CN210491014U - Camera module - Google Patents
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- CN210491014U CN210491014U CN201921813855.0U CN201921813855U CN210491014U CN 210491014 U CN210491014 U CN 210491014U CN 201921813855 U CN201921813855 U CN 201921813855U CN 210491014 U CN210491014 U CN 210491014U
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Abstract
The utility model provides a camera module, including TOF laser emission subassembly and circuit substrate, TOF laser emission subassembly includes light source and support frame, the light source sets up on the support frame, the support frame sets up on circuit substrate, the support frame includes conductive circuit, a plurality of first conductive pin and the conductive pin of second, conductive circuit sets up in the lateral wall of support frame, one side that is close to the light source is located to first conductive pin, one side that is close to circuit substrate is located to the conductive pin of second, conductive circuit connects between first conductive pin and the conductive pin of second, light source and first conductive pin electric connection, circuit substrate and the conductive pin electric connection of second. The utility model discloses a camera module can improve the equipment precision and the heat-sinking capability of module.
Description
Technical Field
The utility model relates to an imaging device technical field especially relates to a camera module.
Background
Tof (time of flight) is to transmit continuous infrared light pulses with a specific wavelength to a target, receive optical signals returned by an object to be measured through a specific sensor, and calculate the time of flight or phase difference of light back and forth to obtain 3D depth information of the object to be measured.
At present, along with electronic equipment's popularization, the camera becomes most electronic equipment's essential subassembly, and 3D-TOF camera module (the camera of measuring the interval) has appeared, it belongs to infrared 3D camera module, because infrared 3D camera module needs transmitting laser, can produce the heat at the in-process that uses, need carry out the heat dissipation processing to it, and need increase a circuit substrate and supply infrared light source circular telegram, this circuit substrate fixes on the lens support through the mode of gluing, in order to promote infrared 3D camera module's whole aesthetic feeling, need reduce the difference in height between camera lens and the infrared light source, camera lens and infrared light source need the parallel and level to set up promptly. But the existing 3D-TOF camera module has the problems of poor heat dissipation capability, difficulty in ensuring the assembly precision between the lens and the infrared light source and the like.
The foregoing description is provided for general background information and is not admitted to be prior art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a camera module can improve the equipment precision and the heat-sinking capability of module.
The utility model provides a camera module, including TOF laser emission subassembly and circuit substrate, TOF laser emission subassembly includes light source and support frame, the light source sets up on the support frame, the support frame sets up on circuit substrate, the support frame includes conductive circuit, a plurality of first conductive pin and the conductive pin of second, conductive circuit sets up in the lateral wall of support frame, one side that is close to the light source is located to first conductive pin, one side that is close to circuit substrate is located to the conductive pin of second, conductive circuit connects between first conductive pin and the conductive pin of second, light source and first conductive pin electric connection, circuit substrate and the conductive pin electric connection of second.
Further, the material of the support frame is a heat dissipation material.
Furthermore, the support frame further comprises a bearing plate and at least two supporting blocks, the bearing plate is connected between the two supporting blocks, the light source is arranged on the bearing plate, the conductive circuit is arranged in the bearing plate and the supporting blocks, the supporting blocks are arranged on the circuit substrate, the first conductive pins are arranged on the bearing plate, and the second conductive pins are arranged on the supporting blocks.
Furthermore, a third conductive pin is arranged on the light source and electrically connected with the first conductive pin, and a fourth conductive pin is arranged on the circuit substrate and electrically connected with the second conductive pin.
Furthermore, the support frame is a quadrangular frustum pyramid, the quadrangular frustum pyramid comprises a bearing surface, a mounting surface and a heat dissipation cavity, the bearing surface is opposite to the mounting surface, the heat dissipation cavity is arranged on the mounting surface, the light source is arranged on the bearing surface, the conductive circuit is arranged in the side wall of the quadrangular frustum pyramid, the first conductive pins are arranged on the bearing surface, the second conductive pins are arranged on the mounting surface, and the mounting surface is opposite to the circuit substrate.
Furthermore, a third conductive pin is arranged on the light source and electrically connected with the first conductive pin, and a fourth conductive pin is arranged on the circuit substrate and electrically connected with the second conductive pin.
