CN210294611U - Heat dissipation device inside optical access local side equipment - Google Patents

Abstract

The application provides an inside heat abstractor of light access local side equipment, light access local side equipment is provided with the shell, heat abstractor includes: the light cage is arranged on the inner side of the shell and comprises a bearing plate, a PCB arranged on the surface of the bearing plate, a chip arranged on the surface of the PCB and a light cage used for mounting an optical module. The cross section of the bearing plate is of a trapezoidal structure, the bearing plate comprises a first vertical plate, a second vertical plate and an inclined plate, and a cavity formed by the first vertical plate, the second vertical plate, the inclined plate and the shell is used for mounting the chip and the optical module. And dividing the PCB into a first sub-board and a second sub-board, wherein the first sub-board is close to the second vertical board and used for mounting the chip, and the second sub-board is used for mounting the light cage. The positions of the chip and the optical module are close to the inner surface of the shell, so that the heat dissipation problem of the chip and the optical module is solved.

Description

Heat dissipation device inside optical access local side equipment

Technical Field

The application relates to the technical field of heat dissipation structures, in particular to a heat dissipation device inside optical access local side equipment.

Background

At present, voice and other multimedia service data are mainly transmitted to a user terminal by means of optical fibers, and the premise of optical fiber transmission is to convert the voice and other multimedia service data into optical signals, and the optical signals can carry out data and signal transmission along optical fibers. The optical access local side device can realize the function of converting an electric signal into an optical signal, wherein the field type optical access local side device is widely applied because the field type optical access local side device is suitable for the field environment.

The field-type optical access local-side equipment is usually provided with a housing, which is a multi-groove sealing structure to prevent the field humid environment from affecting the normal operation of each component inside the housing. An optical module for converting an electrical signal into an optical signal and a chip for controlling data forwarding are generally disposed inside the housing, and the optical module and the chip are respectively mounted on a PCB (Printed Circuit Board). Considering that the chip generates heat during operation and the temperature of the chip is high, the chip and the optical module in the existing field-type optical access local side equipment are overlapped and installed in the shell, and the chip is tightly attached to the shell, so that a good heat dissipation effect is obtained.

However, in the research process of the present application, the inventor finds that, as the data transmission rate of the optical access local side device is increased, the heat generated by the optical module itself is increased by many times compared with the original heat, and the design of overlapping the optical module above the chip is not favorable for heat dissipation of the optical module, which affects the normal operation of the optical module.

SUMMERY OF THE UTILITY MODEL

The application provides a heat abstractor inside optical access local side equipment to in solving current optical access local side equipment, the design of optical module stack in the chip top is unfavorable for the radiating problem of optical module.

The application provides an inside heat abstractor of light access local side equipment, light access local side equipment is provided with the shell, light access local side equipment includes: the receiving plate is arranged in the shell, the PCB is arranged on the surface of the receiving plate, the chip is arranged on the surface of the PCB, and the optical cage is used for mounting an optical module; wherein,

the cross section of the bearing plate is of a trapezoidal structure, the bearing plate comprises a first vertical plate, a second vertical plate and an inclined plate, the first vertical plate and the second vertical plate are respectively arranged at two ends of the inclined plate, the first vertical plate and the second vertical plate are respectively perpendicular to the inner surface of the shell, the height of the first vertical plate in the direction perpendicular to the inner surface of the shell is larger than that of the second vertical plate, the first vertical plate is of a hollow structure, the inclined plate is obliquely arranged relative to the inner surface of the shell, and a cavity defined by the first vertical plate, the second vertical plate, the inclined plate and the shell is used for mounting the chip and the optical module;

a first connecting plate is arranged at one end, far away from the inclined plate, of the first vertical plate, is parallel to the inner surface of the shell and extends towards the outside of the cavity, and the first connecting plate is fixedly connected to the inner surface of the shell;

a second connecting plate is arranged at one end, far away from the inclined plate, of the second vertical plate, is parallel to the inner surface of the shell and extends towards the outside of the cavity, and the second connecting plate is fixedly connected to the inner surface of the shell;

the PCB board sets up the inside swash plate surface of cavity, the PCB board includes first minute board and second minute board, first minute board and second minute board are followed the incline direction of swash plate distributes side by side, first minute board is close to the perpendicular board of second, first minute board is used for the installation the chip, the second minute board is close to first perpendicular board, the second minute board is used for the installation the optical module.

