CN210272290U

CN210272290U - Sheet body connecting device and silicon wafer film thickness measuring system adopting same

Info

Publication number: CN210272290U
Application number: CN201921088507.1U
Authority: CN
Inventors: 吴火亮
Original assignee: Shanghai Yinguan Semiconductor Technology Co Ltd
Current assignee: Shanghai Yinguan Semiconductor Technology Co Ltd
Priority date: 2019-04-30
Filing date: 2019-07-12
Publication date: 2020-04-07
Anticipated expiration: 2029-07-12

Abstract

The utility model relates to a slice body handing-over device and adopt device's thick measurement system of silicon chip membrane. Specifically, the sheet body handing-over device of the utility model comprises an upper sheet hand, a lower sheet hand, a driving device and a handing-over support; the upper piece hand and the lower piece hand are fixedly connected with an output shaft of the driving device directly or indirectly, the upper piece hand is positioned below the lower piece hand, and a channel is formed between the upper piece hand and the lower piece hand; and the driving device is fixed on the cross connecting support. The utility model discloses a platelike body handing-over device handing-over is efficient, simple structure, and possesses the centering function of silicon chip.

Description

Sheet body connecting device and silicon wafer film thickness measuring system adopting same

Technical Field

The utility model belongs to integrated circuit equipment makes the field, more specifically relates to a slice body handing-over device and method and utilize device's thick measurement system of silicon chip membrane.

Background

In the field of detecting the thickness of a semiconductor silicon wafer, a workpiece platform is required to be capable of completing the handover of the silicon wafer with a silicon wafer transmission system. With the continuous improvement of the requirement on the yield, the requirement on the speed of silicon wafer handover is higher and higher, and the handover efficiency is improved accordingly. This requires a silicon wafer interface device with efficient interface efficiency.

In US6485253B1, a silicon wafer interface scheme in the field is proposed. The utility model discloses a through four last hands up-and-down motion of cylinder drive, two sets of linear bearing provide the direction, accomplish with the silicon chip handing-over flow of work piece platform. The utility model discloses a structure is comparatively simple, but handing-over flow can only accomplish the handing-over of a silicon chip once, can't accomplish the centering of silicon chip moreover.

Another approach to silicon wafer interfacing in this field is proposed in US6390767B 1. The utility model mainly comprises three groups of connecting sheet arms fixed on a frame. Each wafer connecting arm is driven by a stepping motor to rotate three positions of the wafer loading hand, so that a silicon wafer handover process with the workpiece table can be completed. The utility model discloses a handing-over and the centering of silicon chip can be accomplished, but the structure is comparatively complicated, needs three group's motors of synchronous control moreover.

Another approach to silicon wafer interfacing in this field is proposed in US6860790B 2. The utility model discloses a mainly drive the annular hand 24 of both sides, 25 through relative drive arrangement 32 and carry out opening and shutting about to accomplish and the handing-over of silicon chip on the manipulator 16. The utility model discloses a handing-over of silicon chip can be accomplished, but the centering of silicon chip can't be accomplished, and the structure is comparatively complicated moreover.

The present invention is directed to a silicon wafer cross-connecting device, which solves the problems of the prior art that the structure is complicated and the cross-connecting efficiency is low.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, the present invention provides a sheet-like body joining device with simple structure and high efficiency.

To achieve the above object, the present invention provides a sheet-shaped body transfer device, which includes an upper sheet hand, a lower sheet hand, a driving device and a transfer support; the upper piece hand and the lower piece hand are fixedly connected with an output shaft of the driving device directly or indirectly, the upper piece hand is positioned below the lower piece hand, and a channel is formed between the upper piece hand and the lower piece hand; and the driving device is arranged on the cross connecting support.

In one embodiment, the ends of the upper sheet hand and the lower sheet hand are respectively provided with a supporting step, and the supporting steps are provided with supporting surfaces for supporting the sheet bodies when the sheet bodies are jointed.

