CN210412288U

CN210412288U - Transistor processing die and punching machine

Info

Publication number: CN210412288U
Application number: CN201921074364.9U
Authority: CN
Inventors: 刘钧; 冯颖盈; 姚顺; 黄田生
Original assignee: Shanghai Weimeisi Power Supply Co Ltd
Current assignee: Shanghai Weimeisi Power Supply Co Ltd
Priority date: 2019-07-10
Filing date: 2019-07-10
Publication date: 2020-04-28
Anticipated expiration: 2029-07-10

Abstract

The utility model discloses a transistor mold processing and punching machine, include: the transistor pin bending die comprises an upper die and a lower die for placing a transistor, wherein a platform capable of attaching the transistor pin in the extension direction is arranged on the lower die, a pressure groove is formed in the position, between two ends of the transistor pin, of the platform, and a jacking block for jacking the pressure groove and then bending the transistor pin is arranged on the upper die. The utility model discloses just to the position between the transistor pin both ends on the platform with the indent setting, after the transistor is kept flat transistor pin spanes the indent and laminates with the platform, go up the profile that the mould pushed down back transistor pin corresponds the indent and buckle, and the transistor body is buckled along with the transistor pin and is unrestricted towards the last free activity with pressure opposite direction, and the transistor body is not influenced by stress completely in the whole forming process, can not produce any stress of dragging to can not receive the injury in the machine-shaping in-process.

Description

Transistor processing die and punching machine

Technical Field

The utility model relates to a transistor processing field especially relates to a transistor mold processing and punching machine.

Background

Transistor pin formation is quite popular in the electronics industry, and transistor formation is widely used in various electrical appliances. As device densities and electrical types increase, more and more transistor pins need to be formed. When the transistor pin is formed, as shown in fig. 1, the conventional method is to add a fixed transistor body and a fixed pin in the forming process; and then, forcibly bending the part to be molded into various shapes. The molding mode causes unpredictable damage to the interior of the pipe; when the body is fixed and the pin is formed, the pin can pull the inside of the body fixing pin, the damage of the stress to the inside of the transistor is large, a small amount of poor electrical performance can occur, and more pins are difficult to find; some damages can even be delivered normally until the client is returned, which causes immeasurable loss to the company.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve the technical problem among the above-mentioned prior art, provide a transistor mold processing and punching machine.

The utility model adopts the technical proposal that:

the utility model provides a transistor mold processing, include: the transistor pin bending die comprises an upper die and a lower die for placing a transistor, wherein a platform capable of attaching the transistor pin in the extension direction is arranged on the lower die, a pressure groove is formed in the position, between two ends of the transistor pin, of the platform, and a jacking block for jacking the pressure groove and then bending the transistor pin is arranged on the upper die.

The platform includes: the transistor comprises a first platform for placing a transistor pin and a second platform for placing a transistor body, wherein a step is formed at the joint of the first platform and the first platform.

Preferably, the indent is disposed opposite to the bending point of the transistor pin.

Preferably, a notch is formed in the position, corresponding to the transistor pin, of the upper die, where the transistor body swings when the transistor pin is bent.

Furthermore, the cross section of one side of the indent, which is parallel to the length direction of the transistor pin, is in a V shape.

Preferably, the indent extends through opposite sides of the lower die.

The utility model also provides a punching machine uses above-mentioned transistor mold processing.

Compared with the prior art, the utility model discloses a just to the position between the transistor pin both ends on the platform with the indent setting, after the transistor is kept flat transistor pin spanes the indent and laminates with the platform, go up the profile that the mould pushed down the back transistor pin and correspond the indent and buckle, and the transistor body is buckled along with the transistor pin and is unrestricted towards the last free activity with opposite pressure direction, the transistor body is not influenced by the stress completely in the whole forming process, can not produce any stress of dragging to can not receive the injury in the machine-shaping in-process.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

FIG. 1 is a schematic view of a prior art mold;

fig. 2 is a schematic view of the forming of the mold according to the embodiment of the present invention;

fig. 3 is a schematic perspective view of the punching machine according to the embodiment of the present invention.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The principles and structure of the present invention will be described in detail below with reference to the accompanying drawings and examples.

As shown in fig. 2, the utility model provides a transistor processing grinding apparatus, include: go up mould 1 and

lower mould

2, 2 tops of lower mould are equipped with the platform of parallel placement transistor, the platform includes adjacent first platform and second platform, the height that highly is greater than the second platform of first platform makes and forms the step between first platform and the second platform, transistor body 32 keeps flat on the second platform, make the transistor pin 31 that sets up at transistor body 32 one end keep flat on first platform along length direction, and transistor pin 31 makes first platform can support transistor pin 31 completely with the laminating of first platform. The position, opposite to the bending point of the transistor pin 31, of the first platform is provided with a pressing groove 21, the upper die 1 is provided with a top block 11 matched with the contour of the pressing groove 21, the pressing groove 21 is arranged at the position, opposite to the position between two ends of the transistor pin 31, of the platform, when the transistor is flatly placed, the transistor pin 31 stretches across the pressing groove 21 and is attached to the first platform, the upper die 1 presses downwards to enable the top block 11 to be pressed into the pressing groove 21 of the first platform, the transistor pin 31 bends corresponding to the contour of the pressing groove 21, the transistor body 32 is not limited towards the upward free movement opposite to the pressure direction along with the bending of the transistor pin 31, the transistor body is not affected by stress completely in the whole forming process, and does not generate any pulling stress, so that the transistor body is not damaged in.

The utility model discloses in, one side of going up mould 1 and being close to transistor body 32 is equipped with the notch, and it is impaired with last mould collision when preventing transistor body 32 free swing upwards.

The utility model discloses in, indent 21 runs through the relative both sides of lower mould 2, makes the lower mould more convenient when processing the indent, and the indent is longer with transistor pin vertically length direction simultaneously, can put more transistors and carry out simultaneous processing.

In a specific embodiment, the cross section of the indent 21 and the side of the transistor pin 31 parallel to the axial direction are V-shaped, so that the transistor pin 31 can be bent corresponding to the V-shaped profile. Wherein, according to the concrete deflection of material, can set up the angle setting of V-arrangement opening between 35 to 60 degrees, and this numerical value all is in the protection scope of the utility model.

As shown in fig. 3, the present invention further provides a punching machine, which uses the transistor processing mold.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A transistor processing die, comprising: go up mould (1) and lower mould (2) of placing the transistor, be equipped with the platform that can place transistor pin (31) extension degree direction laminating on lower mould (2), the platform is just being equipped with indent (21) to the position between transistor pin (31) both ends, go up and be equipped with ejector pad (11) that make transistor pin (31) buckle after indent (21) are gone into in the top on mould (1).

2. The transistor fabrication tool of claim 1, wherein the platform comprises: the transistor comprises a first platform for placing a transistor pin (31) and a second platform for placing a transistor body (32), wherein a step is formed at the joint of the first platform and the first platform.

3. The transistor processing die of claim 1, wherein the indent (21) is disposed opposite to a bending point of the transistor pin (31).

4. The transistor processing die of claim 1, wherein the upper die (1) is provided with a notch corresponding to the swinging position of the transistor body (32) when the transistor pin (31) is bent.

5. The transistor processing die of claim 1, wherein the cross section of the side of the indent (21) parallel to the length direction of the transistor pin (31) is V-shaped.

6. The transistor processing die of claim 1, wherein the indent (21) extends through opposite sides of the lower die (2).

7. A punch press, characterized in that a transistor processing die according to any one of claims 1 to 6 is used.