CN210386956U - Punch forming phase change temperature-uniforming plate - Google Patents

Punch forming phase change temperature-uniforming plate Download PDF

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Publication number
CN210386956U
CN210386956U CN201921313638.5U CN201921313638U CN210386956U CN 210386956 U CN210386956 U CN 210386956U CN 201921313638 U CN201921313638 U CN 201921313638U CN 210386956 U CN210386956 U CN 210386956U
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China
Prior art keywords
protrusion
base plate
groove
cavity
phase change
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CN201921313638.5U
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黄晓峰
张尧
涂志龙
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Changzhou Hengchuang Thermal Management System Co.,Ltd.
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Changzhou Hengchuang Heat Management Co ltd
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Abstract

The utility model discloses a stamping forming phase transition samming board, it is including first base plate and the second base plate that covers each other and close, first base plate with be provided with the closed cavity between the second base plate, go towards keeping away from on the first base plate the direction of second base plate is sunken to be formed with the arch, correspond on the second base plate protruding court towards the direction of first base plate is sunken to be formed with the recess, protruding or the recess is used for laminating mutually with the heat source. The utility model discloses a stamping forming phase transition temperature-uniforming plate compares in traditional structure, goes to the direction of keeping away from the second base plate through first base plate and caves in and be formed with the arch, corresponds protruding orientation on the second base plate and caves in and be formed with the recess towards the direction of first base plate to make arch or recess and heat source directly, closely laminate, reduced the transmission thermal resistance, improved heat dispersion.

