CN210456579U - Ceramic substrate's for chip resistor loading attachment - Google Patents

Ceramic substrate's for chip resistor loading attachment Download PDF

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Publication number
CN210456579U
CN210456579U CN201921385134.4U CN201921385134U CN210456579U CN 210456579 U CN210456579 U CN 210456579U CN 201921385134 U CN201921385134 U CN 201921385134U CN 210456579 U CN210456579 U CN 210456579U
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ceramic substrate
assembly
supporting
feeding device
subassembly
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CN201921385134.4U
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Chinese (zh)
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张毅
汪峰
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Taicang Yifeng Electronics Co Ltd
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Taicang Yifeng Electronics Co Ltd
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Abstract

The utility model relates to a ceramic substrate's for chip resistor loading attachment, be in including microscope carrier subassembly, the setting that is used for placing ceramic substrate the below of microscope carrier subassembly just can drive the ascending lifting subassembly of ceramic substrate, setting are in the top of microscope carrier subassembly just can absorb ceramic substrate's sucking disc subassembly, with sucking disc subassembly fixed connection just can drive the sucking disc subassembly removes the removal subassembly of next production line, is used for supporting the supporting component of removal subassembly. The utility model discloses a loading attachment of ceramic substrate for chip resistor can transport next production line with ceramic substrate uninterruptedly in succession, and convenient to use has reduced the human cost, has improved the efficiency of production.

