CN210420147U - Full-area coating equipment for wafer processing - Google Patents
Full-area coating equipment for wafer processing Download PDFInfo
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- CN210420147U CN210420147U CN201920977103.1U CN201920977103U CN210420147U CN 210420147 U CN210420147 U CN 210420147U CN 201920977103 U CN201920977103 U CN 201920977103U CN 210420147 U CN210420147 U CN 210420147U
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Abstract
The utility model discloses a regional filming equipment entirely for wafer processing, including mounting panel, base, first condenser pipe, cooler bin, refrigerator, second condenser pipe, fan, the door body, evacuation joint, vacuum pump, coating film room, exhaust joint, intake pipe, water tank, fin and semiconductor refrigeration piece. The utility model can lead the gas with lower temperature to pass through the first condenser pipe through the cooling mechanism, and the heat in the coating chamber is taken away by the gas with the temperature reduced by the first condenser pipe, thereby achieving the cooling effect, having better cooling effect, being beneficial to shortening the time required by the cooling of the coating chamber and ensuring the normal work of the vacuum coating equipment; the utility model discloses an evacuation mechanism can clear away the dust in the air of taking out when the evacuation, is favorable to avoiding the dust of taking out to waft the emergence of the condition around the coating equipment, is convenient for improve the dustless grade that the space was placed to the coating equipment.
Description
Technical Field
The utility model relates to a coating equipment specifically is a full regional coating equipment for wafer processing, belongs to coating equipment application technical field.
Background
The wafer is one of the main raw materials of the LED, is the light-emitting part of the LED, the core part of the LED, the quality of the wafer directly determines the performance of the LED, the wafer needs to be coated on the surface during processing, and vacuum coating equipment is generally used for coating the wafer during coating.
But the heat that current vacuum coating equipment can produce when work, surface welding pipe in the outside of coating equipment, it cools off to lead to the cooling water in the pipe, this kind of cooling method, the cooling water does not with the inside direct contact of vacuum coating equipment, the cooling effect is relatively poor, cool off untimely, lead to the vacuum coating equipment very easily to damage because of the high temperature, and during the evacuation of current vacuum coating equipment, the gas of taking out is most direct to be discharged, the dust in the gas of taking out is wafted and is dispersed around coating equipment, be not convenient for guarantee the dustless grade in coating equipment place space, there is certain not enough. Therefore, a full-area coating device for wafer processing is provided to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The present invention is directed to a full-area coating apparatus for wafer processing to solve the above problems.
The utility model discloses a following technical scheme realizes above-mentioned purpose, a full regional coating equipment for wafer processing, including mounting panel, base, first condenser pipe, coating film room, cooling body, evacuation mechanism, the base is installed at the top surface of mounting panel, the coating film room is installed at the top of base, cooling body and evacuation mechanism all install on coating film room and mounting panel, the coating film room is the rectangle structure, the inner wall of the mutual corresponding both sides board of coating film room and a curb plate is attached and is installed first condenser pipe, and the both ends of first condenser pipe pass the mutual corresponding both sides board of coating film room respectively and extend to outside the coating film room;
the cooling mechanism comprises a cooling box, a refrigerator, a second condensation pipe and a fan, the fan is installed on the outer wall of one side plate of the film coating chamber, the cooling box is installed on the top surface of the installation plate, the second condensation pipe is installed on the top plate of the cooling box, two ends of the second condensation pipe extend out of the cooling box, the input end and the output end of the fan are respectively connected with one end of the second condensation pipe and one end of the first condensation pipe, and the refrigerator is embedded and installed on two side plates of the cooling box, which correspond to each other;
the vacuumizing mechanism comprises a vacuum pump, a water tank, an air inlet pipe and a vacuumizing connector, wherein the vacuumizing connector and the vacuum pump are sequentially installed on a side plate of a coating chamber from top to bottom, one end of the vacuumizing connector extends into the coating chamber, the input end of the vacuum pump is connected with one end of the vacuumizing connector, the water tank is installed on the top surface of the installation plate, the air inlet pipe is installed in a top plate pipe of the water tank in a penetrating mode, the bottom end of the air inlet pipe extends to the bottom of the water tank, and the top end of the air inlet pipe is connected with the output end.
Preferably, a door body is hinged to one side face of the coating chamber, and a rubber sealing rubber strip is installed at the contact position of the door body and the coating chamber.