Description

Punch forming phase change temperature-uniforming plate
Technical Field
The utility model relates to a heat dissipation technical field especially, relates to a stamping forming phase transition samming board.
Background
With the rapid development of miniaturization, integration and high efficiency of power electronic equipment and devices, the performance and heat dissipation capacity of the devices are continuously increased, and the problems of uneven heat flow density distribution, extremely high local heat flow density, heat accumulation in local areas and overhigh local temperature are brought.
The existing phase-change temperature-uniforming plate is generally of a flat plate structure and is embedded and pressed in a channel of a substrate, a heat source is attached to the substrate, and heat is conducted to the phase-change temperature-uniforming plate through the substrate to dissipate heat; or the phase-change temperature-uniforming plate is directly attached to the heat source after being bent, and heat is conducted to the cavity of the phase-change temperature-uniforming plate through the bent part and dissipated through the surface of the temperature-uniforming plate. However, for a heat source with a specific shape, structure, position and layout, the structure of the existing temperature equalizing plate is difficult to be directly and tightly attached to the heat source, so that the transfer thermal resistance is increased, and the heat dissipation performance is remarkably reduced.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a punch-formed phase-change vapor chamber that is closely attached to the structure of the heat source.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a stamping forming phase transition temperature-uniforming plate, stamping forming phase transition temperature-uniforming plate is including the first base plate and the second base plate that each other approximately close, the first base plate with be provided with closed cavity between the second base plate, go towards keeping away from on the first base plate the direction of second base plate is sunken to be formed with the arch, correspond on the second base plate protruding towards the direction of first base plate is sunken to be formed with the recess, protruding or the recess is used for laminating mutually with the heat source.
Further, the protrusions include a first protrusion and a second protrusion, the grooves include a first groove and a second groove, the first protrusion corresponds to the first groove, the second protrusion corresponds to the second groove, the first protrusion and the second protrusion are located on the same side of the first substrate and have a height difference, and the first groove and the second groove are located on the same side of the second substrate and have a depth difference.
Further, a solid structure is arranged between the inner surface of the first bulge and the outer surface of the bottom wall of the first groove.
Further, a first cavity is arranged between the first substrate and the second substrate, a second cavity is formed between the inner surface of the first protrusion and the outer surface of the bottom wall of the first groove, the first cavity is communicated with the second cavity, and the closed cavity comprises the first cavity and the second cavity.
Further, the cross section of the protrusion is in a trapezoid shape, the angle between the side wall and the top wall of the protrusion is α, and α is more than or equal to 120 degrees and less than 180 degrees.
Further, be provided with the portion of bending between bellied lateral wall and the roof, the portion of bending is the circular arc structure, the radius of bending of the portion of bending is R, the thickness of stamping forming phase transition samming board is d, and R > 2.5 d.
Furthermore, the closed cavity is filled with a phase change working medium.
The utility model has the advantages that: the utility model provides a stamping forming phase transition temperature-uniforming plate compares in traditional structure, through the sunken arch that is formed with of the orientation of keeping away from the second base plate on the first base plate, correspond protruding orientation on the second base plate and be sunken towards the orientation of first base plate and be formed with the recess to make protruding or recess and heat source direct ground, closely laminate, reduced the transmission thermal resistance, improved heat dispersion, guaranteed different positions, different shapes and not high heat source can with protruding or recess fully contact.
Drawings
The present invention will be further explained with reference to the drawings and examples.
Fig. 1 is a schematic structural view of a first embodiment of the present invention before stamping a stamping-formed phase-change temperature-uniforming plate and a stamping die;
FIG. 2 is a schematic view of the punched and formed phase-change temperature-uniforming plate and the punching mold shown in FIG. 1 after punching and blowing;
FIG. 3 is a schematic view of the structure of the punch-formed phase-change temperature-uniforming plate shown in FIG. 1 cooperating with a heat source;
FIG. 4 is another schematic view of the punch-formed phase change vapor chamber of FIG. 1 in combination with a heat source;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
FIG. 6 is a flow chart of the processing method of the punch forming phase change uniform temperature plate of the present invention;
fig. 7 is a schematic structural view of a second embodiment of the present invention after the stamping of the stamping forming phase-change temperature-uniforming plate and the stamping die;
fig. 8 is a schematic structural view of the cooperation between the punch forming phase-change vapor chamber and the heat source according to the third embodiment of the present invention.
The names and the numbers of the parts in the figure are respectively as follows:
first substrate 1 second substrate 2 protrusions 3
First projection 31, second projection 32 and groove 4
First groove 41 second groove 42 first cavity 21
Second cavity 22 third cavity 23 first heat source 5
Second heat source 6 stamping die 20 first die 201
The second mold 202 has a first limiting groove 203 and a second limiting groove 204
First limiting bulge 205 and second limiting bulge 206 circuit board 7
Detailed Description
The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.
Referring to fig. 1 to 7, the present invention provides a blow molding phase change uniform temperature plate, which includes a first substrate 1 and a second substrate 2 covered with each other, a closed cavity is disposed between the first substrate 1 and the second substrate 2, and a phase change working medium is filled in the closed cavity. The first substrate 1 is concavely provided with a bulge 3 towards the direction far away from the second substrate 2, the second substrate 2 is concavely provided with a groove 4 corresponding to the bulge 3 towards the direction facing the first substrate, and the bulge 3 or the groove 4 is used for being attached to a heat source.
Example one
Referring to fig. 1 to 5, a first embodiment of the present invention provides a punch forming phase change vapor chamber, where the protrusion 3 includes a first protrusion 31 and a second protrusion 32, the groove 4 includes a first groove 41 and a second groove 42, the first protrusion 31 corresponds to the first groove 41, the second protrusion 32 corresponds to the second groove 42, the first protrusion 31 and the second protrusion 32 are located on the same side of the first substrate 1, and the first groove 41 and the second groove 42 are located on the same side of the second substrate 2.
In the present embodiment, the first cavity 21 is provided between the first substrate 1 and the second substrate 2, and the second cavity 22 communicating with the first cavity 21 is formed between the inner surface of the first protrusion 31 and the outer surface of the bottom wall of the first recess 41. A third cavity 23 communicated with the second cavity 22 is formed between the inner surface of the second protrusion 32 and the outer surface of the bottom wall of the second groove 42, the first cavity 21, the second cavity 22 and the third cavity 23 are communicated with each other, the first cavity 21, the second cavity 22 and the third cavity 23 jointly form a closed cavity, a capillary structure is arranged in the closed cavity, and phase-change working media are filled in the first cavity 21, the second cavity 22 and the third cavity 23. In the present embodiment, the height of the first protrusion 31 is higher than that of the second protrusion 32, and correspondingly, the depth of the first groove 41 is deeper than that of the second groove 42. It is understood that in other embodiments, the heights of the first protrusion 31 and the second protrusion 32 may be the same, and correspondingly, the depths of the first groove 41 and the second groove 42 may be the same.
Further, a flow path is formed on the first substrate 1 by an inflation process, and the second substrate 2 is a flat surface.
It is understood that in other embodiments, not shown, the protrusion 3 further includes a third protrusion or a fourth protrusion for a plurality of heat sources requiring heat dissipation, the recess 4 further includes a third recess or a fourth recess, and the number and positions of the protrusion 3 and the recess 4 are determined according to the number and positions of the heat sources, preferably, one protrusion 3 and one recess 4 are provided for each heat source requiring heat dissipation.
In this embodiment, two heat sources need to be dissipated, for example, the heat sources include a first heat source 5 and a second heat source 6 mounted on the circuit board 7, when the circuit board 7 is located on one side of the second substrate 2, the first heat source 5 is accommodated in the first recess 41 and attached to the outer surface of the bottom wall of the first recess 41, the second heat source 6 is accommodated in the second recess 42 and attached to the outer surface of the bottom wall of the second recess 42, the first recess 41 is used for dissipating heat from the first heat source 5, and the second recess 42 is used for dissipating heat from the second heat source 6; when the circuit board 7 is located on one side of the first substrate 1, the first heat source 5 is attached to the outer surface of the first protrusion 31, the second heat source 6 is attached to the outer surface of the second protrusion 32, the first protrusion 31 is used for dissipating heat of the first heat source 5, and the second protrusion 32 is used for dissipating heat of the second heat source 6.
Preferably, the first protrusion 31, the second protrusion 32, the first groove 41 and the second groove 42 are all in a square structure, and the positions of the first protrusion 31, the second protrusion 32, the first groove 41 and the second groove 42 correspond to the positions, shapes and heights of the first heat source 5 and the second heat source 6.
Based on this, please refer to fig. 1 to 6, the present invention further provides a processing method for processing the above punch forming phase change uniform temperature plate, which includes the following steps:
step S1: printing a resist, and printing a resist pattern on the first substrate 1.
Step S2: and hot rolling, namely covering the second substrate 2 on the first substrate 1 printed with the rolling inhibitor, and performing hot rolling on the two substrates to obtain the composite board.
Step S3: and pre-blowing, namely forming a process hole in the composite plate, introducing high-pressure gas into the process hole to perform pipeline blowing, wherein the first cavity 21 is formed between the first substrate 1 and the second substrate 2 through blowing, a second cavity 22 is formed between the inner surface of the first protrusion 31 and the outer surface of the bottom wall of the first groove 41, and a third cavity 23 is formed between the inner surface of the second protrusion 32 and the outer surface of the bottom wall of the second groove 42.
