CN210294981U - 3U vpx integrated circuit board based on feiteng - Google Patents

Abstract

The utility model discloses a 3U vpx board card based on soaring, which comprises a bottom plate, a protective shell is fixedly arranged on the upper side wall of the bottom plate, heat dissipation structures and fixed blocks are symmetrically assembled on the left and right of the inner side wall of the protective shell, a rectangular plate is fixedly arranged between the heat dissipation structures on both sides and the fixed blocks, rectangular holes are uniformly arranged on the lower side wall of the rectangular plate, semiconductor refrigeration sheets are inserted into the inner side wall of the rectangular holes, fixed frames are symmetrically and fixedly arranged on the upper and lower sides of the inner side wall of the rectangular hole, a temperature relay is assembled on a circuit board, a heat conduction plate is fixedly arranged on the upper side wall of the inner cavity of the protective shell, and a metal plate is fixedly arranged at the lower end of the metal block, the utility model utilizes the refrigeration of the semiconductor refrigeration sheets and the control of the temperature relay to maintain a proper temperature environment at the circuit board, and the, increasing the service life thereof.

Description

3U vpx integrated circuit board based on feiteng

Technical Field

The utility model relates to a 3U vpx integrated circuit board technical field specifically is a 3U vpx integrated circuit board based on fly.

Background

The 3U vpx board is a new generation board based on a high-speed serial bus, is used in a plurality of devices and has the characteristics of high density, high-performance calculation, bandwidth expansion, power enhancement and the like, so a large amount of heat can be generated in the use process of the board, the existing heat dissipation mode utilizes a metal protective shell to conduct and dissipate the heat, but when the board runs at high performance, the heat dissipation efficiency of the mode is not enough to well solve the heat dissipation problem, if a vpx board which can effectively ensure proper temperature in the board and can effectively dissipate the heat can be designed, the problem can be solved, and therefore the 3U vpx board based on the soaring is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a 3U vpx integrated circuit board based on it flies to solve the problem that proposes in the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: A3U vpx board card based on soaring comprises a base plate, wherein a circuit board is fixedly mounted on the upper side wall of the base plate, a protective shell is fixedly mounted on the upper side wall of the base plate, a heat dissipation structure and fixed blocks are symmetrically assembled on the left and right of the inner side wall of the protective shell, a rectangular plate is fixedly mounted between the heat dissipation structure and the fixed blocks on two sides, rectangular holes are uniformly formed in the lower side wall of the rectangular plate, semiconductor refrigeration sheets are inserted into the inner side wall of each rectangular hole, fixed frames are symmetrically and fixedly mounted on the upper and lower sides of the inner side wall of each rectangular hole, a temperature relay is assembled on the circuit board, the semiconductor refrigeration sheets are connected in series with the temperature relay and a board card power supply through wires, a heat conduction plate is fixedly mounted on the upper side wall of an inner cavity of the protective shell, and the lower side wall of the metal plate is attached to the heat generation surface of the semiconductor refrigerating sheet.

Preferably, the heat radiation structure includes the heat conduction piece, and heat conduction piece fixed mounting is in the lateral wall upside about the inner chamber of protective housing, and the lateral wall is laminated in both sides respectively about the heat conduction plate the inside wall of heat conduction piece, the even fixed mounting of lateral wall of heat conduction piece has the connecting rod, and the connecting rod runs through the protective housing, the outer end fixed mounting of connecting rod has the fixed plate, the even fixed mounting of lateral wall of fixed plate has the heating panel.

Preferably, a glass fiber plate is fixedly installed between the adjacent heat conducting blocks and the fixing blocks, and a vacuum cavity is formed in an inner cavity of the glass fiber plate.

Preferably, the lower side wall of fixed block all fixed mounting have the block rubber, and the lower side wall laminating of block rubber is in the last lateral wall of circuit board.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses a structure of bottom plate, protective housing, heat radiation structure, rectangular plate, semiconductor refrigeration piece, temperature relay, heat-conducting plate and metal sheet utilizes the refrigeration of semiconductor refrigeration piece and temperature relay's control to maintain suitable temperature environment to circuit board department, and the heat that the semiconductor refrigeration piece produced can effectively spill through heat-conducting plate and heat radiation structure department, and then makes the inside stable suitable temperature environment that is in all the time of this integrated circuit board, increases its life.