Optionally, the light cage is a rectangular parallelepiped structure with a plurality of openings at one end, the open end of the light cage faces the first vertical plate, and the light cage is pressed on the surface of the second sub-plate;

the surface of the first vertical plate is provided with a plurality of through holes;

the optical module penetrates through the through hole and is inserted into the optical cage, so that the optical module is fixedly connected with the PCB.

Optionally, the cavity is internally close to the position of the shell is provided with a first radiating block and a second radiating block, the first radiating block is arranged at the bottom end of the chip, and the second radiating block is arranged at the bottom end of the light cage.

Optionally, the inclination angle of the inclined plate relative to the inner surface of the shell is 3-15 degrees.

Optionally, the inclination angle of the swash plate with respect to the inner surface of the housing is 8 °.

Optionally, the first connecting plate is fixedly connected to the inner surface of the housing by bolts.

Optionally, the second connecting plate is fixedly connected to the inner surface of the housing by bolts.

According to the above technical scheme, the present application provides an inside heat abstractor of light access local side equipment, light access local side equipment is provided with the shell, heat abstractor includes: the receiving plate is arranged in the shell, the PCB is arranged on the surface of the receiving plate, and the chip and the optical module are arranged on the surface of the PCB. The cross section of the bearing plate is of a trapezoidal structure, the bearing plate comprises a first vertical plate, a second vertical plate and an inclined plate, and a cavity formed by the first vertical plate, the second vertical plate, the inclined plate and the shell is used for mounting the chip and the optical module. And dividing the PCB into a first sub-board and a second sub-board, wherein the first sub-board is close to the second vertical board and is used for mounting the chip, and the second sub-board is used for mounting the optical module. The positions of the chip and the optical module are close to the inner surface of the shell, so that the heat dissipation problem of the chip and the optical module is solved. Furthermore, the optical module passes through the hollow structure on the surface of the first vertical plate and is inserted into the optical cage, and the space between the first vertical plate and the inner surface of the shell can meet the requirement that the optical module is fixedly connected to the surface of the PCB plate in a plugging mode.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device inside an optical access office device according to the present application;

fig. 2 is a schematic diagram of a connection structure between an optical module and an optical cage in a heat dissipation apparatus of an optical access local side device according to the present application.

Illustration of the drawings: 1-a housing; 2, bearing plates; 3-a PCB board; 4-chip; 5-an optical module; 6-a cavity; 7-light cage; 8-a first heat sink; 9-a second heat sink; 21-a first vertical plate; 22-a second vertical plate; 23-a sloping plate; 24-a first connection plate; 25-a second connecting plate; 31-a first subpanel; 32-a second section plate; 211-through holes.

Detailed Description

The present application is described in detail below.

Referring to a schematic structural diagram shown in fig. 1, the present application provides a heat dissipation apparatus inside an optical access local side device, the optical access local side device is provided with a housing 1, the housing 1 is a box structure, an annular sealing device is arranged in the middle of the housing 1, the sealing device divides the housing 1 into two parts, the middle of the two parts is concave, the edge of the housing is convex, a plurality of components are arranged inside the two parts, the surface of the housing 1 is a sealing structure with multiple grooves, the two parts of the housing are integrated and sealed by the sealing device, and the surface of the housing 1 can protect the internal components from being damaged by the external environment.

The heat dissipation device provided by the application is mainly designed for a chip and an optical module, and in addition, other auxiliary components are further arranged inside a shell of the optical access local side equipment, and the application is not described in detail. The application provides an optical access local side device includes: the optical module comprises a bearing plate 2 arranged in the shell 1, a PCB 3 arranged on the surface of the bearing plate 2, a chip 4 arranged on the surface of the PCB 3 and an optical cage 7 used for installing an optical module 5.