Description

Ceramic substrate's for chip resistor loading attachment
Technical Field
The utility model relates to a loading attachment of ceramic substrate for chip resistor.
Background
A Chip Resistor (SMD Resistor), also known as a Chip Fixed Resistor, is one of the metal glass enamel resistors. The resistor is manufactured by mixing metal powder and glass glaze powder and printing the mixture on a substrate by a screen printing method. It is resistant to humidity and high temperature and has small temperature coefficient. The circuit space cost can be greatly saved, and the design is more refined.
The composition of the chip resistor is roughly divided into: the device comprises a ceramic substrate, resistance paste, a back conductive material, a front conductive material, a side conductive material, primary protective glass, secondary protective glass and a Mark marking material. Therefore, the steps of the assembly of the chip resistor are more, the feeding of the ceramic substrate is manual operation, the working efficiency of manually placing the ceramic substrate is low on the one hand, the workload is large, in addition, the manual feeding cannot ensure the accuracy of placing the ceramic substrate, and the ceramic substrate is easy to pollute.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a convenient to use's ceramic substrate's for chip resistor loading attachment.
In order to solve the technical problem, the utility model discloses a technical scheme is:
a feeding device of a ceramic substrate for a chip resistor comprises a carrier assembly used for placing the ceramic substrate, a lifting assembly arranged below the carrier assembly and capable of driving the ceramic substrate to rise, a sucker assembly arranged above the carrier assembly and capable of sucking the ceramic substrate, a moving assembly fixedly connected with the sucker assembly and capable of driving the sucker assembly to move to a next production line, and a supporting assembly used for supporting the moving assembly.
Specifically, the stage assembly comprises at least one stage body for placing the ceramic substrate, two limiting plates perpendicular to the stage body and arranged around each stage body in a blocking manner, and a bottom plate fixedly connected with the lower end parts of the limiting plates.
Preferably, the feeding device of the ceramic substrate for the chip resistor further comprises a sliding strip fixedly connected with the bottom plate, a sliding rail connected with the sliding strip in a sliding manner, and a first motor connected with the sliding strip and used for driving the sliding strip to slide on the sliding rail.
Specifically, the sucker assembly comprises a plurality of vacuum suckers arranged above the carrier assembly, a cylinder fixedly connected with the vacuum suckers and capable of driving the vacuum suckers to ascend and descend vertically, and a vacuum mechanism communicated with the vacuum suckers.
Specifically, the supporting assembly comprises a supporting vertical plate arranged above the carrier assembly, at least two fixed blocks fixed on the side surface of the supporting vertical plate and arranged at intervals, and a plurality of guide posts penetrating through the fixed blocks.
Preferably, the removal subassembly is including installing action wheel on the support riser side, install support riser another side on and with the second motor that the action wheel is connected, install support riser side on and with the action wheel interval sets up from the driving wheel, around establishing the action wheel with from the belt on the driving wheel, install many on the belt switching piece and slidable install many on the guide post and with the slider that the switching piece is connected.
Further preferably, the moving assembly further comprises an induction metal sheet fixedly connected with the adapter block and two limit switches installed on the side surface of the supporting vertical plate and matched with the induction metal sheet.
The scope of the present invention is not limited to the technical solutions formed by specific combinations of the above technical features, and other technical solutions formed by arbitrary combinations of the above technical features or equivalent features should be covered. For example, the above features and the technical features (but not limited to) having similar functions disclosed in the present application are mutually replaced to form the technical solution.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages: the utility model discloses a loading attachment of ceramic substrate for chip resistor can transport next production line with ceramic substrate in succession, and convenient to use has reduced the human cost, has improved the efficiency of production.
Drawings
FIG. 1 is a schematic structural view of the present invention;
wherein: 11. a stage body; 12. a limiting plate; 21. a vacuum chuck; 22. a cylinder; 31. a driving wheel; 32. a driven wheel; 33. a belt; 34. a slider; 35. a transfer block; 36. an induction metal sheet; 37. a first limit switch; 38. a second limit switch; 41. a support vertical plate; 42. a fixed block; 43. a guide post; 5. a slide bar; 6. a slide rail.
Detailed Description
As shown in fig. 1, a feeding device for a ceramic substrate for a chip resistor includes a carrier assembly, a lifting assembly (not shown), a suction cup assembly, a moving assembly, a supporting assembly, a slide bar 5, a slide rail 6, and a first motor (not shown).
The stage assembly includes at least one stage body 11 for placing the ceramic substrate, two limiting plates 12 perpendicular to the stage body 11 and blocking the periphery of each stage body 11, and a bottom plate (not shown in the figure) fixedly connected to the lower end of the limiting plates 12. In order to prevent ceramic substrate roll-off microscope carrier subassembly, the utility model discloses in, the terminal surface of limiting plate 12 is the U type, and the limiting plate 12 of two relative settings blocks ceramic substrate. The utility model discloses in, the range upon range of setting of ceramic substrate is on microscope carrier body 11, and ceramic substrate's side offsets with the inner wall of limiting plate 12 and establishes. The number of the carrier assemblies can be one or more, and the number of the carrier assemblies can be regulated according to actual needs. The number of blocks of the carrier assembly is not a key point of the present invention. The utility model discloses in, the microscope carrier subassembly has two.