Furthermore, the support frame is a cylinder, the cylinder comprises a first end face, a second end face and a heat dissipation cavity, the heat dissipation cavity is arranged on the second end face, the light source is arranged on the first end face, the conductive circuit is arranged in the side wall of the cylinder, the first conductive pin is arranged on the first end face, the second conductive pin is arranged on the second end face, and the second end face is opposite to the circuit substrate.
Furthermore, a third conductive pin is arranged on the light source and electrically connected with the first conductive pin, and a fourth conductive pin is arranged on the circuit substrate and electrically connected with the second conductive pin.
Furthermore, the TOF laser emission assembly further comprises a driving chip used for driving the light source, the driving chip is arranged on the supporting frame, a fifth conductive pin is arranged on the driving chip, and the fifth conductive pin is electrically connected with a part of the first conductive pins.
Further, the camera module further comprises a lens, a lens support and a photosensitive chip, the lens is arranged on the lens support, the lens support and the photosensitive chip are both arranged on the circuit substrate, the lens support is located on one side of the support frame, and the photosensitive chip is located below the lens support and electrically connected with the circuit substrate.
The camera module of the utility model locates the conductive circuit in the side wall of the supporting frame, and the supporting frame is electrically connected with the circuit substrate through the conductive pin, so that the power-on between the supporting frame and the circuit substrate is realized, and when the supporting frame is assembled, the procedures of bending, dispensing and the like are omitted, the assembling precision is improved, and the elements of the camera module are saved; the light source, the driving chip and the like are directly and electrically connected with the supporting frame, and the supporting frame is directly and electrically connected with the circuit substrate, so that the power consumption is reduced; the support frame is made by heat dissipation material, and the heat-sinking capability improves, does benefit to TOF laser emission subassembly's heat dissipation.
Drawings
Fig. 1 is a schematic structural view of a camera module according to a first embodiment of the present invention.
Fig. 2 is a front view of the supporting frame according to the first embodiment of the present invention.
Fig. 3 is a schematic structural view of fig. 2 from another view angle.
Fig. 4 is an enlarged schematic view of a portion a in fig. 1.
Fig. 5 is an enlarged schematic view of a portion B in fig. 1.
Fig. 6 is an enlarged schematic view of the structure at C in fig. 1.
Fig. 7 is a schematic structural view of a support frame according to a second embodiment of the present invention.
Fig. 8 is a schematic structural view of fig. 7 from another view angle.
Fig. 9 is a schematic structural view of a support frame according to a third embodiment of the present invention.
Fig. 10 is a schematic structural view of fig. 9 from another angle.
Fig. 11 is a schematic cross-sectional view taken at a-a in fig. 9.
Fig. 12 is a schematic structural view of a support frame according to a fourth embodiment of the present invention.
Fig. 13 is a schematic cross-sectional view of a support frame according to a fourth embodiment of the present invention.
Detailed Description
The following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings and examples. The following examples are intended to illustrate the invention, but are not intended to limit the scope of the invention.
First embodiment
Fig. 1 is a schematic structural view of a camera module according to a first embodiment of the present invention. As shown in fig. 1, the camera module 10 includes a lens 12, a lens holder 13, a light sensing chip 14, a circuit substrate 15 and a TOF laser emitting assembly 16, the lens 12 is disposed on the lens holder 13, the lens holder 13 and the light sensing chip 14 are both disposed on the circuit substrate 15, the light sensing chip 14 is disposed below the lens holder 13 and electrically connected to the circuit substrate 15, the TOF laser emitting assembly 16 is disposed on the circuit substrate 15 and disposed on one side of the lens holder 13, and the TOF laser emitting assembly 16 is electrically connected to the circuit substrate 15.
Specifically, the TOF laser emitting assembly 16 includes a support frame 161a, a light source 162 and a driving chip 163 for driving the light source 162, the light source 162 and the driving chip 163 are both disposed on the support frame 161a and are electrically connected to the support frame 161a, the light source 162 is disposed on one side of the driving chip 163, the support frame 161a is disposed on the circuit substrate 15 and is disposed on one side of the lens holder 13, and the support frame 161a is electrically connected to the circuit substrate 15.
