CN210467865U

CN210467865U - Tray and carrier with same

Info

Publication number: CN210467865U
Application number: CN201921214406.4U
Authority: CN
Inventors: 张丹丹
Original assignee: Dongtai Hi Tech Equipment Technology Co Ltd
Current assignee: Zishi Energy Co.,Ltd.
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-05-05
Anticipated expiration: 2029-07-30

Abstract

The utility model provides a tray and have its carrier, the tray is used for placing the wafer with the film, and the tray includes: a chassis; the base plate and the bosses surround to form an accommodating cavity for placing a wafer, and one surface of the boss, which is far away from the base plate, is used for bearing the part of the thin film protruding out of the wafer; in the circumferential direction of the base plate, the interval area of two adjacent bosses is used for avoiding the corner of the wafer. Through the arrangement, after the wafer attached with the film is placed on the tray, the angle of the wafer cannot be contacted with the tray due to the special area for avoiding the angle of the wafer, so that the angle of the wafer is prevented from being collided, the wafer attached with the film is prevented from being broken when moving, the loss of the wafer is reduced, and the cost is saved.

Description

Tray and carrier with same

Technical Field

The utility model relates to the field of semiconductor technology, particularly, relate to a tray and have its carrier.

Background

The thin-film solar cell has the characteristics of light weight, thin thickness, flexibility and portability, so that the thin-film solar cell has a wide application range. In the fabrication of thin film solar cells, a thin film is often attached to a wafer. The stress at the corners of the wafer with the film attached is large due to the material properties and the process of the wafer. When a wafer with a film is carried or transported in a conventional tray, the four corners of the wafer collide with the tray, which may cause breakage of the wafer and loss of the wafer.

SUMMERY OF THE UTILITY MODEL

The utility model provides a tray and have its carrier to solve the problem that the wafer with the film among the prior art breaks easily when removing.

In order to solve the above problem, according to an aspect of the present invention, the present invention provides a tray for placing a wafer with a thin film, the tray comprising: a chassis; the base plate and the bosses surround to form an accommodating cavity for placing a wafer, and one surface of the boss, which is far away from the base plate, is used for bearing the part of the thin film protruding out of the wafer; in the circumferential direction of the base plate, the interval area of two adjacent bosses is used for avoiding the corner of the wafer.

Furthermore, the chassis is of a square structure, and the bosses are distributed along the four edges of the chassis.

Further, the tray includes four bosss, and four borders one-to-one setting of four bosss and chassis, the length direction of every boss all extends along a border of chassis.

Further, the chassis has dodges the breach, dodges the opening of breach and is located one side of chassis, and any one in a plurality of bosss is first boss, and first boss includes two stoppers, and two stoppers distribute in the open-ended both sides of dodging the breach.

Furthermore, the upper surface of the base plate is a plane, the boss is convexly arranged on the upper surface, and the thickness of the boss is smaller than or equal to that of the wafer.

Furthermore, the boss is of a cuboid structure, and the width of the boss is larger than or equal to the dimension of the part of the film protruding out of the wafer in the width direction of the boss.

According to the utility model discloses an on the other hand provides a carrier, including the tray that a plurality of ranges set up, the tray is the above-mentioned tray that provides.

Further, the carrier further includes: the side support is provided with a plurality of slots in a direction perpendicular to the chassis, and the edges of the trays are inserted into the slots in a one-to-one correspondence mode.

Furthermore, the carrier comprises a plurality of side supports, the side supports surround a U-shaped structure, the slots on the side supports correspond to each other in the direction perpendicular to the chassis, the edges of the trays are inserted into the slots at the same height on the side supports, and the trays are inserted from the opening of the U-shaped structure.

Further, the first side support and the second side support in a plurality of side supports form the opening of U type structure, and the carrier still includes: two baffles for spacing a plurality of trays, two baffles all set up along the direction on perpendicular to chassis, and wherein, at least partly of every slot of first side support is sheltered from to a baffle, and another baffle shelters from at least partly of every slot of second side support.

Further, the carrier also comprises an upper end plate and a lower end plate, the lower end of the side support is connected with the lower end plate, and the upper end of the side support is connected with the upper end plate.

