CN210247131U

CN210247131U - Circuit board assembly and application thereof

Info

Publication number: CN210247131U
Application number: CN201821387474.6U
Authority: CN
Inventors: Feifan Chen; 陈飞帆; Junjie Zeng; 曾俊杰; Beibei Dai; 戴蓓蓓; Xiaofeng Wang; 王晓锋
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2018-08-27
Filing date: 2018-08-27
Publication date: 2020-04-03
Anticipated expiration: 2028-08-27

Abstract

The utility model provides a circuit board assembly and application thereof, wherein circuit board assembly includes a first circuit layer, a first conducting layer, a first insulation layer, a heat dissipation part that can switch on and have at least two second shaping positions, wherein the heat dissipation part has a first surface and a second surface, wherein the first surface is exposed outside for support an electronic component, the second surface can be exposed outside for scatter and disappear the heat.

Description

Circuit board assembly and application thereof

Technical Field

The utility model relates to the circuit board field especially involves a circuit board assembly and application.

Background

With the development of the market, TOF camera modules are gradually applied to small mobile devices such as mobile phones, however, for TOF camera modules, the TOF camera modules include a light source unit and a receiving unit, wherein the light source unit can emit a large amount of heat when emitting light outwards, and when the heat is accumulated at the position of the light source unit, the working quality and the working efficiency of the light source unit are affected, so that the imaging accuracy of the whole TOF camera module is affected.

The light source unit generally includes a light emitting element and a circuit board, wherein the light emitting element is supported on the circuit board and dissipates heat through the circuit board. Common circuit boards in the market generally have common rigid-flex boards, but the heat dissipation performance of the common circuit boards is poor.

Further, the rigid-flex board has poor heat dissipation performance due to itself, and for the multilayer circuit board, the reduction of the thickness dimension of the whole circuit board is limited due to the existence of via holes (vias). The smaller the via size, the higher the overall process requirements and, thus, the higher the cost of the circuit board. That is, it is difficult for a general rigid-flex board to satisfy the current requirement of the electronic device for heat dissipation performance and the requirement of the electronic device for light weight and thin weight.

The existing ceramic substrate has good heat dissipation performance, but the cost is high, and the production capacity of the enterprise which is relevant to the existing ceramic substrate production capacity is limited, so that the large-scale market demand of the current mobile phone or other electronic equipment cannot be met.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a circuit board assembly and use thereof, wherein circuit board assembly can provide a better heat dispersion.

Another object of the present invention is to provide a circuit board assembly and its application, wherein the circuit board assembly can have good electric conductive property when providing better heat dispersion.

Another object of the present invention is to provide a circuit board assembly and an application thereof, wherein the manufacturing method of the circuit board can facilitate manufacturing the circuit board assembly in a miniaturized form.

Another object of the present invention is to provide a circuit board assembly and an application thereof, wherein the circuit board manufactured by the manufacturing method has a better manufacturing accuracy.

Another object of the present invention is to provide a circuit board assembly and its application, wherein the circuit board has better precision can reduce the assembly tolerance in the follow-up assembling process.

Another object of the present invention is to provide a circuit board assembly and an application thereof, wherein the circuit board has a low manufacturing cost.

Another object of the present invention is to provide a circuit board assembly and applications thereof, wherein the circuit board assembly is a multi-layer structure, and no structural cooperation is required between layers, so as to reduce assembly tolerance.

According to the utility model discloses a circuit board assembly and use thereof, wherein need not the structure cooperation between each layer of circuit board assembly, need not for a connecting piece headspace, thereby be favorable to circuit board assembly's miniaturization.

Another object of the present invention is to provide a circuit board assembly and its application, wherein the circuit board assembly does not need to be assembled and aligned gradually for each layer in the manufacturing process, which is favorable for improving the production efficiency.

Another object of the present invention is to provide a circuit board assembly and its application, wherein the flexibility of the circuit board assembly structural design can be improved by the manufacturing method.

