CN210352006U - Heat dissipation shell for vehicle-mounted power amplifier - Google Patents
Heat dissipation shell for vehicle-mounted power amplifier Download PDFInfo
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- CN210352006U CN210352006U CN201921411088.0U CN201921411088U CN210352006U CN 210352006 U CN210352006 U CN 210352006U CN 201921411088 U CN201921411088 U CN 201921411088U CN 210352006 U CN210352006 U CN 210352006U
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- heat dissipation
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- power amplifier
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Abstract
The utility model provides a heat dissipation casing for on-vehicle power amplifier, include: the vehicle-mounted power amplifier comprises a heat dissipation upper shell, a heat dissipation lower shell, side covers and a chip radiator, wherein a main board of the vehicle-mounted power amplifier is arranged on the heat dissipation lower shell, the side covers are fixedly connected with the heat dissipation upper shell and the heat dissipation lower shell respectively, and the chip radiator is arranged on a power amplifier chip of the main board; the upper surface of the radiating upper shell is provided with one or more convex radiating convex strips, and the radiating convex strips surround a radiating channel with a radiating hole. The utility model realizes physical heat dissipation through the heat dissipation shell, and can lead hot air to flow through the heat dissipation channel without colliding through the structural design of the heat dissipation convex strips and the heat dissipation channel; when the local temperature is too high, hot gas can realize global flow along heat dissipation channel and thermovent, effectively solve the heat and can not evacuate toward the bypass pipe problem, and then effectively improved the radiating efficiency, satisfied on-vehicle power amplifier to radiating demand.
Description
Technical Field
The utility model relates to a vehicle-mounted power amplifier casing especially relates to a heat dissipation casing for vehicle-mounted power amplifier.
Background
The vehicle-mounted DSP power amplifier has the functions of other power amplifiers, can attenuate the frequency overlapped by the environment in the vehicle, add the frequency attenuated by the environment, adjust the distance between each loudspeaker in the vehicle and the human ear, and the like; the vehicle-mounted DSP power amplifier can adjust the defect that the physical adjustment in the vehicle cannot be realized. However, the vehicle-mounted DSP power amplifier generates large heat, and when the vehicle is in an application scene, the power amplifier is exposed to the sun outdoors and in a closed environment, so that the power amplifier is prone to poor heat dissipation and faults are caused, and the physical heat dissipation of the power amplifier is very important. The heat dissipation problem of the vehicle-mounted power amplifier in the prior art is not well solved, and some problems of unstable fixation and easy falling exist.
Disclosure of Invention
The utility model aims to solve the technical problem that a need provide a can effectively utilize structural design to improve the radiating efficiency be used for the radiating shell of on-vehicle power amplifier.
To this, the utility model provides a heat dissipation casing for on-vehicle power amplifier, include: the vehicle-mounted power amplifier comprises a heat dissipation upper shell, a heat dissipation lower shell, side covers and a chip radiator, wherein a main board of the vehicle-mounted power amplifier is arranged on the heat dissipation lower shell, the side covers are fixedly connected with the heat dissipation upper shell and the heat dissipation lower shell respectively, and the chip radiator is arranged on a power amplifier chip of the main board; the upper surface of the radiating upper shell is provided with one or more convex radiating convex strips, and the radiating convex strips surround a radiating channel with a radiating hole.
The utility model discloses a further improvement lies in, the heat dissipation sand grip encloses into G type heat dissipation channel.
The utility model discloses a further improvement lie in, adjacent thermovent crisscross set up in both ends about the casing on the heat dissipation.
The utility model discloses a further improvement lies in, including a plurality of fin on the chip radiator, including being provided with the insection on the fin.
The utility model discloses a further improvement lies in, the chip radiator pass through the silica gel subsides adorn in on the power amplifier chip of mainboard.
The utility model discloses a further improvement lies in, be provided with one or many recesses on the casing under the heat dissipation.
The utility model discloses a further improvement lies in, be provided with the through-hole under the heat dissipation on the casing.
The utility model discloses a further improvement lies in, be provided with the locating hole that the symmetry set up under the heat dissipation on the casing.
The utility model discloses a further improvement lies in, the casing includes heat dissipation drain pan, first side shell and second side shell under the heat dissipation, first side shell and second side shell set up respectively in two sides of casing under the heat dissipation, the one end of first side shell and second side shell be provided with respectively with the corresponding first mounting hole of side cap, be provided with on the side cap with the heat dissipation goes up the corresponding second mounting hole of casing.
The utility model discloses a further improvement lies in, be provided with the component window on the first side shell.
Compared with the prior art, the beneficial effects of the utility model reside in that: the heat dissipation device comprises a heat dissipation upper shell, a heat dissipation lower shell, a chip radiator and the like, so that physical heat dissipation is realized through the heat dissipation shell, one or more convex heat dissipation convex strips are arranged on the upper surface of the heat dissipation upper shell, a heat dissipation channel with a heat dissipation opening is defined by the heat dissipation convex strips, hot air can flow through the heat dissipation channel without colliding, and the heat dissipation channel is provided with a fixed heat dissipation opening; when the local temperature is too high, hot gas can realize global flow along heat dissipation channel and thermovent, effectively solves the problem that the heat can not evacuate toward the side pipeline, and then effectively improves the heat dissipation efficiency through structural design, and satisfies the demand of vehicle-mounted power amplifier for heat dissipation.