Use the technical scheme of the utility model, be provided with chassis and a plurality of boss in the tray, a plurality of boss intervals set up on the chassis, and the chassis is used for bearing the part of thin film protrusion in the wafer with a plurality of bosses around forming the chamber that holds that is used for placing the wafer, the one side that deviates from the chassis of boss, and in the circumference on chassis, the interval region of two adjacent bosses is used for dodging the angle of wafer. Through the arrangement, after the wafer attached with the film is placed on the tray, the angle of the wafer cannot be contacted with the tray due to the special area for avoiding the angle of the wafer, so that the angle of the wafer is prevented from being collided, the wafer attached with the film is prevented from being broken when moving, the loss of the wafer is reduced, and the cost is saved.

Drawings

The accompanying drawings, which form a part of the present application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention and not to limit the invention. In the drawings:

fig. 1 is a schematic structural diagram of a tray according to an embodiment of the present invention;

fig. 2 is a schematic view showing a wafer with a thin film attached thereto is placed in the tray of fig. 1;

fig. 3 is a schematic structural diagram of a tray provided in the second embodiment of the present invention;

fig. 4 is a schematic structural diagram of a carrier according to a third embodiment of the present invention;

fig. 5 shows a cross-sectional view of the carrier of fig. 4.

Wherein the figures include the following reference numerals:

10. a chassis; 11. avoiding the notch; 20. a boss; 21. a limiting block; 30. a side bracket; 40. a baffle plate; 51. an upper end plate; 52. a lower end plate; 61. a wafer; 62. a film.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 to 2, an embodiment of the present invention provides a tray for placing a wafer 61 attached with a film 62, the tray including: a chassis 10; the wafer carrier comprises a plurality of bosses 20, wherein the bosses 20 are arranged on a chassis 10 at intervals, the chassis 10 and the bosses 20 surround to form a containing cavity for placing a wafer 61, and one surface of each boss 20, which faces away from the chassis 10, is used for bearing a part of a film 62, which protrudes out of the wafer 61; in the circumferential direction of the base plate 10, the spacing region between two adjacent bosses 20 is used to avoid the corner of the wafer 61.

By applying the technical scheme of the embodiment, a chassis 10 and a plurality of bosses 20 are arranged in the tray, the plurality of bosses 20 are arranged on the chassis 10 at intervals, the chassis 10 and the plurality of bosses 20 surround to form an accommodating cavity for accommodating the wafer 61, one surface of each boss 20, which is far away from the chassis 10, is used for bearing a part of the thin film 62, which protrudes out of the wafer 61, and in the circumferential direction of the chassis 10, the interval area of two adjacent bosses 20 is used for avoiding the corner of the wafer 61. Through the arrangement, after the wafer 61 attached with the film 62 is placed on the tray, the corners of the wafer 61 are not contacted with the tray due to the special area for avoiding the corners of the wafer 61, so that the corners of the wafer 61 are prevented from being collided, the wafer 61 attached with the film 62 is prevented from being broken when moving, the loss of the wafer 61 is reduced, and the cost is saved. The plurality of bosses 20 may act as a restraint for the wafer 61, which may reduce or prevent wafer 61 from wobbling when the wafer 61 is transported.

In the present embodiment, the chassis 10 has a square structure, and a plurality of bosses 20 are distributed along four edges of the chassis 10. This matches the square wafer 61 with the film 62 attached thereto, so that the wafer 61 with the film 62 attached thereto can be placed.

In this embodiment, the tray includes four bosses 20, the four bosses 20 are disposed corresponding to four edges of the chassis 10, and a length direction of each boss 20 extends along one edge of the chassis 10. Thus, for a square wafer 61, the four sides of the wafer 61 can be limited by the four bosses 20, so that the wafer 61 can be placed and fixed, and the shaking is reduced or avoided. The size of the tray can be reduced through the arrangement, so that the occupied space is reduced.

As shown in fig. 2, the upper surface of the base plate 10 is a flat surface, and the bosses 20 are protrudingly provided on the upper surface, and the thickness of the bosses 20 is smaller than or equal to the thickness of the wafer 61. With the above arrangement, when the wafer 61 with the film 62 is placed on the tray, the lower surface of the film 62 is flush with the upper surfaces of the bosses 20, or there is a gap between the lower surface of the film 62 and the upper surfaces of the bosses 20, so that the bosses 20 are prevented from pressing against the film 62 to prevent damage to the film.

Further, the boss 20 has a rectangular parallelepiped structure, and the width of the boss 20 is greater than or equal to the dimension of the portion of the film 62 protruding from the wafer 61 in the width direction of the boss 20. This protects the edges of the film 62 from damage caused by the edges of the film 62 colliding with other objects by the bosses 20.