Another object of the present invention is to provide a circuit board assembly and an application thereof, wherein the circuit board assembly has a better structural strength by the manufacturing method.

Another object of the present invention is to provide a circuit board assembly and application thereof, wherein the circuit board can be applied to the TOF camera module pursuing frivolousness.

According to an aspect of the present invention, there is provided a circuit board assembly including a first wiring layer, a first conductive layer, a first insulating layer, a conductive heat dissipating part and having at least two second molding positions, wherein the first conductive layer is formed on an upper side of the first wiring layer, the first insulating layer is integrally molded with the first wiring layer and the first conductive layer, wherein the first conductive layer is molded at the second molding positions, at least one of the second molding positions forms at least a part of the heat dissipating part, wherein a cross section of a portion of the first conductive layer corresponding to the second molding positions forming the heat dissipating part is larger than cross sections of portions of the first conductive layer corresponding to the other second molding positions, wherein the heat dissipating part has a first surface and a second surface, wherein the first surface is exposed to the outside, for supporting an electronic component, said second surface being capable of being exposed for dissipating heat.

According to some embodiments of the present invention, the heat dissipation portion is formed on the first conductive layer and the first circuit layer.

According to some embodiments of the present invention, the circuit board assembly further includes a second circuit layer and at least two third forming positions, wherein the second circuit layer is formed on the upper side of the first conductive layer and formed at the third forming positions, at least one of the third forming positions forms at least part of the heat dissipation portion, and the cross section of the second circuit layer portion corresponding to the third forming position forming the heat dissipation portion is larger than the cross section of the second circuit layer portion corresponding to the other third forming positions.

According to some embodiments of the present invention, the heat dissipation portion is formed on the second circuit layer, the first conductive layer, and the first circuit layer portion overlapped in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

According to some embodiments of the present invention, the circuit board assembly further includes a second conductive layer and at least two fourth forming positions, wherein the second conductive layer is formed on the second circuit layer and formed at the fourth forming positions, and at least one of the fourth forming positions forms at least part of the heat dissipating portion, wherein the cross section of the second conductive layer portion corresponding to the fourth forming position forming the heat dissipating portion is larger than the cross sections of the second conductive layer portions corresponding to the other fourth forming positions.

According to some embodiments of the present invention, the heat dissipation portion is formed on the first conductive layer, the second wiring layer, and the second conductive layer portion which overlap in a height direction.

According to some embodiments of the present invention, the circuit board assembly further includes a third circuit layer and at least two fifth forming positions, wherein the third circuit layer is formed on the second conductive layer and formed at the fifth forming positions, at least one of the fifth forming positions forms at least part of the heat dissipating part, wherein the cross section of the third circuit layer part corresponding to the fifth forming positions of the heat dissipating part is formed larger than the cross section of the third circuit layer part corresponding to the fifth forming positions.

According to some embodiments of the present invention, the heat dissipation portion is formed at the first conductive layer, the second circuit layer, the second conductive layer, and the third circuit layer portion which are overlapped in a height direction.

According to some embodiments of the present invention, the circuit board assembly further has at least two first molding positions, wherein the first circuit layer is molded at the first molding position, at least one of the first molding positions forms at least part of the heat dissipation portion, wherein the cross section of the first circuit layer portion corresponding to the first molding position of the heat dissipation portion is formed larger than the cross section of the first circuit layer portion corresponding to the first molding position.

According to some embodiments of the invention, the circuit board assembly further comprises a second solder mask, wherein the second solder mask covers at least part of the second insulating layer.

According to some embodiments of the present invention, the circuit board assembly further comprises a first solder mask layer, wherein the first solder mask layer covers at least a portion of the first insulating layer.

According to some embodiments of the present invention, a line width a and a line distance B of the circuit board assembly satisfy the following conditions, respectively:

a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m.

