CN210402254U

CN210402254U - Computer motherboard heat radiation structure

Info

Publication number: CN210402254U
Application number: CN201921911204.5U
Authority: CN
Inventors: 石建明
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-04-24
Anticipated expiration: 2029-11-07

Abstract

The utility model provides a computer motherboard heat radiation structure relates to computer technology field, which comprises a main board, the circular recess has been seted up to the lateral wall before the mainboard, the arc wall has been seted up to the inner wall of circular recess, the draw-in groove that two symmetries set up is seted up to the arc wall, the mainboard front side is equipped with fan body, the fixture block that two symmetries of lateral wall fixedly connected with set up behind the fan body, and seted up the card hole in the fixture block, the fixture block joint is inside the arc wall, the lateral wall is equipped with the installation component that two symmetries set up before the mainboard. The utility model discloses in, adopt the installation component, aim at the draw-in groove with the fixture block inside, then rotate the fan body, when fixture block and inserted bar contact, promote the inserted bar and shift up, then when the position in card hole, the inserted bar is because the elasticity of spring, inside the card hole is gone into to the card, realizes the work of installation, convenient operation, simple to use.

Description

Computer motherboard heat radiation structure

Technical Field

The utility model relates to a computer technology field especially relates to a computer motherboard heat radiation structure.

Background

The computer case mainboard is also called a mainboard, a system board or a motherboard; the computer motherboard is divided into a commercial motherboard and an industrial motherboard, is arranged in a case, is one of the most basic and important components of a microcomputer, is generally a rectangular circuit board, is provided with a main circuit system forming a computer, and needs to be subjected to heat dissipation in the working process of the computer motherboard.

A prior art section of thick bamboo adopts the fan to dispel the heat usually, but the fan adopts the bolt installation fixed usually when the installation, and the installation is comparatively inconvenient, consumes more time, and falls grey easily on the fan, causes certain influence to the use of fan easily.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a computer mainboard heat radiation structure.

In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a computer motherboard heat radiation structure, includes the mainboard, the circular recess has been seted up to the lateral wall before the mainboard, the arc wall has been seted up to the inner wall of circular recess, the draw-in groove that two symmetries set up is seted up to the arc wall lateral wall, the mainboard front side is equipped with fan body, the fixture block that two symmetries of fan body rear side wall fixedly connected with set up, and seted up the card hole in the fixture block, the fixture block joint is inside the arc, the lateral wall is equipped with the installation component that two symmetries set up before the mainboard.

Preferably, fan body front side is equipped with the heat dissipation nylon gauze, and the heat dissipation nylon gauze is close to one side lateral wall fixedly connected with sealing strip of fan body, and the first magic subsides of sealing strip one side lateral wall fixedly connected with.

Preferably, the mounting groove has been seted up to lateral wall before the fan body, mounting groove inner wall fixedly connected with second magic subsides, first magic subsides bond each other with the second magic subsides, the specification of first magic subsides and second magic subsides is the same.

Preferably, the installation component comprises a pull disc, the pull disc is close to the side wall of one end of the main board and fixedly connected with an inserted bar, the other end of the inserted bar is located in the arc-shaped groove and penetrates through the fixture block, and one end of the inserted bar is inclined.

Preferably, the inserted link is sleeved with a spring, one end of the spring is fixedly connected with the pull disc, the other end of the spring is fixedly connected with the main board, and the thread pitch of the spring is 2 mm.

Preferably, a plurality of horizontal heat dissipation strips and a plurality of vertical heat dissipation strips of circular recess inner wall fixedly connected with, horizontal heat dissipation strip and vertical heat dissipation strip set up perpendicularly, silica gel has all been paintd to the junction of horizontal heat dissipation strip, vertical heat dissipation strip and mainboard.

Advantageous effects

1. The utility model discloses in, adopt the installation component, aim at the draw-in groove with the fixture block inside, then rotate the fan body, when fixture block and inserted bar contact, promote the inserted bar and shift up, then when the position in card hole, the inserted bar is because the elasticity of spring, inside the card hole is gone into to the card, realizes the work of installation, convenient operation, simple to use.

2. The utility model discloses in, adopt heat dissipation nylon gauze, sealing strip, first magic subsides and the subsides of second magic, set up heat dissipation nylon gauze and realize dirt-proof effect, prevent inside the dust gets into the fan, avoid causing the influence to the heat dissipation.

Drawings

Fig. 1 is a three-dimensional structure diagram of a heat dissipation structure of a computer motherboard according to the present invention;

fig. 2 is a top view structural diagram of a heat dissipation structure of a computer motherboard according to the present invention;

FIG. 3 is a view showing a structure at A in FIG. 1;

fig. 4 is a main board internal structure diagram of a computer main board heat dissipation structure according to the present invention;

fig. 5 is a fan structure diagram of a heat dissipation structure of a computer motherboard according to the present invention.

Illustration of the drawings:

1. a main board; 2. a fan body; 3. a sealing strip; 4. a heat-dissipating nylon gauze; 5. a card slot; 6. an arc-shaped slot; 7. a circular groove; 8. mounting the component; 81. pulling the disc; 82. inserting a rod; 83. a spring; 9. a first magic tape; 10. a transverse heat dissipation strip; 11. a vertical heat dissipation strip; 12. a second magic tape; 13. and (7) clamping blocks.

Detailed Description

In order to make the technical means, the creation features, the achievement purposes and the functions of the present invention easy to understand, the present invention will be further explained below with reference to the following embodiments and the accompanying drawings, but the following embodiments are only the preferred embodiments of the present invention, and not all embodiments are included. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention.

