CN210325745U

CN210325745U - SMT paster packaging structure

Info

Publication number: CN210325745U
Application number: CN201921534590.0U
Authority: CN
Inventors: 李存芝
Original assignee: Shenzhen Jieshuncheng Technology Co Ltd
Current assignee: Shenzhen Jieshuncheng Technology Co Ltd
Priority date: 2019-09-16
Filing date: 2019-09-16
Publication date: 2020-04-14
Anticipated expiration: 2029-09-16

Abstract

The utility model discloses a SMT paster packaging structure, comprising a base plate, be close to the top fixedly connected with stand at its edge on the bottom plate, the top fixedly connected with roof of stand, the both ends of roof an organic whole is formed with the cardboard, the through-hole has been seted up at the middle part of roof, wear to be equipped with the rubber post in the through-hole, the bottom fixedly connected with lifter of rubber post, the fixed section of thick bamboo of middle part fixedly connected with at bottom plate top, the inner wall of fixed section of thick bamboo and the outer wall sliding connection of lifter. The utility model discloses, when fixed semiconductor, upwards lift up the second fixed axle, through the counterbalance effect of guide post and guide way, drive the lifter and move down, then the rubber post moves down along the through-hole, after then with the semiconductor card in the inboard of cardboard, then loosen behind the second fixed axle, the torsional spring resets, drives the lifter and moves up, the top of rubber post supports the bottom surface of semiconductor for the semiconductor is fixed, the effectual semiconductor skew that has prevented, improvement welding quality.

Description

SMT paster packaging structure

Technical Field

The utility model relates to the field of semiconductor technology, specifically be a SMT paster packaging structure.

Background

In the semiconductor device packaging process, need to weld electronic component on semiconductor device, prior art during the welding, at first place the semiconductor on the plane, then with the electric iron point tin with electronic component welding on semiconductor device, sometimes because the molten tin has certain viscidity, even if the viscidity is not very big, but when breaking away from electric iron head and semiconductor device, can drive semiconductor device and move, shift, and then cause the welding deviation, influence the welded quality, so need to design a fixing device, fix semiconductor device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a SMT paster packaging structure possesses fixed effectual, the swift advantage of convenient operation, has solved the problem of proposing in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a SMT paster packaging structure, includes the bottom plate, be close to its marginal top fixedly connected with stand on the bottom plate, the top fixedly connected with roof of stand, the both ends of roof an organic whole is formed with the cardboard, the through-hole has been seted up at the middle part of roof, wear to be equipped with the rubber column in the through-hole, the bottom fixedly connected with lifter of rubber column, the solid fixed cylinder of middle part fixedly connected with at bottom plate top, the inner wall of solid fixed cylinder and the outer wall sliding connection of lifter, the inboard swivelling joint of stand has lifts the pressure mechanism.

Preferably, the pressure lifting mechanism comprises a first fixing shaft, the end of the first fixing shaft is fixedly connected with the inner side of the upright column, a rotating plate is rotatably connected to the surface of the first fixing shaft, a torsion spring is sleeved on the surface of the first fixing shaft, one end of the torsion spring is fixedly connected with the surface of the upright column, and the other end of the torsion spring is fixedly connected with the inner side of the rotating plate.

Preferably, the inner side of one end of the rotating plate is fixedly connected with a second fixing shaft, the surface of the other end, far away from the second fixing shaft, of the rotating plate is provided with a guide groove, the outer wall of the lifting rod is fixedly connected with a guide post, and the outer wall of the guide post is abutted to the inner wall of the guide groove.

Preferably, the bottom of the rubber column is sleeved with the top of the lifting rod.

Preferably, a gasket is adhered to the bottom side of the clamping plate.

Compared with the prior art, the beneficial effects of the utility model are as follows: the utility model discloses, when fixed semiconductor, upwards lift up the second fixed axle, through the counterbalance effect of guide post and guide way, drive the lifter and move down, so the rubber post moves down along the through-hole, after then with the semiconductor card in the inboard of cardboard, then loosen behind the second fixed axle, the torsional spring resets, drive the lifter and move up, the top of rubber post supports the bottom surface of semiconductor for the semiconductor is fixed, the effectual emergence of taking place the skew when having stopped the semiconductor welding, moving the phenomenon improves welded precision and quality.

Drawings

Fig. 1 is a schematic structural view of a top plate perspective view of the present invention;

FIG. 2 is a schematic structural view of a perspective view of the rotating plate of the present invention;

FIG. 3 is a schematic structural view of a perspective view of the fixing cylinder of the present invention;

fig. 4 is a schematic structural diagram of a top view of the top plate of the present invention;

fig. 5 is a schematic structural view of the present invention along the sectional view a-a in fig. 4;

fig. 6 is a schematic structural view of a cross-sectional view when the rotating plate is lifted.

In the figure: the device comprises a base plate 1, a stand column 2, a top plate 3, a clamping plate 4, a through hole 5, a rubber column 6, a lifting rod 7, a fixing cylinder 8, a pressure lifting mechanism 9, a first fixing shaft 10, a rotating plate 11, a torsion spring 12, a second fixing shaft 13, a guide groove 14, a guide column 15 and a gasket 16.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1 to 6, the present invention provides a technical solution: an SMT chip packaging structure comprises a bottom plate 1, wherein a vertical column 2 is fixedly connected to the top of the bottom plate 1 close to the edge of the bottom plate, a top plate 3 is fixedly connected to the top end of the

vertical column

2, 4 vertical columns 2 are arranged in the embodiment, clamping plates 4 are integrally formed at two ends of the top plate 3, the clamping plates 4 clamp two ends of a semiconductor, a through hole 5 is formed in the middle of the top plate 3, a rubber column 6 penetrates through the through hole 5, a lifting rod 7 is fixedly connected to the bottom end of the rubber column 6, a fixing cylinder 8 is fixedly connected to the middle of the top of the bottom plate 1, the inner wall of the fixing cylinder 8 is in sliding connection with the outer wall of the lifting rod 7, a lifting mechanism 9 is rotatably connected to the inner side of the vertical column 2, the lifting mechanism 9 drives the rubber column 6 to lift, the rubber column 6 abuts against the bottom surface of the semiconductor when lifting, the semiconductor is fixed, for example, ethylene propylene rubber can resist 150 ℃; the silica gel can resist 200 ℃; the fluorine glue can resist 240 ℃, the perfluoroether can resist 320 ℃ and the like, and when the rubber column 6 descends, the semiconductor can be drawn out from the inner side of the clamping plate 4.

Specifically, the lifting mechanism 9 includes a first fixing shaft 10, an end of the first fixing shaft 10 is fixedly connected to the inner side of the upright 2, a rotating plate 11 is rotatably connected to the surface of the first fixing shaft 10, a torsion spring 12 is sleeved on the surface of the first fixing shaft 10, one end of the torsion spring 12 is fixedly connected to the surface of the upright 2, the other end of the torsion spring 12 is fixedly connected to the inner side of the rotating plate 11, the rotating plate 11 is normally in a state as shown in fig. 5, when the rotating plate 11 is lifted upwards as shown in fig. 6, the torsion spring 12 is twisted, and when the rotating plate 11 is released, the torsion spring 12 drives the rotating plate 11 to return to the original position.

The inner side of one end of the rotating plate 11 is fixedly connected with a second fixing shaft 13, the rotating plate 11 is conveniently driven to rotate by lifting the second fixing shaft 13, a guide groove 14 is formed in the surface of the other end, far away from the second fixing shaft 13, of the rotating plate 11, a guide post 15 is fixedly connected to the outer wall of the lifting rod 7, the outer wall of the guide post 15 abuts against the inner wall of the guide groove 14, when the second fixing shaft 13 is lifted to conveniently drive the rotating plate 11 to rotate upwards, the guide groove 14 abuts against the guide post 15, the lifting rod 7 fixedly connected with the guide post 15 is driven to move downwards, the rubber post 6 moves downwards, after the second fixing shaft 13 is loosened, the rotating plate 11 resets, the lifting rod 7 moves upwards, and the rubber post 6 also moves upwards.

Further, the bottom of rubber column 6 cup joints with the top of lifter 7, conveniently dismantles and changes rubber column 6.

Further, a gasket 16 is adhered to the bottom side of the card board 4, so that a protection effect is achieved, and the edge of the semiconductor is prevented from being crushed.

The working principle is as follows: when the SMT chip packaging structure is used, the second fixing shaft 13 is lifted at first to conveniently drive the rotating plate 11 to rotate upwards, the guide groove 14 abuts against the guide post 15, the lifting rod 7 fixedly connected with the guide post 15 is driven to move downwards, then the rubber post 6 moves downwards, a semiconductor is inserted into the inner side of the clamping plate 4, after the second fixing shaft 13 is loosened, the torsion spring 12 drives the rotating plate 11 to return to the original position, and the rubber post 6 moves upwards to abut against the bottom surface of the semiconductor, so that the semiconductor is fixed.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An SMT paster packaging structure, includes bottom plate (1), its characterized in that: the novel lifting and pressing mechanism is characterized in that a stand column (2) is fixedly connected to the top of the bottom plate (1) close to the edge of the bottom plate, a top plate (3) is fixedly connected to the top of the stand column (2), clamping plates (4) are integrally formed at two ends of the top plate (3), a through hole (5) is formed in the middle of the top plate (3), a rubber column (6) is arranged in the through hole (5) in a penetrating mode, a lifting rod (7) is fixedly connected to the bottom end of the rubber column (6), a fixing cylinder (8) is fixedly connected to the middle of the top of the bottom plate (1), the inner wall of the fixing cylinder (8) is connected with the outer wall of the lifting rod (7) in a sliding mode.

2. An SMT patch package structure according to claim 1, wherein: the lifting and pressing mechanism (9) comprises a first fixing shaft (10), the end portion of the first fixing shaft (10) is fixedly connected with the inner side of the upright post (2), a rotating plate (11) is connected to the surface of the first fixing shaft (10) in a rotating mode, a torsion spring (12) is sleeved on the surface of the first fixing shaft (10), one end of the torsion spring (12) is fixedly connected with the surface of the upright post (2), and the other end of the torsion spring (12) is fixedly connected with the inner side of the rotating plate (11).

3. An SMT patch package structure according to claim 2, wherein: the inner side of one end of the rotating plate (11) is fixedly connected with a second fixing shaft (13), the surface of the other end, far away from the second fixing shaft (13), of the rotating plate (11) is provided with a guide groove (14), the outer wall of the lifting rod (7) is fixedly connected with a guide column (15), and the outer wall of the guide column (15) is abutted to the inner wall of the guide groove (14).

4. An SMT patch package structure according to claim 1, wherein: the bottom of the rubber column (6) is sleeved with the top of the lifting rod (7).

5. An SMT patch package structure according to claim 1, wherein: and a gasket (16) is adhered to the bottom side of the clamping plate (4).