CN210272331U

CN210272331U - Heat radiator for high-power electronic power device

Info

Publication number: CN210272331U
Application number: CN201921619769.6U
Authority: CN
Inventors: 李建中; 夏中宇; 徐雪舟
Original assignee: Miracle Power Semiconductor Co ltd
Current assignee: Miracle Power Semiconductor Co ltd
Priority date: 2019-09-27
Filing date: 2019-09-27
Publication date: 2020-04-07
Anticipated expiration: 2029-09-27

Abstract

The utility model discloses a heat dissipation device of a high-power electronic power device, which comprises a shell, a cover body is arranged above the shell, the shell is movably connected with the cover body through a pin shaft, a mounting plate is fixedly arranged on the inner wall of the shell, the power device is arranged on the mounting plate through screws, and a heat dissipation fin is arranged on the left side of the mounting plate, the utility model can realize the heat emission of the electronic power device and the heat inside the shell to carry out effective conduction work by arranging a heat conduction pipe, a heat conduction plate, the heat dissipation fin and a heat dissipation mechanism, simultaneously, the heat dissipation mechanism is equally arranged on the side wall of the shell, the heat dissipation is uniform and efficient, thereby reducing the temperature of the electronic power device during work, reducing the failure occurrence probability of the electronic power device, playing a better explosion-proof role and having obvious heat dissipation effect, is convenient for popularization and use.

Description

Heat radiator for high-power electronic power device

Technical Field

The utility model relates to an electric power device technical field especially relates to a heat abstractor of high-power electron electric power device.

Background

Along with the development of the society, electronic power devices are applied more and more widely in factories or families, the electronic power devices often generate heat when working, the existing electronic power devices do not have special heat dissipation devices and are slow in heat dissipation, so that the internal temperature of the electronic power devices is overhigh, the electronic power devices have potential safety hazards in the use process, especially, the loss of some high-power circuits can generate huge heat energy in the electronic power devices, but if the heat is not dissipated, the electrical cabinets can be easily short-circuited to cause explosion, and inestimable results are caused, so that the heat dissipation device of the high-power electronic power devices is provided.

SUMMERY OF THE UTILITY MODEL

The utility model provides a heat abstractor of high-power electronic power device, aim at can carry out even, efficient heat dissipation work to the heat that electronic power device produced to protected electronic power device not receive the influence of dust, and ensured the effect of electronic power device during operation.

In order to realize the technical purpose, the technical effect is achieved, the utility model discloses a realize through following technical scheme:

a heat dissipation device for a high-power electronic power device comprises a shell, wherein the top of the shell is designed in an unclosed mode, a pin shaft is mounted at the top of the shell, a cover body is arranged above the shell and movably connected with the cover body through the pin shaft, a mounting plate is fixedly mounted on the inner wall of the shell, mounting screw holes are symmetrically formed in the upper surface of the mounting plate, the power device is mounted on the mounting plate through screws, heat dissipation fins are arranged on the left side of the mounting plate and mounted on the left side wall of an inner cavity of the shell, a heat dissipation mechanism is arranged on the left side of the heat dissipation fins and mainly composed of a heat dissipation fan and a cylinder, the cylinder is mounted on the left side outer wall of the shell, a dustproof net is mounted on an opening of the left side outer wall of the cylinder, the heat dissipation fan is mounted in the inner, the lateral wall of radiator fan and radiator fin's left side wall mutually contact, the bottom outer wall fixed mounting of shell has the base.

Preferably, in the heat dissipation device for high-power electronic and power devices, four heat dissipation mechanisms are linearly and equally mounted on the side wall of the housing.

Based on the technical characteristics, the heat absorbed by the radiating fins can be well conducted to the outside through the equal installation of the radiating mechanism, and the efficient radiating work is completed.

Preferably, in the heat dissipation device for a high-power electronic power device, the cover body and the outer wall of the right side of the housing are correspondingly provided with the mutually matched limiting locking blocks.

Based on the technical characteristics, the installation of the limiting lock block is realized. So as to facilitate mounting of the cover on the housing.

Preferably, in the heat dissipation device for a high-power electronic power device, two air ducts are fixedly installed at an opening of a right side wall of the housing, and dust screens are installed on inner walls of the two air ducts.

Based on the technical characteristics, through the arrangement of the two air guide cylinders and the internal dustproof net, a good air guide effect can be achieved, and dust can be prevented from entering the shell.

Preferably, in the heat dissipation device for a high-power electronic power device, the outer wall of the bottom of the mounting plate is fixedly provided with the heat conduction pipe, the outer wall of the left side of the mounting plate is fixedly provided with the heat conduction plate, and the heat conduction plate is attached to the outer wall of the right side of the heat dissipation fin.