In the prior art, the chip 4 and the optical module 5 are respectively arranged on different PCBs, and due to the fact that the PCBs are attenuated under the condition that the data transmission rate is high, data loss and other problems are caused, and the two PCBs are overlapped in the prior art, the attenuation can be accelerated. In the application, the chip 4 and the optical module 5 are arranged on the same PCB, so that attenuation can be reduced, and the stability of data transmission is ensured.

In order to solve the heat dissipation problem of the chip 4 and the optical module 5, the chip 4 and the optical module 5 are arranged on the surface of the same PCB, namely, the chip 4 and the optical module 5 can be close to one side of the inner surface of the shell 1 at the same time, and the heat dissipation problem caused by a double-layer structure is avoided. In this application, the inner surface of the housing 1 refers to the inner surface of the housing where the chip 4 and the optical module 5 are located, and since each component inside the optical access local side device generates heat during normal operation, the inner surface at the edge position has a better heat dissipation effect than other positions inside the housing 1. In the present application, since the optical module 5 is connected to the PCB in a plug-in manner, if the chip 4 and the optical module 5 are tightly attached to the inner surface of the housing 1, the optical module 5 is difficult to be mounted on the surface of the PCB 3 in a plug-in manner under the limitation of the space inside the housing 1.

In view of the above problems, the present application designs a bearing plate 2, the cross section of the bearing plate 2 is a trapezoid structure, the bearing plate 2 comprises a first vertical plate 21, a second vertical plate 22 and an inclined plate 23, the first vertical plate 21 and the second vertical plate 22 are respectively arranged at two ends of the inclined plate 23, the first vertical plate 21 and the second vertical plate 22 are respectively perpendicular to the inner surface of the housing 1, the height of the first vertical plate 21 in the direction perpendicular to the inner surface of the housing 1 is greater than the height of the second vertical plate 22, the first vertical plate 21 is a hollow structure, the hollow structure is used for inserting the optical module 5 into the optical cage 7 in a plugging manner, the inclined plate 23 is disposed obliquely with respect to the inner surface of the housing 1, and the cavity 6 enclosed by the first vertical plate 21, the second vertical plate 22, the inclined plate 23 and the housing 1 is used for mounting the chip 4 and the optical module 5.

The PCB 3 is arranged on the surface of the inclined plate 23 inside the cavity 6, the PCB 3 comprises a first board divider 31 and a second board divider 32, the first board divider 31 and the second board divider 32 are distributed in parallel along the inclined direction of the inclined plate 23, the first board divider 31 is close to the second vertical plate 22, the first board divider 31 is used for installing the chip 4, the second board divider 32 is close to the first vertical plate 21, and the second board divider 32 is used for installing the optical cage 7.

Due to the inclined plate 23 designed to be inclined relative to the inner surface of the housing 1, the space between the second board 32 close to the first vertical plate 21 and the inner surface of the housing 1 is larger than the space between the first board 31 and the inner surface of the housing 1, and the optical module 5 is mounted on the surface of the second board 32 with a relatively large space, so that the optical module 5 can be connected with the PCB 3 in a plugging and unplugging manner. In practical applications, the heights of the first vertical plate 21 and the second vertical plate 22 are determined according to practical situations, and the height of the first vertical plate 21 is subject to an operation of plugging and unplugging the optical module 5 in and out in real time.

One end of the first vertical plate 21, which is far away from the inclined plate 23, is provided with a first connecting plate 24, the first connecting plate 24 is parallel to the inner surface of the housing 1 and extends towards the outside of the cavity 6, and the first connecting plate 24 is fixedly connected to the inner surface of the housing 1. One end of the second vertical plate 22, which is far away from the inclined plate 23, is provided with a second connecting plate 25, the second connecting plate 25 is parallel to the inner surface of the shell 1 and extends towards the outside of the cavity 6, and the second connecting plate 25 is fixedly connected to the inner surface of the shell 1.

