CN210268590U - PCB surface copper thickness measuring machine - Google Patents
PCB surface copper thickness measuring machine Download PDFInfo
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- CN210268590U CN210268590U CN201921502651.5U CN201921502651U CN210268590U CN 210268590 U CN210268590 U CN 210268590U CN 201921502651 U CN201921502651 U CN 201921502651U CN 210268590 U CN210268590 U CN 210268590U
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Abstract
The utility model discloses a PCB surface copper thickness measuring machine, which comprises a measuring head for measuring the surface copper thickness of a PCB; the conveying device is used for conveying the PCB; the computer control system is connected with the conveying device driving equipment and the copper thickness measuring instrument; the copper thickness measuring heads are positioned above and below the PCB conveying device; the copper thickness measuring head is arranged on a driving device which can synchronously move with the PCB and keep the copper thickness measuring head and the PCB relatively static; the copper thickness measuring head driving device is connected with a computer control system for controlling the copper thickness measuring head driving device. According to the method, the whole PCB device and the PCB synchronously move when the PCB is fed, the copper thickness measuring head and the PCB synchronously move when in measurement, the PCB does not stop during the measurement, and simultaneously the copper thickness of the upper surface and the lower surface of the PCB at the same position above and below the PCB conveying device is measured simultaneously by the copper thickness measuring head, so that the working efficiency of the PCB copper thickness measuring equipment is improved.
Description
Technical Field
The utility model belongs to be used for measuring thickness field, in particular to improvement to PCB board surface copper thickness measuring equipment and method.
Background
When a circuit board of a PCB manufacturer leaves a factory, the thickness of the surface copper foil of the circuit board is measured to detect whether the PCB meets customer requirements or not, count the qualified rate and eliminate unqualified products and the like, and the existing special machine (named as a copper foil thickness measuring machine by the name of patent publication No. CN 207991502U) for measuring the thickness of the surface copper foil of a plate can solve the problem of thickness classification of the automatically produced surface copper foil. However, when the copper thickness measuring machine is used for measuring, the PCB needs to be stopped in the machine, and other production steps can be carried out only after the measurement is completed, which is obviously not beneficial to improving the production efficiency of the production line.
SUMMERY OF THE UTILITY MODEL
Particularly the utility model discloses an above-mentioned problem is solved to following scheme:
the utility model discloses a PCB surface copper thickness measuring machine, which is a measuring head used for measuring the thickness of PCB surface copper;
the conveying device is used for conveying the PCB;
the computer control system is connected with the conveying device driving equipment and the copper thickness measuring head;
the copper thickness measuring heads are positioned above and below the PCB conveying device;
the copper thickness measuring head is arranged on a driving device which can synchronously move with the PCB and keep the copper thickness measuring head and the PCB relatively static;
the copper thickness measuring head driving device is connected with a computer control system for controlling the copper thickness measuring head driving device.
The conveying device comprises various conveying devices, and the purpose of the conveying device is to enable the PCB to flow in the thickness measuring equipment. The computer control system is used for controlling the copper thickness measuring head, the driving device and the conveying device to cooperatively work to finish measurement; when the PCB board gets into inside the measuring equipment, computer control system controls measuring head drive arrangement drive the removal velocity of thick measuring head of copper is the same with the PCB board, thereby makes thick measuring head of copper keeps static relatively with the PCB board, and computer control system control this moment the thick measuring head of copper that Z axle mechanism drove above the PCB board descends to contact to the PCB board, thereby drives the thick measuring head of copper below the PCB board to rise to contact to the PCB board and accomplish the measurement simultaneously. The same this provides the measurement condition of relative stillness to thick measuring head measurement of copper of the moving speed of thick measuring head drive arrangement of copper and the moving speed of PCB board to the face copper thickness of measurement PCB board that can be accurate does not need the PCB board to pause in the in-process of production simultaneously, because thick measuring head of copper is located the upper and lower surface copper thickness simultaneous measurement of PCB board same position in PCB board conveyor's top and below simultaneously.
In a preferred embodiment, the copper thickness measuring head driving device comprises an X-axis driving device, and the moving direction of the X-axis driving device is the same as the conveying direction of the PCB conveying device.
In a preferred embodiment, the copper thick measuring head is mounted on an X-axis drive.
In a preferred embodiment, a Y-axis driving device is mounted on the X-axis driving device, and the moving direction of the Y-axis driving device is perpendicular to the X-axis driving device.
In a preferred embodiment, one or more groups of the copper thick measuring heads are simultaneously arranged on an X-axis driving device or a Y-axis driving device.
In a preferred embodiment, the X-axis driving device includes sliding bases disposed at both sides of the conveying device, and Y-axis driving device supports disposed above or below the conveying device.