Preferably, an air exhaust joint is installed on a top plate of the water tank in a penetrating manner.
Preferably, a water filling port is formed in the center of a top plate of the cooling box, and a liquid level observation window is embedded in one side plate of the cooling box.
Preferably, the four corners of the bottom surface of the mounting plate are provided with support legs, and the bottom surfaces of the support legs are attached with wear-resistant rubber anti-slip pads.
Preferably, the refrigerator is composed of two radiating fins and a semiconductor refrigerating fin, the two radiating fins are mutually clamped together, and the semiconductor refrigerating fin is located between the two radiating fins.
The utility model has the advantages that:
1. the first condenser pipe is arranged in the coating chamber, the cooling mechanism of the device comprises a cooling box, a refrigerator, a second condenser pipe and a fan, gas with lower temperature can pass through the first condenser pipe through the cooling mechanism, and the heat in the coating chamber is taken away by the gas with the temperature reduced by the first condenser pipe, so that the cooling effect is achieved, the cooling effect is better, the time required by the cooling of the coating chamber is favorably shortened, and the production work of vacuum coating equipment is favorably ensured;
2. the utility model discloses an evacuation mechanism mainly contains vacuum pump, water tank and intake pipe, when the evacuation, can clear away the dust in the air of taking out, is favorable to avoiding the dust of taking out to waft the emergence of the condition around the coating equipment, is convenient for improve the dustless grade that the space was placed to the coating equipment.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a front view of the present invention;
FIG. 2 is a front view of the internal structure of the cooling box of the present invention;
FIG. 3 is a top view of the inner structure of the coating chamber of the present invention;
fig. 4 is a schematic view of the internal structure of the refrigerator of the present invention.
In the figure: 1. the solar refrigerator comprises a mounting plate, 2, a base, 3, a first condensation pipe, 4, a cooling box, 5, a refrigerator, 6, a second condensation pipe, 7, a fan, 8, a door body, 9, a vacuumizing joint, 10, a vacuum pump, 11, a coating chamber, 12, an exhaust joint, 13, an air inlet pipe, 14, a water tank, 501, radiating fins, 502 and semiconductor refrigerating fins.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-4, a full-area coating apparatus for wafer processing includes a mounting plate 1, a base 2, a first condenser tube 3, a coating chamber 11, a cooling mechanism, and a vacuum pumping mechanism, where the base 2 is mounted on the top surface of the mounting plate 1, the coating chamber 11 is mounted on the top of the base 2, both the cooling mechanism and the vacuum pumping mechanism are mounted on the coating chamber 11 and the mounting plate 1, the coating chamber 11 is rectangular, the first condenser tube 3 is mounted on the inner walls of two corresponding side plates and one side plate of the coating chamber 11, so as to facilitate cooling the inside of the coating chamber 11, and two ends of the first condenser tube 3 extend out of the coating chamber 11 through the two corresponding side plates of the coating chamber 11;
the cooling mechanism comprises a cooling box 4, a refrigerator 5, a second condensation pipe 6 and a fan 7, the fan 7 is installed on the outer wall of one side plate of the coating chamber 11, the cooling box 4 is installed on the top surface of the installation plate 1 and facilitates containing of water, the second condensation pipe 6 is installed on the top plate of the cooling box 4, two ends of the second condensation pipe 6 extend out of the cooling box 4, the input end and the output end of the fan 7 are respectively connected with the second condensation pipe 6 and one end of the first condensation pipe 3, external air is conveniently introduced into the second condensation pipe 6 for cooling, then introduced into the first condensation pipe 3 for cooling the interior of the coating chamber 11, the refrigerators 5 are embedded in two side plates corresponding to each other of the cooling box 4, and the temperature of the water in the cooling box 4 is conveniently reduced;
the vacuumizing mechanism comprises a vacuum pump 10, a water tank 14, an air inlet pipe 13 and a vacuumizing joint 9, wherein the vacuumizing joint 9 and the vacuum pump 10 are sequentially installed on a side plate of a coating chamber 11 from top to bottom, one end of the vacuumizing joint 9 extends into the coating chamber 11, the input end of the vacuum pump 10 is connected with one end of the vacuumizing joint 9, the internal vacuumizing of the coating chamber 11 is facilitated, the water tank 14 is installed on the top surface of the installation plate 1, the air inlet pipe 13 is installed on a top plate pipe of the water tank 14 in a penetrating mode, the bottom end of the air inlet pipe 13 extends to the bottom of the water tank 14, and when the vacuumizing is facilitated, dust in pumped gas is collected and filtered, and the top end of the air inlet pipe 13 is connected with the.
