CN210432331U - Electromagnetic shielding film with insulating structure layer - Google Patents
Electromagnetic shielding film with insulating structure layer Download PDFInfo
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- CN210432331U CN210432331U CN201920912461.4U CN201920912461U CN210432331U CN 210432331 U CN210432331 U CN 210432331U CN 201920912461 U CN201920912461 U CN 201920912461U CN 210432331 U CN210432331 U CN 210432331U
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Abstract
The utility model discloses an electromagnetic shielding membrane with environmental protection insulating structure layer, including the carrier rete that connects gradually, from type layer, environmental protection insulating layer, metal level, adhesive linkage, protection rete. The utility model discloses an electromagnetic shielding film have high dyne value and insulating properties, and environment friendly is applicable to aspects or fields such as electromagnetic shield, copper-clad plate, flexible circuit board (FPC), demonstration simultaneously. The utility model discloses an electromagnetic wave shielding function membrane's insulating layer uses water-based ink coating, and the insulating layer of effectively having solved current shielding membrane uses oil coating, the environmental pollution problem that causes, moreover the utility model discloses a surface of insulating layer reaches the value height, has improved the printable performance on insulating layer surface greatly.
Description
Technical Field
The utility model belongs to the communication field, in particular to electromagnetic shielding membrane, conductive adhesive membrane, FPC, function membrane such as demonstration with environmental protection insulating layer.
Background
The rapid development of the electronic communication industry, high frequency transmission drives shielding product demand and constantly increases, and electromagnetic shielding film product is as the increase of supporting segmentation product, and the environmental protection problem that is difficult to overcome is outstanding, and current shielding film production is whole to use oily printing ink (glue), must use a large amount of solvents, because most discharges and can't avoid, and the solvent is inflammables for the majority simultaneously, and the security is poor, is unfavorable for drawbacks such as operation and can't overcome. The utility model discloses the product utilizes water-based ink to replace oil ink production, and the product is fit for all requirements of shielding film production, has solved the environmental protection problem, makes the printing ink surface reach the value and improves by a wide margin simultaneously.
Disclosure of Invention
The utility model aims to overcome the problems of the prior art and provide an electromagnetic shielding film with an environment-friendly insulating structure, which is formed by reasonably superposing a release layer, an environment-friendly insulating layer and a metal layer; meanwhile, the electromagnetic shielding functional film with the environment-friendly insulating layer prepared by the method of the utility model is simple, convenient, light and thin, convenient to use, capable of being produced in batches and suitable for various electronic products and communication equipment; the utility model discloses an electromagnetic shielding film has effectively solved the insulating layer oil printing ink of current electromagnetic shielding film and has made, and uses a series of safety, environmental protection problems such as emission that oil printing ink brought, but also is showing the printing performance who has improved the insulating layer surface.
In order to realize the utility model discloses an aspect provides an electromagnetic shielding film with environmental protection insulating layer, including the carrier rete that connects gradually, from type layer, insulating layer, metal level, adhesive linkage, protection rete.
The carrier film layer is a polyester film such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), Polyimide (PI), Polyethylene (PE), polypropylene (PP) and the like.
The release layer is a film layer made of a release agent coating.
In particular, the release agent coating comprises a release agent and an organic solvent.
Particularly, the release agent is a silicon-containing release agent or a non-silicon release agent.
In particular, the silicon-containing release agent is a silicone release agent or a modified silicone resin, such as silicone oil or the like; the non-silicon release agent is acrylic resin, polyester, polyurethane, melamine resin, organic fluorine resin (such as Teflon) or corresponding modified resin thereof.
In particular, the organic solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester, PMA and the like.
The release layer is formed by diluting resins such as acrylic acid, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and the like or modified resins thereof with an organic solvent, coating the diluted resins on the surface of the carrier film layer, and drying.
Particularly, the thickness of the release layer is 0.05-2 μm.