It will be appreciated that the tube pattern can be blown out by pre-blowing, so that the local position of the projections to be punched can be obtained.
Step S4: punching, load onto the punching machine with the composite sheet, be provided with stamping die 20 on the punching machine, stamping die 20 includes first mould 201 and second mould 202, load onto the composite sheet between first mould 201 and the second mould 202, mutually support through first mould 201 and second mould 202, carry out the punching press to make and form arch 3 and recess 4 on the composite sheet, arch 3 includes first arch 31, second arch 32, recess 4 includes first recess 41 and second recess 42. After punching, the second cavity 22 formed between the inner surface of the first protrusion 31 and the outer surface of the bottom wall of the first groove 41 is compressed, the third cavity 23 formed between the inner surface of the second protrusion 32 and the outer surface of the bottom wall of the second groove 42 is compressed, a solid structure is formed between the inner surface of the first protrusion 31 and the outer surface of the bottom wall of the first groove 41, and a solid structure is formed between the inner surface of the second protrusion 32 and the outer surface of the bottom wall of the second groove 42.
Furthermore, the cross sections of the protrusions 3 are all roughly trapezoidal, so that the protrusions are not easy to tear when blown, the angle between the side wall and the top wall of each protrusion 3 is α, 120 degrees or more and α or less and 180 degrees or less, in the present embodiment, α degrees or more and 150 degrees or less, a bent portion is arranged between the side wall and the top wall of each protrusion 3, the bent portion is in a circular arc structure, the bending radius of the bent portion is R (unit: mm), in addition, the thickness of the composite plate is d (unit: mm), wherein R is more than 2.5d, in the present embodiment, R is 3mm, and d is 9 mm.
Before stamping, a first limiting groove 203 and a second limiting groove 204 are formed in the first die 201, the position of the first limiting groove 203 corresponds to the position of the first protrusion 31, the position of the second limiting groove 204 corresponds to the position of the second protrusion 32, specifically, the depths of the first limiting groove 203 and the second limiting groove 204 are different, the depth of the first limiting groove 203 is matched with the height of the first protrusion 31, and the depth of the second limiting groove 204 is matched with the height of the second protrusion 32. A first limiting protrusion 205 and a second limiting protrusion 206 are formed on the second mold 202, the position of the first limiting protrusion 205 corresponds to the position of the first groove 41, the position of the second limiting protrusion 206 corresponds to the position of the second groove 42, specifically, the heights of the first limiting protrusion 205 and the second limiting protrusion 206 are different, the height of the first limiting protrusion 205 matches with the depth of the first groove 41, and the height of the second limiting protrusion 206 matches with the depth of the second groove 42.
In the stamping process, the first substrate 1 is provided with a part corresponding to the first limiting groove 203 and the second limiting groove 204, the first substrate 1 can extend into the first limiting groove 203 and the second limiting groove 204 due to the first limiting groove 203 and the second limiting groove 204, the surface of the first substrate 1 is attached to the first limiting groove 203, the surface of the first protrusion 31 is attached to the second limiting groove 204, the first limiting groove 203 forms the first protrusion 31, and the second limiting groove 204 forms the second protrusion 32. In the present embodiment, since the first stopper groove 203 and the second stopper groove 204 have different depths, the first projection 31 and the second projection 32 can have different heights. The portion of the second substrate 2 corresponding to the first limiting protrusion 205 and the second limiting protrusion 206 can make the second substrate 2 recessed inwards due to the first limiting protrusion 205 and the second limiting protrusion 206, the surface of the first substrate 1 is attached to the first limiting protrusion 205, the surface of the first groove 41 is attached to the second limiting protrusion 206, the first limiting protrusion 205 forms a first groove 41, and the second limiting protrusion 206 forms a second groove 42. In the present embodiment, since the first stopper protrusion 205 and the second stopper protrusion 206 have different heights, the first recess 41 and the second recess 42 can have different depths.
In the composite sheet after hot rolling and compounding, the flow path pattern is printed inside the composite sheet, but cannot be seen from the outside, so that the finally formed protrusion does not correspond to the flow path pattern and the expected punching position cannot be obtained because the punching die cannot be placed at the position of the flow path pattern. To solve this problem, a pre-blow operation is performed to obtain the local position of the protrusion to be punched when punching positioning is performed.
The step S1 is preceded by the following steps,
preparing materials, preparing two substrates, wherein in the embodiment, the two substrates are both aluminum plates, and the model of the aluminum plate is 3003.
The steps between the step S2 and the step S3 further include the steps,
