CN210268322U - Heat radiator - Google Patents
Heat radiator Download PDFInfo
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- CN210268322U CN210268322U CN201920894032.9U CN201920894032U CN210268322U CN 210268322 U CN210268322 U CN 210268322U CN 201920894032 U CN201920894032 U CN 201920894032U CN 210268322 U CN210268322 U CN 210268322U
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Abstract
The utility model discloses a radiator, including hydrothermal solution pipeline subassembly, heat-conducting plate, wherein hydrothermal solution pipeline subassembly and heat-conducting plate sealing connection, there is the cavity in the middle of the heat-conducting plate, the heat-conducting plate both ends are sealed, the heat-conducting medium is equipped with to the cavity, and the heat-conducting plate becomes to be greater than zero degree with hydrothermal solution pipeline subassembly and is less than ninety degrees angle and places, be equipped with first bone position, second bone position in the cavity, the heat-conducting plate inserts the opposite side pipe wall to hydrothermal solution pipeline subassembly from one side of hydrothermal solution pipeline subassembly. The beneficial effect of adopting above-mentioned technical scheme is: the heat conduction plate is added with the heat conduction medium in the cavity of the heat conduction plate, so that the heat conduction superconducting effect of the heat conduction plate is realized, and the heat radiator is manufactured by using the heat superconducting heat conduction plate and has ultrahigh heat radiation efficiency.
Description
Technical Field
The utility model relates to a heat exchange equipment technical field, in particular to radiator.
Background
At present, most of heat conducting plates are metal conduction heat dissipation, the heat dissipation mode is slow, heat dissipation equipment cannot be too large, and the heat dissipation efficiency is low due to the fact that heat conduction is carried out by metal materials and the distance is long.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to provide a radiator solves the problem of radiator inefficiency.
In order to solve the technical problem, the utility model discloses a technical scheme does: a radiator comprises a hydrothermal solution pipeline component and a heat conducting plate, wherein the hydrothermal solution pipeline component is in sealing connection with the heat conducting plate, a cavity is arranged in the middle of the heat conducting plate, two ends of the heat conducting plate are sealed, and a heat conducting medium is filled in the cavity.
Preferably, the cavity of the heat conducting plate is a vacuum cavity.
Preferably, the centre line of the inlet of the hot liquid conduit is different from the centre line of the outlet.
Preferably, the hot liquid pipeline and the heat conducting plate are in welded sealing connection or in sealing connection by using a sealing ring.
Preferably, the hydrothermal pipe assembly comprises a hydrothermal pipe inlet, a hydrothermal pipe outlet, a hydrothermal pipe cover plate and a hydrothermal pipe bottom plate, the hydrothermal pipe inlet and the hydrothermal pipe outlet are welded and hermetically connected with the hydrothermal pipe bottom plate, and the hydrothermal pipe cover plate and the hydrothermal pipe bottom plate are hermetically connected through a sealing ring and a screw.
Preferably, the heat conducting plate is inserted from one side of the hot liquid pipe assembly to the other side of the pipe wall of the hot liquid pipe assembly.
Preferably, a first bone position and a second bone position are arranged in the cavity of the heat conducting plate.
Preferably, a protective net is arranged outside the hot liquid pipeline assembly and the heat conducting plate.
Preferably, a fan for enhancing air flow is arranged outside the heat conducting plate.
Preferably, the heat conducting plate is placed at an angle greater than zero degrees and less than ninety degrees with respect to the hot liquid conduit assembly.
The beneficial effect of adopting above-mentioned technical scheme is: the heat conduction plate is added with the heat conduction medium in the cavity of the heat conduction plate, so that the heat conduction superconducting effect of the heat conduction plate is realized, and the heat radiator is manufactured by using the heat superconducting heat conduction plate and has ultrahigh heat radiation efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a perspective view of a heat sink;
FIG. 2 is a partial cross-sectional view of a heat sink;
FIG. 3 is a cross-sectional view of a thermally conductive plate;
fig. 4 is an enlarged sectional view of the heat-conducting plate.