The release layer is a silicon-containing or non-silicon release film. The release film layer has the functions of heat transfer printing and insulating layer protection. The coating mode of the release layer is realized by a slightly concave or mesh roller (500 meshes) coating mode.
The environment-friendly insulating layer is a film layer made of water-based ink paint; the thickness of the environment-friendly insulating layer is 1-20 μm, preferably 2-20 μm.
In particular, the water-based ink coating comprises a water-based coating, a curing agent, a flame retardant, an auxiliary agent, a filler and a diluent.
Particularly, the water-based ink coating comprises the following raw materials in parts by weight:
wherein the water-based paint is water-based polyurethane resin, water-based epoxy resin, water-based acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide or magnesium hydroxide; the auxiliary agent is a surface wetting agent or a surface coupling agent, OFX-5211 (polyether modified silicone oil, Dow Corning) and the like; the filler is silicon dioxide, micro silicon powder, barium sulfate and the like; the diluent is water.
Particularly, the water-based paint is water-based polyurethane resin; the curing agent is isocyanate; the flame retardant is aluminum hydroxide; the auxiliary agent is OFX-5211; the filler is silicon dioxide; the diluent is water.
In particular, the water-based ink coating is:
the above water-based ink coating is known material, and besides the above water-based ink coating, other water-based ink coatings in the art are all suitable for the present invention.
Particularly, the environment-friendly insulating layer is a water-based ink coating film layer formed by coating water-based ink coating on the surface of the release layer.
In particular, the surface dyne value of the insulating layer formed by coating the water-based paint film layer on the surface of the release layer is more than 32 dynes.
Particularly, the surface insulation resistance value of the insulation layer is more than or equal to 8-power ohm of 10. The coating method is common screen printing, micro gravure or slit extrusion coating. The environment-friendly insulating layer can meet the requirements of production, use and the like of circuit boards and shielding films, such as: high temperature resistance of 288 ℃ for 5 times and 10 seconds (applicable to reflow SMT process); chemical resistance, weather resistance, acid and alkali resistance, and the like. The utility model discloses an insulating layer is owing to do not use the solvent, more environmental protection, printing nature advantage such as good.
The surface of the environment-friendly insulating layer has high dyne (more than 32 dynes), a metal layer or other functional materials can be formed by coating conductive adhesive or vacuum coating on the surface of the environment-friendly insulating layer, and the adhesion is greatly enhanced due to the high dyne value, so that the environment-friendly insulating layer can be printed and attached again when in use.
The metal layer is a metal foil layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or alloy thereof; the thickness of the metal layer is 0.01-10 μm, preferably 0.01-5 μm.
In particular, the metal foil layer is selected from one of gold, silver, copper, aluminum or an alloy foil thereof.
In particular, the metal foil layer is a copper foil layer.
The metal layer plays a shielding role, the thickness of the metal layer is set according to the frequency, the shielding efficiency is higher, the metal layer needs to be made thicker, and different thicknesses can be designed according to different frequency band products so as to achieve the shielding efficiency.
The metal layer is formed on the surface of the insulating layer in a vacuum coating mode, and the insulating layer has a high dyne value, so that the adhesive force is greatly enhanced, and the metal layer is favorably adhered.
The metal layer is formed by performing vacuum coating on the surface of the insulating layer and depositing a metal foil film on the surface of the insulating layer.
The surface of the insulating layer has a high dyne value, so that surface metallization treatment can be realized, and vacuum coating can be realized on the surface of the insulating layer. If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Wherein, the bonding layer is a film layer made of conductive adhesive paint or non-conductive adhesive paint.
Particularly, the bonding layer is formed by coating a conductive adhesive coating or a non-conductive adhesive coating on the surface of the metal film layer; the thickness of the bonding layer is 3-20 μm.