In one embodiment, a positioning surface is arranged between the supporting step of the upper plate hand and the top surface of the upper plate hand, and a positioning surface is arranged between the supporting step of the lower plate hand and the top surface of the lower plate hand.

In one embodiment, the connecting device further includes a hand fixing seat, the lower hand and the upper hand are respectively fixed on the hand fixing seat from top to bottom, and the hand fixing seat is fixedly connected to the output shaft of the driving device.

In one embodiment, the head ends of the upper plate hand and the lower plate hand are provided with mounting holes, the lower plate hand and the upper plate hand are fixed on the plate hand fixing seat through the mounting holes from top to bottom, the other ends of the upper plate hand and the lower plate hand are provided with supporting steps and positioning surfaces, supporting surfaces are arranged on the supporting steps, the positioning surfaces and the supporting surfaces are intersected to form a preset angle, and the positioning surfaces are arranged to center the plate-shaped body when the plate-shaped body is connected.

In one embodiment, the upper and lower blades each have a pivot arm and a support arm extending from an end of the pivot arm at an oblique angle to the pivot arm.

In one embodiment, the top surface of the upper film hand is positioned on the supporting arm; the top surface of the lower slice hand is positioned on the supporting arm.

In one embodiment, the upper tab hand comprises an elastic piece, a tab bracket and a tab hand support; wherein one end of the tab holder is elastically connected to the tab hand holder by the elastic member, and the other end of the tab holder is for receiving a sheet-like member.

Preferably, the lower plate hand and the upper plate hand are identical in structure.

In one embodiment, the other end of the tabbed bracket is provided with a supporting step and a positioning surface, wherein the supporting step is provided with a supporting surface, the positioning surface and the supporting surface intersect at a predetermined angle, and the positioning surface is arranged to centre the sheet when the sheet is jointed.

In one embodiment, the positioning surface is an inclined surface.

In one embodiment, the driving device is a swing cylinder, a stepping motor or a servo motor.

Further, another object of the present invention is to provide a silicon wafer film thickness measuring system including the above sheet-like body connecting device.

For this reason, the utility model provides a thick measurement system of silicon chip membrane, the thick measurement system of silicon chip membrane includes:

a frame;

a workpiece table movably connected to the frame;

the film thickness detection device is used for detecting the film thickness of the silicon wafer;

a robot hand arranged to be able to place the silicon wafer on which the measurement is completed on the lower hand and to place the silicon wafer to be measured on the upper hand; and

at least two of the above described sheet interface devices mounted on the frame and surrounding the workpiece table.

In one embodiment, the silicon wafer film thickness measuring system further comprises a robot arm arranged to place the silicon wafer on which the measurement is completed on the lower hand and to place the silicon wafer to be measured on the upper hand.

In one embodiment, the mechanical arm is provided with an upper wafer mechanism and a lower wafer mechanism which can move relatively, wherein the upper wafer mechanism is used for placing a silicon wafer to be measured on the upper wafer hand; and the wafer discharging mechanism is used for removing the silicon wafer which is subjected to measurement from the wafer discharging hand.

In one embodiment, the workpiece stage is arranged to be able to place a silicon wafer on which measurements are made on the lower hand.

In one embodiment, the silicon wafer film thickness measuring system comprises four sheet body connecting devices, wherein every two sheet body connecting devices are arranged on two sides of the workpiece table; or the silicon wafer film thickness measuring system comprises three flaky body connecting devices which are arranged around the workpiece platform in a triangular shape.

Further, another object of the present invention is to provide a silicon wafer transfer method using the sheet transfer apparatus.