Drawings
Fig. 1 is a schematic diagram of an explosive structure according to an embodiment of the present invention;
fig. 2 is a schematic structural view of an upper heat dissipating housing according to an embodiment of the present invention;
fig. 3 is a schematic view of a partial cross-sectional structure of an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view of a chip heat sink according to an embodiment of the present invention;
fig. 5 is a schematic perspective view of an embodiment of the present invention.
Detailed Description
Preferred embodiments of the present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 to 5, this example provides a heat dissipation housing for a vehicle power amplifier, including: the vehicle-mounted power amplifier comprises a heat dissipation upper shell 1, a heat dissipation lower shell 2, side covers 3 and a chip radiator 4, wherein a main board 5 of the vehicle-mounted power amplifier is arranged on the heat dissipation lower shell 2, the side covers 3 are respectively and fixedly connected with the heat dissipation upper shell 1 and the heat dissipation lower shell 2, and the chip radiator 4 is arranged on a power amplifier chip of the main board 5; one or more convex radiating convex strips 101 are arranged on the upper surface of the radiating upper shell 1, and a radiating channel 103 with a radiating opening 102 is enclosed by the radiating convex strips 101.
In this embodiment, the upper heat dissipation housing 1, the lower heat dissipation housing 2, the side cover 3, and the chip heat sink 4 are all made of aluminum heat dissipation members, and are made of metal or other heat dissipation housings, so that the heat conduction performance is good, and further physical heat dissipation can be realized through the heat dissipation housings, and one or more protruding heat dissipation protruding strips 101 are arranged on the upper surface of the upper heat dissipation housing 1, and the heat dissipation protruding strips 101 surround a heat dissipation channel 103 having heat dissipation openings 102, as shown in fig. 1 and 3, so that hot air can flow through the heat dissipation channel 103 without colliding, and the heat dissipation openings 102 are fixed; when the local temperature is too high, the hot air flows globally along the heat dissipation channel 103 and the heat dissipation port 102, the problem that the heat cannot be evacuated to a side pipeline is effectively solved, the heat dissipation efficiency is further effectively improved through structural design, and the requirement of vehicle-mounted power amplifier on heat dissipation is met.
In this embodiment, the heat dissipation upper housing 1 is totally closed without holes in order to prevent dust from falling into the main body, and the concave-convex structure of the heat dissipation convex strips 101 is adopted to increase the heat dissipation area in order to increase the heat dissipation effect, and the structure is designed to form the heat dissipation channel 103 as a heat dissipation pipeline, so as to meet the heat dissipation requirement.
More preferably, as shown in fig. 1 and fig. 3, the heat dissipation ribs 101 in this embodiment form a G-shaped heat dissipation channel, that is, one heat dissipation rib 101 forms a G-shaped heat dissipation channel 103 in the middle, and the opening of the G-shaped heat dissipation channel is a fixed heat dissipation opening 102, so that the flow guidance of hot air can be realized more effectively, and the heat dissipation efficiency can be improved.
Still further, in this embodiment, the adjacent heat dissipation openings 102 are alternately disposed at the left and right ends of the heat dissipation upper housing 1, as shown in fig. 1, that is, one of the adjacent heat dissipation openings 102 is on the left side of the heat dissipation upper housing 1, and the other is on the right side of the heat dissipation upper housing 1, so that the two adjacent heat dissipation openings 102 can be prevented from being disposed at one position, and the problem of local overheating caused by hot air being conducted to the same position can be avoided.
As shown in fig. 1, the chip heat sink 4 of the present embodiment includes a plurality of heat dissipating fins 401, the number of the heat dissipating fins 401 is determined by the width of the chip heat sink 4, and generally does not exceed 10 fins, and as shown in fig. 4, the heat dissipating fins 401 include the serrations 402, and the heat dissipating fins 401 are preferably aluminum alloy fins, and the heat dissipating area is increased by adding the serrations 402 to each aluminum alloy fin, thereby further improving the heat dissipating efficiency.
In this embodiment, the chip heat spreader 4 is preferably attached to the power amplifier chip of the motherboard 5 through silica gel, so that the power amplifier chip can effectively utilize the heat conducted by the chip heat spreader 4.
As shown in fig. 3 and 5, the heat dissipation lower case 2 of the present embodiment is provided with one or more grooves 201, the grooves 201 are downward recessed grooves, and the grooves 201 are added to promote heat dissipation by utilizing air circulation.
As shown in fig. 3 and 5, the heat dissipation lower casing 2 of the present embodiment is provided with a through hole 202, so as to better realize the airflow inside the heat dissipation casing.
As shown in fig. 1 and 5, the heat dissipation lower housing 2 of this embodiment is provided with symmetrically arranged positioning holes 203, the number of the positioning holes 203 is preferably four, and the heat dissipation lower housing 2 is provided with four positioning holes 203, so that the fixing can be realized by screws and/or bands, and the problems of unstable fixing and easy falling in the prior art are solved.
