CN210324022U

CN210324022U - Compact 5U reinforcing server

Info

Publication number: CN210324022U
Application number: CN201921549863.9U
Authority: CN
Inventors: 王永战
Original assignee: Hefei Hengyan Intelligent Technology Co ltd
Current assignee: Hefei Hengyan Intelligent Technology Co ltd
Priority date: 2019-09-17
Filing date: 2019-09-17
Publication date: 2020-04-14
Anticipated expiration: 2029-09-17

Abstract

The utility model provides a compact 5U reinforced server, which divides a case into an upper cavity structure and a lower cavity structure; the fixed radiating block is fixedly arranged on the radiating partition plate; the lower end of the heat conducting piece is connected with the main board assembly in a positioning way, and the upper end of the heat conducting piece penetrates through the heat radiating partition plate and then is connected with the fixed heat radiating block in a positioning way; the power supply assembly passes through the heat dissipation partition plate and is connected with the fixed heat dissipation block in a positioning way; the fans are oppositely arranged on two side edges of the case of the upper-layer cavity structure to form an air channel, so that heat conduction and heat dissipation of the counterweight heat mounting assembly are realized respectively; through setting up independent wind channel, reduced the dust of internal plant and gathered, dustproof and waterproof effect is better. The utility model discloses when realizing each unit mount, still improved the box that quick-witted case and heat dissipation baffle connect into greatly, realize still strengthening mainboard subassembly and power supply module when to mainboard subassembly radiating, improved complete machine anti-vibration, shock resistance greatly, novel structure.

Description

Compact 5U reinforcing server

Technical Field

The utility model relates to a consolidate server technical field, concretely relates to server is consolidated to 5U of compact.

Background

At present, for example, in the fields of national defense, traffic, news, geology, medical treatment, mining, fire fighting, rescue and the like, the demand for the vehicle-mounted reinforcement server is great. Due to the particularity of the working environment, the vehicle-mounted server is required to have strong processing capacity, good EMC performance, vibration resistance, shock resistance and the like, and can adapt to environments of high and low temperature, damp and hot, high dust and the like, but the commercial computer which is popular in the market at present does not have the performance. Present 5U consolidates server is the square box structure of high individual layer usually, and the part of quick-witted incasement arranges in the square box structure of individual layer, because present 5U consolidates the fan that the server generally adopted the unilateral to dispel the heat to the internals, because the quick-witted incasement has each installation component to separate the fender, especially key installation component (CPU and GPU), radiating effect and dustproof effect are not good, await the improvement urgently.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a compact's 5U consolidates server aims at optimizing 5U at present stage and consolidates the heat radiation structure of part overall installation structure and key installing component of server.

In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:

a compact type 5U reinforced server comprises a heat dissipation assembly, a main board assembly, a hard disk assembly and a power supply assembly which are positioned in a case; the heat dissipation assembly comprises a heat dissipation partition plate, a heat conduction piece, a fixed heat dissipation block and a fan; the heat dissipation partition plate is fixedly arranged on a fixed support plate in the middle of the case, so that the case is divided into an upper layer cavity structure and a lower layer cavity structure; the fixed heat dissipation block is fixedly arranged on the heat dissipation partition plate; the mainboard assembly, the hard disk assembly and the power supply assembly are positioned at the bottom of the case of the lower-layer cavity structure at intervals; the lower end of the heat conducting piece is connected with the main board assembly in a positioning mode, and the upper end of the heat conducting piece penetrates through the heat radiating partition plate and then is connected with the fixed heat radiating block in a positioning mode; the power supply assembly penetrates through the heat dissipation partition plate to be connected with the fixed heat dissipation block in a positioning mode; the fans are oppositely arranged on two side edges of the case of the upper-layer cavity structure to form an air channel.

Optionally, an upper cover is further provided; the upper cover is arranged at an upper opening of the case; the upper cover is detachably and fixedly connected with the case through a set screw, so that the installation of the whole closed box body of the reinforcing server is realized.

Optionally, the main plate assembly comprises a main plate and a supporting bulkhead; the supporting partition plate is vertically arranged at the rear part of the lower-layer cavity structure, so that the aerial plug connector at the rear end of the case is isolated; the upper end of the supporting partition plate is fixedly connected with the heat dissipation partition plate, and the lower end of the supporting partition plate is fixedly connected with the bottom of the case; one side edge of the main board is fixedly connected with the side edge of the supporting partition board, so that the supporting board is reinforced to be positioned and installed.

Optionally, the hard disk assembly is arranged on the front side of the chassis; the hard disk assembly comprises a hard disk and a bracket; the bracket covers the hard disk and is connected to the bottom of the case through the bracket in a positioning manner to realize the positioning of the hard disk.

Optionally, the fixed heat dissipation block is a heat dissipation fin; the fixed radiating block comprises GPU radiating fins, CPU radiating fins and power supply radiating fins; the power supply radiating fins are in contact with a power supply.

Optionally, the heat conducting member comprises a heat conducting aluminum plate and a heat radiating copper pipe; two side edges of the lower part of the heat-conducting aluminum plate are clamped and positioned through the GPU positioning heat-conducting pressing block respectively; and the GPU positioning heat-conducting pressing block and the GPU on the mainboard are positioned, so that heat on the GPU is transmitted to the heat-conducting aluminum plate through the fixed heat-radiating blocks respectively.

Optionally, the heat dissipation copper pipe is of a U-shaped tubular structure; the lower end support arm of the heat dissipation copper pipe is positioned in the CPU positioning heat conduction pressure block, and the upper end support arm penetrates through the heat dissipation partition plate and is positioned in the CPU heat dissipation fin, so that the heat dissipation of the CPU on the mainboard is realized.

Optionally, the fans are arranged at the upper positions of the two side edges of the case in a one-to-one correspondence manner, and the fans are uniformly distributed on the case; and a ventilation hole is also formed in the fan mounting position on the case.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model greatly improves the box body formed by connecting the chassis and the heat dissipation partition plate while realizing the installation of each component, realizes the transverse reinforcement of the mainboard component and the power supply component while heat dissipation of the mainboard component, and greatly improves the vibration resistance and the shock resistance of the whole machine; meanwhile, effective heat dissipation of the key installation assembly is ensured through heat conduction and heat dissipation of the key heat installation assembly respectively, and the effective service life of the key installation assembly is greatly prolonged.

2. The utility model discloses a design in wind channel is kept apart on upper portion realizes that the heat dispels the heat to quick-witted case outside from the upper portion wind channel, has improved the inside radiating efficiency of whole device greatly.

3. The utility model has the advantages that the independent isolation air channel is arranged at the upper part, thereby greatly reducing the dust accumulation of the main parts in the lower cavity and having good dustproof effect; the independent isolation air channel is arranged at the upper part, so that the concentration of water vapor of main parts in the lower cavity is greatly reduced, and the moisture-proof effect is good.

Of course, it is not necessary for any particular product to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic view of the overall mounting structure of the present invention;

FIG. 2 is a schematic view of a horizontal cross-sectional configuration of the present invention;

FIG. 3 is a schematic longitudinal sectional view of the present invention;

FIG. 4 is a schematic cross-sectional view of the present invention;

FIG. 5 is a schematic illustration of an explosive structure according to the present invention;

FIG. 6 is a schematic illustration of a partial explosion configuration of the present invention;

the reference numbers in the figures illustrate:

1. a chassis; 11. fixing the support plate; 12. a vent hole; 2. a heat dissipating component; 21. a heat dissipating partition; 22. a heat conductive member; 221. a heat conducting aluminum plate; 222. a heat dissipation copper pipe; 23. fixing the heat dissipation block; 231. a GPU heat dissipation fin; 232. CPU heat sink fins; 233. a power supply heat dissipation fin; 24. a fan; 3. a motherboard assembly; 31. a main board; 32. supporting the partition plate; 4. a hard disk assembly; 41. a hard disk; 42. a support; 5. a power supply component; 6. an upper cover; 8. a GPU; 7. positioning a heat-conducting pressing block by the GPU; 9. CPU positioning heat-conducting pressing block; 10. a CPU; 20. an aerial plug; 30. a handle.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the embodiments of the present invention are combined to clearly and completely describe the technical solution in the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The present invention will be further explained with reference to the accompanying drawings 1 to 6:

a compact 5U strengthens the server, including locating the heat-dissipating module 2, motherboard assembly 3, hard disk assembly 4 and power module 5 set up in the chassis 1; the heat dissipation assembly 2 comprises a heat dissipation clapboard 21, a heat conduction piece 22, a fixed heat dissipation block 23 and a fan 24; the heat dissipation partition plate 21 is fixedly arranged on the fixed support plate 11 in the middle of the case 1, so that the case 1 is divided into an upper layer cavity structure and a lower layer cavity structure; the fixed radiating block 23 is fixedly arranged on the radiating partition plate 21; the mainboard component 3, the hard disk component 4 and the power supply component 5 are positioned at the bottom of the case 1 of the lower-layer cavity structure at intervals; the lower end of the heat conducting piece 22 is connected with the mainboard component 3 in a positioning way, and the upper end of the heat conducting piece passes through the heat dissipation partition plate 21 and then is connected with the fixed heat dissipation block 23 in a positioning way; the power supply assembly 5 passes through the heat dissipation partition plate 21 and is connected with the fixed heat dissipation block 23 in a positioning way; the fans 24 are oppositely arranged on two side edges of the case 1 of the upper-layer cavity structure to form an air channel.

The utility model greatly improves the box body formed by connecting the chassis and the heat dissipation partition plate while realizing the installation of each component, realizes the transverse reinforcement of the mainboard component and the power supply component while heat dissipation of the mainboard component, greatly improves the vibration resistance and shock resistance of the whole machine, and has novel structure; through the design of the upper isolation air channel, heat is radiated from the upper air channel to the outside of the case, and the internal heat radiation efficiency of the whole device is greatly improved; the independent isolation air channel is arranged at the upper part, so that the dust accumulation of main parts in the lower cavity is greatly reduced, and the dustproof effect is good; through the design of the upper isolation air channel, heat exchange from the upper air channel to the outside of the case is realized, and the internal heat dissipation efficiency of the whole device is greatly improved; the independent isolation air channel is arranged at the upper part, so that the moisture accumulation of main parts in the lower cavity is greatly reduced, and the moisture-proof effect is good; through heat conduction and heat dissipation to the key spot heat installation component respectively, ensured key installation component's effective heat dissipation, improved key installation component's effective life-span greatly.

The upper end of the power supply body of the power supply component 5 passes through the through hole on the heat dissipation partition plate 21, and the limit of the power supply body is realized by fixing a heat dissipation block 23; when the positioning of the power supply body is realized, the heat conduction and the heat dissipation of the power supply body are realized, the structure is compact, and the structure of the whole case 1 is more stable.

An upper cover 6 is also arranged; the upper cover 6 is arranged at the upper opening of the case 1; the upper cover 6 is detachably and fixedly connected with the case 1 through a set screw, so that the installation of a closed box body of the whole reinforcement server is realized; and the upper cover 6 is also provided with radiating fins.

The main plate assembly 3 comprises a main plate 31 and a supporting partition plate 32; the supporting partition plate 32 is vertically arranged at the rear part of the lower-layer cavity structure, so that the aerial plug 20 at the rear end of the case 1 is isolated; the upper end of the supporting partition plate 32 is fixedly connected with the heat dissipation partition plate 21, and the lower end is fixedly connected with the bottom of the case 1; one side edge of the main board 31 is fixedly connected with the side edge of the supporting partition plate 32, so that the supporting plate is reinforced to be positioned and installed;

preferably, the supporting partition plate 32 is provided with a through hole, so that the data line on the component at the front side of the supporting partition plate 32 is connected with the aviation plug 20 at the rear end of the case 1 through the through hole, the whole device is reinforced, and meanwhile, the data line is sequentially arranged, so that the installation and the later maintenance and overhaul are facilitated.

The hard disk assembly 4 is arranged on the front side of the case 1; the hard disk assembly 4 comprises a hard disk 41 and a bracket 42; the bracket 42 covers the hard disk 41 and is positioned and connected to the bottom of the case 1 through the bracket 42 to realize the positioning of the hard disk 41; the bracket 42 is also provided with a lightening hole.

The power supply assembly 5 is arranged on one side of the bottom of the case 1;

the fins with the same direction as the air channel are arranged on the radiating partition plate 21 in an array mode, so that the radiating area of the convective gas is increased, and the radiating efficiency is greatly improved.

The fixed radiating block 23 is a radiating fin; the fixed heat dissipation block 23 includes GPU heat dissipation fins 231, CPU heat dissipation fins 232, and power supply heat dissipation fins 233; the power supply heat dissipation fins 233 are in contact with the power supply, thereby achieving effective heat dissipation of the power supply.

The heat conducting member 22 comprises a heat conducting aluminum plate 221 and a heat radiating copper pipe 222; two side edges of the lower part of the heat-conducting aluminum plate 221 are clamped and positioned through the GPU positioning heat-conducting pressing block 7 respectively; the GPU positioning heat-conducting pressing block 7 and the GPU8 on the motherboard 31 are positioned, so that heat on the GPU8 is transmitted to the lower part of the heat-conducting aluminum plate 221 through the fixed heat-radiating block 23, and effective heat radiation is realized through the GPU heat-radiating fins 231 and the air duct on the upper part of the heat-conducting aluminum plate 221;

the heat dissipation copper pipe 222 is a U-shaped tubular structure; the lower end arm of the heat dissipation copper pipe 222 is positioned in the CPU positioning heat conduction pressure block 9, and the upper end arm passes through the heat dissipation partition 21 and is positioned in the CPU heat dissipation fins 232, so as to realize effective heat dissipation for the CPU10 on the motherboard 31.

The fans 24 are correspondingly arranged at the upper parts of the two side edges of the case 1 one by one, and the fans 24 are uniformly distributed on the case 1; the fan 24 on the case 1 is also provided with a vent hole 12 at the installation position, and under the condition of realizing blowing relative to the fan 24, the vent hole 12 can realize that the wind of the upper-layer cavity structure inside enters from the front side vent hole and blows out from the rear side vent hole, so as to realize heat exchange with the external space of the case 1;

through the design of the air duct, functional faults caused by aging deformation caused by heating can be effectively avoided, and the stability is higher; by respectively conducting heat and dissipating heat to the important point heat-emitting mounting assembly, effective heat dissipation of the mounting assembly is realized, effective heat dissipation of the mounting assembly is ensured, and the effective service life of important mounting components is greatly prolonged; meanwhile, through the arrangement of the independent air channels, the airflow exchange is basically in the upper cavity structure, dust is basically collected on the detachable radiating block on the upper layer, dust collection of internal equipment is reduced, the dustproof and waterproof effects are better, and the space utilization rate is higher.

Preferably, the front of the cabinet 1 is further provided with a handle 30.

The positioning and mounting is a detachable connection, and the positioning and mounting between the two parts can be realized by bolts (which is a conventional means in the field).

The device has the advantages of simple structure, convenient installation and operation, economy, practicality, reasonable design, compact structure and good market prospect.

It should be noted that the detailed description of the present invention is not included in the prior art, or can be obtained directly from the market, and those skilled in the art can obtain the detailed description without creative efforts, and the detailed connection method has a very wide application in the field or daily life, and is not described in detail herein.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like, indicate the orientation or positional relationship indicated based on the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

In the present application, unless expressly stated or limited otherwise, the first feature may be directly on or directly under the second feature or indirectly via intermediate members. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.

Claims

1. The utility model provides a server is consolidated to 5U of compact which characterized in that: the computer case comprises a heat dissipation assembly, a main board assembly, a hard disk assembly and a power supply assembly which are positioned in the case; the heat dissipation assembly comprises a heat dissipation partition plate, a heat conduction piece, a fixed heat dissipation block and a fan; the heat dissipation partition plate is fixedly arranged on a fixed support plate in the middle of the case, so that the case is divided into an upper layer cavity structure and a lower layer cavity structure; the fixed heat dissipation block is fixedly arranged on the heat dissipation partition plate; the mainboard assembly, the hard disk assembly and the power supply assembly are positioned at the bottom of the case of the lower-layer cavity structure at intervals; the lower end of the heat conducting piece is connected with the main board assembly in a positioning mode, and the upper end of the heat conducting piece penetrates through the heat radiating partition plate and then is connected with the fixed heat radiating block in a positioning mode; the power supply assembly penetrates through the heat dissipation partition plate to be connected with the fixed heat dissipation block in a positioning mode; the fans are oppositely arranged on two side edges of the case of the upper-layer cavity structure to form an air channel.

2. The compact, 5U ruggedized server of claim 1, wherein: an upper cover is also arranged; the upper cover is arranged at an upper opening of the case; the upper cover is detachably and fixedly connected with the case through a set screw, so that the installation of the whole closed box body of the reinforcing server is realized.

3. The compact, 5U ruggedized server of claim 1, wherein: the main board assembly comprises a main board and a supporting clapboard; the supporting partition plate is vertically arranged at the rear part of the lower-layer cavity structure, so that the aerial plug connector at the rear end of the case is isolated; the upper end of the supporting partition plate is fixedly connected with the heat dissipation partition plate, and the lower end of the supporting partition plate is fixedly connected with the bottom of the case; one side edge of the main board is fixedly connected with the side edge of the supporting partition board, so that the supporting board is reinforced to be positioned and installed.

4. The compact, 5U ruggedized server of claim 1, wherein: the hard disk assembly is arranged on the front side of the case; the hard disk assembly comprises a hard disk and a bracket; the bracket covers the hard disk and is connected to the bottom of the case through the bracket in a positioning manner to realize the positioning of the hard disk.

5. The compact, 5U ruggedized server of claim 1, wherein: the fixed radiating block is a radiating fin; the fixed radiating block comprises GPU radiating fins, CPU radiating fins and power supply radiating fins; the power supply radiating fins are in contact with a power supply.

6. The compact, 5U ruggedized server of claim 1, wherein: the heat conducting piece comprises a heat conducting aluminum plate and a heat radiating copper pipe; two side edges of the lower part of the heat-conducting aluminum plate are clamped and positioned through the GPU positioning heat-conducting pressing block respectively; and the GPU positioning heat-conducting pressing block and the GPU on the mainboard are positioned, so that heat on the GPU is transmitted to the heat-conducting aluminum plate through the fixed heat-radiating blocks respectively.

7. The compact, 5U ruggedized server of claim 6, wherein: the heat dissipation copper pipe is of a U-shaped tubular structure; the lower end support arm of the heat dissipation copper pipe is positioned in the CPU positioning heat conduction pressure block, and the upper end support arm penetrates through the heat dissipation partition plate and is positioned in the CPU heat dissipation fin, so that the heat dissipation of the CPU on the mainboard is realized.

8. The compact, 5U ruggedized server of claim 1, wherein: the fans are arranged at the upper parts of the two side edges of the case in a one-to-one correspondence manner and are uniformly distributed on the case; and a ventilation hole is also formed in the fan mounting position on the case.