Therefore, the utility model provides a double-silicon-wafer handing-over method, the method includes the step:

s1, providing a frame, a workpiece table, a manipulator and at least two of the above-mentioned sheet body handing-over devices, wherein the workpiece table is movably connected to the frame, and the sheet body handing-over devices are arranged on the frame and surround the workpiece table;

s2, transferring the silicon wafer after measurement to the lower wafer hand;

s3, removing the silicon wafer after measurement from the lower wafer hand;

s4, placing the silicon wafer to be measured on the upper wafer hand;

and S5, transferring the silicon wafer to be measured from the upper wafer hand to the workpiece table.

In one embodiment, in step S2, the upper and lower blades are first rotated to the transfer position, the lower blade is ready, the workpiece stage is then moved from the first position to the second position, and the silicon wafer whose measurement is completed is transferred to the lower blade.

In one embodiment, in step S3, the robot moves to the joint position between the upper hand and the lower hand, and receives the silicon wafer after measurement from the lower hand, and then exits from the joint position.

In one embodiment, after step S2 and before step S3, the method further comprises moving the workpiece stage in a vertical direction and triggering the robot action.

In one embodiment, in step S4, the robot arm carries the silicon wafer to be measured to move to the joint between the upper hand and the lower hand, places the silicon wafer to be measured on the upper hand, and then withdraws from the joint.

In one embodiment, after step S3 and before step S4, the method further comprises moving the workpiece stage vertically downward ready to receive a silicon wafer to be measured after the robot exits from the interface; and triggering a loading signal to enable the manipulator to act.

In one embodiment, in step S5, the stage moves to a top height and hands the silicon wafer to be measured from the top, and then the measurement is performed.

In one embodiment, after step S4 and before step S5, the method further comprises triggering a workpiece stage tab signal after the robot exits from the interface.

The utility model has the main advantages that:

compared with the traditional handing-over device, the flaky body handing-over device of the utility model has high handing-over efficiency and simple structure. Furthermore, the slice body handing-over device of the utility model can also have the centering function of the silicon slice.

Drawings

Fig. 1 is a perspective view of the film thickness measuring system of the present invention, showing a state at the time of handover.

Fig. 2 is a plan view of the film thickness measuring system of the present invention, showing a state during handover, and hiding the robot.

Fig. 3 is another plan view of the film thickness measuring system according to the present invention, showing a state during measurement or at the end of handover.

Fig. 4 is a perspective view of a dual-silicon wafer transfer device according to an embodiment of the present invention.

Fig. 5 is a cross-sectional view of the dual silicon wafer interface device of fig. 4.

Fig. 6 is a perspective view of an upper/lower wafer hand in a double-wafer exchange device according to an embodiment of the present invention.

Fig. 7 is a flow chart showing the handover process and the measurement process when the double-silicon-wafer handover device of the present invention is used for silicon wafer measurement.

Fig. 8 is a layout diagram of a dual-silicon wafer interface device according to yet another embodiment of the present invention.

Fig. 9 is a sectional view showing the structure of an upper/lower blade hand in a double silicon wafer exchanging apparatus according to still another embodiment of the present invention.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the objects, features and advantages of the invention can be more clearly understood. It should be understood that the embodiments shown in the drawings are not intended as limitations on the scope of the invention, but are merely illustrative of the true spirit of the technical solution of the invention.

In the following description, for the purposes of illustrating various disclosed embodiments, certain specific details are set forth in order to provide a thorough understanding of the various disclosed embodiments. One skilled in the relevant art will recognize, however, that the embodiments may be practiced without one or more of the specific details. In other instances, well-known devices, structures and techniques associated with this application may not be shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

Throughout the specification and claims, the word "comprise" and variations thereof, such as "comprises" and "comprising," are to be understood as an open, inclusive meaning, i.e., as being interpreted to mean "including, but not limited to," unless the context requires otherwise.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

As used in this specification and the appended claims, the singular forms "a", "an", and "the" include plural referents unless the context clearly dictates otherwise. It should be noted that the term "or" is generally employed in its sense including "and/or" unless the context clearly dictates otherwise.

