CN210470072U - Circuit board for middle-high grade electromechanical assembly - Google Patents
Circuit board for middle-high grade electromechanical assembly Download PDFInfo
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- CN210470072U CN210470072U CN201921357600.8U CN201921357600U CN210470072U CN 210470072 U CN210470072 U CN 210470072U CN 201921357600 U CN201921357600 U CN 201921357600U CN 210470072 U CN210470072 U CN 210470072U
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- circuit board
- multilayer circuit
- standing groove
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- supporting rod
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Abstract
The utility model relates to a circuit board technical field discloses a circuit board for well high-grade electromechanical component, including multilayer circuit board standing groove, the four corners of multilayer circuit board standing groove's bottom all is connected with height-adjusting device, just the bottom of multilayer circuit board standing groove is connected with two miniature rotating electrical machines housings, the inboard of multilayer circuit board standing groove is connected with multilayer circuit board mount, a plurality of louvre has been seted up to the impartial distance in both sides around the bottom of the inner wall of multilayer circuit board standing groove. The utility model discloses a first spring, slider and spout, when electromechanical device bumps, multilayer circuit board mount and the multilayer circuit board that it loaded reciprocate through first spring, slider and spout by a small margin in multilayer circuit board standing groove to reduce because the vibrations that electromechanical device collision brought the circuit board, thereby avoided the circuit board to send rather than the installation position and avoided the circuit board impaired.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a circuit board for medium and high-grade electromechanical subassembly.
Background
A circuit board, also called a printed circuit board, is an important electronic component, a support for an electronic component, and a carrier for electrical connection of the electronic component. After the electronic equipment adopts the printed board, due to the consistency of the printed boards of the same type, automatic insertion or mounting, automatic tin soldering and automatic detection of electronic components can be realized, the quality of the electronic equipment is ensured, the labor productivity is improved, the cost is reduced, and the maintenance is convenient. The circuit board used in the middle and high grade electromechanical device at present is usually a multilayer circuit board, and the multilayer circuit board is usually fixed and mounted on a multilayer circuit board fixing frame firstly and then mounted in the electromechanical device in the mounting process. Because the thickness of the high-integration circuit board is thicker, the installation height of the circuit board can be adjusted to be better suitable for the internal space of equipment, and the optimal assembly fixing position is reached.
At present, a plurality of circuit boards for medium-high grade electromechanical components exist in the market, but the circuit boards generally have the defects that the height of the circuit boards cannot be conveniently adjusted in electromechanical equipment so as to adjust the installation height of the multilayer circuit board, and the heat dissipation efficiency of the multilayer circuit board is low. Therefore, a circuit board for a middle-high grade electromechanical assembly is provided by those skilled in the art to solve the problems in the background art.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a well circuit board for high-grade electromechanical component to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a circuit board for a middle-high grade electromechanical component comprises a multilayer circuit board placing groove, wherein four corners of the bottom end of the multilayer circuit board placing groove are connected with height adjusting devices, two miniature rotating motor housings are connected with the bottom end of the multilayer circuit board placing groove, a multilayer circuit board fixing frame is connected with the inner side of the multilayer circuit board placing groove, a plurality of heat dissipation holes are formed in the front side and the rear side of the bottom end of the inner wall of the multilayer circuit board placing groove at equal distances, a plurality of first springs are arranged in the middle position of the bottom end of the inner wall of the multilayer circuit board placing groove at equal distances, sliding grooves are formed in the bottoms of the two sides of the inner wall of the multilayer circuit board placing groove, the inner side of the multilayer circuit board fixing frame is connected with a multilayer circuit board, sliding blocks are connected with the bottoms of the two sides of, and the top end of the miniature rotating motor is provided with a fan blade.
As a further aspect of the present invention: the height adjusting device comprises a second supporting rod, a plurality of second limiting holes are formed in equal distances in two sides of the second supporting rod, a first supporting rod is connected to the inner side of the second supporting rod, first limiting holes are formed in the bottoms of the two sides of the first supporting rod, a supporting block is connected to the middle position of the bottom end of the inner wall of the first supporting rod, second springs are arranged on the two sides of the supporting block, limiting ball installation seats are connected to one sides, away from each other, of the two second springs, and limiting balls are installed on one sides, away from each other, of the two limiting ball installation seats.