The heat dissipation lower casing 2 in this embodiment includes a heat dissipation bottom casing 204, a first side casing 205 and a second side casing 206, the first side casing 205 and the second side casing 206 are respectively disposed on two side edges of the heat dissipation lower casing 2, one end of the first side casing 205 and one end of the second side casing 206 are respectively provided with a first mounting hole 207 corresponding to the side cover 3, and the side cover 3 is provided with a second mounting hole 301 corresponding to the heat dissipation upper casing 1. The reason for such a structural design is that the tolerance of the metal shell is not well controlled, which leads to low assembly efficiency, in this example, the two sides of the side cover 3 are both provided with first bending portions 302, the first bending portions 302 are provided with fixing holes, the fixing holes correspond to the first mounting holes 207, and the fixing between the heat dissipation lower shell 2 and the side cover 3 can be directly realized by screws and the like; in addition, a second bending portion 303 is also arranged at the upper end of the side cover 3, a second mounting hole 301 is formed in the second bending portion 303, and therefore the side cover 3 and the heat dissipation upper shell 1 can be fixed through screws and the like, and the assembly efficiency of the heat dissipation shell is effectively improved through the structural design.
As shown in fig. 5, the side cover 3 and the second side shell 206 are patterned with raised strips to increase the area for promoting heat dissipation, which is a preferred embodiment.
As shown in fig. 1, in this embodiment, a component window 208 is disposed on the first side shell 205, so as to facilitate the installation and design of the motherboard 5, and also facilitate the external connection of various interfaces on the motherboard 5. In this embodiment, the lower end of the main board 5 is preferably further provided with a mounting pin 501, so that a gap exists between the main board 5 and the heat dissipation lower housing 2, and the heat dissipation lower housing 2 is convenient to cooperate with the structure of the heat dissipation lower housing 2 to realize the heat dissipation and circulation of hot air.
The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the shape and structure of the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides a heat dissipation casing for on-vehicle power amplifier which characterized in that includes: the vehicle-mounted power amplifier comprises a heat dissipation upper shell, a heat dissipation lower shell, side covers and a chip radiator, wherein a main board of the vehicle-mounted power amplifier is arranged on the heat dissipation lower shell, the side covers are fixedly connected with the heat dissipation upper shell and the heat dissipation lower shell respectively, and the chip radiator is arranged on a power amplifier chip of the main board; the upper surface of the radiating upper shell is provided with one or more convex radiating convex strips, and the radiating convex strips surround a radiating channel with a radiating hole.
2. The heat dissipation casing for a vehicle-mounted power amplifier according to claim 1, wherein the heat dissipation ribs surround a G-shaped heat dissipation channel.
3. The heat dissipation casing for a vehicle power amplifier according to claim 1, wherein adjacent heat dissipation ports are alternately disposed at left and right ends of the heat dissipation upper casing.
4. The heat dissipation casing for a vehicle-mounted power amplifier according to any one of claims 1 to 3, wherein the chip heat sink comprises a plurality of heat dissipation fins, and the heat dissipation fins comprise insections.
5. The heat dissipation casing for a vehicle-mounted power amplifier according to any one of claims 1 to 3, wherein the chip heat sink is attached to the power amplifier chip of the main board through silica gel.
6. The heat dissipation casing for a vehicle-mounted power amplifier according to any one of claims 1 to 3, wherein one or more grooves are formed on the heat dissipation lower casing.
7. The heat dissipation casing for a vehicle-mounted power amplifier according to any one of claims 1 to 3, wherein a through hole is formed in the heat dissipation lower casing.
8. The heat dissipation casing for a vehicle-mounted power amplifier according to any one of claims 1 to 3, wherein the heat dissipation lower casing is provided with symmetrically arranged positioning holes.
9. The heat dissipation casing for a vehicle power amplifier according to any one of claims 1 to 3, wherein the heat dissipation lower casing comprises a heat dissipation bottom casing, a first side casing and a second side casing, the first side casing and the second side casing are respectively disposed at two side edges of the heat dissipation lower casing, one end of the first side casing and one end of the second side casing are respectively provided with a first mounting hole corresponding to the side cover, and the side cover is provided with a second mounting hole corresponding to the heat dissipation upper casing.
10. The heat dissipating housing for a vehicle power amplifier according to claim 9, wherein a component window is provided on the first side housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921411088.0U CN210352006U (en) | 2019-08-28 | 2019-08-28 | Heat dissipation shell for vehicle-mounted power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921411088.0U CN210352006U (en) | 2019-08-28 | 2019-08-28 | Heat dissipation shell for vehicle-mounted power amplifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210352006U true CN210352006U (en) | 2020-04-17 |
Family
ID=70176593
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921411088.0U Active CN210352006U (en) | 2019-08-28 | 2019-08-28 | Heat dissipation shell for vehicle-mounted power amplifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210352006U (en) |
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2019
- 2019-08-28 CN CN201921411088.0U patent/CN210352006U/en active Active
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