CN210351933U - Sealing structure of circuit board - Google Patents
Sealing structure of circuit board Download PDFInfo
- Publication number
- CN210351933U CN210351933U CN201920927465.XU CN201920927465U CN210351933U CN 210351933 U CN210351933 U CN 210351933U CN 201920927465 U CN201920927465 U CN 201920927465U CN 210351933 U CN210351933 U CN 210351933U
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- circuit board
- sealing
- accommodating cavity
- sealing element
- opening
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Abstract
The utility model discloses a sealing structure of a circuit board, which comprises a container, a circuit board, a wire harness, a first sealing element and a second sealing element; the container is provided with an accommodating cavity, the circuit board is placed in the accommodating cavity, and the wire harness penetrates through an opening of the accommodating cavity and is electrically connected to the circuit board; the first sealing element is matched with a space between the circuit board and the inner wall of the accommodating cavity in an filling manner and covers the connection part of the circuit board and the wire harness; the second sealing element is in sealing fit with the opening of the accommodating cavity and is in seamless connection with the first sealing element. The sealing device has the advantages that the first sealing element and the second sealing element are arranged, so that the sealing property between the circuit board and the container is enhanced; and the first sealing element and the second sealing element are formed by twice glue filling in production, so that the production quality of the existing filling and sealing process can be improved, particularly the sealing treatment effect of the miniature circuit board is improved, and the waterproof and dustproof sealing effect of the container is improved.
Description
Technical Field
The utility model relates to an industry assembly field especially indicates a seal structure of circuit board.
Background
In industrial application, many products with circuit boards have strict sealing requirements on circuit board parts due to practical application requirements, and the sealing performance of the circuit boards is normally realized by adopting an encapsulation or low-pressure injection molding process. The technical difficulties of the potting process are that bubbles are generated in the process, and air gaps are generated between the cured epoxy glue and a container of the circuit board, so that the sealing effect is poor, and moisture/dust enters the circuit board to influence the product performance. Especially for the sealing of a small circuit board, due to the space problem, the functional problems of uneven encapsulation, poor air tightness, even influence on the service performance of the product and the like are easily caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a seal structure of circuit board can improve the sealing performance of circuit board container, is particularly useful for microminiature circuit board, improves the production quality of embedment technology.
In order to achieve the above purpose, the solution of the present invention is:
a sealing structure of a circuit board includes a container, a circuit board, a wire harness, a first sealing member and a second sealing member; the container is provided with an accommodating cavity, the circuit board is placed in the accommodating cavity, and the wire harness penetrates through an opening of the accommodating cavity and is electrically connected to the circuit board; the first sealing element is matched with a space between the circuit board and the inner wall of the accommodating cavity in an filling manner and covers the connection part of the circuit board and the wire harness; the second sealing element is in sealing fit with the opening of the accommodating cavity and is in seamless connection with the first sealing element.
A circle of sloping platforms are arranged at the opening of the accommodating cavity along the circumferential direction of the opening, and the aperture of each sloping platform is gradually increased along the direction from inside to outside of the accommodating cavity; the surface of the first sealing piece at the opening of the accommodating cavity does not exceed the bottom end of the inclined table.
The surface of the second sealing piece protrudes outwards along the direction departing from the accommodating cavity to form a convex surface.
The first sealing element and the second sealing element are both made of epoxy resin.
After the structure is adopted, the sealing performance between the circuit board and the container is enhanced by arranging the first sealing element and the second sealing element; and the first sealing element and the second sealing element are formed by twice glue filling in production, so that the production quality of the existing filling and sealing process can be improved, particularly the sealing treatment effect of the miniature circuit board is improved, and the waterproof and dustproof sealing effect of the container is improved.
Drawings
FIG. 1 is a cross-sectional view of an embodiment of the present invention;
FIG. 2 is a perspective view of a container according to an embodiment of the present invention;
FIG. 3 is a cross-sectional view of an embodiment of the present invention before glue is applied to form a first seal;
fig. 4 is a cross-sectional view of the embodiment of the present invention before glue is poured to form the second sealing member.
The reference numbers illustrate: a container 1; an accommodating chamber 11; a ramp 12; a circuit board 2; a wire harness 3; a first seal member 4; a second seal 5; a convex surface 51.
Detailed Description
In order to further explain the technical solution of the present invention, the present invention is explained in detail by the following embodiments.
Referring to fig. 1 to 4, the present invention relates to a sealing structure of a circuit board, which is particularly suitable for a micro circuit board, and comprises a container 1, a circuit board 2, a wire harness 3, a first sealing member 4 and a second sealing member 5.