According to the utility model discloses an on the other hand, the utility model provides a TOF module of making a video recording, it includes:

the floodlight is used for emitting light to a shot object; and

a receiving unit, wherein the receiving unit is used for receiving a reflected light ray reflected by the photographed object, and obtaining the depth information of the photographed object based on the information of the transmitted light ray and the reflected light ray, wherein the floodlight comprises a light-emitting element and a circuit board assembly according to the above, wherein the light-emitting element is conductively connected to the heat dissipation part of the circuit board assembly.

According to the utility model discloses an on the other hand, the utility model provides an electronic equipment, it includes:

the TOF camera module is arranged on the electronic equipment body.

According to some embodiments of the present invention, the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are installed together in the electronic device body.

According to the utility model discloses an on the other hand, the utility model provides a floodlight, it includes:

a light emitting element;

a circuit board assembly according to the above, and

a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive layer of the circuit board assembly, and the support is connected to the circuit board assembly.

a floodlight according to the above; and

a receiving unit with a flexible circuit board, wherein the receiving unit comprises a lens assembly, a light sensing element, a circuit board and a flexible circuit board, wherein the lens assembly provides an optical path for light to reach the light sensing element for photoelectric conversion, wherein the light sensing element is conductively connected to the circuit board, wherein the circuit board is conductively connected to the flexible circuit board, and wherein the floodlight is conductively connected to the flexible circuit board.

a floodlight according to the above;

an electronic device body; and

a main circuit board, wherein the main circuit board is disposed on the electronic device body, wherein when the floodlight is mounted on the main circuit board, the first conductive layer of the circuit board assembly of the floodlight is conductively connected to the main circuit board.

a light emitting element;

a circuit board assembly according to the above;

a support, wherein the support forms an optical window, the light emitting element is supported on a first conductive layer of the circuit board assembly, the support is connected to the circuit board assembly; and

a flexible wiring board, wherein said flexible wiring board is conductively connected to said circuit board assembly.

a floodlight according to the above; and

a receiving unit, wherein the receiving unit comprises a lens component, a photosensitive element and a circuit board, wherein the lens component provides an optical path for light to reach the photosensitive element for photoelectric conversion, the photosensitive element is conductively connected to the circuit board, and the flexible circuit board of the floodlight is conductively connected to the circuit board of the receiving unit.

Drawings

Fig. 1 is a schematic cross-sectional view of a circuit board assembly according to a preferred embodiment of the present invention.

Fig. 2A, fig. 2B, fig. 2C, fig. 2D, fig. 2E, fig. 2F, fig. 2G, fig. 2H, fig. 2I, fig. 2J, fig. 2K, fig. 2L, fig. 2M, fig. 2N, fig. 2P, fig. 2Q, and fig. 2R are schematic diagrams illustrating a manufacturing process of a circuit board assembly according to a preferred embodiment of the present invention.

Fig. 3 is a schematic cross-sectional view of a circuit board assembly according to a preferred embodiment of the present invention.

Fig. 4 shows a TOF camera module with the circuit board assembly according to a preferred embodiment of the present invention.

Fig. 5 is a schematic diagram of an electronic device with the TOF camera module according to a preferred embodiment of the invention.

Fig. 6A is a schematic view of a floodlight according to a preferred embodiment of the present invention.

Fig. 6B is a schematic view of a floodlight according to a preferred embodiment of the present invention.

Detailed Description

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in a generic and descriptive sense only and not for purposes of limitation, as the terms are used in the description to indicate that the referenced device or element must have the specified orientation, be constructed and operated in the specified orientation, and not for the purpose of limitation.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1, a circuit board assembly 1 according to the present invention is shown in a preferred embodiment.

In fig. 1, a multilayer circuit board assembly 1 is taken as an example, and it can be understood by those skilled in the art that the circuit board assembly 1 can be a single-layer board or a multilayer board. The circuit board assembly 1 has an upper surface, wherein the upper surface of the circuit board assembly 1 can be used for supporting at least one electronic component, and the electronic component can transmit an electrical signal through the circuit board assembly 1 and can also dissipate heat through the circuit board assembly 1, so as to prevent heat from accumulating in the electronic component and affecting the normal operation of the electronic component.

