, that is, the first step portion 161 has a certain protrusion, and the second step portion 171 has a certain groove, so as to realize the snap connection.

Referring to fig. 4, fig. 4 is a schematic partial structure diagram of an earphone according to a fourth embodiment of the present application. The structure of the earphone 1 according to the fourth embodiment of the present invention is substantially the same as the structure of the earphone 1 according to the third embodiment of the present invention, and in the present embodiment, at least the following differences are included, the passive radiator 30 includes a vibration portion 31 and a connection portion 32, the connection portion 32 connects the periphery of the vibration portion 31, and the connection portion 32 is interposed between the first step portion 161 and the second step portion 171.

The passive radiator 30 of the present application may include a vibration portion 31 and a connection portion 32, wherein the vibration portion 31 is configured to receive compressed air emitted from the active speaker 20 and directed to the first sealed sub-space 141, so that the vibration portion 31 repeatedly vibrates and emits sound waves again in the direction of the sound emission hole 11. And the connection part 32 serves to connect the passive radiator 30 to the housing 10 to form the enclosed first subspace 141. In the present embodiment, the connection portion 32 may be interposed between the first stepped portion 161 and the second stepped portion 171. This allows the connection portion 32 to be fixed when the first sub-housing 16 and the second sub-housing 17 are assembled, thereby further improving the stability of the passive radiator 30. Alternatively, the connecting portion 32 may be used to receive compressed air to generate a suitable amount of vibration, i.e., the connecting portion 32 is mainly used for connection, but the connecting portion 32 may also vibrate to generate sound. The vibration part 31 is used for vibration sound production. Alternatively, in a specific assembling process, the connecting portion 32 may be adhered to the step surface of the first step portion 161 or the second step portion 171 by glue, and then the first sub-housing 16 and the second sub-housing 17 may be fixedly mounted.

Referring to fig. 5, fig. 5 is a schematic partial structure diagram of an earphone according to a fifth embodiment of the present application. The structure of the earphone 1 according to the fifth embodiment of the present invention is substantially the same as the structure of the earphone 1 according to the fourth embodiment of the present invention, and in this embodiment, at least some or all of the following differences are included, the passive radiator 30 further includes a skirt 33, and the skirt 33 is protruded at one side or two opposite sides of the connecting portion 32.

The present application may also provide a skirt 33 on one or both of the opposite surfaces of the connecting portion 32. This embodiment is illustrated by providing skirts 33 on the surfaces of the opposite sides of the connecting portion 32. Here, the one side or the two opposite sides of the connecting portion 32 refers to the side of the connecting portion 32 close to the first step portion 161 and the second step portion 171, that is, one end of the skirt 33 connects to the connecting portion 32, and the other end connects to the first step portion 161 or the second step portion 171. In addition, the skirt 33 can be understood as a plurality of folding rings 341 convexly provided on the surface of the connecting portion 32, and the skirt 33 also has elasticity. Thus, after the connecting portion 32, the first sub-housing 16 and the second sub-housing 17 are assembled, the skirt 33 deforms under the action of pressure, so as to fill up the gap on the surface of the first sub-housing 16 or the second sub-housing 17, thereby effectively improving the sealing performance and the fixing connection performance of the housing 10, and improving the sound quality of the earphone 1. Alternatively, the passive radiator 30 is of an integrated structure, that is, the skirt 33, the connecting portion 32 and the vibrating portion 31 are prepared through one process. Alternatively the skirt 33 may be circular, arcuate, triangular, quadrilateral, etc.

Referring to fig. 6, fig. 6 is a schematic partial structure diagram of an earphone according to a sixth embodiment of the present application. The structure of the earphone 1 provided by the sixth embodiment of the present application is substantially the same as the structure of the earphone 1 provided by the third or fifth embodiment of the present application, and in the present embodiment, at least the following differences are included, where the passive radiator 30 includes a vibration portion 31 and a folded loop portion 34, one end of the folded loop portion 34 is connected to the vibration portion 31, and the other end of the folded loop portion 34 is connected to the housing 10; the hinge part 34 includes at least one hinge 341.

The passive radiator 30 of the present application may include a vibration portion 31 and a corrugated portion 34, wherein the vibration portion 31 is configured to receive compressed air emitted from the active speaker 20 and directed to the first sealed sub-space 141, so that the vibration portion 31 repeatedly vibrates, and then emits sound waves toward the sound emission hole 11 again. And the corrugated portion 34 is an auxiliary structure for forming a protrusion by bending. The folded ring part 34 can be used to connect the passive radiator 30, that is, one end of the folded ring part 34 is connected to the vibration part 31, and the other end of the folded ring part 34 is connected to the housing 10, so as to fixedly connect the passive radiator 30 to the housing 10. Secondly, the folded ring part 34 can also be used to further improve the vibration effect of the vibration part 31, and since the folded ring part 34 is already in the folded state, the vibration part 31 is more easily vibrated when being vibrated by the compressed air.