Fig. 2 is a front view of the supporting frame according to the first embodiment of the present invention. Fig. 3 is a schematic structural view of fig. 2 from another view angle. As shown in fig. 1 to 3, the supporting frame 161a includes a loading plate 1611, two supporting blocks 1612, a conductive circuit 1613, a plurality of first conductive pins 1614, and a plurality of second conductive pins 1615. The loading plate 1611 is connected between the two support blocks 1612, and specifically, an edge of the loading plate 1611 is connected to an edge of the support blocks 1612, the loading plate 1611 and the support blocks 1612 form a "C" type structure, and the "C" type structure is favorable for heat dissipation. The first conductive pin 1614 is disposed on the loading board 1611, and the second conductive pin 1615 is disposed on the supporting block 1612, specifically, the first conductive pin 1614 is disposed on one side of the loading board 1611 close to the light source 162, and the second conductive pin 1615 is disposed on one side of the supporting block 1612 close to the circuit substrate 15. The conductive circuit 1613 is disposed within the carrier plate 1611 and the support block 1612 and is connected between the first conductive pin 1614 and the second conductive pin 1615, the light source 162 is disposed on the carrier plate 1611, and the support block 1612 is disposed on the circuit substrate 15. In the present embodiment, the supporting frame 161a is made of a heat dissipating material, specifically, a ceramic material, but not limited thereto, for example, the material may also be aluminum oxide, aluminum nitride, etc.; the conductive circuit 1613 is disposed within the carrier plate 1611 and the support block 1612 by an integral molding process.
Fig. 4 is an enlarged schematic view of a portion a in fig. 1. Fig. 5 is an enlarged schematic view of a portion B in fig. 1. Fig. 6 is an enlarged schematic view of the structure at C in fig. 1. As shown in fig. 1, 4 and 6, the light source 162 is provided with a third conductive pin 1621, the circuit substrate 15 is provided with a fourth conductive pin 151, the driving chip 163 is provided with a fifth conductive pin 1631, the third conductive pin 1621 is electrically connected to a portion of the first conductive pins 1614, the fourth conductive pin 151 is electrically connected to the second conductive pins 1615, and the fifth conductive pin 1631 is electrically connected to another portion of the first conductive pins 1614. The third conductive pin 1621 and the first conductive pin 1614, the fourth conductive pin 151 and the second conductive pin 1615, and the fifth conductive pin 1631 and the first conductive pin 1614 may be connected by an SMT process, but not limited thereto, for example, the third conductive pin 1621 and the first conductive pin 1614, the fourth conductive pin 151 and the second conductive pin 1615, and the fifth conductive pin 1631 and the first conductive pin 1614 may also be connected by a silver paste dispensing process. When the third conductive pin 1621 is connected to the first conductive pin 1614, the fourth conductive pin 151 is connected to the second conductive pin 1615, and the fifth conductive pin 1631 is connected to the first conductive pin 1614 by an SMT process, the first conductive pin 1614, the second conductive pin 1615, the third conductive pin 1621, the fourth conductive pin 151, and the fifth conductive pin 1631 are pads. In the present embodiment, the specific number and shape of the first conductive lead 1614, the second conductive lead 1615, the third conductive lead 1621, the fourth conductive lead 151, and the fifth conductive lead 1631 may be freely selected according to practical situations.
The camera module 10 of the present invention has the conductive circuit 1613 disposed in the loading plate 1611 and the supporting block 1612, and the supporting frame 161a is electrically connected to the circuit board 15 via the conductive pins, so that the supporting frame 161a is electrically connected to the circuit board 15, and when the supporting frame 161a is assembled, the processes of bending, dispensing, etc. are omitted, the assembly accuracy is improved, and the components of the camera module 10 are saved; the light source 162, the driving chip 163 and the like are directly electrically connected with the supporting frame 161a, and the supporting frame 161a is directly electrically connected with the circuit substrate 15, so that the power consumption is reduced; the support frame 161a is made of a heat dissipation material, and the heat dissipation capability is improved, which is favorable for heat dissipation of the TOF laser emitting assembly 16.
Second embodiment
Fig. 7 is a schematic structural view of a support frame according to a second embodiment of the present invention. Fig. 8 is a schematic structural view of fig. 7 from another view angle. As shown in fig. 7 and 8, the supporting frame 161b of the present embodiment has substantially the same structure as the supporting frame 161a of the first embodiment, except that four supporting blocks 1612 are provided.