Based on above-mentioned technical characteristics, through the bottom installation heat pipe at the mounting panel, can effectually be with heat transfer to the radiating fin on the mounting panel.

Preferably, in the heat dissipation device for a high-power electronic power device, the heat conduction pipe is disposed in an S-shaped curved shape, and four transverse pipes are mounted at one end of the heat conduction pipe close to the heat dissipation fins, the four transverse pipes are perpendicular to the heat conduction pipe, and the tail ends of the four transverse pipes are in contact with the outer wall of the heat conduction plate.

Based on the technical characteristics, the heat conduction efficiency of the heat conduction pipe and the heat dissipation fins is high, and the heat dissipation effect is good.

The utility model has the advantages that:

(1) the utility model discloses install electronic power device at the mounting panel, through the setting of heat pipe, heat-conducting plate, heat radiation fins and heat dissipation mechanism, can realize sending the heat and the inside heat of shell to electronic power device, carry out effectual conduction work, and then reduced the temperature that reduces electronic power device during operation, reduced the probability that electronic power device trouble takes place, play better explosion-proof effect, the radiating effect is obvious, convenient to popularize and use.

(2) The utility model discloses the installation of heat dissipation mechanism at the lateral wall equipartition of shell, the heat dissipation is even and high-efficient to through dust screen in the heat dissipation mechanism, and the setting of two air ducts and inside dust screen, not only can play a fine wind-guiding effect, and can also prevent that the dust from getting into the shell, protected electronic power device not receive the influence of dust, and ensured the effect of electronic power device during operation, fine practicality has.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic overall structure diagram of the present invention;

fig. 2 is a schematic bottom structure diagram of the mounting plate of the present invention;

fig. 3 is a schematic view of the internal structure of the heat dissipation mechanism of the present invention;

fig. 4 is a schematic view of the internal structure of the air duct of the present invention.

In the drawings, the components represented by the respective reference numerals are listed below:

1. a housing; 2. a cover body; 3. a pin shaft; 4. mounting a plate; 41. a heat conducting plate; 42. a heat conducting pipe; 43. mounting a screw hole; 5. heat dissipation fins; 6. a heat dissipation mechanism; 61. a cylinder; 62. a heat radiation fan; 63. a dust screen; 64. mounting a rod; 7. an air duct; 8. a base; 9. and a limiting block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention.

Referring to fig. 1-4, the present embodiment is a heat dissipation device for high-power electronic power devices, which includes a housing 1, the top of the housing 1 is of an open design, a pin 3 is installed on the top of the housing 1, a cover 2 is installed above the housing 1, the housing 1 is movably connected to the cover 2 through the pin 3, the cover 2 and the right outer wall of the housing 1 are respectively and correspondingly installed with a mutually matched limit lock 9, the cover 2 is installed on the housing 1 through the installation of the limit lock 9, an installation plate 4 is fixedly installed on the inner wall of the housing 1, installation screw holes 43 are symmetrically formed on the upper surface of the installation plate 4, the power devices are installed on the installation plate 4 through screws, a heat dissipation fin 5 is installed on the left side of the installation plate 4, a heat pipe 42 is fixedly installed on the outer wall of the bottom of the installation plate 4, the heat pipe 42 is disposed in an S-shaped curved shape, the four transverse pipes and the heat conducting pipes 42 are vertically arranged, and the tail ends of the four transverse pipes are mutually contacted with the outer wall of the heat conducting plate 41, the heat conducting pipes 42 and the radiating fins 5 have high heat conduction efficiency and good radiating effect, the heat conducting plate 41 is fixedly arranged on the outer wall of the left side of the mounting plate 4, the heat conducting plate 41 is tightly attached to the outer wall of the right side of the radiating fins 5, the heat on the mounting plate 4 can be effectively transferred to the radiating fins 5 by arranging the heat conducting pipes 42 at the bottom of the mounting plate 4, the radiating fins 5 are arranged on the left side wall of the inner cavity of the shell 1, the radiating mechanism 6 is arranged on the left side of the radiating fins 5, the radiating mechanism 6 mainly comprises a radiating fan 62 and a cylinder 61, the cylinder 61 is arranged on the outer wall of the left side of the shell 1, a dustproof net 63 is arranged on the outer wall of the left side of, lateral wall and the left side wall of cooling fin 5 of radiator fan 62 contact each other, heat dissipation mechanism 6 is linear type installs four at the lateral wall equipartition of shell 1, equipartition installation through heat dissipation mechanism 6, can be fine with the absorptive heat of cooling fin 5, conduct to the outside, accomplish efficient radiating work, the right side wall trompil fixed mounting of shell 1 has two guide ducts 7, dust screen 63 is installed to the inner wall of two guide ducts 7, setting through two guide ducts 7 and inside dust screen 63, not only can play a fine wind-guiding effect, and can also prevent that the dust from getting into in the shell 1, the bottom outer wall fixed mounting of shell 1 has base 8.