In a preferred embodiment, a Z-axis driving device is arranged on the Y-axis driving device, and the moving direction of the Z-axis driving device is vertical to the moving direction of the X-axis and the Y-axis; one or more groups of copper thick measuring heads are simultaneously arranged on the Y-axis driving device or the Z-axis driving device.
In a preferred embodiment, the two sides of the conveying device are provided with the plate-arranging devices, and the plate-arranging devices comprise a plate-arranging conveying mechanism with the same moving speed as that of the plate-arranging mechanism and a driving mechanism capable of driving the plate-arranging belt wheels to move along the Y-axis direction;
in order to solve the above technical problem, the utility model also provides a method of PCB thickness measurement, it includes the step:
1) a plate finishing step: the PCB is conveyed on the conveying device through the whole board conveying mechanism, the whole board conveying mechanism moves along the Y-axis direction, the moving speed of the whole board conveying mechanism on the whole board conveying mechanism is the same as that of the PCB, and the whole board conveying mechanism keeps relative rest with the PCB in the X-axis direction and simultaneously corrects the Y-axis position of the PCB;
2) a measurement step: the copper thickness measuring head driving device keeps the moving speed of the copper thickness measuring head in the X axial direction equal to the moving speed of the PCB, and measures and stores the measurement parameters to the computer control system;
in a preferred embodiment, in the step 1), the speed of the movement of the belt wheel controlled by the computer control system is the same as the movement speed of the PCB, and the computer control system controls the whole board conveying mechanism to move to the computer control system parameter setting position in the Y-axis direction;
in the step 2), the computer control system controls the moving speed of the copper thickness measuring head driving device to be the same as the moving speed of the PCB, and the computer control system receives and processes data measured by the copper thickness measuring head to obtain a measuring result.
Compared with the prior art, the utility model has the advantages that the copper thickness measuring head can keep the same with the moving speed of the PCB under the action of the driving device, and the copper thickness measuring head and the PCB keep relatively static, so that the PCB can complete the measuring process without pausing in the surface copper thickness measuring machine while the measuring precision is ensured; similarly, when the board finishing mechanism finishes the board, the board finishing mechanism finishes the board by using a movable belt wheel and a Y-axis driving device, the movable belt wheel and the PCB keep relatively static on an X axis, namely an axis where the PCB moves in the moving direction, during the board finishing process, and the PCB is kept normally conveyed on the conveying device without stopping while finishing the board. The method can obviously improve the measurement efficiency of the PCB surface copper thickness measuring equipment, and can keep the same speed with the PCB production line.
Drawings
Fig. 1 is a schematic view of the whole structure of a PCB thickness measuring machine.
Fig. 2 is a schematic view of an internal measurement structure of a PCB thickness measuring mechanism, which includes a conveying device, a copper thickness measuring head, and a board finishing device.
FIG. 3 is a schematic view of a plate finishing apparatus.
FIG. 4 is a top view of an internal measurement structure of the PCB thickness measuring mechanism.
Detailed Description
Referring to fig. 1, the PCB thickness measuring machine 100 includes a frame 102 for supporting the entire test equipment, and a conveying mechanism 220, a thickness measuring mechanism 106 and a computer control system 105 are disposed on the frame 102. An electric box is arranged in the frame 101, and a protective metal plate 109 is arranged on the side surface of the power supply frame 102.
Referring to fig. 2 and 3, the inside conveyor that has of PCB thickness measuring machine, in the utility model discloses in conveyor includes three conveyer 223 that is parallel to each other, the belt pulley 224 at conveyer 223 both ends is installed on base 225, and one of them belt pulley 224 of a conveyer sets up driving motor and rotates with certain speed in order to drive belt 223, and the slew velocity accessible computer control system 101 of belt 223 is controlled. The two side bases where the belt pulleys 224 are arranged are mounted on a sliding rail 226, the two side bases are connected through a connecting mechanism 227, the connecting mechanism 227 is connected with a lead screw driving mechanism, the lead screw driving mechanism can drive the base 225 to slide on the sliding rail 226, the distance between the belts 223 can be adjusted through the lead screw 229 driving mechanism 228 to drive the belt pulley bases 225, and different belt distances can be suitable for PCB boards with different sizes.
Referring to fig. 2 and 4, copper thickness measuring heads 212, which measure the thickness of copper foil on the upper surface of the PCB when above the PCB and the thickness of copper foil on the lower surface of the PCB when below the PCB, are installed above and below the PCB conveying mechanism.
The copper thickness measuring head 212 is mounted on a driving device 200 that is movable in synchronization with the PCB and keeps the copper thickness measuring head stationary relative to the PCB. The copper thickness measuring head driving device 200 is connected with the computer control system 101 for controlling the same, and the computer control system 101 controls the copper thickness measuring head driving device 200 to move at the same speed as the PCB board, so that the copper thickness measuring head 210 can keep relatively still when measuring the PCB board, and the copper thickness measuring head can measure the thickness of the copper foil at a designated position on the PCB board.