In the figure, 1-hydrothermal fluid pipeline inlet, 2-hydrothermal fluid pipeline component, 3-hydrothermal fluid pipeline outlet, 4-support rod, 5-sealing fixing piece, 6-fixing plate, 7-hydrothermal fluid pipeline cover plate, 8-heat conducting plate, 9-hydrothermal fluid pipeline bottom plate, 10-second bone position, 11-first bone position and 12-cavity.
Detailed Description
For further explanation of the embodiments, the drawings are provided as part of the disclosure and serve primarily to illustrate the embodiments and, together with the description, to explain the principles of operation of the embodiments, and to provide further explanation of the invention and advantages thereof, it will be understood by those skilled in the art that various other embodiments and advantages of the invention are possible, and that elements in the drawings are not to scale and that like reference numerals are generally used to designate like elements.
The following describes the present invention with reference to the accompanying drawings. It should be noted that the description of the embodiments is provided to help understanding of the present invention, but the present invention is not limited thereto. In addition, the technical features related to the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
Referring to the attached drawings, the radiator comprises a hydrothermal solution pipeline component 2 and a heat conduction plate 8, wherein the hydrothermal solution pipeline component 2 is hermetically connected with the heat conduction plate 8, the heat conduction plate 8 and the hydrothermal solution pipeline component 2 are placed at an angle larger than zero and smaller than ninety degrees, a cavity 12 is arranged in the middle of the heat conduction plate 8, two ends of the heat conduction plate 8 are sealed, a heat conduction medium is filled in the cavity 12, a first bone position 11 and a second bone position 10 are arranged in the cavity 12, and the heat conduction plate 8 is inserted into the pipe wall of the other side of the hydrothermal solution pipeline component 2 from one side of the hydrothermal solution pipeline component 2.
Preferably, the cavity 12 is a vacuum cavity.
Preferably, the center line of the hot liquid pipe inlet 1 is different from the center line of the hot liquid pipe outlet 3, so that the hot liquid flowing in from the inlet does not directly flow out.
Preferably, the hot liquid pipeline assembly 2 is hermetically connected with the heat conducting plate 8 by welding or sealing with a sealing ring.
Preferably, the hot liquid pipeline assembly 2 includes a hot liquid pipeline inlet 1, a hot liquid pipeline outlet 3, a hot liquid pipeline cover plate 7, and a hot liquid pipeline bottom plate 9, the hot liquid pipeline inlet 1 and the hot liquid pipeline outlet 3 are welded and hermetically connected with the hot liquid pipeline bottom plate 9, and the hot liquid pipeline cover plate 7 and the hot liquid pipeline bottom plate 9 are hermetically connected with each other by a screw through a sealing ring.
Preferably, the heat conducting plate 8 is inserted from one side of the hot liquid pipe assembly 2 to the other side of the pipe wall of the hot liquid pipe assembly 2.
Preferably, the cavity 12 is provided with a first bone site 11 and a second bone site 10.
Preferably, a protective net is arranged outside the hot liquid pipeline component 2 and the heat conducting plate 8.
Preferably, a fan for enhancing air flow is arranged outside the heat conducting plate 8.
Preferably, said heat-conducting plate 8 is placed at an angle greater than zero degrees and less than ninety degrees with respect to the hot liquid duct assembly 2.
Since the heat conductive plate 8 dissipates heat, the heat conductive plate 8 is in a strip shape to increase a heat dissipating contact area.
The heat-conducting plate 8 is placed at an angle greater than zero degrees and less than ninety degrees with the hot liquid conduit assembly 2, so that the flow of the hot liquid is increased in order to increase the convection effect of the hot liquidThe heat conducting plate is more complex and has better heat conducting effect, the first bone position 11 is arranged in the cavity 12, the strength of the heat conducting plate can be increased, the heat conducting plate is not easy to deform, and meanwhile, the heat radiating and conducting contact area can be increased, but if the first bone position 11 is arranged too densely, the heat conducting plate is difficult to produce, so a second bone position 10 is arranged in the cavity, the heat radiating area can be increased by the second bone position 10, and the included angle formed by the heat conducting plate 8 and the hot liquid pipeline component 2 is ∠ A, 00＜∠A＜900. The heat conducting plate 8 is inserted into the pipe wall of the other side of the hydrothermal solution pipeline component 2 from one side of the hydrothermal solution pipeline component 2, that is, the heat conducting plate 8 is inserted into the other side of the hydrothermal solution pipeline component 2 from one side with a hole in the hydrothermal solution pipeline component 2, the heat conducting plate 8 absorbs heat by the part immersed in the hydrothermal solution pipeline component 2, then the heat is conducted out and conducted to the other end of the heat conducting plate 8, and then the heat is taken away from the other end of the heat conducting plate 8 by air. This completes the heat dissipation process. The heat-conducting plate 8 is placed as much as possible in the hot liquid duct assembly 2, so that the efficiency of heat conduction is higher.