Before the device starts to operate, the ceramic substrates are all arranged on the stage body 11 in a laminated mode, after the device starts to operate, the ceramic substrates on the stage body 11 are sequentially moved away by the sucker assemblies (the ceramic substrates are then manually placed on the empty stage body 11), after the last ceramic substrate is moved, the stage assembly moves on the slide rails 6, and the other stage assembly filled with the ceramic substrates is moved to the position below the sucker assemblies.
The lifting assembly (not shown in the figure) is arranged below the carrier assembly and can drive the carrier body 11 to lift so as to drive the ceramic substrate to rise, when one ceramic substrate is moved away, the lifting assembly (not shown in the figure) rises a little, and the next ceramic substrate can rise to the height which can be sucked by the sucker assembly. The lifting assembly (not shown) can be arranged in various ways, and the existing conventional way can be adopted; for example, a vertically arranged screw rod is matched with a servo motor, and a cylinder is used for stretching. The setting mode of lifting subassembly (not shown in the figure) is not the key point of the utility model protection, as long as can realize driving microscope carrier body 11 and go up and down can.
The sucking disc subassembly sets up in the top of microscope carrier subassembly and can absorb ceramic substrate. The sucker assembly comprises a plurality of vacuum suckers 21 arranged above the carrier assembly, a cylinder 22 which is fixedly connected with the vacuum suckers 21 and can drive the vacuum suckers 21 to lift up and down in a small range, and a vacuum mechanism (not shown in the figure) communicated with the vacuum suckers 21. Vacuum chuck 21 sets up in microscope carrier body 11 top and can absorb ceramic substrate, and cylinder 22 and vacuum chuck 21 fixed connection just can go up and down by a small margin, and when vacuum chuck 21 goes down by a small margin to contact with ceramic substrate, vacuum mechanism (not shown in the figure, the same below) suction, vacuum chuck 21 holds ceramic substrate, moves to next production line, and vacuum mechanism inflates, then ceramic substrate breaks away from vacuum chuck 21.
The supporting component is used for supporting the moving component and comprises a supporting vertical plate 41 arranged above the carrier component, at least two fixing blocks 42 fixed on the side surface of the supporting vertical plate 41 and arranged at intervals, and a plurality of guide columns 43 penetrating through the fixing blocks 42. The utility model discloses in, fixed block 42 has two, and guide post 43 has two, and the piece number of fixed block 42 and the radical of guide post 43 are not the utility model discloses the key point of protection as long as can realize fixed can.
The moving assembly is fixedly connected with the sucker assembly and can drive the sucker assembly to move to a downstream production line. The moving assembly comprises a driving wheel 31 mounted on one side surface of a supporting vertical plate 41, a second motor (not shown in the figure) mounted on the other side surface of the supporting vertical plate 41 and connected with the driving wheel 31, a driven wheel 32 mounted on one side surface of the supporting vertical plate 41 and arranged at an interval with the driving wheel 31, a belt 33 wound on the driving wheel 31 and the driven wheel 32, a switching block 35 mounted on the belt 33, a sliding block 34 slidably mounted on a plurality of guide posts 43 and connected with the switching block 35, an induction metal sheet 36 fixedly connected with the switching block 35, and two limit switches mounted on one side surface of the supporting vertical plate 41 and matched with the induction metal sheet 36. The utility model discloses in, limit switch is including setting up at the first limit switch 37 of microscope stage subassembly top, keeping away from microscope stage subassembly's second limit switch 38.
The slide bar 5 is fixedly connected with the bottom plate (not shown in the figure), the slide rail 6 is installed on a fixed plate at one side of the production line and is connected with the slide bar 5 in a sliding manner (in a conventional sliding connection manner), and a first motor or a horizontally-arranged cylinder (not shown in the figure) is connected with the slide bar 5 to drive the slide bar 5 to slide on the slide rail 6. The slide bar 5 is fixedly connected with a bottom plate (not shown in the figure) and can drive the stage assembly to slide, so that the vacuum chuck 21 corresponds to different stage bodies 11.
The working principle is as follows: when a second motor (not shown in the figure) works, the driving wheel 31 rotates to drive the belt 33 to rotate, the belt 33 drives the driven wheel 32 to rotate, meanwhile, the belt 33 drives the sliding block 34 to move until the sensing metal sheet 36 is contacted with the first limit switch 37, a vacuum mechanism (not shown in the figure) sucks, the cylinder 22 slightly moves downwards to enable the vacuum chuck 21 to suck a ceramic substrate, then the cylinder 22 slightly moves upwards, meanwhile, the sliding block 34 moves in the opposite direction until the sensing metal sheet 36 is contacted with the second limit switch 38, the vacuum mechanism (not shown in the figure) inflates air, and the ceramic substrate is separated from the vacuum chuck 21 and enters a downstream production line; at the same time, the lift assembly (not shown) moves upward, so that the next ceramic substrate disposed in a stack moves upward, so that the uppermost ceramic substrate is located at the standby position; then the slide block 34 moves in the opposite direction, so that the loading operation of the ceramic substrate on one stage assembly is completed repeatedly, then the first motor (not shown in the figure) operates, the slide bar 5 moves on the slide rail 6, the stage assembly with the empty stage body is removed, and the other stage assembly with the ceramic substrate filled in is moved to the position below the vacuum chuck 21 for material suction; at this time, a ceramic substrate may be manually placed on the vacant stage body (in this way, the slide bar 5 reciprocates on the slide rail 6 to realize the synchronous reciprocating motion of the two stage bodies).
As described above, the present invention has been explained in full in accordance with the spirit of the present invention, but the present invention is not limited to the above-described embodiments and implementation methods. The practitioner of the related art can make various changes and implementations within the scope permitted by the technical idea of the present invention.