In particular, the conductive adhesive layer can be an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer, and the conductive adhesive coating comprises a matrix resin, conductive particles, an inorganic filler, a curing agent and an organic solvent, wherein the conductive particles can be conductive particles with transverse or longitudinal orientation or all-directional conductive particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the conductive particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the conductive adhesive coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
Particularly, the matrix resin is epoxy resin, acrylic acid, polyurethane, polyester or modified resin thereof; the conductive particles are gold, silver, nickel, copper, cadmium, chromium, zinc, iron and the like or alloys thereof; the inorganic filler is one or more of barium sulfate, calcium carbonate, talcum powder, mica, wollastonite, kaolin, aluminum hydroxide and magnesium hydroxide, and barium sulfate is preferred; the curing agent is one or more of isocyanate, acid anhydride and amino resin, and the solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester or PMA.
The conductive adhesive layer can absorb and conduct electromagnetic waves and can be grounded through soft connection or thermosetting connection. The adhesive layer has good adhesion performance, and is adhered to a workpiece (such as the adhesion with an FPC and the like) and meets the manufacturing requirements of a composite circuit board.
Particularly, the bonding layer is a modified epoxy adhesive film layer.
The conductive adhesive used in the middle bonding layer of the utility model is the same as the conductive adhesive used in the patent number 201320106820.X (the name of the invention: a wave-absorbing magnetic conduction shielding film with a laminated structure).
Particularly, the protective film layer is a polymer film such as PET, PEN, PI, PE or PP; the thickness of the protective film layer is 30-120 mu m.
The protective film layer protects the bonding layer glue from being polluted. When in use, the adhesive is torn off during the lamination through the protection of the processes of cutting, punching, die cutting and the like.
The utility model discloses another aspect provides a preparation method of electromagnetic shielding film with environmental protection insulating structure layer, include: and coating a release layer on the surface of one pretreated side of the carrier film layer, and then sequentially superposing an environment-friendly insulating layer, a metal layer, a bonding layer and a protective film layer on the surface of the release layer.
Wherein the pretreatment is corona treatment or plasma treatment.
The utility model discloses another aspect provides a preparation method of electromagnetic shielding film with environmental protection insulating structure layer, include the step of going on as follows:
1) pretreating one side surface of the carrier membrane layer, and coating a release agent component on the pretreated one side surface to form a release layer, wherein the thickness of the release layer is 0.05-2 μm;
2) coating water-based ink paint on the surface of the release layer to form an insulating layer, wherein the thickness of the insulating layer is 1-20 mu m;
3) overlapping a metal foil on the surface of the insulating layer to form a metal layer, wherein the thickness of the metal layer is 0.01-5 mu m;
4) coating conductive adhesive or non-conductive adhesive on the surface of the metal layer to form a bonding layer, wherein the thickness of the bonding layer is 3-20 mu m;
5) and attaching a protective film layer on the surface of the bonding layer.
Wherein, the pretreatment in the step 1) is corona treatment and plasma treatment, and preferably corona treatment.
Wherein, the carrier film layer in the step 1) is a polyester film such as PET, PEN, PI, PE, PP and the like.
Wherein, the voltage in the corona pretreatment process of the step 1) is 5000-.
The release layer in the step 1) is formed by coating a release agent coating on the pretreatment film surface of the carrier film in a coating mode.
And coating a release agent coating by adopting a common screen printing method, a screen roller, slit extrusion or a micro-gravure method to form a release layer. The release agent coating used by the release layer of the utility model is the conventionally used release agent existing in the field.
Particularly, the release agent coating comprises a release agent and an organic solvent.
Wherein the release agent is a silicon-containing release agent or a non-silicon release agent.
In particular, the silicon-containing release agent is a silicone release agent or a modified silicone resin (e.g., silicone oil, release silicone oil); the non-silicon release agent is acrylic resin, polyester, polyurethane, melamine resin, organic fluorine resin (such as Teflon) or corresponding modified resin thereof.
In particular, the release agent is dissolved in an organic solvent, and then applied to the surface of the carrier film layer, the organic solvent is volatilized, and the release agent adheres to the surface of the carrier film layer, thereby forming a release layer.
In particular, the organic solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester, PMA and the like.