In the following description, for the sake of clarity, the structure and operation of the present invention will be described with the aid of directional terms, but the terms "front", "rear", "left", "right", "outer", "inner", "outer", "inward", "upper", "lower", etc. should be understood as words of convenience and not as words of limitation.

The present invention relates to a wafer transfer apparatus, a silicon wafer film thickness detection system including the same, and a double-wafer transfer method. The sheet body transfer device can complete the transfer of the silicon wafer which is measured and the silicon wafer to be measured through the movement of the mechanical arm. The double-silicon-wafer handing-over device and the process can greatly improve the handing-over efficiency of the silicon wafers and improve the yield of the whole silicon wafer film thickness detection system. The sheet-like body may be a silicon wafer or the like. Each part is described in detail below.

Sheet body transfer device

As shown in fig. 4-6, the sheet delivery device 101 includes an upper hand, a lower hand, a drive device 1015, and a delivery support 1013. The upper and lower blades are fixedly coupled to an output shaft of the driving device 1015 directly or indirectly. The upper plate hand is positioned below the lower plate hand, and a channel is formed between the upper plate hand and the lower plate hand. The driving device 1015 is fixed to the delivery support 1013. The loading hand is responsible for interfacing with the silicon wafer to be measured on the loading position of the robot arm for loading the wafer body to be measured, such as a silicon wafer, which may have a respective suitable structure and shape. The lower hand is responsible for interfacing with the silicon wafer on which the measurement has been completed on the chuck for loading the measurement-completed sheet-like body, such as a silicon wafer, which may have a respective suitable structure and shape. Preferably, the upper and lower blades have the same structure.

The upper and lower film hand can be connected to the driving device 1015 via the film hand fixing base 1014. Specifically, the lower and upper blades are fixed to the blade holder 1014, respectively, up and down. The gripper fixing base 1014 is fixedly connected to an output shaft of the driving device. The hand fixing seat can be a positioning shaft and can also have other structures. The drive means 1015 may be a pendulum cylinder. Of course, a stepping motor or a servo motor may be used as the driving device instead of the oscillating cylinder.

The tail ends of the upper slice hand and the lower slice hand are respectively provided with a supporting step, and the supporting steps are provided with supporting surfaces 203 for supporting the sheet-shaped bodies when the sheet-shaped bodies are connected. In the measurement, a sheet-like body such as a silicon wafer is placed on a support surface. A positioning surface 202 is arranged between the supporting step of the upper plate hand and the top surface of the upper plate hand, and a positioning surface 202 is arranged between the supporting step of the lower plate hand and the top surface of the lower plate hand. The positioning surface can realize the centering of the sheet-shaped body.

The locating surface may be a flat surface having an oblique angle. Of course, the positioning surface may be an irregular surface, such as a curved surface, a gear-like surface, or the like. The entire surface may have an inclination angle, or a part may have an inclination angle. For example, the plane having the inclination angle may occupy only 10% to 90% of the area of the entire positioning surface, and the rest may be an irregular surface such as a curved surface, a gear shape, or the like.

The support surface may have a small bevel, the angle of inclination of which may be determined by the skilled person according to the specific contact requirements of the upper and lower hands with the silicon wafer, may be an angle of inclination of 0-15 °, preferably 5-10 °.

Preferably, the head ends of the upper and lower blades have mounting holes 201. The lower blade hand 1011 and the upper blade hand 1012 are fixed on the blade hand fixing seat 1014 up and down through the mounting hole 201. The other ends of the lower piece hand 1011 and the upper piece hand 1012 are provided with the supporting step, the supporting surface 203 and the positioning surface 202. The locating surface 202 intersects the support surface 203 at a predetermined angle. The positioning surface is configured to center the sheet-like body when the sheet-like body is transferred.

In the above sheet body joining apparatus, both the upper and lower sheet hands have a rigid structure.