As a further aspect of the present invention: the top of first spring is connected with the bottom of multilayer circuit board mount, the bottom of first spring is connected with the bottom of the inner wall of multilayer circuit board standing groove.
As a further aspect of the present invention: the slider is connected with the inboard of spout, multilayer circuit board mount passes through spout and slider sliding connection with multilayer circuit board standing groove.
As a further aspect of the present invention: the limiting ball sequentially penetrates through the inner sides of the first limiting hole and the second limiting hole, and the first supporting rod and the second supporting rod are fixedly connected through the limiting ball, the first limiting hole and the second limiting hole.
As a further aspect of the present invention: the position of the fan blade corresponds to the opening positions of two of the heat dissipation holes.
As a further aspect of the present invention: the multilayer circuit board placing groove is a component made of insulating heat-conducting materials, and an anti-collision rubber sheet is arranged on the inner side of the multilayer circuit board placing groove.
Compared with the prior art, the beneficial effects of the utility model are that:
1. through first bracing piece, the second bracing piece, first spacing hole, spacing hole of second, spacing ball and second spring, when needs install the multilayer circuit board in electromechanical device, can be according to the inside actual space condition of electromechanical device, adjust the height of first bracing piece in the second bracing piece, thereby can be convenient adjust multilayer circuit board standing groove and multilayer circuit board height in electromechanical device, so that the multilayer circuit board can be installed inside electromechanical device with best assembly fixture position, thereby made things convenient for installer's use.
2. Through first spring, slider and spout, when electromechanical device bumps, multilayer circuit board mount and the multilayer circuit board that it loaded are through first spring in multilayer circuit board standing groove, reciprocating of slider and spout by a small margin, thereby reduced because the vibrations that electromechanical device bumps brought the circuit board, thereby avoided the circuit board to send rather than the installation position and avoided the circuit board impaired, through miniature rotating electrical machines, flabellum and louvre, when multilayer circuit board circular telegram work, miniature rotating electrical machines can be opened, miniature rotating electrical machines's output shaft drives the flabellum and rotates, and blow the air into multilayer circuit board standing groove in order to dispel the heat to the multilayer circuit board from the louvre, thereby the life of multilayer circuit board has been improved.
Drawings
FIG. 1 is a schematic structural diagram of a circuit board for a middle-high grade electromechanical assembly;
FIG. 2 is a schematic view of a partial structure of a multilayer circuit board placement groove in a circuit board for a middle-high grade electromechanical assembly;
FIG. 3 is a schematic view of a partial structure of a multi-layer circuit board and a multi-layer circuit board holder in a circuit board for a middle-high grade electromechanical assembly;
FIG. 4 is a partial sectional view of a multilayer wiring board placement groove and a micro rotary electric machine cover in a wiring board for a middle to high-grade electromechanical component;
FIG. 5 is a partial cross-sectional view of a multilayer wiring board placement groove and a multilayer wiring board holder in a wiring board for a middle-to-high class electromechanical component;
fig. 6 is a partial cross-sectional view of a height adjustment device in a wiring board for a medium to high grade electromechanical assembly.
In the figure: 1. a multilayer circuit board placing groove; 2. a height adjusting device; 3. a multilayer wiring board; 4. a multi-layer circuit board fixing frame; 5. heat dissipation holes; 6. a first spring; 7. a chute; 8. a slider; 9. a fan blade; 10. a miniature rotating electrical machine; 11. a miniature rotating motor housing; 21. a first support bar; 22. a second spring; 23. a first limit hole; 24. a second limiting hole; 25. a second support bar; 26. a support block; 27. a limiting ball mounting seat; 28. the ball is limited.
Detailed Description
Referring to fig. 1 to 6, in an embodiment of the present invention, a circuit board for a middle-high grade electromechanical assembly, includes a multilayer circuit board placement groove 1, four corners of a bottom end of the multilayer circuit board placement groove 1 are all connected with height adjusting devices 2, a bottom end of the multilayer circuit board placement groove 1 is connected with two micro rotating motor housings 11, an inner side of the multilayer circuit board placement groove 1 is connected with a multilayer circuit board fixing frame 4, a plurality of heat dissipation holes 5 are disposed at equal distances on front and back sides of a bottom end of an inner wall of the multilayer circuit board placement groove 1, a plurality of first springs 6 are disposed at equal distances in a middle position of the bottom end of the inner wall of the multilayer circuit board placement groove 1, a chute 7 is disposed at bottom portions of both sides of the inner wall of the multilayer circuit board placement groove 1, a multilayer circuit board 3 is connected to the inner side of the, the micro rotating motor 10 is installed on the inner side of the micro rotating motor housing 11, and the fan blades 9 are installed on the top end of the micro rotating motor 10.