Drawings

Fig. 1 is a front sectional view of the present invention.

Fig. 2 is a partially enlarged view of a portion a in fig. 1 according to the present invention.

Fig. 3 is a top view of the present invention.

In the figure: 1. the heat-conducting plate comprises a base plate, 2, a circuit board, 3, a protective shell, 4, a heat-radiating structure, 41, a heat-conducting block, 42, a connecting rod, 43, a fixing plate, 44, a heat-radiating plate, 5, a fixing block, 6, a rectangular plate, 7, a rectangular hole, 8, a semiconductor refrigerating sheet, 9, a fixing frame, 10, a temperature relay, 11, a heat-conducting plate, 12, a metal block, 13, a metal plate, 14, a glass fiber plate, 15, a vacuum cavity, 16 and a rubber block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, fig. 2 and fig. 3, the present invention provides a technical solution: A3U vpx board card based on soaring comprises a bottom plate 1, a circuit board 2 is fixedly installed on the upper side wall of the bottom plate 1, the circuit board 2 is a circuit board in the 3U vpx board card, a protective shell 3 is fixedly installed on the upper side wall of the bottom plate 1, the protective shell 3 is a metal product, the circuit board 2 is protected and has certain heat dissipation capacity, a heat dissipation structure 4 and a fixed block 5 are symmetrically assembled on the left side and the right side of the inner side wall of the protective shell 3, the heat dissipation structure 4 is used for guiding out and dissipating heat, a rectangular plate 6 is fixedly installed between the heat dissipation structures 4 on two sides and the fixed block 5, rectangular holes 7 are uniformly formed in the lower side wall of the rectangular plate 6, semiconductor refrigeration pieces 8 are inserted into the inner side wall of the rectangular holes 7, the heat generation surface of each semiconductor refrigeration piece 8 faces upwards, fixing frames 9 are fixedly installed on the upper and lower sides of the inner side, be equipped with temperature relay 10 on circuit board 2, temperature relay 10 can play the effect of switch, when the inside temperature of this device surpassed the temperature range of settlement, temperature relay 10 can be closed, make semiconductor refrigeration piece 8 circular telegram refrigeration, maintain the inside temperature of this device, and semiconductor refrigeration piece 8 establishes ties through wire and temperature relay 10 and integrated circuit board power connection department, lateral wall fixed mounting has heat-conducting plate 11 on the inner chamber of protective housing 3, the even fixed mounting of lower lateral wall of heat-conducting plate 11 has metal block 12, the lower extreme fixed mounting of metal block 12 has metal sheet 13, and the lower lateral wall of metal sheet 13 pastes the heat generation face in semiconductor refrigeration piece 8, can lead away the heat that semiconductor refrigeration piece 8 produced through metal sheet 13, metal block 12 and heat-conducting plate 11, make semiconductor refrigeration piece 8 can normally work.

Specifically, heat radiation structure 4 includes heat conduction piece 41, and heat conduction piece 41 fixed mounting is in lateral wall upside about the inner chamber of protective housing 3, and the lateral wall is laminated in the inside wall of both sides heat conduction piece 41 respectively about heat-conducting plate 11, consequently, can be with the heat effluvium that semiconductor refrigeration piece 8 produced through heat radiation structure 4, the even fixed mounting of lateral wall of heat conduction piece 41 has connecting rod 42, and connecting rod 42 runs through protective housing 3, the outer end fixed mounting of connecting rod 42 has fixed plate 43, the even fixed mounting of lateral wall of fixed plate 43 has heating panel 44, connecting rod 42, fixed plate 43 and heating panel 44 are the metal product, good heat conductivility has, a heat direction outside for with protective housing 3 inside, and effluvium, promote the heat dissipation of.