Particularly, after the release agent is dissolved in the organic solvent, the content of the release agent is 1 wt% -40 wt%.
In particular, the release agent component is a curing type siloxane (silicone oil syl-off 7458, Dow Corning 7458) or other type of release resin.
The water-based ink coating in the step 2) comprises a water-based coating, a curing agent, a flame retardant, an auxiliary agent, a filler and a diluent.
Particularly, the water-based paint is water-based polyurethane resin, water-based epoxy resin, water-based acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide and magnesium hydroxide; the auxiliary agent is a surface wetting agent, a coupling agent and the like; the filler is silicon dioxide, micro silicon powder, barium sulfate and the like; the diluent is water.
Particularly, the water-based paint is water-based polyurethane resin; the curing agent is isocyanate; the flame retardant is aluminum hydroxide; the filler is silicon dioxide; the diluent is water.
The water-based ink coating comprises the following raw materials in parts by weight:
the surface dyne value of the insulating layer formed by the water-based ink coating coated on the surface of the release layer is more than 32 dynes.
The coating method is common screen printing, micro gravure or slit extrusion coating. The water-based ink paint used for the insulating layer of the present invention is conventionally used water-based ink known in the art.
Wherein, the metal foil in the step 3) is made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or alloy metal thereof.
In particular, the metal foil layer is selected from one of gold, silver, copper, aluminum or an alloy foil thereof.
In particular, the metal foil layer is a copper foil layer.
Wherein, in the step 3), the metal foil is laminated on the surface of the insulating layer, the surface of the insulating layer is subjected to vacuum coating, a metal foil film is vacuum-coated on the surface of the insulating layer, the metal foil film is laminated on the surface of the insulating layer, and the thickness of the metal film layer coated on the surface of the insulating layer is 0.01-10 μm, preferably 0.01-5 μm.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
Wherein, the bonding layer in the step 4) is a film layer made of conductive adhesive paint or non-conductive adhesive paint.
Particularly, the bonding layer is formed by coating a conductive adhesive coating or a non-conductive adhesive coating on the surface of the metal film layer.
In particular, the conductive adhesive layer can be an isotropic conductive adhesive layer or an anisotropic conductive adhesive layer, and the conductive adhesive coating comprises a matrix resin, conductive particles, an inorganic filler, a curing agent and an organic solvent, wherein the conductive particles can be conductive particles with transverse or longitudinal orientation or all-directional conductive particles; wherein, the content of the matrix resin is 10 wt% -40 wt%, the content of the conductive particles is 10 wt% -50 wt%, the content of the inorganic filler is 4 wt% -20 wt%, the content of the curing agent is 1 wt% -5 wt%, and the solid content of the conductive adhesive coating is 25 wt% -60% by adjusting the dosage of the organic solvent.
Particularly, the matrix resin is organic silicon, organic fluorine, epoxy resin, acrylic acid, polyurethane, polyester or modified resin thereof; the conductive particles are gold, silver, nickel, copper, cadmium, chromium, zinc, iron and the like or alloys thereof; the inorganic filler is one or more of barium sulfate, calcium carbonate, talcum powder, mica, wollastonite, kaolin, aluminum hydroxide and magnesium hydroxide, and barium sulfate is preferred; the curing agent is one or more of isocyanate, acid anhydride and amino resin, and the solvent is volatile organic solvent such as butanone, acetone, ethyl ester, butyl ester or PMA.
The conductive adhesive layer can absorb and conduct electromagnetic waves and can be grounded through soft connection or thermosetting connection.
Particularly, the bonding layer is a modified epoxy adhesive film layer.
The non-conductive adhesive layer is made of non-conductive paint, wherein the non-conductive paint is the same as the conductive paint except that the non-conductive paint does not contain conductive particles.
The coating method of the bonding layer comprises micro-concave coating, roll coating, blade coating and slit extrusion coating.
The conductive adhesive and the non-conductive adhesive coating used in the bonding layer of the utility model are conventionally used conductive adhesive or non-conductive adhesive known in the art.