In fig. 6: the height adjusting device 2 comprises a second support rod 25, a plurality of second limiting holes 24 are arranged on two sides of the second support rod 25 at equal distances, a first support rod 21 is connected to the inner side of the second support rod 25, first limiting holes 23 are arranged at the bottoms of two sides of the first support rod 21, a support block 26 is connected to the middle position of the bottom end of the inner wall of the first support rod 21, second springs 22 are arranged on two sides of the support block 26, limiting ball mounting seats 27 are connected to one sides, far away from each other, of the two second springs 22, limiting balls 28 are mounted on one sides, far away from each other, of the two limiting ball mounting seats 27, so that when the mounting heights of the multilayer circuit board placing groove 1 and the multilayer circuit board 3 in the electromechanical device need to be adjusted, the two limiting balls 28 are pressed down by hands, the first support rod 21 is pulled in the second support rod 25, and when the heights are proper, the limiting balls 28 are loosened, the spherical limit ball 28 is snapped into the second limit hole 24, so that the first support rod 21 and the second support rod 25 are fixed together.
In fig. 5: the top of first spring 6 is connected with the bottom of multilayer circuit board mount 4, and the bottom of first spring 6 is connected with the bottom of multilayer circuit board standing groove 1's inner wall to when electromechanical device bumps, multilayer circuit board mount 4 and multilayer circuit board 3 that it loaded reciprocate through first spring 6, slider 8 and 7 small ranges of spout in multilayer circuit board standing groove 1, thereby reduced because the vibrations that electromechanical device bumps and bring multilayer circuit board 3.
In fig. 5: slider 8 is connected with the inboard of spout 7, and multilayer circuit board mount 4 passes through spout 7 and slider 8 sliding connection with multilayer circuit board standing groove 1 to multilayer circuit board mount 4 can reciprocate of small margin in multilayer circuit board standing groove 1.
In fig. 6: the limiting round ball 28 sequentially penetrates through the inner sides of the first limiting hole 23 and the second limiting hole 24, and the first supporting rod 21 and the second supporting rod 25 are fixedly connected through the limiting round ball 28, the first limiting hole 23 and the second limiting hole 24, so that the first supporting rod 21 and the second supporting rod 25 can be conveniently fixed together.
In fig. 4: the position of flabellum 9 corresponds with the opening position of two of them louvres 5 in a plurality of louvre 5 to when multilayer circuit board 3 circular telegram work, can open miniature rotating electrical machines 10, miniature rotating electrical machines 10's output shaft drives flabellum 9 and rotates, and blow the air from louvre 5 into multilayer circuit board standing groove 1 in order to dispel the heat to multilayer circuit board 3, thereby improved multilayer circuit board 3's life.
In fig. 1: multilayer circuit board standing groove 1 is the component of insulating heat conduction material, and the inboard of multilayer circuit board standing groove 1 is provided with the anticollision sheet rubber to multilayer circuit board 3 can dispel the heat in multilayer circuit board standing groove 1 better.
The utility model discloses a theory of operation is: when the installation height of the multilayer circuit board placing groove 1 and the multilayer circuit board 3 in the electromechanical device needs to be adjusted, firstly, two limiting round balls 28 are pressed by hands, the first supporting rod 21 is pulled in the second supporting rod 25, when the height is proper, the limiting round balls 28 are loosened, and the limiting round balls 28 are clamped in the second limiting holes 24, so that the first supporting rod 21 and the second supporting rod 25 are fixed together, when the electromechanical device collides, the multilayer circuit board fixing frame 4 and the multilayer circuit board 3 loaded by the multilayer circuit board fixing frame move up and down in the multilayer circuit board placing groove 1 through the first spring 6, the sliding block 8 and the sliding groove 7 in a small range, so that the vibration of the multilayer circuit board 3 caused by the collision of the electromechanical device is reduced, when the multilayer circuit board 3 works in an electrifying mode, the micro rotating motor 10 can be opened, and the output shaft of the micro rotating motor 10 drives the fan blades 9 to rotate, and blows air into the multilayer wiring board placement groove 1 from the heat radiation holes 5 to radiate heat to the multilayer wiring board 3, thereby improving the service life of the multilayer wiring board 3.