Fig. 9 is a block diagram illustrating an upper/lower gripper of another sheet delivery apparatus. The difference between the sheet body transfer apparatus shown in fig. 9 and the above-described structure of the upper/lower sheet hand is that both the upper/lower sheet hands 1012a,1011a have an elastic structure. The lower slice hand and the upper slice hand have the same structure. As shown in fig. 9, the upper tab hand includes a spring 301, a tab holder 302, a tab hand support 303, and the like. One end of the tab holder 302 is elastically mounted on the tab hand support 303 by a spring 301. The mounting hole is provided on the tab hand support 303. The other end of the tab support 302 has a support step with a support surface thereon and a locating surface intersecting the support surface at a predetermined angle, the locating surface being configured to center the sheet when it is being handed over. The positioning surface may be an inclined surface. It should be understood that the spring 301 may be replaced with other elastic members.

When the silicon wafer is handed over, the silicon wafer connecting bracket 302 of the upper/lower silicon wafer hand contacts the periphery of the silicon wafer, and when the handing over is finished, the silicon wafer connecting bracket 302 reaches the positioning surface of the silicon wafer connecting bracket 303, so that the silicon wafer centering effect can be provided, and the safety of the silicon wafer in the handing over process is improved.

Silicon wafer film thickness detection system

The utility model discloses a thick measurement system of membrane includes frame, work piece platform, platelike body handing-over device and thick detection device of membrane. The workpiece table is movably connected to the frame. The workpiece table is arranged to be able to place the silicon wafer on which measurement is completed on the lower hand and to be able to receive the silicon wafer to be measured from the upper hand. The film thickness detection device is used for detecting the film thickness of the silicon wafer. The sheet body cross connecting device is used for cross connecting the measured silicon chip and the silicon chip to be measured and is arranged on the machine frame.

The silicon wafer film thickness measuring system further comprises a mechanical arm. The robot arm is arranged to be able to place the silicon wafer on which measurement is completed on the lower hand and to be able to place the silicon wafer to be measured on the upper hand. The manipulator is provided with an upper piece mechanism and a lower piece mechanism which can move relatively. The loading mechanism is used for placing the silicon wafer to be measured on the loading hand. And the lower wafer mechanism is used for removing the silicon wafer which is subjected to measurement from the lower wafer hand. The loading mechanism and the unloading mechanism may be of any suitable construction capable of handling silicon wafers.

The silicon wafer film thickness measuring system comprises four sheet body connecting devices which are arranged on two sides of a workpiece table in pairs, as shown in figures 1-3. Alternatively, the silicon wafer film thickness measuring system may comprise three sheet-shaped body interface devices arranged around the workpiece table in a triangular shape at the outer side of the workpiece table, as shown in fig. 8.

Fig. 1 to 5 show a silicon wafer film thickness measuring system according to an embodiment of the present invention. As shown in fig. 1 to 3, the film thickness detection apparatus of the present embodiment is provided with 4 sets of sheet delivery devices 101 (101 a,101 b, 101c, and 101d, respectively) fixed to both sides of a workpiece stage 103. As shown in fig. 4-5, each set of sheet-shaped body transfer device mainly comprises a lower sheet hand 1011, an upper sheet hand 1012, a transfer support 1013, a sheet hand fixing seat 1014, a driving device 1015, and the like. In this embodiment, the lower hand 1011 and the upper hand 1012 have the same structure, are different in position in the height direction, and are fixed to the hand fixing base 1014. The top hand 1012 is responsible for interfacing with the silicon wafer to be measured on the top position of the robot 102, and the bottom hand 1011 is responsible for interfacing with the silicon wafer on the chuck after the measurement has been completed. The gripper fixing base 1014 is fixed to the driving unit 1015, the driving unit 1015 is fixed to the delivery support 1013, and the delivery support 1013 is fixed to the workpiece table 103. The driving device 1015 provides a 90 ° rotation function for the lower film hand 1011 and the upper film hand 1012. When the silicon wafer is needed to be handed over, the lower wafer hand 1011 and the upper wafer hand 1012 rotate 90 degrees at the same time, and the silicon wafers are matched and received. When the hand-over is finished, the lower film hand 1011 and the upper film hand 1012 rotate reversely by 90 degrees at the same time, and the movement space of the workpiece table 103 is opened.