Wherein, the protective film layer in the step 5) is a PET, PEN, PI, PE or PP film.
The electromagnetic shielding film with the environment-friendly insulating structure layer manufactured by the method consists of a carrier film layer, a release layer, an environment-friendly insulating layer, a metal layer, a bonding layer and a protective film layer which are sequentially stacked. When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to an FPC (flexible printed circuit) or other attached objects, and the carrier film layer is torn off to leak the insulating layer after the pressure of 80KG is applied for 2 minutes by hot-pressing (170 plus 180 ℃).
Compared with the prior art, the utility model have following advantage and effect:
1. the utility model discloses an electromagnetic shield membrane with environmental protection insulating structure layer has the environmental protection, does benefit to operation processing, surface dyne value height, promotes with metal cohesion, low cost.
2. The utility model discloses an electromagnetic shielding membrane with environmental protection insulating structure layer has overcome current insulating layer effectively and has need use oil paint, need use a large amount of organic solvents in the preparation process, causes environmental pollution's technical problem, the utility model discloses an electromagnetic shielding membrane's insulating layer uses water based ink coating to water does not need to use organic solvent with the diluent, has reached the environmental protection requirement, moreover the utility model discloses the surface of electromagnetic shielding membrane's insulating layer reaches because of the height, has still improved the printing performance on insulating layer surface greatly.
3. The utility model discloses an electromagnetic shielding film has environmental protection insulating structure layer, and the insulating layer is the water paint layer, and the surface has the high reason that reaches, effectively promotes cohesion between the layer, if during the metallization, more does benefit to processing.
4. The utility model discloses an electromagnetic shielding film application scope is wide, is applicable to the shielding film production of any model thickness.
5. The utility model discloses electromagnetic shielding film's preparation method is simple, and is easy and simple to handle, and is safe convenient, suitable industrialization is promoted, and the rete is frivolous evenly fine and close, and soft bendable, tensile strength are excellent, and the insulating layer is made by water based paint in addition, has reduced the pollution in the preparation process, and the dyne on insulating layer surface is high moreover, is showing the printing effect that has improved the insulating layer surface.
Drawings
Fig. 1 is a schematic structural view of the electromagnetic shielding film with an environmental insulation structure layer according to the present invention.
Description of the reference numerals
1. A carrier film layer; 2. a release layer; 3. an insulating layer; 4. a metal layer; 5. a bonding layer; 6. and (5) a protective film layer.
Detailed Description
The invention will be further described with reference to specific embodiments, and the advantages and features of the invention will become apparent as the description proceeds. These examples are illustrative only and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications may be made without departing from the spirit and scope of the invention.
Examples
As shown in fig. 1, the shielding film with environmental protection insulating structure layer of the present invention comprises a carrier film layer 1, a release layer 2, an insulating layer 3, a metal layer 4, a bonding layer 5, and a protective film layer 6 from top to bottom.
1. Preparation of the Carrier film layer
A PET polyester film having a thickness of 50 μm and a width of 600mm is selected as a carrier film, and one side surface of the film is subjected to corona pretreatment (pretreatment other than corona treatment, plasma pretreatment is also possible), wherein the voltage during corona pretreatment is 20000V (usually 5000-20000V) until the surface tension reaches 60 dynes (usually 35-60 dynes).
2. Laminated release layer
Coating a release agent coating on the corona-pretreated surface of the carrier film layer in a slit extrusion mode, and drying after coating to form a release layer, wherein the thickness of the release layer is 1 micrometer (usually 0.05-2 micrometers), the drying time is 2 minutes, and the drying temperature is 160 ℃.
The release agent coating comprises a release agent and an organic solvent, the release agent is dissolved in volatile organic solvent acetone (usually the organic solvent is butanone, acetone, ethyl ester, butyl ester, PMA and the like) to prepare the release agent coating with the release agent content of 30 wt% (usually 1-40 wt%), and then the release agent coating is coated on the surface of a carrier film layer for pretreatment and dried to prepare the release film layer.