The above-mentioned, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.
Claims (7)
1. The utility model provides a circuit board for middle and high-grade electromechanical component, includes multilayer circuit board standing groove (1), its characterized in that, the four corners of the bottom of multilayer circuit board standing groove (1) all is connected with height-adjusting device (2), just the bottom of multilayer circuit board standing groove (1) is connected with two miniature rotating electrical machines enclosers (11), the inboard of multilayer circuit board standing groove (1) is connected with multilayer circuit board mount (4), a plurality of louvre (5) have been seted up to both sides impartial distance around the bottom of the inner wall of multilayer circuit board standing groove (1), the intermediate position of the bottom of the inner wall of multilayer circuit board standing groove (1) is provided with a plurality of first spring (6) equidistance, spout (7) have all been seted up to the bottom of the both sides of the inner wall of multilayer circuit board standing groove (1), the inboard of multilayer mount (4) is connected with multilayer circuit, the bottom of the both sides of multilayer circuit board mount (4) all is connected with slider (8), miniature rotating electrical machines (10) are installed to the inboard of miniature rotating electrical machines housing (11), flabellum (9) are installed on the top of miniature rotating electrical machines (10).
2. The wiring board for middle and high grade electromechanical assembly according to claim 1, the height adjusting device (2) comprises a second supporting rod (25), a plurality of second limiting holes (24) are arranged on two sides of the second supporting rod (25) at equal distances, the inner side of the second supporting rod (25) is connected with a first supporting rod (21), the bottoms of the two sides of the first supporting rod (21) are respectively provided with a first limiting hole (23), the middle position of the bottom end of the inner wall of the first supporting rod (21) is connected with a supporting block (26), two sides of the supporting block (26) are respectively provided with a second spring (22), one sides of the two second springs (22) far away from each other are respectively connected with a limiting spherical mounting seat (27), and the limiting round balls (28) are arranged on the sides, far away from each other, of the two limiting round ball mounting seats (27).
3. The circuit board for the middle-high grade electromechanical assembly according to claim 1, wherein the top end of the first spring (6) is connected with the bottom end of the multilayer circuit board fixing frame (4), and the bottom end of the first spring (6) is connected with the bottom end of the inner wall of the multilayer circuit board placing groove (1).
4. The circuit board for the middle-high grade electromechanical assembly according to claim 1, wherein the sliding block (8) is connected with the inner side of the sliding groove (7), and the multilayer circuit board fixing frame (4) is slidably connected with the multilayer circuit board placing groove (1) through the sliding groove (7) and the sliding block (8).
5. The circuit board of claim 2, wherein the limiting round ball (28) sequentially penetrates through the inner sides of the first limiting hole (23) and the second limiting hole (24), and the first supporting rod (21) and the second supporting rod (25) are fixedly connected through the limiting round ball (28), the first limiting hole (23) and the second limiting hole (24).
6. The breadboard for a middle-high grade electromechanical component according to claim 1, characterized in that the position of the fan blade (9) corresponds to the opening position of two of the heat dissipation holes (5) in the plurality of heat dissipation holes (5).
7. The circuit board for the middle-high grade electromechanical assembly according to claim 1, wherein the multilayer circuit board placing groove (1) is a member made of an insulating and heat-conducting material, and an anti-collision rubber sheet is disposed on an inner side of the multilayer circuit board placing groove (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357600.8U CN210470072U (en) | 2019-08-21 | 2019-08-21 | Circuit board for middle-high grade electromechanical assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921357600.8U CN210470072U (en) | 2019-08-21 | 2019-08-21 | Circuit board for middle-high grade electromechanical assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210470072U true CN210470072U (en) | 2020-05-05 |
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ID=70452542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921357600.8U Active CN210470072U (en) | 2019-08-21 | 2019-08-21 | Circuit board for middle-high grade electromechanical assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210470072U (en) |
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2019
- 2019-08-21 CN CN201921357600.8U patent/CN210470072U/en active Active
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