The first connecting plate 24 and the second connecting plate 25 are used for fixing the bearing plate 2 on the inner surface of the housing 1, and optionally, the first connecting plate 24 is fixedly connected to the inner surface of the housing 1 through bolts, and the second connecting plate 25 is fixedly connected to the inner surface of the housing 1 through bolts.

According to the above technical scheme, the present application provides an inside heat abstractor of light access local side equipment, light access local side equipment is provided with shell 1, heat abstractor includes: the optical module comprises a bearing plate 2 arranged in the shell 1, a PCB 3 arranged on the surface of the bearing plate 2, a chip 4 arranged on the surface of the PCB 3 and an optical cage 7 for installing an optical module 5. The cross section of the socket plate 2 is a trapezoid structure, the socket plate 2 comprises a first vertical plate 21, a second vertical plate 22 and an inclined plate 23, and a cavity 6 enclosed by the first vertical plate 21, the second vertical plate 22, the inclined plate 23 and the housing 1 is used for mounting the chip 4 and the optical module 5. The PCB 3 is divided into a first board 31 and a second board 32, the first board 31 is close to the second vertical board 22 for mounting the chip 4, and the second board 32 is for mounting the light cage 7. The positions of the chip 4 and the optical cage 7 are close to the inner surface of the shell 1, so that the heat dissipation problem of the chip 4 and the optical module 5 is solved. Further, the optical module 5 passes through the hollow structure on the surface of the first vertical plate 21 and is inserted into the optical cage 7, and the space between the first vertical plate 21 and the inner surface of the housing 1 can meet the requirement that the optical module 5 is fixedly connected to the surface of the PCB 3 in a plugging mode.

Referring to fig. 2, the light cage 7 is a rectangular parallelepiped structure with a plurality of openings at one end, the open end of the light cage 7 faces the first vertical plate 21, and the light cage 7 is pressed against the surface of the second plate 32; the surface of the first vertical plate 21 is provided with a plurality of through holes 211; the optical module 5 passes through the through hole 211 and is inserted into the optical cage 7, so that the optical module 5 is fixedly connected with the PCB 3.

Fig. 2 is a schematic view of a connection structure between the optical cage 7 and the optical module 5, when the optical cage 7 is applied to the heat dissipation device provided by the present application, the optical cage 7 is disposed on the surface of the second partition 32 inside the cavity 6, an opening end of the optical cage 7 is tightly attached to the first vertical plate 21, and a through hole 211 formed on the surface of the first vertical plate 21 is consistent with the opening position and shape of the optical cage 7, so that the optical module 5 can pass through the through hole 211 and be inserted into the optical cage 7. In addition, the shape of the opening end of the optical cage 7 and the shape of the interface of the optical module 5 shown in fig. 2 are merely exemplary and should not be construed as a limitation to the present application.

Optionally, the cavity 6 is internally close to the housing 1, and a first heat dissipation block 8 and a second heat dissipation block 9 are arranged at the position of the housing, wherein the first heat dissipation block 8 is arranged at the bottom end of the chip 4, and the second heat dissipation block 9 is arranged at the bottom end of the light cage 7. The first heat dissipation block 8 and the second heat dissipation block 9 can dissipate heat generated by the chip 4 and the optical module 5 to the outside more quickly, which is beneficial to maintaining the temperature inside the cavity 6 in a normal range.

Optionally, the inclination angle of the inclined plate 23 relative to the inner surface of the housing 1 is 3-15 °. Within the range of the inclination angle, the distance between the second splitter 32 and the inner surface of the housing 1 can meet the requirement of inserting and extracting the optical module 5. If the inclination angle is too large, the distance between the optical module 5 and the inner surface of the housing 1 is too long, which may affect the heat dissipation of the optical module 5. Optionally, an inclination angle of the inclined plate 23 with respect to the inner surface of the housing 1 is 8 °, and the inclination angle can meet the requirements of heat dissipation and plugging of the optical module 5.