When the utility model is used, firstly, the electronic power device is installed on the installation plate 4 through the installation screw 43, then the heat dissipation fan 62 in the heat dissipation mechanism 6 is turned on through an external power supply and a switch, when the electronic power device generates heat during working, the heat pipe 42 can well absorb the heat generated by the electronic power device during working and simultaneously conduct the heat to the heat dissipation fins 5 through the heat conduction plate 41, the heat dissipation fan 62 passes through the side wall of the shell 1, the side wall of the heat dissipation fan 62 is mutually contacted with the left side wall of the heat dissipation fins 5, the heat absorbed by the heat dissipation fins 5 can be well discharged to the outer side of the shell 1 by the heat dissipation fan 62, meanwhile, the heat dissipation mechanism 6 is equally installed on the side wall of the shell 1, the heat dissipation is uniform and efficient, and the heat dissipation mechanism passes through the dust screen 63 in the heat dissipation mechanism 6, and the arrangement of the two air guide cylinders 7, not only can play a fine wind-guiding effect to can also prevent that the dust from getting into in shell 1, protect the influence that electronic power device does not receive the dust, and then reduced the temperature that reduces electronic power device during operation, reduce the probability that electronic power device trouble takes place, play better explosion-proof effect, the radiating effect is obvious, convenient to popularize and use.

In the description herein, references to the description of "one embodiment," "an example," "a specific example," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. The preferred embodiments are not exhaustive and do not limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and its practical applications, to thereby enable others skilled in the art to best understand the invention for and utilize the invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A heat abstractor of high-power electronic power device which characterized in that: including shell (1), the top of shell (1) is the design of non-enclosed, round pin axle (3) are installed at the top of shell (1), the top of shell (1) is provided with lid (2), shell (1) is through round pin axle (3) swing joint lid (2), and the inner wall fixed mounting of shell (1) has mounting panel (4), installation screw (43) have been seted up to the upper surface symmetry of mounting panel (4), and power device is installed through the screw in mounting panel (4), the left of mounting panel (4) is provided with heat dissipation fin (5), heat dissipation fin (5) are installed on the inner chamber left side wall of shell (1), the left of heat dissipation fin (5) is provided with heat dissipation mechanism (6), heat dissipation mechanism (6) mainly comprises radiator fan (62) and drum (61), the left side outer wall at shell (1) is installed to drum (61), and dust screen (63) are installed to the left side outer wall trompil of drum (61), radiator fan (62) are installed in the inner chamber of drum (61) through installation pole (64), just radiator fan (62) pass the lateral wall of shell (1), and the lateral wall of radiator fan (62) and the left side wall of heat radiation fin (5) contact each other, the bottom outer wall fixed mounting of shell (1) has base (8).

2. The heat dissipating device for high power electronic power device as claimed in claim 1, wherein: the four heat dissipation mechanisms (6) are arranged on the side wall of the shell (1) in a linear mode and are arranged in an equally-divided mode.

3. The heat dissipating device for high power electronic power device as claimed in claim 1, wherein: the right side outer wall of lid (2) and shell (1) all corresponds installs spacing locking piece (9) that match each other.

4. The heat dissipating device for high power electronic power device as claimed in claim 1, wherein: two air ducts (7) are fixedly installed on the opening of the right side wall of the shell (1), and dust screens (63) are installed on the inner walls of the two air ducts (7).

5. The heat dissipating device for high power electronic power device as claimed in claim 1, wherein: the bottom outer wall fixed mounting of mounting panel (4) has heat pipe (42), and the left side outer wall fixed mounting of mounting panel (4) has heat-conducting plate (41), heat-conducting plate (41) paste the right side outer wall of tightly at cooling fin (5).

6. The heat dissipating device for high power electronic power device as claimed in claim 5, wherein: the heat conduction pipe (42) is the crooked form setting of S-shaped, just four horizontal pipes are installed to the one end that heat conduction pipe (42) are close to radiator fin (5), and four horizontal pipes are perpendicular setting with heat conduction pipe (42), and the end of four horizontal pipes all contacts each other with the outer wall of heat conduction plate (41).