Particularly, fixed mounting has glass fiber board 14 between adjacent heat conduction piece 41 and the fixed block 5, and glass fiber is thermal insulation material, and vacuum cavity 15 has been seted up to glass fiber board 14's inner chamber, and vacuum cavity 15 also can play good thermal-insulated effect, makes the heat of heat conduction piece 41 department can not transmit fixed block 5 department, and then can not transmit semiconductor refrigeration piece 8 refrigeration face one side, promotes the normal work of semiconductor refrigeration piece 8.

Specifically, the equal fixed mounting of lower lateral wall of fixed block 5 has block rubber 16, and the lower lateral wall of block rubber 16 laminates in the last lateral wall of circuit board 2, carries out supplementary fixed to the position of circuit board 2, and the rubber material of block rubber 16 is insulating, and has elasticity, can not cause the damage to circuit board 2.

The working principle is as follows: this 3U vpx integrated circuit board based on soaring, when its during operation produced a large amount of heats, temperature relay 10 can be closed and make semiconductor refrigeration piece 8 circular telegram work, semiconductor refrigeration piece 8 refrigeration face makes the temperature recovery of circuit board department normal, this in-process is carried out auxiliary control by temperature relay 10, semiconductor refrigeration piece 8's the generating heat face can produce the heat simultaneously, this part heat transmits heat radiation structure 41 behind metal sheet 13, metal block 12 and heat-conducting plate 11, and finally give off in heating panel 44 department, this device is through inside cooling, and two parts effect to the heat effluvium, can high-efficient quick completion to the regulation of device internal temperature, and under temperature relay 10's control to semiconductor refrigeration piece 8, make circuit board 2 be in suitable temperature range all the time, make this integrated circuit board can normally work all the time, increase its life.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (4)

1. The utility model provides a 3U vpx integrated circuit board based on feiteng which characterized in that: the heat dissipation plate comprises a base plate (1), a circuit board (2) is fixedly mounted on the upper side wall of the base plate (1), a protective shell (3) is fixedly mounted on the upper side wall of the base plate (1), heat dissipation structures (4) and fixed blocks (5) are assembled on the left and right sides of the inner side wall of the protective shell (3), rectangular plates (6) are fixedly mounted between the heat dissipation structures (4) and the fixed blocks (5), rectangular holes (7) are uniformly formed in the lower side wall of each rectangular plate (6), semiconductor refrigeration sheets (8) are inserted into the inner side wall of each rectangular hole (7), fixed frames (9) are symmetrically and fixedly mounted on the upper portion and the lower portion of the inner side wall of each rectangular hole (7), a temperature relay (10) is assembled on the circuit board (2), the semiconductor refrigeration sheets (8) are connected with the temperature relay (10) and a board card power supply connecting portion in series through a wire, the even fixed mounting of the lower lateral wall of heat-conducting plate (11) has metal block (12), the lower extreme fixed mounting of metal block (12) has metal sheet (13), and the lower lateral wall laminating of metal sheet (13) in the heat generation face of semiconductor refrigeration piece (8).

2. The FT-based 3U vpx board card of claim 1, wherein: heat radiation structure (4) are including heat conduction piece (41), and heat conduction piece (41) fixed mounting is in the inner chamber left and right sides lateral wall upside of protective housing (3), and the lateral wall of controlling of heat-conducting plate (11) laminates in both sides respectively the inside wall of heat conduction piece (41), the even fixed mounting of lateral wall of heat conduction piece (41) has connecting rod (42), and connecting rod (42) run through protective housing (3), the outer end fixed mounting of connecting rod (42) has fixed plate (43), the even fixed mounting of lateral wall of fixed plate (43) has heating panel (44).

3. A FT-based 3U vpx board card as claimed in claim 2, wherein: a glass fiber plate (14) is fixedly arranged between the adjacent heat conducting block (41) and the fixing block (5), and a vacuum cavity (15) is formed in the inner cavity of the glass fiber plate (14).

4. The FT-based 3U vpx board card of claim 1, wherein: the equal fixed mounting of lower lateral wall of fixed block (5) has block rubber (16), and the lower lateral wall laminating of block rubber (16) is in the last lateral wall of circuit board (2).

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