and (4) leveling by cold rolling, wherein in order to ensure the flatness of the composite plate, the composite plate formed after hot rolling needs to be sent into a cold rolling mill for cold rolling treatment, and the composite plate after cold rolling is leveled. Meanwhile, the effect of adjusting the length of the finished product can be achieved through cold rolling operation. The hot rolled clad plate is elongated after rolling, but the elongation after hot rolling has an error, so the hot rolled clad plate is sorted according to length and is controlled to reach the expected length by cold rolling.
And (4) annealing treatment, namely conveying the rolled composite board into an annealing furnace, annealing at 600 ℃, and cooling. Through annealing treatment, the residual stress generated in the cold rolling and leveling process of the composite plate can be effectively reduced, and the deformation of the composite plate is avoided. In this embodiment, the composite panel is annealed after heating to 600 ℃.
The step S6 is followed by the following steps,
and secondary blowing, wherein the blowing can ensure that the inner surface of the first bulge 31 and the outer surface of the bottom wall of the first groove 41 are blown apart again to form the second cavity 22, and the inner surface of the second bulge 32 and the outer surface of the bottom wall of the second groove 42 are blown apart again to form the third cavity 23.
And trimming, namely trimming the composite plate according to the pattern and the size required by the process.
Filling phase change working medium and sealing, arranging a filling port communicated with the outside on the composite board, and welding a process connecting pipe connected with the filling port. The composite board is vacuumized and filled with the phase change working medium through the process connecting pipe, and the process connecting pipe is cut after welding or crimping sealing, so that the phase change working medium is sealed in the closed cavity, and the phase change uniform temperature board is obtained.
The utility model provides a stamping forming phase transition temperature-uniforming plate, compare in traditional structure, go to the protruding arch 3 that is equipped with of orientation that deviates from second base plate 2 on first base plate 1, second base plate 2 is gone to the concave recess 4 that is equipped with towards the orientation of first base plate 1, thereby make protruding 3 or recess 4 and heat source direct ground, closely laminate, the transmission thermal resistance has been reduced, heat dispersion has been improved, the heat source of different positions, different shapes and co-altitude can fully contact with arch 3 or recess 4.
Example two
Referring to fig. 7, the difference between the punch forming phase change vapor chamber provided in the second embodiment of the present invention and the punch forming phase change vapor chamber provided in the first embodiment of the present invention is: in the present embodiment, a solid structure is formed between the inner surface of the first projection 31 and the outer surface of the bottom wall of the first recess 41, and a solid structure is formed between the inner surface of the second projection 32 and the outer surface of the bottom wall of the second recess 42.
The embodiment of the utility model provides a processing of stamping forming phase transition temperature-uniforming plate and embodiment one's the processing method of stamping forming phase transition temperature-uniforming plate's difference lies in: in the present embodiment, the second inflation is not performed, so that a solid structure is formed between the inner surface of the first projection 31 and the outer surface of the bottom wall of the first groove 41, and a solid structure is formed between the inner surface of the second projection 32 and the outer surface of the bottom wall of the second groove 42.
The embodiment of the utility model provides a stamping forming phase transition samming board that second provided, be solid construction between the surface of the internal surface through first arch 31 and the diapire of first recess 41, be solid construction between the internal surface of the protruding 32 of second and the surface of the diapire of second recess 42, can realize protruding 3 or recess 4 and heat source directly ground equally, laminate closely, transfer thermal resistance has been reduced, heat dispersion has been improved, different positions have been guaranteed, different shapes and the heat source of co-altitude can fully contact with protruding 3 or recess 4.
EXAMPLE III
Referring to fig. 8, the difference between the punch forming phase change vapor chamber provided in the third embodiment of the present invention and the punch forming phase change vapor chamber provided in the first embodiment of the present invention is: in this embodiment, the first substrate 1 is a plane, and the second substrate 2 is formed with a flow path by a blowing process, so that the protrusion 3 is convexly disposed on the plane side of the phase-change temperature-uniforming plate.
The embodiment of the utility model provides a stamping forming phase transition samming board that three provided, first base plate 1 is the plane, forms the flow path through the inflation technology on the second base plate 2. The direct and close fit between the protrusion 3 or the groove 4 and the heat source can be realized, the transfer thermal resistance is reduced, the heat dissipation performance is improved, and the heat sources in different positions, different shapes and different heights can be fully contacted with the protrusion 3 or the groove 4.
In light of the foregoing, it will be apparent to those skilled in the art from this disclosure that various changes and modifications can be made without departing from the scope of the invention. The technical scope of the present invention is not limited to the content of the specification, and must be determined according to the scope of the claims.