As shown in fig. 3, the second embodiment of the present invention is different from the above-mentioned second embodiment in that the chassis 10 has an avoidance notch 11, the opening of the avoidance notch 11 is located on one side of the chassis 10, any one of the plurality of bosses 20 is a first boss, the first boss includes two stoppers 21, and the two stoppers 21 are distributed on two sides of the opening of the avoidance notch 11. By arranging the avoiding gap 11, equipment such as a mechanical arm can conveniently extend into the tray to take and place the wafer 61. The first boss is provided with two limiting blocks 21, so that the wafer 61 can be limited, and the avoidance notch 11 is not blocked. The avoidance gap 11 may be formed in a square shape, a U-shape, or the like.

As shown in fig. 4 and 5, a third embodiment of the present invention provides a carrier, where the carrier includes a plurality of trays arranged in a row, and the tray is the tray provided in the above embodiment. By applying the technical scheme of the embodiment, a chassis 10 and a plurality of bosses 20 are arranged in the tray, the plurality of bosses 20 are arranged on the chassis 10 at intervals, the chassis 10 and the plurality of bosses 20 surround to form an accommodating cavity for accommodating the wafer 61, one surface of each boss 20, which is far away from the chassis 10, is used for bearing a part of the thin film 62, which protrudes out of the wafer 61, and in the circumferential direction of the chassis 10, the interval area of two adjacent bosses 20 is used for avoiding the corner of the wafer 61. With the above arrangement, after the wafer 61 with the film 62 is placed on the tray, since there is a region that is specially evacuated from the corners of the wafer 61, the corners of the wafer 61 do not contact the tray, so that the corners of the wafer 61 are prevented from being knocked, and the wafer 61 with the film 62 is prevented from being broken when moving. By providing a plurality of trays in the carrier, a plurality of wafers 61 with films 62 attached can be carried and conveyed at a time, thereby improving the conveying efficiency.

In this embodiment, the carrier further includes: the side bracket 30 is provided with a plurality of slots arranged along a direction perpendicular to the chassis 10, and the edges of the plurality of trays are inserted into the plurality of slots in a one-to-one correspondence manner. The arrangement and fixation of the plurality of trays is facilitated by the provision of the side brackets 30. Moreover, the mode of inserting the slots is adopted, and the assembly of a plurality of trays can be conveniently realized. In this embodiment, there is sufficient clearance between two adjacent trays to avoid the trays colliding with the film 62 or the wafer 61 below or above. For example, a preset distance is arranged between two adjacent trays, and the preset distance is larger than the thickness of the wafer, so that the wafer can be conveniently picked and placed by a mechanical arm.

As shown in fig. 4 and 5, in the present embodiment, the carrier includes a plurality of side brackets 30, the plurality of side brackets 30 are surrounded into a U-shaped structure, the slots of the side brackets 30 correspond to each other in a direction perpendicular to the chassis 10, the edge of the tray is inserted into the slot of the side bracket 30 at the same height, and the plurality of trays are inserted from the opening of the U-shaped structure. By providing a plurality of side brackets 30, a plurality of pallets can be better restrained and supported. The plurality of side brackets 30 are surrounded into a U-shaped structure, which facilitates the assembly of a plurality of pallets.

Further, a first side bracket and a second side bracket of the plurality of side brackets 30 form an opening of a U-shaped structure, and the carrier further includes: the two baffle plates 40 are used for limiting the plurality of trays, the two baffle plates 40 are arranged along the direction perpendicular to the chassis 10, one baffle plate 40 shields at least one part of each slot of the first side bracket, and the other baffle plate 40 shields at least one part of each slot of the second side bracket. The side brackets 30 enclose a U-shaped structure that can position three sides of the pallet, but the U-shaped structure has an open side, and the pallet still has a movable risk. Through setting up two baffles 40, can be located open-ended one side of U type structure to the tray and carry on spacingly, four sides of tray all have spacingly like this to reliable spacing has been carried out to the tray, avoid the tray to rock, improve reliability and security.

In this embodiment, the opening of the avoiding notch of each tray faces the opening of the U-shaped structure, so that a pick-and-place area can be formed to facilitate picking and placing of the wafer.