Optionally, to further enhance the vibration effect, the corrugated portion 34 includes at least one corrugated ring 341. The greater the number of the corrugated rim 341, the more advantageous the vibration portion 31 vibrates. Alternatively, the shape of the corrugated rim 341 may be circular, arc-shaped, triangular, quadrangular, or the like. Alternatively, the corrugated rim 341 may be convex toward the first subspace 141, may be convex toward the second subspace 142, or may be convex alternately toward different directions. Alternatively, the passive radiator 30 may be a one-piece structure, that is, the vibration portion 31 and the bending ring portion 34 are directly prepared through a single process. In the present embodiment, the corrugated portion 34 includes two corrugated rings 341, and the corrugated rings 341 are protruded toward the second subspace 142, so that the volume of the first subspace 141 can be increased, and the sound quality of the earphone 1 can be further improved.

Please refer to fig. 7 and 8 together, fig. 7 is a partial schematic structural diagram of an earphone according to a seventh embodiment of the present application. Fig. 8 is a schematic partial structure diagram of an earphone according to an eighth embodiment of the present application. The structure of the earphone 1 according to the seventh and eighth embodiments of the present invention is substantially the same as the earphone 1 according to the first embodiment of the present invention, and the sixth and seventh embodiments include at least some or all of the following differences: the earphone 1 further includes a weight increasing portion 35, wherein the weight increasing portion 35 is disposed on a side of the passive radiator 30 close to the second subspace 142, or the weight increasing portion 35 is disposed in the passive radiator 30.

The present application can provide the weight increasing portion 35 on the passive radiator 30. Wherein the weight increasing part 35 serves to increase the weight of the passive radiator 30. As the weight of the passive radiator 30 is larger, the swing amplitude of the passive radiator 30 is larger when being impacted by the compressed air, so that the sound quality of the earphone 1 can be further improved. The weight increasing portion 35 may be provided in various manners, for example, the weight increasing portion 35 may be provided in the passive radiator 30 (as shown in fig. 6) by a soft bag, so as to improve the aesthetic performance of the earphone 1. Alternatively, the weight increasing part 35 may be directly provided at one side of the passive radiator 30, which may reduce the difficulty of assembling the headset 1. When the weight increasing part 35 is provided at one side of the passive radiator 30, the weight increasing part 35 may be provided in the first subspace 141 or in the second subspace 142. Alternatively, the weight increasing part 35 is disposed in the second subspace 142, that is, the weight increasing part 35 is disposed on the side of the passive radiator 30 close to the second subspace 142 (as shown in fig. 7), so that the volume of the first subspace 141 is not reduced, and thus the sound quality of the earphone 1 is not reduced. Optionally, the weight increasing portion 35 is made of metal or rubber.

Referring to fig. 9, fig. 9 is a schematic partial structure diagram of an earphone according to a ninth embodiment of the present application. The structure of the earphone 1 according to the ninth embodiment of the present invention is substantially the same as the structure of the earphone 1 according to the first embodiment of the present invention, and the present embodiment includes at least the following differences in part or all: the earphone 1 further comprises a dust screen 40, the dust screen 40 is arranged on the casing 10, a tuning hole 41 is formed in the casing 10 close to the second subspace 142, and the dust screen 40 covers the tuning hole 41.

The sound adjusting hole 41 can be formed in the casing 10 close to the second subspace 142, so that the sound adjusting hole 41 is communicated with the second subspace 142, and thus the second subspace 142 is communicated with the atmosphere, and the air pressure of the second subspace 142 is always the same as the external atmospheric pressure, and as can be seen from the above, the air pressure of the first subspace 141 can be changed along with the sound wave emitted by the active speaker 20, so that the pressure difference can be generated at the two ends of the passive radiator 30, and the passive radiator 30 can generate resonance along with the frequency of the active speaker 20, and can generate passive sound, and further the low-frequency effect of the earphone 1 is improved. In addition, this application sets up dust screen 40 on casing 10 to make dust screen 40 cover accent hole 41, can further reduce the size of accent hole 41 under the prerequisite of guaranteeing second subspace 142 and atmosphere intercommunication like this, thereby prevent that dust or other impurity from getting into the inside earphone 1 of polluting of earphone 1. Alternatively, the dust screen 40 is disposed closer to the passive radiator 30 than the case 10, that is, the dust screen 40 is disposed on the inner sidewall of the case 10, thereby increasing the aesthetic appearance of the headset 1.