The release agent is selected from curable silicone (such as silicone oil syl-off 7458, Dow Corning 7458; Xinyue).
The organosilicon release agent is preferably Dow Corning curing organosilicon release agent (Dow Corning 7485), so that release components do not pollute the surface of the insulating layer after curing; the non-silicon release agent is preferably melamine resin and can be cured at the hot pressing temperature of 170 ℃, so that the insulating ink layer attached to the surface of the non-silicon release agent falls off, and the thermal transfer effect is achieved.
The release agent in the release agent coating can also be acrylic acid, polyester, polyurethane, organic silicon, melamine resin, organic fluorine and other resins or modified resins thereof.
3. Superimposed insulating layer
And coating a water-based ink coating on the surface of the release layer in a slit extrusion manner, and drying after coating to form an environment-friendly insulating layer, wherein the thickness of the environment-friendly insulating layer is 15 micrometers (usually 1-20 micrometers, preferably 2-20 micrometers).
The water-based ink coating comprises the following components in parts by weight:
in addition to the above-described water-based ink coating, other water-based ink coatings are suitable for use in the present invention.
The water-based ink coating comprises water-based coating, a curing agent, a flame retardant, an auxiliary agent, a filler and a diluent, wherein the water-based coating is water-based polyurethane resin, water-based epoxy resin, water-based acrylic resin or modified resin thereof; the curing agent is isocyanate, anhydride or amino resin; the flame retardant is aluminum hydroxide and magnesium hydroxide; the auxiliary agent is a wetting agent and a coupling agent; the filler is silicon dioxide, micro silicon powder and barium sulfate; the diluent is water.
4. Superimposed metal layers
And plating a layer of metal copper foil film on the surface of the insulating layer by adopting a vacuum plating mode, wherein the thickness of the formed metal layer is 2 micrometers (usually 0.01-5 micrometers), and performing vacuum plating on the surface of the insulating layer to form a metal shielding layer.
Wherein, the working conditions in the vacuum coating process are controlled as follows:
the temperature of a cold roll of the equipment is as follows; 25 degree
The vacuum degree is; 2.0*10-2Handkerchief
The vehicle speed is 5 m.
The metal layer may also be a thin metal layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or an alloy thereof.
If a thicker metal layer is required, a metal film can be vacuum-plated on the surface of the insulating layer, and then water plating (such as alkali plating and acid plating) is performed, so that the metal layer can meet the thicker requirement.
5. Superimposed adhesive layer
And coating a non-conductive adhesive coating on the surface of the metal layer in a slit extrusion manner to form a non-conductive adhesive layer, wherein the thickness of the non-conductive adhesive layer is 50 microns.
The non-conductive adhesive coating comprises the following components in percentage by weight:
wherein the solid matter in the coating is powdery, the average particle size is less than 10 μm, and the content of the solid matter is 55%.
After the components are prepared according to the proportion, the components are fully dispersed and stirred, and are kept stand for 1 hour to prepare coating, and the coating adopts a blade coating mode, the drying temperature is 160 ℃, and the time is 2 minutes.
The utility model provides a bonding layer except that the non-conductive glue film be can also be conductive glue film. For example, the conductive adhesive coating comprises the following components in percentage by weight:
wherein the solid matter in the coating is powdery, the average particle size is less than 10 μm, and the content of the solid matter is 58%. Particularly, the conductive particles are formed by mixing nickel, copper and iron according to the proportion of 1:1: 1.
Non-conductive glue and conductive glue known in the art are all suitable for the present invention.
6. Laminating protective film layer
A PET polyester film having a thickness of 50 μm (usually 30 to 100 μm) is attached to the surface of the adhesive layer as a protective film layer.
The protective film layer can also be a PET, PEN, PI, PE or PP film.