In the sheet delivery device 101 of the present embodiment, the driving device 1015 is a swing cylinder.

In the sheet body transfer device 101 of the present embodiment, as shown in fig. 6, each of the lower hand 1011 and the upper hand 1012 includes: mounting holes 201, a positioning surface 202, a supporting surface 203, a rotating arm 205, a supporting arm 206 and the like. The lower blade hand 1011 and the upper blade hand 1012 are fixed by the mounting hole 201 and the blade hand fixing seat 1014. As can be seen from fig. 6, the swivel arm 205 and the support arm 206 have an angle, preferably an obtuse angle, such as 120 °. The support surface 203 has a small angle slope, for example, 5 °, and can realize point contact support with the back surface of the silicon wafer to prevent the silicon wafer from being damaged. The locating surface 202 on the support arm can perform centering function on the silicon chip.

In this embodiment, when the film thickness detection system performs silicon wafer transfer, the dual silicon wafer transfer device 101, the robot 102, the workpiece stage 103, and the chuck are required to be synchronously engaged. When the workpiece table 103 finishes the measurement of the silicon wafer on the chuck, the workpiece table 103 moves to the transfer position, the robot arm 102 sends the silicon wafer to be measured to the transfer position, and the double-silicon wafer transfer device 101 can simultaneously complete the transfer of the silicon wafer which is already measured on the chuck and the silicon wafer to be measured on the robot arm 102. The double-silicon-wafer handing-over device and the process can greatly improve the handing-over efficiency of the silicon wafers and improve the yield of the whole measuring device.

In this embodiment, the lower hand 1011 and the upper hand 1012 have the same structure, but have different positions in the height direction. Of course, the structure of the lower hand 1011 and the upper hand 1012 may be different, such as the size, shape, and design of the positioning surface and the supporting surface.

When the silicon wafer is transferred by the film thickness detection apparatus, the sheet transfer apparatus 101, the robot 102, the work stage 103, and the chuck must be synchronized. Specifically, after the silicon wafer 1 on the chuck completes the film thickness measurement, the transfer signals of the double-wafer transfer apparatus 101 fixed to both sides of the workpiece stage 103 are triggered. The drive 1015 is rotated 90 deg. and the upper and lower gripper hands are moved simultaneously to the interface position. At this time, the silicon wafer 1 on the chuck of the stage 103 is released from the vacuum and moves vertically to the transfer position of the lower wafer. The lower hand 1011 and the chuck of the workpiece table 103 complete the lower transfer of the silicon wafer 1.

The workpiece stage 103 continues to move in the vertical direction until it reaches the waiting position, and a silicon wafer transfer signal is triggered between the robot 102 and the transfer device 101. At this time, the robot 102 lower fork (not shown) moves to the transfer position, and the lower hand 1011 of the transfer apparatus 101 completes the lower transfer of the silicon wafer 1.

After the handover is completed, the lower piece fork of the mechanical arm 102 moves horizontally, the joint position is withdrawn, and the workpiece platform moves vertically downwards to a waiting position for receiving the silicon chip to be measured; and simultaneously triggers the pick-up signal of the robot 102.

The wafer-loading fork (not shown) of the robot 102 carries the silicon wafer 2 to be measured and moves to the transfer position, and the wafer-loading hand 1012 of the transfer device 101 completes the wafer-loading transfer of the silicon wafer 2. After the handover is completed, the film feeding fork of the manipulator 102 moves horizontally, exits the handover position, and simultaneously triggers a film feeding signal of the workpiece table 103.

The vacuum of the work stage 103 is turned on and, at the same time, the vertical direction is moved from the waiting position to the loading height, and the silicon wafer 2 to be measured is received by the loading hand 1012 of the transfer apparatus 101.