Specifically, the supporting blocks 1612 are distributed around the loading plate 1611, the edge of the loading plate 1611 is connected with the edge of the supporting block 1612, two adjacent supporting blocks 1612 are connected with each other, the loading plate 1611 and the supporting blocks 1612 enclose a half-closed space, so that the supporting frame 161b is substantially in a box shape, heat dissipation is facilitated, one or more supporting blocks 1612 can be optionally selected for the second conductive pins 1615, and preferably, the second conductive pins 1615 are arranged on the two opposite supporting blocks 1612. In other embodiments, two adjacent support blocks 1612 are spaced apart from each other, that is, a gap exists between two adjacent support blocks 1612, and the gap facilitates air flow and heat dissipation.
Third embodiment
Fig. 9 is a schematic structural view of a support frame according to a third embodiment of the present invention. Fig. 10 is a schematic structural view of fig. 9 from another angle. Fig. 11 is a schematic cross-sectional view taken at a-a in fig. 9. As shown in fig. 9 to 11, the structure of the supporting frame 161c of the present embodiment is substantially the same as that of the supporting frame 161b of the second embodiment, except that the supporting frame 161c of the present embodiment is a quadrangular frustum pyramid.
Specifically, the square prism table includes a carrying surface 1616c, a mounting surface 1617c and a heat dissipation cavity 1618, the carrying surface 1616c is opposite to the mounting surface 1617c, the heat dissipation cavity 1618 is disposed on the mounting surface 1617c, the light source 162 is disposed on the carrying surface 1616c, the conductive circuit 1613 is disposed in a sidewall of the square prism table, the first conductive pin 1614 is disposed on the carrying surface 1616c, the second conductive pin 1615 is disposed on the mounting surface 1617c, the mounting surface 1617c is opposite to the circuit substrate 15, the third conductive pin 1621 on the light source 162 is electrically connected to a portion of the first conductive pins 1614, the fourth conductive pin 151 on the circuit substrate 15 is electrically connected to the second conductive pin 1615, and the fifth conductive pin 1631 on the driver chip 163 is electrically connected to another portion of the first conductive pins 1614.
Fourth embodiment
Fig. 12 is a schematic structural view of a support frame according to a fourth embodiment of the present invention. Fig. 13 is a schematic cross-sectional view of a support frame according to a fourth embodiment of the present invention. As shown in fig. 12 and 13, a structure of a support 161d of the present embodiment is substantially the same as that of a support 161c of the third embodiment, except that the support 161d of the present embodiment is a cylinder.
Specifically, the cylinder includes a first end surface 1616d, a second end surface 1617d and a heat dissipation cavity 1618, the heat dissipation cavity 1618 is disposed on the second end surface 1617d, the light source 162 is disposed on the first end surface 1616d, the conductive circuit 1613 is disposed in a sidewall of the cylinder, the first conductive pin 1614 is disposed on the first end surface 1616d, the second conductive pin 1615 is disposed on the second end surface 1617d, the second end surface 1617d faces the circuit substrate 15, the third conductive pin 1621 on the light source 162 is electrically connected to a portion of the first conductive pins 1614, the fourth conductive pin 151 on the circuit substrate 15 is electrically connected to the second conductive pin 1615, and the fifth conductive pin 1631 on the driver chip 163 is electrically connected to another portion of the first conductive pins 1614.
The utility model discloses a camera module 10 locates conductive circuit 1613 in the lateral wall of support frame 161a, 161b, 161c, 161d, through electrically conductive pin electric connection between support frame 161a, 161b, 161c, 161d and the circuit substrate 15, realize the circular telegram between messenger's support frame 161a, 161b, 161c, 161d and the circuit substrate 15, when assembling support frame 161a, 161b, 161c, 161d, saved processes such as buckling, some glue, improved the equipment precision, and saved the component of camera module 10; the light source 162 and the driving chip 163 are directly electrically connected to the supporting frames 161a, 161b, 161c and 161d, and the supporting frames 161a, 161b, 161c and 161d are directly electrically connected to the circuit substrate 15, so that power consumption is reduced; the support frames 161a, 161b, 161c, 161d are made of a heat dissipation material, so that the heat dissipation capability is improved, and the heat dissipation of the TOF laser emitting assembly 16 is facilitated.