The copper thickness measuring head can be mounted on the copper thickness measuring head drive in 3 ways, which are described below.
In the first installation manner, the copper thickness measuring head driving device 200 includes an X-axis driving device DX which moves in the same direction as the conveying direction of the belt 223 of the PCB conveying device. The X-axis driving device DX comprises sliding bases arranged at both sides of a conveying device 220, wherein the sliding bases comprise sliding rods and bases 206 and 206' matched with the sliding rods 221, a driving mechanism 225 is arranged on the sliding rod matched base, the driving mechanism 225 is connected with a computer control system 101, and the computer control system 101 can control the PCB conveying device 200 and the sliding rod driving mechanism 225 to keep the same driving speed, so that the X-axis speed of a copper thickness measuring head 212 is the same as the X-axis speed of a PCB. A support 203 is arranged above the sliding base, the copper thickness measuring head can be mounted on the support 203, the copper thickness measuring head 212 is mounted on the support 203, the X-axis driving device 200 drives the copper thickness measuring head 212 to move forwards along the same direction and at the same speed as the PCB during measurement, and the copper thickness measuring head 212 measures the thickness of the copper foil of the PCB during movement.
In the second mounting manner, Y-axis driving devices 240 are provided above and below the support member 203. In fact, the support 203 extends along the Y-axis, which is perpendicular to the extending direction of the X-axis, and the moving direction of the Y-axis driving device 203 is perpendicular to the X-axis; the driving mechanism 242 of the Y-axis driving device 240 is connected to the computer control system 101, and the computer control system 101 can control the coordinate position of the Y-axis driving mechanism 240 in the Y-axis direction. The computer control system controls X, Y to move the axial driving device 241, can control the initial measuring position of the copper thickness measuring head in XY coordinate system, the computer control system 101 can firstly position the coordinate position of the copper thickness measuring head in XY axis, and then measure the thickness of the copper foil of the PCB board after keeping the copper thickness measuring head 212 moving synchronously with the PCB board in X axis direction. The Y-axis driving mechanism 240 includes a traveling wheel 241 with a driving motor 242 linked by the motor, and a belt track 204 engaged with the traveling wheel 241, obviously, the motor 242 may be a stepping motor, and a speed reduction device may be arranged between the traveling wheel 241 and the stepping motor 240. The fixture of the Y-axis drive mechanism 241 is wrapped around the support 203 and allows the Y-axis drive 240 to slide freely on the support 203. It is apparent that the support and the Y-axis driving unit 240 need to be disposed at the bottom of the PCB transferring unit 220 when measuring the thickness of the copper foil of the lower surface of the PCB, and the structural layout thereof is similar to the structure disposed above. In order to achieve the effect of multi-point testing, the copper thickness measuring head 212 can be installed on the Y-axis driving device, and the copper thickness measuring head can be installed on the X-axis driving device 200 at the same time.
In the third mounting mode, a Z-axis driving device 210 is mounted on the Y-axis driving device 240, and the moving direction of the Z-axis driving device 210 is perpendicular to the moving direction of the X-axis and the Y-axis; the copper thick measurement head 212 is mounted on either the Y-axis drive 240 or the Z-axis drive 210. Can set up on Z axle drive arrangement 210 and drive actuating cylinder 214 and make when measuring thick measuring head of copper can contact the PCB board on thick measuring head 212 optional dress elasticity telescopic link 213 and limiting plate 211, the limiting plate includes the upper and lower limiting plate of distance fixing, the limiting plate contacts with the PCB board when cylinder 214 downstream down, simultaneously because slip telescopic link compression 213, the limiting plate keeps all the time to contact with the PCB board down, can guarantee measurement accuracy like this. The driving air cylinder 214 is connected with the computer control system 101, and the computer control system 101 can control the coordinate position of the copper thickness measuring head on the Z axis when measuring the PCB.
Referring to fig. 2 and 3, a board finishing device 230 is disposed at both sides of the conveying device 220, and the board finishing device 230 includes a board finishing conveying mechanism 231 moving at the same speed as the PCB conveying device 220, and a driving mechanism 233 driving the board finishing movement along the Y-axis direction. The driving mechanism 231 of the plate-arranging device is a belt 232 driving device, the belt moving speed of the belt driving mechanism is the same as the moving speed of the PCB, the belt 232 is driven by a motor 236, the motor is connected with a computer control system, and the motor 236 preferably comprises a stepping motor or a servo motor. The belt 232 and the motor are integrally mounted on a fixing plate 237, a driving cylinder 235 is mounted on the fixing plate 237, a driving arm of the driving cylinder 235 is connected with a base of the PCB conveying device, so that the whole board mechanism 230 can move along the Y-axis direction, the cylinder of the board mechanism 230 is preferably connected with the computer control system 101, the position of the board mechanism 230 can clamp and move the PCB, the belt is in contact with the PCB when the board mechanism is whole, and the PCB and the belt 232 are kept relatively static in the X-axis direction because the belt 232 and the PCB are kept at the same speed, so that the conveying speed of the PCB on the conveying device is not influenced in the whole board process.