The working principle is as follows: because the heat conducting plate 8 is internally provided with the cavity 12, the liquid heat conducting medium is arranged in the cavity 12, when the liquid heat conducting medium is heated, the liquid heat conducting medium is gasified to fill the whole cavity 12, the whole cavity 12 is subjected to heat conduction, meanwhile, gasified gas is cooled to become liquid to flow to the bottom of the heat conducting plate 8, the liquid is heated at the bottom of the heat conducting plate, and the heat dissipation effect is formed by the reciprocating way. The heat conducting plate 8 is usually inserted into a place where heat dissipation is required, i.e., the hot liquid in the hot liquid pipe assembly 2, and the heat dissipation place is usually disposed at an upper portion, i.e., an upper portion of the heat conducting plate 8, and heat is conducted from a lower portion of the heat conducting plate 8 to the heat conducting plate, conducted to the whole body of the heat conducting plate 8 through a liquid conducting medium, and then conducted out from the upper portion to exchange heat with air and diffused in the atmosphere or other places. In short, the hot liquid pipe assembly 2 of this radiator is usually arranged at the lower part, and the radiating part is usually arranged at the upper part, so that convection is formed, and the heat is rapidly conducted by using evaporative refrigeration and gas-liquid phase change.
The beneficial effect of adopting above-mentioned technical scheme is: the heat conduction plate 8 is used for manufacturing the radiator, the heat exchange efficiency is ultrahigh, the heat radiation of the radiator to the surrounding environment is reduced, and the superconducting temperature uniformity of the heat conduction plate 8 is utilized to improve the waste heat recovery utilization rate by 30%.
In a first specific embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate are sealed, the cavity 12 is filled with a liquid heat conducting medium, and a first bone position 11 and a second bone position 10 are arranged in the cavity 12.
In the second specific embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate 8 are sealed, the cavity 12 is filled with a liquid heat conducting medium, a first bone position 11 is arranged in the cavity 12, and a second bone position 10 is not arranged. I.e. the second bone site 10 is removed.
In the third specific embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate 8 are sealed, the cavity 12 is filled with a liquid heat conducting medium, the cavity 12 is internally provided with the second bone position 10, and the first bone position 11 is not arranged. I.e. the first bone site 11 is removed.
In the fourth specific embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate 8 are closed, and the cavity 12 is filled with a liquid heat conducting medium.
In a fifth embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate 8 are sealed, the cavity 12 is filled with a liquid heat conducting medium, a first bone position 11 is arranged in the cavity 12, the cavity 12 is divided into a plurality of small cavities by the first bone position 11, and the small cavities are not communicated with each other, that is, two adjacent cavities are isolated and not communicated with each other.
In a sixth specific embodiment, a cavity 12 is formed in the middle of the heat conducting plate 8, two ends of the heat conducting plate 8 are sealed, the cavity 12 is filled with a liquid heat conducting medium, a first bone position 11 is arranged in the cavity 12, the cavity 12 is divided into a plurality of small cavities by the first bone position 11, the small cavities are communicated with each other, that is, two adjacent cavities 12 are communicated with each other.
In the sixth embodiment, a fan for enhancing air flow is disposed beside the heat conducting plate 8.
In the seventh embodiment, protective nets are arranged outside the hot liquid pipeline assembly 2 and the heat conducting plate 8 to protect workers from being scalded.
The utility model discloses a heat-conducting plate 8 is the aluminium alloy preparation, so all bone positions are the aluminium alloy and extrude the direction setting. The hot liquid pipeline component 2 and the heat conducting plate 8 can be made of different materials, if corrosion-resistant liquid is adopted, stainless steel is mostly adopted, and other materials can be made of aluminum profiles.