The circuit board assembly 1 has a good heat dissipation performance.

The circuit board assembly 1 includes at least a circuit layer 10, a conductive layer 20, an insulating layer 30 and a heat sink 40, wherein the insulating layer 30 is integrally formed on the circuit layer 10 and the conductive layer 20, and the insulating layer 30 serves as an insulation between the circuit layer 10 and the conductive layer 20 to prevent short circuit between the circuit layer 10 and the conductive layer 20 during operation.

The heat sink 40 is conductive, and the heat sink 40 has a first surface and a second surface, wherein heat at the first surface can be conducted to the second surface. The first surface is provided with an electronic component, so that when the electronic component works, heat is transferred to the second surface, and then the second surface transfers the heat to the outside.

The heat dissipation portion 40 is formed on the conductive layer 20, or the wiring layer 10 and the conductive layer 20. The first surface is exposed for supporting the electronic component, and the second surface is exposed for dissipating heat outward.

The wiring layer 10 is conductively connected to the conductive layer 20.

In some examples of the present invention, the first surface of the heat dissipating part 40 is an upper surface of the conductive layer 20, and at least a portion of the conductive layer 20 penetrates the insulating layer 30 in a height direction, that is, an upper surface and a lower surface of the conductive layer 20 are not at least partially covered by the insulating layer 30 so that heat from the outside can be transferred to the upper surface of the conductive layer 20, then transferred to the lower surface of the conductive layer 20, and then transferred to the outside of the conductive layer 20. That is, a first surface of the heat dissipation portion 40 is the upper surface of the conductive layer 20, a second surface of the heat dissipation portion 40 is a lower surface of the circuit layer 10, the first surface of the heat dissipation portion 40 may be the upper surface of the conductive layer 20, the second surface of the heat dissipation portion 40 is the lower surface of the conductive layer 20, for example, when the conductive layers 20 are respectively located at upper and lower sides of the circuit layer 10, the first surface of the heat dissipation portion 40 may be the upper surface of the circuit layer 10, and the second surface of the heat dissipation portion 40 is the lower surface of the circuit layer 10, for example, when the circuit layers 10 are respectively located at upper and lower sides of the conductive layer 20.

In other examples of the present invention, the first surface of the heat dissipating part 40 is the upper surface of the conductive layer 20, and the second surface of the heat dissipating part 40 is a side surface of the conductive layer 20.

In other examples of the present invention, the first surface of the heat sink member 40 is the upper surface of the conductive layer 20, and the second surface of the heat sink member 40 is a side surface of the circuit layer.

In other examples of the present invention, the first surface of the heat dissipating part 40 is the upper surface of the circuit layer 10, and the second surface of the heat dissipating part 40 is the lower surface of another circuit layer 10.

Preferably, the heat dissipation portion 40 penetrates the insulating layer 30, that is, at least a portion of the circuit layer 10 and at least a portion of the conductive layer 20 overlap each other in a height direction, and the heat dissipation portion 40 is formed at the portion of the circuit layer 10 and the conductive layer 20 that overlap each other.

In this example, the circuit board assembly 1 includes a first circuit layer 10A, a first conductive layer 20A and a first insulating layer 30A, wherein the first circuit layer 10A has an upper surface, the first conductive layer 20A is formed on the upper surface of the first circuit layer 10A, and the first insulating layer 30A is integrally formed on the first circuit layer 10A and the first conductive layer 20A. The first insulating layer 30A can prevent the first line layer 10A portions in the width direction from being short-circuited with each other or the first conductive layer 20A portions in the width direction from being short-circuited with each other. The first insulating layer 30A is integrally formed on the first circuit layer 10A and the first conductive layer 20A, which is favorable for the structural strength between the three layers.

It is understood that the first insulating layer 30A is connected to the first circuit layer 10A and the first conductive layer 20A at the same time, and a part of the first insulating layer 30A may be integrally formed on the first circuit layer 10A first, and a part of the first insulating layer 30A is integrally formed on the first insulating layer 30A and the first conductive layer 20A first. The first insulating layer 30A may be integrally formed on the first circuit layer 10A and the first conductive layer 20A at a time.