The PCB thickness measuring equipment performs PCB surface copper thickness measurement according to the following method.
1) A plate finishing step: the PCB is transported on the transporting device 220 through the board-arranging mechanism 230, the board-arranging mechanism 230 moves along the Y-axis direction, the moving speed of the board-arranging mechanism 230 is the same as the moving and transporting of the PCB, and the board-arranging mechanism keeps stationary relative to the PCB in the X-axis direction while aligning the Y-axis position of the PCB. In the process, the conveying speed of the PCB is controlled by the computer control system 101 to be consistent with the moving speed of a belt of the board arranging mechanism, the computer control system 101 controls an air cylinder 235 of the board arranging mechanism to push the board arranging mechanism to move in the Y-axis direction, the computer control system 101 controls the board arranging mechanisms on two sides of the belt wheel to cooperate to correct the position of the PCB, and the position of the Y-axis movement of the board arranging mechanism can be set by parameters of the computer control system 101.
2) A measurement step: the copper thickness measuring head driving device 212 keeps the moving speed of the copper thickness measuring head in the X axial direction equal to the moving speed of the PCB, and measures and stores the measurement parameters to the computer control system;
a plurality of measurement parameters may be displayed on a screen of the computer control system, and the measurement parameters may include results of a passing test.
The technical scheme thick measuring head of copper and whole board mechanism keep its direction and PCB board relatively static at PCB board transmission at the during operation, for PCB board flow state down measures and has created the condition, consequently its measuring speed that can improve the PCB board. Meanwhile, the width of the PCB conveying mechanism can be adjusted to adapt to PCBs of different sizes.
Claims (7)
1. A PCB surface copper thickness measuring machine comprises a copper thickness measuring head for measuring the copper thickness of a PCB;
the conveying device is used for conveying the PCB;
the computer control system is connected with the conveying device driving equipment and the copper thickness measuring head;
the copper thickness measuring heads are positioned above and below the PCB conveying device;
the device is characterized in that the copper thickness measuring head is arranged on a driving device which can synchronously move with the PCB and keep the copper thickness measuring head and the PCB relatively static;
the copper thickness measuring head driving device is connected with a computer control system for controlling the copper thickness measuring head driving device.
2. The PCB surface copper thickness measuring machine of claim 1, wherein the measuring head driving device comprises an X-axis driving device, and the moving direction of the X-axis driving device is the same as the conveying direction of the PCB conveying device.
3. The PCB panel surface copper thickness measuring machine according to claim 2, wherein the measuring head is mounted on the X-axis driving device.
4. The PCB surface copper thickness measuring machine of claim 2, wherein the X-axis driving device is provided with a Y-axis driving device, and the moving direction of the Y-axis driving device is perpendicular to the X-axis driving device.
5. The PCB surface copper thickness measuring machine of claim 4, wherein the measuring heads are mounted on the X-axis driving device or the Y-axis driving device in one or more groups at the same time.
6. The PCB surface copper thickness measuring machine of claim 4, wherein the X-axis driving device comprises sliding bases arranged at both sides of the conveying device, and Y-axis driving device supports arranged above or below the conveying device.
7. The PCB surface copper thickness measuring machine of claim 6, wherein a Z-axis driving device is mounted on the Y-axis driving device, and the moving direction of the Z-axis driving device is perpendicular to the moving direction of the X-axis and the Y-axis; one or more groups of copper thick measuring heads are simultaneously arranged on the Y-axis driving device or the Z-axis driving device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921502651.5U CN210268590U (en) | 2019-09-10 | 2019-09-10 | PCB surface copper thickness measuring machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921502651.5U CN210268590U (en) | 2019-09-10 | 2019-09-10 | PCB surface copper thickness measuring machine |
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| Publication Number | Publication Date |
|---|---|
| CN210268590U true CN210268590U (en) | 2020-04-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921502651.5U Active CN210268590U (en) | 2019-09-10 | 2019-09-10 | PCB surface copper thickness measuring machine |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487234A (en) * | 2019-09-10 | 2019-11-22 | 昆山盈达科机电科技有限公司 | A kind of pcb board surface copper thickness measuring machine and measurement method |
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2019
- 2019-09-10 CN CN201921502651.5U patent/CN210268590U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110487234A (en) * | 2019-09-10 | 2019-11-22 | 昆山盈达科机电科技有限公司 | A kind of pcb board surface copper thickness measuring machine and measurement method |
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