Please refer to fig. 10 and fig. 11 together, and fig. 10 is a partial schematic structural diagram of an earphone according to a tenth embodiment of the present application. Fig. 11 is a schematic partial structure diagram of an earphone according to an eleventh embodiment of the present application. The structure of the earphone 1 according to the tenth and eleventh embodiments of the present invention is substantially the same as the structure of the earphone 1 according to the first embodiment of the present invention, and in this embodiment, at least some or all of the following differences are included, the earphone 1 further includes a processor 50 and a wire 60, the passive radiator 30 is provided with a through hole 36, and the wire 60 passes through the through hole 36 to electrically connect the processor 50 and the active speaker 20. Alternatively, the housing 10 is provided with a passage 80, and the lead 60 passes through the passage 80 to electrically connect the processor 50 and the active speaker 20.

In the present application, the processor 50 is connected to the active speaker 20 through a wire 60, so that the audio signal of the processor 50 is transmitted to the active speaker 20. However, the wire 60 can be simply connected to the active speaker 20 because the passive radiator 30 does not exist in the prior art, but in the present application, the wire 60 cannot bypass the passive radiator 30 to reach the enclosed first subspace 141 to be connected to the active speaker 20 because the passive radiator 30 divides the second receiving space 14 into the second subspace 142 and the enclosed first subspace 141. Therefore, in one embodiment of the present application, as shown in fig. 10, a through hole 36 is formed in the passive radiator 30 to allow the lead wire 60 to pass through the passive radiator 30 to be connected to the active speaker 20. Alternatively, the diameter of the wire 60 is the same as the aperture size of the through hole 36, so that the through hole 36 can be completely blocked by the wire 60, thereby forming the closed first subspace 141. Or when the diameter of the through hole 36 is larger than the diameter of the lead 60, the present application may also completely seal the through hole 36 by disposing the sealing portion 70 in the through hole 36 to fill up the excess gap, so as to form a sealed first sub-space 141 (as shown in fig. 9).

In another embodiment of the present application, as shown in fig. 11, a channel 80 may be further disposed at a corresponding position of the housing 10, so that the lead 60 is connected to the active speaker 20 through the channel 80, and a corresponding sealing process is performed, so as to prevent the lead 60 from contacting the passive radiator 30 to affect its vibration effect.

The foregoing detailed description has provided for the embodiments of the present application, and the principles and embodiments of the present application have been presented herein for purposes of illustration and description only and to facilitate understanding of the methods and their core concepts; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An earphone, characterized in that the earphone comprises:

2. The headset of claim 1, wherein the first subspace is comprised of the active speaker, the passive radiator, and the housing; the active loudspeaker and the passive radiator are respectively connected with the shell.

3. The headset of claim 1, wherein the housing comprises a first sub-housing and a second sub-housing, the first sub-housing having a first step, the second sub-housing having a second step, the first step and the second step cooperating such that the first sub-housing connects the second sub-housing.

4. The earphone according to claim 3, wherein the passive radiator includes a vibrating portion and a connecting portion, the connecting portion connects a periphery of the vibrating portion, and the connecting portion is interposed between the first stepped portion and the second stepped portion.

5. The headset of claim 4, wherein the passive radiator further comprises a skirt protruding from one side or opposite sides of the connecting portion.

6. The earphone according to claim 2 or 5, wherein the passive radiator comprises a vibration part and a folded ring part, one end of the folded ring part is connected with the vibration part, and the other end of the folded ring part is connected with the casing; the edge portion includes at least one edge.

7. The earphone according to claim 1, further comprising a weight increasing portion provided at a side of the passive radiator close to the second subspace, or provided inside the passive radiator.

8. The headset of claim 1, wherein the passive radiator is disposed parallel to the active speaker.

9. The earphone according to claim 1, further comprising a dust screen, wherein the dust screen is disposed on the housing, a tuning hole is formed on the housing near the second subspace, and the dust screen covers the tuning hole.

10. The headset of claim 1, further comprising a processor and a wire, wherein the passive radiator has a through hole formed therein, and wherein the wire passes through the through hole to electrically connect the processor to the active speaker;

or, a channel is arranged on the shell, and the lead passes through the channel to electrically connect the processor and the active loudspeaker.