A door body 8 is hinged to one side face of the coating chamber 11, and a rubber sealing rubber strip is arranged at the contact position of the door body 8 and the coating chamber 11, so that the wafer is coated conveniently; an exhaust joint 12 is arranged on a top plate of the water tank 14 in a penetrating manner, so that when vacuum is pumped, gas is discharged after being washed; a water filling port is formed in the center of the top plate of the cooling box 4, and a liquid level observation window is embedded in one side plate of the cooling box 4, so that water can be conveniently added into the cooling box 4 and the liquid level of the water can be conveniently observed; supporting legs are arranged at four corners of the bottom surface of the mounting plate 1, and wear-resistant rubber anti-slip pads are attached to the bottom surfaces of the supporting legs, so that the device is convenient to place; the refrigerator 5 is composed of two radiating fins 501 and a semiconductor refrigerating fin 502, the two radiating fins 501 are mutually clamped together, and the semiconductor refrigerating fin 502 is located between the two radiating fins 501, so that the refrigerating effect of the refrigerator 5 is convenient to guarantee.
When the utility model is used, the electrical components in the application are externally connected with a power supply and a control switch when in use, a proper amount of water is injected into the water tank 14 and the cooling tank 4, when the interior of the film coating chamber 11 needs to be cooled, the semiconductor refrigerating sheets 502 of the fan 7 and the refrigerator 5 are enabled to work through the control switch, when the semiconductor refrigerating sheets 502 work, the temperature of the water in the cooling tank 4 is reduced, when the fan 7 works, the outside air enters the second condensing pipe 6 from one end of the second condensing pipe 6, because the water temperature in the cooling tank 4 is lower, the temperature of the air entering the second condensing pipe 6 is also reduced, the gas with reduced temperature enters the first condensing pipe 3 from one end of the first condensing pipe 3 under the action of the fan 7, because the first condensing pipe 3 is positioned in the film coating chamber 11, at the moment, the heat in the film coating chamber 11 is taken away by the gas with the temperature reduced through the first condensing pipe 3, therefore, the cooling effect is achieved, the cooling effect is good, the time required for cooling the coating chamber 11 is shortened, the device comprises a vacuumizing mechanism, the vacuum pump 10 works through a control switch during vacuumizing, air in the coating chamber 11 is led out through the vacuumizing connector 9 when the vacuum pump 10 works, then the air is led into the water tank 14 through the air inlet pipe 13, the air led out at the moment is led into the water in the water tank 14 due to the fact that the bottom end of the air inlet pipe 13 extends to the bottom of the water tank 14, dust in the led air is dissolved in the water tank 14, the air after water washing is discharged out of the water tank 14 through the air exhaust connector 12, when the coating chamber 11 is vacuumized, the drawn dust can be removed, the situation that the drawn dust is scattered around the coating equipment is avoided, and the dust-free level of a placing space of the coating equipment is improved.
The fan 7 is an A120 fan provided by Tafeng fan Co., Ltd, Hainin, and a power supply circuit matched with the fan is provided by a manufacturer.
The semiconductor refrigeration piece 502 is a TEC-12705 type semiconductor refrigeration piece provided by shanghai pointent electronics technologies ltd, and a power supply circuit thereof is provided by a manufacturer.