When the adhesive is used, the protective film layer is firstly torn off during cutting, punching and post-attaching, the adhesive layer is attached to a workpiece such as a circuit board (FPC, flexible circuit board) or other attached objects, the carrier film layer is torn off after 2 minutes under the pressure of 80KG at the temperature of 180 ℃ through hot pressing (170), and the insulating layer is leaked. Then printing and attaching are carried out.
The shielding effectiveness of the electromagnetic shielding functional film having an insulating structure layer obtained according to this method was tested in accordance with standard SJ20524-1995 "test method for material shielding effectiveness", and the test results are shown in table 1.
Table 1 test results of the shielding effect of the electromagnetic shielding film prepared in table 1
| Film thickness | Frequency range | Shielding effectiveness | |
| Example 1 | 15 micron | 3000MHZ | 60.5 |
| Comparative example | 15 micron | 3000MHZ | 60.5 |
Measuring the surface dyne value of the insulating layer of the prepared electromagnetic shielding film by adopting a tensile tester; the bonding force between the insulating layer and the metal layer of the electromagnetic shielding film was measured using a tensile tester, and the measurement results are shown in table 2.
TABLE 2 test results of surface dyne value and film bonding force of insulating layer of electromagnetic shielding film prepared by
Comparative example
The same as in the example was conducted except that the insulating layer was laminated in step 3) using an oil-based ink (oil-based ink paste).
The oily ink glue used in the comparative example is a formula conventionally used in the field, and specifically comprises the following components:
in the process of coating the oily ink glue, an oily ink component solution in an organic solvent (such as butanone) needs to be added, so that the organic solvent is used, and the organic solvent is large in usage amount, so that the environment is polluted.
The above embodiments of the present invention are only exemplary, and do not limit the scope of the present invention. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention, and that such changes and modifications are intended to be included within the scope of the invention.
Claims (6)
1. An electromagnetic shielding film with an insulating structure layer is characterized by comprising a carrier film layer, a release layer, an environment-friendly insulating layer, a metal layer, an adhesive layer and a protective film layer which are sequentially connected, wherein the environment-friendly insulating layer is a water-based ink coating film layer formed by coating water-based ink coating on the surface of the release layer; the metal layer is a metal foil layer made of gold, silver, copper, nickel, aluminum, nickel silver, nickel copper or alloy thereof, and the thickness of the metal layer is 0.01-5 μm.
2. The electro-magnetic shielding film according to claim 1, wherein the release layer is a film layer made of a silicon-containing type release agent or a non-silicon type release agent.
3. The electro-magnetic shielding film according to claim 1 or 2, wherein the release layer has a thickness of 0.05 μm to 2 μm.
4. The electro-magnetic shielding film of claim 1 or 2, wherein the environmentally insulating layer has a thickness of 1 μm to 20 μm.
5. The electro-magnetic shielding film according to claim 1 or 2, wherein the adhesive layer is a film layer made of a conductive adhesive paint or a non-conductive adhesive paint.
6. The electro-magnetic shielding film according to claim 1 or 2, wherein the protective film layer is a PET, PEN, PI, PE, or PP film.
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| CN201920912461.4U CN210432331U (en) | 2019-06-18 | 2019-06-18 | Electromagnetic shielding film with insulating structure layer |
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| CN201920912461.4U CN210432331U (en) | 2019-06-18 | 2019-06-18 | Electromagnetic shielding film with insulating structure layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613482A (en) * | 2021-08-06 | 2021-11-05 | 保定乐凯新材料股份有限公司 | Electromagnetic wave shielding film suitable for grounding of extremely-small grounding hole, preparation method and application |
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2019
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113613482A (en) * | 2021-08-06 | 2021-11-05 | 保定乐凯新材料股份有限公司 | Electromagnetic wave shielding film suitable for grounding of extremely-small grounding hole, preparation method and application |
| CN113613482B (en) * | 2021-08-06 | 2024-03-19 | 航天智造科技股份有限公司 | Electromagnetic wave shielding film suitable for grounding of very small grounding hole, preparation method and application |
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