The present application has been described in detail with reference to specific embodiments and illustrative examples, but the description is not intended to limit the application. Those skilled in the art will appreciate that various equivalent substitutions, modifications or improvements may be made to the presently disclosed embodiments and implementations thereof without departing from the spirit and scope of the present disclosure, and these fall within the scope of the present disclosure. The protection scope of this application is subject to the appended claims.

Claims (7)

1. The utility model provides an inside heat abstractor of light access local side equipment, light access local side equipment is provided with shell (1), its characterized in that, light access local side equipment includes: the optical module comprises a bearing plate (2) arranged in the shell (1), a PCB (3) arranged on the surface of the bearing plate (2), a chip (4) arranged on the surface of the PCB (3) and an optical cage (7) used for installing an optical module (5); wherein,

the cross section of the bearing plate (2) is of a trapezoidal structure, the bearing plate (2) comprises a first vertical plate (21), a second vertical plate (22) and an inclined plate (23), the first vertical plate (21) and the second vertical plate (22) are respectively arranged at two ends of the inclined plate (23), the first vertical plate (21) and the second vertical plate (22) are perpendicular to the inner surface of the housing (1), respectively, the height of the first vertical plate (21) in the direction perpendicular to the inner surface of the housing (1) is greater than the height of the second vertical plate (22), the first vertical plate (21) is of a hollow structure, the inclined plate (23) is obliquely arranged relative to the inner surface of the shell (1), a cavity (6) surrounded by the first vertical plate (21), the second vertical plate (22), the inclined plate (23) and the shell (1) is used for mounting the chip (4) and the optical module (5);

a first connecting plate (24) is arranged at one end, away from the inclined plate (23), of the first vertical plate (21), the first connecting plate (24) is parallel to the inner surface of the shell (1) and extends towards the outside of the cavity (6), and the first connecting plate (24) is fixedly connected to the inner surface of the shell (1);

a second connecting plate (25) is arranged at one end, away from the inclined plate (23), of the second vertical plate (22), the second connecting plate (25) is parallel to the inner surface of the shell (1) and extends towards the outside of the cavity (6), and the second connecting plate (25) is fixedly connected to the inner surface of the shell (1);

PCB board (3) set up swash plate (23) surface inside cavity (6), PCB board (3) include first minute board (31) and second minute board (32), first minute board (31) and second minute board (32) are followed the slope direction of swash plate (23) distributes side by side, first minute board (31) are close to second vertical plate (22), first minute board (31) are used for the installation chip (4), second minute board (32) are close to first vertical plate (21), second minute board (32) are used for the installation light cage (7).

2. The heat sink according to claim 1, wherein the light cage (7) is a rectangular parallelepiped structure provided with a plurality of openings at one end, the open end of the light cage (7) facing the first vertical plate (21), the light cage (7) being crimped on a surface of the second plate (32);

the surface of the first vertical plate (21) is provided with a plurality of through holes (211);

the optical module (5) penetrates through the through hole (211) to be inserted into the optical cage (7) so that the optical module (5) is fixedly connected with the PCB (3).

3. The heat sink according to claim 1, wherein a first heat sink (8) and a second heat sink (9) are disposed inside the cavity (6) and near the housing (1), the first heat sink (8) is disposed at the bottom end of the chip (4), and the second heat sink (9) is disposed at the bottom end of the light cage (7).

4. The heat sink according to claim 1, wherein the inclined plate (23) is inclined at an angle of 3 to 15 ° with respect to the inner surface of the housing (1).

5. The heat sink according to claim 3, wherein the inclined plate (23) is inclined at an angle of 8 ° with respect to the inner surface of the housing (1).

6. The heat dissipating device according to claim 1, wherein the first connection plate (24) is fixedly connected to the inner surface of the housing (1) by bolts.

7. The heat sink as claimed in claim 1, characterised in that the second connection plate (25) is fixedly connected to the inner surface of the housing (1) by means of bolts.

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