A sensor (not shown) on the workpiece stage 103 detects the presence of a wafer 2 on the chuck and, if so, performs subsequent wafer measurements.

At this time, the driving device 1015 of the interface device 101 drives the lower blade hand 1011 and the upper blade hand 1012 to rotate reversely by 90 ° and return to the zero position. The flow of the handover of the silicon wafer 1 and the silicon wafer 2 is finished.

Dual silicon wafer handover method

Fig. 7 is a flow chart showing the handover of the double-silicon wafer handover device of the present invention during the measurement of the silicon wafer. Particularly, the utility model discloses a double silicon piece handing-over method includes the step: s1, providing a frame, a workpiece table, a manipulator and at least two of the above-mentioned sheet body handing-over devices, wherein the workpiece table is movably connected to the frame, and the sheet body handing-over devices are arranged on the frame and around the workpiece table; s2, transferring the silicon wafer after measurement to a lower wafer hand; s3, removing the silicon wafer after measurement from the lower wafer hand; s4, placing the silicon wafer to be measured on a wafer loading hand; and S5, transferring the silicon wafer to be measured from the wafer loading hand to the workpiece table.

Specifically, in step S2, the loading hand and the unloading hand are first rotated to the transfer position, the unloading hand is ready, the stage is moved from the first position to the second position, and the silicon wafer whose measurement is completed is transferred to the unloading hand. And in the process of transferring the silicon wafer to the lower wafer hand, the workpiece table moves along the vertical direction, and when the workpiece table moves to a preset position, the mechanical hand is triggered to act.

In step S3, the robot moves to the interface between the upper hand and the lower hand, and receives the silicon wafer from the lower hand after the measurement is completed, and then exits from the interface. After the manipulator withdraws from the transfer position, the workpiece platform moves downwards and vertically to a waiting position for receiving the silicon wafer to be measured; and triggering the film loading signal to enable the manipulator to act so as to carry out the film loading action.

In step S4, the robot arm carries the silicon wafer to be measured to move to the transfer position between the upper hand and the lower hand, places the silicon wafer to be measured on the upper hand, and then withdraws from the transfer position. And triggering a workpiece table splicing signal after the manipulator withdraws from the delivery position.

In step S5, the stage moves to the top height and takes in the silicon wafer to be measured from the top by hand, and then the measurement is performed. Then, the silicon wafer is measured correspondingly. After the measurement is completed, the above steps from S2 to S5 are repeated to perform the handover and measurement of the next silicon wafer.

The utility model discloses a platelike body handing-over device simple structure, and can once operate the handing-over of accomplishing two silicon chips, the handing-over is efficient, has solved the problem that handing-over efficiency is on the low side among the prior art. The utility model discloses a platelike body handing-over device is through setting up the locating surface that has certain inclination on last/lower piece is hand, for the silicon chip handing-over in-process provides the centering function, has solved the centering function problem that lacks the silicon chip among the prior art.

While the preferred embodiments of the present invention have been described in detail above, it should be understood that aspects of the embodiments can be modified, if necessary, to employ aspects, features and concepts of the various patents, applications and publications to provide yet further embodiments.

These and other changes can be made to the embodiments in light of the above detailed description. In general, in the claims, the terms used should not be construed to be limited to the specific embodiments disclosed in the specification and the claims, but should be construed to include all possible embodiments along with the full scope of equivalents to which such claims are entitled.

Claims

1. A sheet body connecting device is characterized in that: the sheet body connecting device comprises an upper sheet hand, a lower sheet hand, a driving device and a connecting support; the upper piece hand and the lower piece hand are fixedly connected with an output shaft of the driving device directly or indirectly, the upper piece hand is positioned below the lower piece hand, and a channel is formed between the upper piece hand and the lower piece hand; and the driving device is arranged on the cross connecting support.