Specific embodiments of the present invention will be described below with reference to the accompanying drawings.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

Referring to fig. 1-5, a computer motherboard heat radiation structure, including mainboard 1, circular slot 7 has been seted up to mainboard 1 front side wall, a plurality of horizontal heat dissipation strip 10 and a plurality of vertical heat dissipation strip 11 of circular slot 7 inner wall fixedly connected with, horizontal heat dissipation strip 10 and vertical heat dissipation strip 11 set up perpendicularly, horizontal heat dissipation strip 10, vertical heat dissipation strip 11 all scribble the silica gel with mainboard 1's junction, set up horizontal heat dissipation strip 10 and vertical heat dissipation strip 11 and realized radiating work, it has good heat dissipation heat conduction radiating effect to set up the silica gel.

Arc 6 has been seted up to the inner wall of circular slot 7, draw-in groove 5 that two symmetries set up is seted up to 6 lateral walls of arc, 1 front side of mainboard is equipped with

fan body

2, 2 front sides of fan body are equipped with heat dissipation nylon gauze 4, and heat dissipation nylon gauze 4 is close to one side lateral wall fixedly connected with sealing strip 3 of fan body 2, and the first magic of 3 one side lateral wall fixedly connected with of sealing strip 9, the mounting groove has been seted up to 2 front side walls of fan body, mounting groove inner wall fixedly connected with second magic subsides 12, first magic subsides 9 and the mutual bonding of second magic subsides 12, the specification of first magic subsides 9 and second magic subsides 12 is the same, adopt heat dissipation nylon gauze 4, sealing strip 3, first magic subsides 9 and second magic subsides 12, it realizes dirt-proof effect to set up heat dissipation nylon gauze 4, prevent that the dust from getting into 2 insides of fan.

Two symmetrically arranged clamping blocks 13 are fixedly connected to the rear side wall of the fan body 2, clamping holes are formed in the clamping blocks 13, the clamping blocks 13 are clamped inside the arc-shaped groove 6, two symmetrically arranged mounting assemblies 8 are arranged on the front side wall of the main board 1, each mounting assembly 8 comprises a pull disc 81, an inserting rod 82 is fixedly connected to the side wall of one end, close to the main board 1, of each pull disc 81, the other end of each inserting rod 82 is located inside the arc-shaped groove 6 and penetrates through the corresponding clamping block 13, one end of each inserting rod 82 is inclined, a spring 83 is sleeved on each inserting rod 82, one end of each spring 83 is fixedly connected with each pull disc 81, the other end of each spring 83 is fixedly connected with the main board 1, the thread pitch of each spring 83 is 2mm, the fan body 2 is rotated to rotate the clamping blocks 13 inside the arc-shaped grooves 6, when the clamping blocks 13 are in contact with the inserting rods 82, the inserting rods 82 are pushed to move upwards, and realizing the installation work.

The utility model discloses a theory of operation: when this fan body 2 of needs installation, aim at inside draw-in groove 5 with fixture block 13, then rotate fan body 2, rotate inside arc wall 6 with fixture block 13, when fixture block 13 and inserted bar 82 contact, promote inserted bar 82 and shift up, then when the position in card hole, inserted bar 82 is because the elasticity of spring 83, the card is gone into inside the card hole, realize the work of installation, high durability and convenient operation, high durability and convenient use, realize dirt-proof effect through setting up heat dissipation nylon gauze 4, prevent that the dust from getting into inside fan body 2, avoid causing the influence to the heat dissipation.

In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. A computer motherboard heat radiation structure, includes mainboard (1), its characterized in that: circular recess (7) have been seted up to mainboard (1) preceding lateral wall, arc wall (6) have been seted up to the inner wall of circular recess (7), draw-in groove (5) that two symmetries set up are seted up to arc wall (6) lateral wall, mainboard (1) front side is equipped with fan body (2), fixture block (13) that two symmetries of fan body (2) rear side wall fixedly connected with set up, and seted up the card hole in fixture block (13), fixture block (13) joint is inside arc wall (6), mainboard (1) preceding lateral wall is equipped with installation component (8) that two symmetries set up.

2. A computer motherboard heat dissipation structure as recited in claim 1, wherein: fan body (2) front side is equipped with heat dissipation nylon gauze (4), and heat dissipation nylon gauze (4) are close to one side lateral wall fixedly connected with sealing strip (3) of fan body (2), and the first magic subsides of sealing strip (3) one side lateral wall fixedly connected with (9).

3. A computer motherboard heat dissipation structure as recited in claim 2, wherein: the mounting groove has been seted up to lateral wall before fan body (2), mounting groove inner wall fixedly connected with second magic subsides (12), first magic subsides (9) bond each other with second magic subsides (12), the specification of first magic subsides (9) and second magic subsides (12) is the same.

4. A computer motherboard heat dissipation structure as recited in claim 1, wherein: installation component (8) are including drawing dish (81), and draw dish (81) to be close to mainboard (1) one end lateral wall fixedly connected with inserted bar (82), and the inserted bar (82) other end is located arc wall (6) and runs through fixture block (13) setting, and inserted bar (82) one end is the slope form.

5. The heat dissipation structure of a computer motherboard according to claim 4, wherein: the spring (83) is sleeved on the inserted bar (82), one end of the spring (83) is fixedly connected with the pull disc (81), the other end of the spring (83) is fixedly connected with the main board (1), and the thread pitch of the spring (83) is 2 mm.

6. A computer motherboard heat dissipation structure as recited in claim 1, wherein: circular recess (7) inner wall fixedly connected with a plurality of horizontal heat dissipation strip (10) and a plurality of vertical heat dissipation strip (11), horizontal heat dissipation strip (10) and vertical heat dissipation strip (11) set up perpendicularly, silica gel has all been paintd to the junction of horizontal heat dissipation strip (10), vertical heat dissipation strip (11) and mainboard (1).