In this document, the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", "vertical", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the sake of clarity and convenience of description of the technical solutions, and thus, should not be construed as limiting the present invention.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. The utility model provides a camera module, includes TOF laser emission subassembly and circuit substrate, TOF laser emission subassembly includes light source and support frame, the light source sets up on the support frame, the support frame sets up on the circuit substrate, a serial communication port, the support frame includes conductive circuit, a plurality of first electrically conductive pin and the electrically conductive pin of second, conductive circuit sets up in the lateral wall of support frame, first electrically conductive pin is located and is close to one side of light source, the electrically conductive pin of second is located and is close to one side of circuit substrate, conductive circuit connects first electrically conductive pin with between the electrically conductive pin of second, the light source with first electrically conductive pin electric connection, the circuit substrate with the electrically conductive pin electric connection of second.
2. The camera module of claim 1, wherein the material of the support frame is a heat sink material.
3. The camera module of claim 1, wherein the support frame further comprises a carrier plate and at least two support blocks, the carrier plate is connected between the two support blocks, the light source is disposed on the carrier plate, the conductive circuit is disposed in the carrier plate and the support blocks, the support blocks are disposed on the circuit substrate, the first conductive pins are disposed on the carrier plate, and the second conductive pins are disposed on the support blocks.
4. The camera module according to claim 3, wherein a third conductive pin is disposed on the light source, the third conductive pin is electrically connected to the first conductive pin, and a fourth conductive pin is disposed on the circuit substrate, and the fourth conductive pin is electrically connected to the second conductive pin.
5. The camera module of claim 1, wherein the support frame is a rectangular frustum comprising a bearing surface, a mounting surface and a heat dissipation cavity, the bearing surface is opposite to the mounting surface, the heat dissipation cavity is disposed on the mounting surface, the light source is disposed on the bearing surface, the conductive circuit is disposed in a sidewall of the rectangular frustum, the first conductive pin is disposed on the bearing surface, the second conductive pin is disposed on the mounting surface, and the mounting surface faces the circuit substrate.
6. The camera module according to claim 5, wherein a third conductive pin is disposed on the light source, the third conductive pin is electrically connected to the first conductive pin, and a fourth conductive pin is disposed on the circuit substrate, and the fourth conductive pin is electrically connected to the second conductive pin.
7. The camera module of claim 1, wherein the supporting frame is a cylinder, the cylinder includes a first end surface, a second end surface and a heat dissipation cavity, the heat dissipation cavity is disposed on the second end surface, the light source is disposed on the first end surface, the conductive circuit is disposed in a sidewall of the cylinder, the first conductive pin is disposed on the first end surface, the second conductive pin is disposed on the second end surface, and the second end surface faces the circuit substrate.
8. The camera module according to claim 7, wherein a third conductive pin is disposed on the light source, the third conductive pin is electrically connected to the first conductive pin, and a fourth conductive pin is disposed on the circuit substrate, and the fourth conductive pin is electrically connected to the second conductive pin.
9. The camera module of claim 1, wherein the TOF laser emitting assembly further comprises a driving chip for driving the light source, the driving chip is disposed on the supporting frame, and a fifth conductive pin is disposed on the driving chip and electrically connected to a portion of the first conductive pin.
10. The camera module of claim 1, further comprising a lens, a lens holder and a photo sensor chip, wherein the lens is disposed on the lens holder, the lens holder and the photo sensor chip are disposed on the circuit substrate, the lens holder is disposed on one side of the supporting frame, and the photo sensor chip is disposed under the lens holder and electrically connected to the circuit substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921813855.0U CN210491014U (en) | 2019-10-25 | 2019-10-25 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921813855.0U CN210491014U (en) | 2019-10-25 | 2019-10-25 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210491014U true CN210491014U (en) | 2020-05-08 |
Family
ID=70508992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921813855.0U Active CN210491014U (en) | 2019-10-25 | 2019-10-25 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210491014U (en) |
-
2019
- 2019-10-25 CN CN201921813855.0U patent/CN210491014U/en active Active
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| CP01 | Change in the name or title of a patent holder |
Address after: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300 Patentee after: Kunshan Qiuti Microelectronics Technology Co.,Ltd. Address before: No.3, Taihong Road, Kunshan high tech Industrial Development Zone, Suzhou, Jiangsu Province, 215300 Patentee before: KUNSHAN Q TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |