CN210295028U

CN210295028U - Heat dissipation improvement mechanism for computer

Info

Publication number: CN210295028U
Application number: CN201921935314.5U
Authority: CN
Inventors: 周道生
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-11-11
Filing date: 2019-11-11
Publication date: 2020-04-10
Anticipated expiration: 2029-11-11

Abstract

The utility model discloses a heat dissipation improvement mechanism for a computer, which comprises a heat dissipation box, wherein a heat dissipation pipe is arranged in the heat dissipation box, fins are distributed on the outer side of the pipe wall of the radiating pipe, a cold air diffusion cover is fixedly connected to one side surface of the radiating box, one side surface of the cold air diffusion cover is fixedly connected with an air pipe, the other end of the air pipe is fixedly connected with an air outlet of the radiating pipe, an air suction pump is arranged on the outer wall of one side of the heat dissipation box, an air guide bent pipe is fixedly connected with an air outlet of the air suction pump, the other end of the air guide bent pipe is fixedly connected with an air inlet of the radiating pipe, an air inlet of the air suction pump is provided with an air suction cover, the heat dissipation box is internally provided with a semiconductor refrigeration sheet which is positioned at the rear side of the heat dissipation pipe, each fin is contacted with one side surface of the semiconductor refrigeration sheet, and the rear side wall of the heat dissipation box is fixedly connected with a heat dissipation fan, and the heat dissipation fan is positioned at the rear side of the semiconductor refrigeration sheet. The utility model discloses simple structure, convenient to use, the effectual radiating efficiency who improves the host computer.

Description

Heat dissipation improvement mechanism for computer

Technical Field

The utility model relates to a computer cooling equipment technical field especially relates to a heat dissipation improves mechanism for computer.

Background

The inside circuit board of computer host is at the in-process of long-time use, inside electronic components can produce a large amount of heats, make electronic components on the circuit board burn the damage automatically very easily, when serious, can produce the phenomenon of electrocution or catching fire and take place, seriously influence people's life and property's safety, and when electronic components generate heat, damage very easily, lead to the loss of a large amount of resources and cost, and present computer host heat dissipation mainly dispels the heat through radiator fan and louvre, the radiating effect is relatively poor, the radiating efficiency is lower, thereby lead to the host computer temperature high, the functioning speed is slow.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a heat dissipation improvement mechanism for a computer.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a heat dissipation improvement mechanism for a computer comprises a heat dissipation box, wherein the heat dissipation box is rectangular, one side surface of the heat dissipation box is open, the heat dissipation box is positioned inside a computer mainframe, rectangular fixing plates are fixedly connected to the bottom surface and the top surface of the heat dissipation box, each fixing plate is fixedly connected to the corresponding inner surface of the computer mainframe, a heat dissipation tube is arranged in the heat dissipation box, the outer walls of two ends of the heat dissipation tube are fixedly connected to the corresponding inner wall of one side of the heat dissipation box, circular fins are distributed on the outer side of the tube wall of the heat dissipation tube, a circular cold air diffusion cover is arranged in front of the open, rectangular support plates are fixedly connected to the periphery of the cold air diffusion cover, the other end of each support plate is fixedly connected to a corresponding side plate of the heat dissipation box, a through gas pipe is fixedly connected to the middle part of one side surface of the cold air diffusion, the gas outlet rigid coupling of aspirator pump has the air guide return bend, the other end of air guide return bend and the air inlet rigid coupling of cooling tube, the air inlet of aspirator pump is equipped with hemispherical cover of breathing in, the heat dissipation incasement is equipped with the semiconductor refrigeration piece, the semiconductor refrigeration piece is located the cooling tube rear side, and every fin all corresponds a side contact with the semiconductor refrigeration piece, lateral wall middle part rigid coupling has radiator fan behind the heat dissipation case, radiator fan is located semiconductor refrigeration piece rear side.

Preferably, the air inlet and the gas outlet lateral wall of cooling tube all are equipped with solid fixed ring, gu fixed ring one side is equipped with the opening, and the equal rigid coupling in opening both sides has the fixed block, and two fixed blocks pass through fastening bolt and connect, gu fixed ring a lateral wall rigid coupling has the fixed block of rectangle form, fixed block other end side is equipped with the screw hole, the fixed block passes through the screw rod and corresponds one side inner wall rigid coupling with the heat dissipation case.

Preferably, the equal rigid coupling of every backup pad one end has the fixed slot of rectangle form, and every fixed slot all is equipped with the circular shape fixed orifices, and every fixed slot all blocks and establishes at the heat dissipation case and correspond a curb plate middle part, and pass through fixing bolt and connect.

Preferably, the lower end of the outer wall of one side of the heat dissipation box is fixedly connected with a rectangular bearing plate, the top surface of the bearing plate is provided with a circular supporting groove, and the lower end of the suction pump is positioned in the supporting groove.

Preferably, a side of the suction hood is provided with a through supporting tube, the other end of the supporting tube is fixedly connected with an air inlet of the suction pump, a round filtering layer is arranged in the suction hood, a bearing is fixedly connected to the middle of the inside of the filtering layer, a rotating shaft is arranged in the suction hood, one end of the rotating shaft penetrates through the filtering layer and the bearing and is fixedly connected with the inner wall of the bearing, one end of the rotating shaft is fixedly connected with a cylindrical fixed tube, rectangular brushes are distributed on the outer wall of the fixed tube, each brush is in contact with one side of the filtering layer, and fan blades are distributed on the.

Preferably, the bottom surface and the top surface of the heat dissipation box are fixedly connected with L-shaped limiting plates, the top surface of each limiting plate is concavely provided with rectangular limiting grooves, and the upper end and the lower end of each semiconductor refrigeration sheet are located in the corresponding limiting grooves.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the air suction pump, the radiating fan, the radiating pipe and the fins are matched with the semiconductor refrigerating sheet, so that heat can be radiated to the host computer, the air suction pump can suck hot air in the host computer case and then transmit the hot air into the radiating pipe, the semiconductor refrigerating sheet absorbs the heat in the radiating pipe and changes the hot air into cold air to be discharged into the host computer case, the fins can accelerate the radiating speed, the radiating efficiency of the host computer is effectively improved, the electronic elements in the host computer case are prevented from being damaged due to high temperature, and the safety and the running speed of the host computer are effectively protected;

2. the air suction cover, the filter layer, the rotating shaft, the fan blades, the brush and the air suction pump are matched, so that hot air in the host can be sucked for heat dissipation, dust on an electronic board in the host can be sucked, the situation that the heat dissipation efficiency of the electronic board is low due to dust accumulation is avoided, the brush can clean the filter layer, and the situation that the filter layer is blocked by the dust is avoided;

to sum up, the utility model discloses simple structure, convenient to use, the effectual radiating efficiency who improves the host computer has protected electronic component's safety.

Drawings

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limitation. In the drawings:

fig. 1 is a front view of a heat dissipation box of a heat dissipation improvement mechanism for a computer provided by the present invention;

fig. 2 is a cross-sectional view of a heat dissipation box of the heat dissipation improvement mechanism for a computer according to the present invention;

fig. 3 is a left side view of a heat dissipation box of the improved heat dissipation mechanism for a computer according to the present invention;

fig. 4 is a cross-sectional view of an air suction cover of a heat dissipation improvement mechanism for a computer according to the present invention;

fig. 5 is a top view of a fixing ring of the heat dissipation improving mechanism for a computer according to the present invention;

number in the figure: the cooling device comprises a cooling box 1, a computer mainframe 2, a cooling pipe 3, fins 4, a cold air diffusion cover 5, an air suction pump 6, an air guide bent pipe 7, an air suction cover 8, a filter layer 9, a brush 10, an air delivery pipe 11, a support plate 12, a fixing ring 13, fan blades 14, a rotating shaft 15, a support pipe 16, a limiting plate 17, a cooling fan 18, a semiconductor refrigeration sheet 19, a fixing plate 20 and a bearing plate 21.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Example (b): referring to fig. 1-5, a computer heat dissipation improvement mechanism, includes a heat dissipation box 1, the heat dissipation box 1 is rectangular, one side of the heat dissipation box 1 is open, the heat dissipation box 1 is located inside a computer mainframe 2, rectangular fixing plates 20 are fixedly connected to both ends of the bottom surface and the top surface of the heat dissipation box 1, each fixing plate 20 is fixedly connected to the corresponding inner surface of the computer mainframe 2, a heat dissipation tube 3 is arranged in the heat dissipation box 1, outer walls of both ends of the heat dissipation tube 3 are fixedly connected to the corresponding inner wall of the heat dissipation box 1, circular fins 4 are distributed on the outer side of the tube wall of the heat dissipation tube 3, a circular cool air diffusion cover 5 is arranged in front of the open, rectangular support plates 12 are fixedly connected to the periphery of the cool air diffusion cover 5, the other end of each support plate 12 is fixedly connected to a corresponding side plate of the heat dissipation box 1, a through air pipe 11 is fixedly connected, 11 other ends of gas-supply pipe and the gas outlet rigid coupling of

cooling tube

3, 1 one side outer wall of heat dissipation case is equipped with aspirator pump 6, the gas outlet rigid coupling of aspirator pump 6 has air guide return bend 7, the other end of air guide return bend 7 and the air inlet rigid coupling of cooling tube 3, the air inlet of aspirator pump 6 is equipped with hemispherical cover 8 of breathing in, be equipped with semiconductor refrigeration piece 19 in the heat dissipation case 1, semiconductor refrigeration piece 19 is located 3 rear sides of cooling tube, and every fin 4 all corresponds a side contact with

semiconductor refrigeration piece

19, 1 rear side wall middle part rigid coupling of heat dissipation case has radiator fan 18, radiator fan 18 is located 19 rear sides of semiconductor refrigeration piece.

The utility model discloses in, the air inlet and the gas outlet lateral wall of cooling tube 3 all are equipped with solid fixed ring 13, solid fixed ring 13 one side is equipped with the opening, and the equal rigid coupling in opening both sides has the fixed block, and two fixed blocks pass through fastening bolt and connect, solid fixed ring 13 a lateral wall rigid coupling has the fixed block of rectangle form, fixed block other end side is equipped with the screw hole, the fixed block passes through the screw rod and corresponds one side inner wall rigid coupling with heat dissipation case 1.

The utility model discloses in, the equal rigid coupling of 12 one ends of every backup pad has the fixed slot of rectangle form, and every fixed slot all is equipped with the circular shape fixed orifices, and every fixed slot is all blocked and is established at 1 corresponding curb plate middle parts of heat dissipation case and through fixing bolt connection.

The utility model discloses in, 1 one side outer wall lower extreme rigid coupling of heat dissipation case has the loading board 21 of rectangle form, 11 top surfaces of loading board are equipped with the circular shape and support the groove, the 6 lower extremes of aspirator pump are located and support the inslot.

The utility model discloses in, 8 side of suction hood are equipped with the stay tube 16 that link up, the air inlet rigid coupling of the 16 other ends of stay tube and aspirator pump 6, be equipped with circular shape filter layer 9 in the suction hood 8, the middle part rigid coupling has the bearing in the filter layer 9, be equipped with rotation axis 15 in the suction hood, 15 one end of rotation axis pass filter layer 9 and bearing connotation, and with the bearing inner wall rigid coupling, 15 one end rigid couplings of rotation axis have the fixed pipe of columniform, fixed pipe outer wall distributes has the stay tube 16 of rectangle form, every brush 10 all with a filter layer 9 side contact, 15 other end outer wall distributions of rotation axis have flabellum 14.

The utility model discloses in, the equal rigid coupling of 1 bottom surfaces of heat dissipation case and top surface has the limiting plate 17 of L shape, and every 17 top surfaces of limiting plate are all concave limiting grooves that are equipped with the rectangle form, semiconductor refrigeration piece 19 is gone up the lower extreme and is all located the corresponding limiting groove.

The utility model discloses in, be connected aspirator pump 6, radiator fan 18, semiconductor refrigeration piece 19's power cord and host computer power cord.

When the utility model is used, the power line of the host is firstly connected with the power supply, then the air suction pump 6 starts to work, the air suction pump 6 sucks the hot air in the host through the air suction cover 8, the hot air sequentially passes through the filter layer 9, the support tube 16 and the air guide bent tube 7 and enters the radiating tube 3, when the hot air passes through the filter layer 9, the filter layer 9 can filter out the dust carried by the hot air, the hot air can blow the fan blade 14 to rotate, the fan blade 14 drives the rotating shaft 15 to rotate, the rotating shaft 15 drives the brush 10 to rotate, the brush 10 cleans the surface of the filter layer 9, the surface of the filter layer 9 is blocked by the dust, the hot air enters the radiating tube 3, the hot air can transmit the heat to the fins 4, the semiconductor refrigerating sheets 19 can absorb the heat on the fins 4 and change the hot air in the radiating tube 3 into cold air generated by the semiconductor refrigerating, the heat dissipation of the fins 4 is accelerated, hot air becomes cold air and then enters the air delivery pipe 11 from the air outlet of the radiating pipe 3, and then enters the computer mainframe 2 through the cold air diffusion cover 5, so that the temperature in the computer mainframe 2 is reduced.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a heat dissipation improves mechanism for computer, includes heat dissipation case (1), its characterized in that: the heat dissipation box (1) is rectangular, one side face of the heat dissipation box (1) is open, the heat dissipation box (1) is located inside the computer mainframe box (2), the bottom face and the top face of the heat dissipation box (1) are fixedly connected with rectangular fixing plates (20), each fixing plate (20) is fixedly connected with the corresponding inner surface of the computer mainframe box (2), a heat dissipation pipe (3) is arranged in the heat dissipation box (1), the outer walls of the two ends of the heat dissipation pipe (3) are fixedly connected with the corresponding inner wall of the heat dissipation box (1), round fins (4) are distributed on the outer side of the pipe wall of the heat dissipation pipe (3), a round air conditioning diffusion cover (5) is arranged in front of the opening, rectangular support plates (12) are fixedly connected around the air conditioning diffusion cover (5), the other end of each support plate (12) is fixedly connected with a corresponding side plate of the heat dissipation box (1), and a through air pipe (11) is fixedly connected to the middle part of, gas outlet rigid coupling of gas-supply pipe (11) other end and cooling tube (3), heat dissipation case (1) one side outer wall is equipped with aspirator pump (6), the gas outlet rigid coupling of aspirator pump (6) has air guide return bend (7), the other end of air guide return bend (7) and the air inlet rigid coupling of cooling tube (3), the air inlet of aspirator pump (6) is equipped with hemispherical cover (8) of breathing in, be equipped with semiconductor refrigeration piece (19) in heat dissipation case (1), semiconductor refrigeration piece (19) are located cooling tube (3) rear side, and every fin (4) all correspond a side contact with semiconductor refrigeration piece (19), heat dissipation case (1) rear side wall middle part rigid coupling has radiator fan (18), radiator fan (18) are located semiconductor refrigeration piece (19) rear side.

2. The improved mechanism for heat dissipation of computer of claim 1, wherein: the air inlet and the gas outlet lateral wall of cooling tube (3) all are equipped with solid fixed ring (13), gu fixed ring (13) one side is equipped with the opening, and the equal rigid coupling in opening both sides has the fixed block, and two fixed blocks pass through fastening bolt to be connected, gu fixed ring (13) a lateral wall rigid coupling has the fixed block of rectangle form, fixed block other end side is equipped with the screw hole, the fixed block passes through the screw rod and corresponds one side inner wall rigid coupling with heat dissipation case (1).

3. The improved mechanism for heat dissipation of computer of claim 1, wherein: the equal rigid coupling of every backup pad (12) one end has the fixed slot of rectangle form, and every fixed slot all is equipped with the circular shape fixed orifices, and every fixed slot all blocks and establishes at a heat dissipation case (1) corresponding curb plate middle part, and through fixing bolt connection.

4. The improved mechanism for heat dissipation of computer of claim 1, wherein: the heat dissipation box is characterized in that a rectangular bearing plate (21) is fixedly connected to the lower end of the outer wall of one side of the heat dissipation box (1), a circular supporting groove is formed in the top surface of the bearing plate (21), and the lower end of the air suction pump (6) is located in the supporting groove.

5. The improved mechanism for heat dissipation of computer of claim 1, wherein: the utility model discloses a suction hood, including suction hood (8), support pipe (16), rotation axis (15) one end is passed filter layer (9) and bearing connotation and is just with bearing inner wall rigid coupling, rotation axis (15) one end rigid coupling has the fixed pipe of columniform, fixed outer wall of the pipe distributes and has brush (10) of rectangle form, and every brush (10) all contacts with a side of filter layer (9), rotation axis (15) other end outer wall distributes and has flabellum (14), the air inlet rigid coupling of the stay pipe (16) other end and aspirator pump (6), be equipped with circular shape filter layer (9) in suction hood (8), the middle part rigid coupling has the bearing in filter layer (9), be equipped with rotation axis (15) one end.

6. The improved mechanism for heat dissipation of computer of claim 1, wherein: the heat dissipation box (1) bottom surface and the equal rigid coupling of top surface have limiting plate (17) of L shape, and every limiting plate (17) top surface all is equipped with the spacing groove of rectangle form concavely, the lower extreme all is located the corresponding spacing inslot on semiconductor refrigeration piece (19).