The container 1 is formed with an accommodating cavity 11, the circuit board 2 is placed in the accommodating cavity 11, and the wire harness 3 penetrates through an opening of the accommodating cavity 11 and is electrically connected to the circuit board 2. The first sealing member 4 is fitted into a space between the circuit board 2 and the inner wall of the accommodating chamber 11, and covers a joint between the circuit board 2 and the wire harness 3. The second sealing element 5 is in sealing fit with the opening of the accommodating cavity 11 and is in seamless connection with the first sealing element 4.
The first sealing member 4 and the second sealing member 5 are made of epoxy resin.
A circle of sloping platforms 12 are arranged at the opening of the accommodating cavity 11 along the circumferential direction of the opening, and the aperture of the sloping platforms 12 is gradually increased along the direction from inside to outside of the accommodating cavity 11. The surface of the first sealing element 4 at the opening of the accommodating cavity 11 does not exceed the bottom end of the inclined platform 12. The surface of the second sealing element 5 is convex in the direction away from the receiving chamber 11 to form a convex surface 51.
With the structure, in practical production, the first sealing element 4 and the second sealing element 5 are produced and formed by a potting process, and the method comprises the following specific steps:
①, the circuit board 2 and the wiring harness 3 are connected and placed in the housing chamber 11 of the container 1 as shown in fig. 3.
② first gluing, namely, uniformly injecting the uniformly mixed epoxy resin into the bottom of the accommodating cavity 11 at a constant speed by adhering an ultrathin needle tube to the inner wall of the accommodating cavity 11, controlling the glue amount by a glue dispenser to ensure that the glue amount does not exceed the bottom end of the inclined table 12, taking the inclined table 12 as a glue amount precaution line for the first gluing, standing at normal temperature for 30-50min, and curing the first glue to form a first sealing element 4, wherein the structure of the first sealing element is shown in FIG. 4, and bubbles are fully discharged in the standing process.
④ applying glue for the second time, injecting epoxy resin into the opening of the cavity 11 again, controlling the glue amount by a glue dispenser to make the glue surface exceed the opening plane of the cavity 11, standing for curing, and curing the glue for the second time to form a second sealing member 5. due to the tension of the container 1 and the glue surface, the second sealing member 5 completely covers the opening of the cavity 11, and the surface thereof protrudes outwards to form the convex surface 51.
Through the structure, the sealing performance between the circuit board 2 and the container 1 is enhanced by arranging the first sealing element 4 and the second sealing element 5; and the first sealing element 4 and the second sealing element 5 are formed by twice glue filling in production, so that the production quality of the existing filling and sealing process can be improved, particularly the sealing treatment effect of the miniature circuit board 2 is improved, and the waterproof and dustproof sealing effect of the container 1 is improved.
The above embodiments and drawings are not intended to limit the form and style of the present invention, and any suitable changes or modifications made by those skilled in the art should not be construed as departing from the scope of the present invention.
Claims (4)
1. A sealing structure of a circuit board is characterized in that: comprises a container, a circuit board, a wire harness, a first sealing member and a second sealing member; the container is provided with an accommodating cavity, the circuit board is placed in the accommodating cavity, and the wire harness penetrates through an opening of the accommodating cavity and is electrically connected to the circuit board; the first sealing element is matched with a space between the circuit board and the inner wall of the accommodating cavity in an filling manner and covers the connection part of the circuit board and the wire harness; the second sealing element is in sealing fit with the opening of the accommodating cavity and is in seamless connection with the first sealing element.
2. A sealing structure of a circuit board according to claim 1, wherein: a circle of sloping platforms are arranged at the opening of the accommodating cavity along the circumferential direction of the opening, and the aperture of each sloping platform is gradually increased along the direction from inside to outside of the accommodating cavity; the surface of the first sealing piece at the opening of the accommodating cavity does not exceed the bottom end of the inclined table.
3. A sealing structure of a circuit board according to claim 1, wherein: the surface of the second sealing piece protrudes outwards along the direction departing from the accommodating cavity to form a convex surface.
4. A sealing structure of a circuit board according to any one of claims 1 to 3, wherein: the first sealing element and the second sealing element are both made of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920927465.XU CN210351933U (en) | 2019-06-19 | 2019-06-19 | Sealing structure of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920927465.XU CN210351933U (en) | 2019-06-19 | 2019-06-19 | Sealing structure of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210351933U true CN210351933U (en) | 2020-04-17 |
Family
ID=70186677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920927465.XU Active CN210351933U (en) | 2019-06-19 | 2019-06-19 | Sealing structure of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210351933U (en) |
-
2019
- 2019-06-19 CN CN201920927465.XU patent/CN210351933U/en active Active
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