2. The lamina interface apparatus of claim 1, wherein: the tail ends of the upper sheet hand and the lower sheet hand are respectively provided with a supporting step, and the supporting steps are provided with supporting surfaces for supporting the sheet bodies when the sheet bodies are connected.

3. The lamina interface apparatus of claim 2, wherein: the supporting step of the upper plate hand and the top surface of the upper plate hand are provided with positioning surfaces, and the supporting step of the lower plate hand and the top surface of the lower plate hand are provided with positioning surfaces.

4. The lamina interface apparatus of claim 1, wherein: the connecting device further comprises a slice hand fixing seat, the slice hand and the upper slice hand are respectively fixed on the slice hand fixing seat from top to bottom, and the slice hand fixing seat is fixedly connected with the output shaft of the driving device.

5. The lamina interface apparatus of claim 1, wherein: the head end of going up piece hand and piece hand down all has the mounting hole, piece hand down with go up the piece hand and pass through the mounting hole is fixed from top to bottom on the piece hand fixing base, the other end of going up piece hand and piece hand down all has support step and locating surface, wherein be equipped with the holding surface on the support step, the locating surface with the holding surface intersects into predetermined angle, the locating surface sets to carry out the centering to the platelike body when handing-over platelike body.

6. A web interface apparatus as claimed in claim 3, wherein: the upper piece hand and the lower piece hand are both provided with a rotating arm and a supporting arm which extends out from the tail end of the rotating arm and forms an oblique angle with the rotating arm.

7. The lamina interface apparatus of claim 6, wherein: the top surface of the upper film hand is positioned on the supporting arm; the top surface of the lower slice hand is positioned on the supporting arm.

8. The lamina interface apparatus of claim 1, wherein: the upper tab hand comprises an elastic piece, a tab support and a tab hand support; wherein one end of the tab holder is elastically connected to the tab hand holder by the elastic member, and the other end of the tab holder is for receiving a sheet-like member.

9. The lamina interface apparatus of claim 8, wherein: the lower slice hand and the upper slice hand have the same structure.

10. The lamina interface apparatus of claim 7, wherein: the other end of the splicing support is provided with a supporting step and a positioning surface, wherein the supporting step is provided with a supporting surface, the positioning surface and the supporting surface are intersected to form a preset angle, and the positioning surface is arranged to center the sheet-shaped body when the sheet-shaped body is jointed.

11. The lamina interface apparatus of claim 10, wherein: the positioning surface is an inclined surface.

12. The lamina interface apparatus of claim 1, wherein: the driving device is a swinging cylinder, a stepping motor or a servo motor.

13. A silicon wafer film thickness measuring system is characterized in that: the silicon wafer film thickness measuring system comprises:

a frame;

a workpiece table movably connected to the frame;

at least two sheet handling apparatus according to any of claims 1 to 12 mounted on the frame and surrounding the workpiece table; and

a robot hand arranged to be able to place the silicon wafer on which the measurement is completed on the lower hand and to be able to place the silicon wafer to be measured on the upper hand.

14. The silicon wafer film thickness measuring system according to claim 13, wherein: the mechanical arm is provided with an upper wafer mechanism and a lower wafer mechanism which can move relatively, wherein the upper wafer mechanism is used for placing a silicon wafer to be measured on the upper wafer hand; and the wafer discharging mechanism is used for removing the silicon wafer which is subjected to measurement from the wafer discharging hand.

15. The silicon wafer film thickness measuring system according to claim 13, wherein: the workpiece table is arranged to be able to place the silicon wafer on which the measurement is completed on the lower hand.

16. The silicon wafer film thickness measuring system according to claim 13, wherein: the silicon wafer film thickness measuring system comprises four flaky body connecting devices which are arranged on two sides of the workpiece table in pairs; or the silicon wafer film thickness measuring system comprises three flaky body connecting devices which are arranged around the workpiece platform in a triangular shape.