Claims (7)

1. The utility model provides a stamping forming phase transition temperature-uniforming plate which characterized in that: the stamping forming phase change temperature-uniforming plate comprises a first base plate and a second base plate which are mutually covered, a closed cavity is arranged between the first base plate and the second base plate, the first base plate is far away from the direction of the second base plate, the direction of the second base plate is sunken to form a protrusion, the second base plate is provided with a groove corresponding to the protrusion, the direction of the protrusion towards the first base plate is sunken to form a groove, and the protrusion or the groove is used for being attached to a heat source.
2. The stamped phase change vapor chamber of claim 1, wherein: the protrusion comprises a first protrusion and a second protrusion, the groove comprises a first groove and a second groove, the first protrusion corresponds to the first groove, the second protrusion corresponds to the second groove, the first protrusion and the second protrusion are located on the same side of the first substrate and have a height difference, and the first groove and the second groove are located on the same side of the second substrate and have a depth difference.
3. The stamped phase change vapor chamber of claim 2, wherein: and a solid structure is arranged between the inner surface of the first bulge and the outer surface of the bottom wall of the first groove.
4. The stamped phase change vapor chamber of claim 2, wherein: a first cavity is arranged between the first substrate and the second substrate, a second cavity is formed between the inner surface of the first protrusion and the outer surface of the bottom wall of the first groove, the first cavity is communicated with the second cavity, and the closed cavity comprises the first cavity and the second cavity.
5. The punch-formed phase-change vapor chamber as defined in claim 1, wherein said protrusion has a trapezoidal cross-section, and an angle between a side wall and a top wall of said protrusion is α, 120 ° - α ° -180 °.
6. The stamped phase change vapor chamber of claim 5, wherein: be provided with the portion of bending between bellied lateral wall and the roof, the portion of bending is the circular arc structure, the radius of bending of the portion of bending is R, the thickness of stamping forming phase transition samming board is d, and R > 2.5 d.
7. The stamped phase change vapor chamber of claim 1, wherein: the closed cavity is filled with a phase change working medium.
CN201921313638.5U 2019-08-13 2019-08-13 Punch forming phase change temperature-uniforming plate Active CN210386956U (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110421001A (en) * 2019-08-13 2019-11-08 常州恒创热管理有限公司 A kind of punch forming phase transformation temperature-uniforming plate and processing method
CN112203470A (en) * 2020-09-18 2021-01-08 深圳市飞荣达科技股份有限公司 Three-dimensional heat dissipation plate and processing method thereof
WO2022166863A1 (en) * 2021-02-08 2022-08-11 浙江三花汽车零部件有限公司 Heat exchanger

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110421001A (en) * 2019-08-13 2019-11-08 常州恒创热管理有限公司 A kind of punch forming phase transformation temperature-uniforming plate and processing method
CN110421001B (en) * 2019-08-13 2023-10-24 常州恒创热管理有限公司 Phase-change temperature-equalizing plate formed by stamping and processing method
CN112203470A (en) * 2020-09-18 2021-01-08 深圳市飞荣达科技股份有限公司 Three-dimensional heat dissipation plate and processing method thereof
WO2022166863A1 (en) * 2021-02-08 2022-08-11 浙江三花汽车零部件有限公司 Heat exchanger

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Address after: 213176 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Patentee after: Changzhou Hengchuang Thermal Management System Co.,Ltd.

Country or region after: China

Address before: 213000 No.20, Jiandong Road, Lijia Town, Wujin District, Changzhou City, Jiangsu Province

Patentee before: CHANGZHOU HENGCHUANG HEAT MANAGEMENT Co.,Ltd.

Country or region before: China