It is well within the skill of those in the art to implement, without undue experimentation, the present invention does not relate to software and process improvements, as related to circuits and electronic components and modules.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (6)
1. A full zone coating equipment for wafer processing which characterized in that: the solar film coating device comprises a mounting plate (1), a base (2), a first condenser pipe (3), a film coating chamber (11), a cooling mechanism and a vacuumizing mechanism, wherein the base (2) is mounted on the top surface of the mounting plate (1), the film coating chamber (11) is mounted at the top of the base (2), the cooling mechanism and the vacuumizing mechanism are both mounted on the film coating chamber (11) and the mounting plate (1), the film coating chamber (11) is of a rectangular structure, the first condenser pipe (3) is mounted on two mutually corresponding side plates of the film coating chamber (11) and the inner wall of one side plate in an attached mode, and two ends of the first condenser pipe (3) respectively penetrate through the two mutually corresponding side plates of the film coating chamber (11) and extend out of the film coating chamber (11);
the cooling mechanism comprises a cooling box (4), a refrigerator (5), a second condensation pipe (6) and a fan (7), the fan (7) is installed on the outer wall of one side plate of the coating chamber (11), the cooling box (4) is installed on the top surface of the installation plate (1), the second condensation pipe (6) is installed on the top plate of the cooling box (4), two ends of the second condensation pipe (6) extend out of the cooling box (4), the input end and the output end of the fan (7) are respectively connected with the second condensation pipe (6) and one end of the first condensation pipe (3), and the refrigerators (5) are embedded and installed on two side plates, corresponding to each other, of the cooling box (4);
the vacuum pumping mechanism comprises a vacuum pump (10), a water tank (14), an air inlet pipe (13) and a vacuum pumping connector (9), wherein the vacuum pumping connector (9) and the vacuum pump (10) are sequentially installed on a side plate of a coating chamber (11) from top to bottom, one end of the vacuum pumping connector (9) extends into the coating chamber (11), the input end of the vacuum pump (10) is connected with one end of the vacuum pumping connector (9), the top surface of a mounting plate (1) is installed on the water tank (14), the air inlet pipe (13) is installed in a penetrating mode of a top plate pipe of the water tank (14), the bottom end of the air inlet pipe (13) extends to the bottom of the water tank (14), and the top end of the air inlet pipe (13) is connected with the output end of the vacuum.
2. The full-area coating device for wafer processing according to claim 1, wherein: one side of the coating chamber (11) is hinged with a door body (8), and a rubber sealing rubber strip is arranged at the contact position of the door body (8) and the coating chamber (11).
3. The full-area coating device for wafer processing according to claim 1, wherein: an exhaust joint (12) is arranged on the top plate of the water tank (14) in a penetrating way.
4. The full-area coating device for wafer processing according to claim 1, wherein: a water filling port is formed in the center of a top plate of the cooling box (4), and a liquid level observation window is embedded in one side plate of the cooling box (4).
5. The full-area coating device for wafer processing according to claim 1, wherein: the supporting legs are installed at four corners of the bottom surface of the installing plate (1), and the wear-resistant rubber anti-slip pads are installed on the bottom surfaces of the supporting legs in an attached mode.
6. The full-area coating device for wafer processing according to claim 1, wherein: the refrigerator (5) is composed of two radiating fins (501) and a semiconductor refrigerating fin (502), the two radiating fins (501) are mutually clamped together, and the semiconductor refrigerating fin (502) is located between the two radiating fins (501).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920977103.1U CN210420147U (en) | 2019-06-26 | 2019-06-26 | Full-area coating equipment for wafer processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920977103.1U CN210420147U (en) | 2019-06-26 | 2019-06-26 | Full-area coating equipment for wafer processing |
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| CN210420147U true CN210420147U (en) | 2020-04-28 |
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| CN201920977103.1U Active CN210420147U (en) | 2019-06-26 | 2019-06-26 | Full-area coating equipment for wafer processing |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667956A (en) * | 2021-08-19 | 2021-11-19 | 北华航天工业学院 | Aluminum-magnesium alloy coating method |
| CN115572938A (en) * | 2022-07-18 | 2023-01-06 | 江西弘耀光学水晶有限公司 | High-precision optical lens coating method |
-
2019
- 2019-06-26 CN CN201920977103.1U patent/CN210420147U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113667956A (en) * | 2021-08-19 | 2021-11-19 | 北华航天工业学院 | Aluminum-magnesium alloy coating method |
| CN115572938A (en) * | 2022-07-18 | 2023-01-06 | 江西弘耀光学水晶有限公司 | High-precision optical lens coating method |
| CN115572938B (en) * | 2022-07-18 | 2024-03-22 | 江西弘耀光学水晶有限公司 | High-precision optical lens coating method |
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Address after: No.15, Xinchao Road, Chang'an Town, Haining City, Jiaxing City, Zhejiang Province Patentee after: Zhejiang meidikai optical semiconductor Co.,Ltd. Address before: No.15, Xinchao Road, Haining hi tech Industrial Park, Chang'an Town, Haining City, Jiaxing City, Zhejiang Province Patentee before: Zhejiang Jiamei Photoelectric Technology Co.,Ltd. |