Alternatively, as shown in fig. 5, in the present embodiment, four side brackets 30 are provided to form a U-shaped structure, wherein two side brackets 30 may limit one side of the tray away from the U-shaped structure (which may be understood as a rear side of the tray in the horizontal direction), the other two side brackets may limit the left side and the right side of the tray, respectively, and the baffle 40 may limit one side of the tray located at the opening of the U-shaped structure (which may be understood as a front side of the tray in the horizontal direction).

In fig. 5, there are two baffles 40, and the two baffles 40 are respectively connected to the two side brackets 30, and the two side brackets 30 are the first side bracket and the second side bracket. Therefore, the limiting effect and the structural strength of the carrier can be improved.

In this embodiment, the carrier further includes an upper end plate 51 and a lower end plate 52, the lower end of the side bracket 30 is connected to the lower end plate 52, and the upper end of the side bracket 30 is connected to the upper end plate 51. The overall structural strength of the carrier may be improved by the upper and

lower end plates

51 and 52, and the arrangement of the plurality of side brackets 30 and the barrier 40 may be facilitated.

The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.

Unless specifically stated otherwise, the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present invention. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplification of description, and in the case of not making a contrary explanation, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be interpreted as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.

Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and if not stated otherwise, the terms have no special meaning, and therefore, the scope of the present invention should not be construed as being limited.

Claims

1. A tray for holding a wafer with a film attached thereto, comprising:

a chassis (10);

the base plate (10) and the bosses (20) are arranged on the base plate (10) at intervals, a containing cavity for placing the wafer is formed by the base plate (10) and the bosses (20), and the side of the boss (20) facing away from the base plate (10) is used for bearing the part of the film protruding out of the wafer;

in the circumferential direction of the base plate (10), the interval area of two adjacent bosses (20) is used for avoiding the corner of the wafer.

2. A pallet according to claim 1, characterised in that the chassis (10) is of square construction, and that a plurality of said bosses (20) are distributed along four edges of the chassis (10).

3. A tray as claimed in claim 2, characterized in that it comprises four bosses (20), the four bosses (20) being arranged in a one-to-one correspondence with four edges of the chassis (10), the length direction of each boss (20) extending along one edge of the chassis (10).

4. The tray according to claim 1, wherein the chassis (10) is provided with an avoidance notch (11), an opening of the avoidance notch (11) is positioned at one side of the chassis (10), any one of the plurality of bosses (20) is a first boss, the first boss comprises two limiting blocks (21), and the two limiting blocks (21) are distributed at two sides of the opening of the avoidance notch (11).

5. A tray as claimed in claim 1, characterized in that the upper surface of the chassis (10) is plane, the bosses (20) being provided projecting on said upper surface, the thickness of the bosses (20) being less than or equal to the thickness of the wafers.

6. A tray as claimed in claim 1, characterized in that said bosses (20) are of rectangular parallelepiped conformation, the width of said bosses (20) being greater than or equal to the dimension of the portion of said film projecting from said wafer in the width direction of said bosses (20).

7. A carrier comprising a plurality of aligned trays, the trays being as claimed in any one of claims 1 to 6.

8. The carrier of claim 7, further comprising:

the side support (30), the direction of edge perpendicular to chassis (10) is arranged on side support (30) and is provided with a plurality of slots, the border one-to-one correspondence of a plurality of the tray is inserted in a plurality of the slots.

9. The vehicle according to claim 8, characterized in that it comprises a plurality of said side brackets (30), a plurality of said side brackets (30) being enclosed in a U-shaped structure, the slots of each of said side brackets (30) corresponding to each other in a direction perpendicular to said chassis (10), the edge of said tray being inserted into the slot of each of said side brackets (30) located at the same height, and a plurality of said trays being inserted from the opening of said U-shaped structure.

10. The carrier according to claim 9, wherein a first side bracket and a second side bracket of the plurality of side brackets (30) form an opening of the U-shaped structure, the carrier further comprising:

the two baffle plates (40) are used for limiting the plurality of trays, the two baffle plates (40) are arranged along the direction perpendicular to the chassis (10), one baffle plate (40) shields at least one part of each slot of the first side bracket, and the other baffle plate (40) shields at least one part of each slot of the second side bracket.

11. The carrier according to claim 8, further comprising an upper end plate (51) and a lower end plate (52), wherein the lower ends of the side brackets (30) are connected with the lower end plate (52), and the upper ends of the side brackets (30) are connected with the upper end plate (51).