Claims (7)

1. The utility model provides a loading attachment of ceramic substrate for chip resistor which characterized in that: the ceramic substrate lifting device comprises a carrier assembly for placing a ceramic substrate, a lifting assembly, a sucker assembly, a moving assembly and a supporting assembly, wherein the lifting assembly is arranged below the carrier assembly and can drive the ceramic substrate to rise, the sucker assembly is arranged above the carrier assembly and can suck the ceramic substrate, the moving assembly is fixedly connected with the sucker assembly and can drive the sucker assembly to move to the next production line, and the supporting assembly is used for supporting the moving assembly.
2. The feeding device of the ceramic substrate for chip resistors according to claim 1, wherein: the stage assembly comprises at least one stage body (11) used for placing the ceramic substrate, two limiting plates (12) which are perpendicular to the stage body (11) and are arranged on the periphery of each stage body (11) in a blocking mode, and a bottom plate fixedly connected with the lower end portions of the limiting plates (12).
3. The feeding device of the ceramic substrate for chip resistors according to claim 2, wherein: the feeding device of the ceramic substrate for the chip resistor further comprises a sliding strip (5) fixedly connected with the bottom plate, a sliding rail (6) connected with the sliding strip (5) in a sliding mode, and a first motor connected with the sliding strip (5) and used for driving the sliding strip (6) to slide.
4. The feeding device of the ceramic substrate for chip resistors according to claim 1, wherein: the sucker assembly comprises a plurality of vacuum suckers (21) arranged above the carrier assembly, a cylinder (22) fixedly connected with the vacuum suckers (21) and capable of driving the vacuum suckers (21) to ascend and descend, and a vacuum mechanism communicated with the vacuum suckers (21).
5. The feeding device of the ceramic substrate for chip resistors according to claim 1, wherein: the supporting assembly comprises a supporting vertical plate (41) arranged above the carrier assembly, at least two fixing blocks (42) fixed on the side surface of the supporting vertical plate (41) and arranged at intervals, and a plurality of guide posts (43) penetrating through the fixing blocks (42).
6. The feeding device of the ceramic substrate for chip resistors according to claim 5, wherein: remove the subassembly including installing drive wheel (31) on supporting riser (41) side, install support on riser (41) another side and with second motor that drive wheel (31) are connected, install support on riser (41) side and with from driving wheel (32), around establishing that drive wheel (31) interval set up drive wheel (31) with from belt (33) on driving wheel (32), install switching piece (35) and slidable on belt (33) are installed many on guide post (43) and with slider (34) that switching piece (35) are connected.
7. The feeding device of the ceramic substrate for chip resistors according to claim 6, wherein: the moving assembly further comprises an induction metal sheet (36) fixedly connected with the transfer block (35) and two limit switches which are arranged on the side surface of the supporting vertical plate (41) and matched with the induction metal sheet (36).
CN201921385134.4U 2019-08-23 2019-08-23 Ceramic substrate's for chip resistor loading attachment Active CN210456579U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921385134.4U CN210456579U (en) 2019-08-23 2019-08-23 Ceramic substrate's for chip resistor loading attachment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921385134.4U CN210456579U (en) 2019-08-23 2019-08-23 Ceramic substrate's for chip resistor loading attachment

Publications (1)

Publication Number Publication Date
CN210456579U true CN210456579U (en) 2020-05-05

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111504249A (en) * 2020-05-19 2020-08-07 盐城工业职业技术学院 Ceramic substrate flatness detector
CN111578889A (en) * 2020-05-19 2020-08-25 盐城工业职业技术学院 Method for detecting parallelism of circular or square ceramic substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111504249A (en) * 2020-05-19 2020-08-07 盐城工业职业技术学院 Ceramic substrate flatness detector
CN111578889A (en) * 2020-05-19 2020-08-25 盐城工业职业技术学院 Method for detecting parallelism of circular or square ceramic substrate

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