Because the heat conducting plate 8 adopts the liquid heat conducting medium, the heat conducting distance is long, the heat conducting efficiency is high, and the radiator can be made larger. This heat-conducting plate 8 has the temperature uniformity good, and high-efficient heat conduction, quick exothermic uniqueness not only can provide the hypervelocity heat conductivity, but also can eliminate high temperature focus, makes electronic components stable and efficient work. Thermal conductivity of the heat-conducting plate 8: 1000000W/m.k, working environment: -50-180 ℃, temperature uniformity: 1 to less than or equal to 1K/M, electric power, electronics, communication base station heat dissipation, heaters, semiconductor devices, automobiles, LEDs, flat televisions, lithium battery heat dissipation, automatic equipment frequency converters, environment-friendly and energy-saving heat exchangers and other industries.
The liquid heat-conducting medium has various choices, and the effect of each liquid heat-conducting medium is different, wherein lithium bromide is commonly used. A lithium bromide refrigerator, i.e. a lithium bromide absorption refrigerator, uses a lithium bromide aqueous solution as a working medium, wherein water is a refrigerant, and lithium bromide is an absorbent. Lithium bromide belongs to salts, is white crystal, is easily soluble in water and alcohol, is nontoxic, has stable chemical property and cannot deteriorate. When air exists in the lithium bromide water solution, the lithium bromide water solution has strong corrosivity to steel. An example is a lithium bromide absorption refrigerator, which can only be used for air conditioning equipment and for preparing cold water for production processes, because water is used as a refrigerant and the evaporation temperature is above 0 ℃. The refrigerator can use low-pressure steam or hot water with the temperature of over 75 ℃ as a heat source, thereby having important functions on utilizing waste gas, waste heat, solar energy and low-temperature heat energy.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.
Claims (10)
1. A radiator is characterized by comprising a hydrothermal solution pipeline assembly and a heat conducting plate, wherein the hydrothermal solution pipeline assembly is in sealing connection with the heat conducting plate, a cavity is arranged in the middle of the heat conducting plate, two ends of the heat conducting plate are sealed, and a heat conducting medium is filled in the cavity.
2. A heat sink according to claim 1, wherein the cavity of the thermally conductive plate is a vacuum cavity.
3. The heat sink as claimed in claim 1, wherein the hot liquid pipe assembly comprises a hot liquid pipe inlet, a hot liquid pipe outlet, a hot liquid pipe cover plate, and a hot liquid pipe bottom plate, the hot liquid pipe inlet and the hot liquid pipe outlet are welded to the hot liquid pipe bottom plate and hermetically connected to the hot liquid pipe cover plate and the hot liquid pipe bottom plate via a sealing ring and screws.
4. The heat sink of claim 1, wherein the hot fluid conduit assembly is sealingly connected to the thermally conductive plate by welding or by a gasket.
5. A heat sink according to claim 3, wherein the centre line of the hot liquid conduit inlet is different from the centre line of the hot liquid conduit outlet.
6. The heat sink of claim 1, wherein the thermally conductive plate is disposed at an angle of greater than zero degrees and less than ninety degrees to the hot fluid conduit assembly.
7. The heat sink of claim 1, wherein the thermal conductive plate is inserted from one side of the hydrothermal tubing assembly to the other side of the tube wall of the hydrothermal tubing assembly.
8. The heatsink of claim 1, wherein the thermally conductive plate defines a cavity having a first bone site and a second bone site.
9. The heat sink of claim 1, wherein the hydrothermal conduit assembly and the thermal conductive plate are provided with a protective net.
10. A heat sink according to claim 1, wherein the thermally conductive plate is externally provided with a fan for enhancing air flow.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920894032.9U CN210268322U (en) | 2019-06-14 | 2019-06-14 | Heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920894032.9U CN210268322U (en) | 2019-06-14 | 2019-06-14 | Heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210268322U true CN210268322U (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920894032.9U Active CN210268322U (en) | 2019-06-14 | 2019-06-14 | Heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210268322U (en) |
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2019
- 2019-06-14 CN CN201920894032.9U patent/CN210268322U/en active Active
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