The first circuit layer 10A is used for transmitting electrical signals, the first conductive layer 20A is capable of conducting electricity and performing a heat dissipation function, and the first insulating layer 30A is capable of insulating electrical signals.

That is, the conductive portions of the first wiring layers 10A at different positions in the width direction are separated by the first insulating layer 30A, and the conductive portions of the first conductive layers 20A at different positions in the width direction are separated by the first insulating layer 30A.

The first wiring layer 10A and the first conductive layer 20A are located at different heights. At least a part of the first wiring layer 10A is communicable with the first conductive layer 20A, and more specifically, the first conductive layer 20A is attached to at least the upper surface of the part of the first wiring layer 10A in the height direction. In other words, at least the first wiring layer 10A is overlapped with the first conductive layer 20A, and the overlapped portions can be electrically connected to each other.

Further, at least a portion of the upper surface of the first conductive layer 20A is exposed, that is, at least a portion of the upper surface of the conductive layer 20 is not covered by the first insulating layer 30A.

The circuit board assembly 1 further includes the heat dissipation portion 40, wherein the heat dissipation portion 40 is formed on the first conductive layer 20A and the first circuit layer 10A that overlap each other, the heat dissipation portion 40 has a first surface and a second surface, the first surface of the heat dissipation portion 40 is the upper surface of the first conductive layer 20A, and the second surface of the heat dissipation portion 40 is at least a part of the lower surface of the first circuit layer 10A. When the electronic component is mounted on the upper surface of the heat sink 40, that is, the upper surface of the first conductive layer 20A, heat generated by the electronic component during operation is transferred to the first conductive layer 20A of the heat sink 40, then transferred to the portion of the first circuit layer 10A conducted to the first conductive layer 20A, and then transferred to the outside through the lower surface of the first circuit layer 10A, so that heat is prevented from accumulating at the position of the first conductive layer 20A directly contacting the electronic component, most of heat is prevented from being dissipated at the upper surface of the first conductive layer 20A, and the temperature of the environment where the electronic component is located is further increased. It is worth mentioning that the electronic component can be directly attached to the heat dissipation portion 40, and the heat dissipation portion 40 directly dissipates heat, that is, the electronic component is attached to the upper surface of the heat dissipation portion, and the generated heat is transferred from the first surface of the heat dissipation portion 40 to the second surface of the heat dissipation portion 40 and then transferred to the external environment.

In another aspect, the circuit board assembly 1 has at least two first forming positions, wherein the first circuit layer 10A is formed at the first forming positions. At least a portion of the heat sink 40 is formed in at least one of the first molding locations. The cross section of the first circuit layer 10A portion corresponding to the first forming position where the heat dissipation portion is formed is larger than the cross sections of the first circuit layer 10A portions corresponding to the other first forming positions. That is, the first circuit layer 10A provides a plurality of conducting positions on the surface, wherein the conducting capability of one of the conducting positions is stronger than that of the other conducting positions.

Further, the circuit board assembly 1 has at least two second forming positions, wherein the first conductive layer 20A is formed at the second forming positions. At least a part of the heat dissipating part 40 is formed at least one of the second molding positions. The cross section of the portion of the first conductive layer 20A corresponding to the second molding position where the heat sink member 40 is formed is larger than the cross section of the portions of the first conductive layer 20A corresponding to the other second molding positions. That is, the first conductive layer 20A provides a plurality of conducting positions on its surface, wherein the conducting capability of one of the conducting positions is stronger than that of the other conducting positions.

Further, the cross sections of the portions of the first conductive layer 20A and the portions of the second conductive layer 20B corresponding to the first molding position and the second molding position where the heat sink member 40 is formed are larger than the cross sections of the portions of the first conductive layer 20A and the portions of the second conductive layer 20B corresponding to the other first molding position and the second molding position where the heat sink member 40 is formed. That is, the heat sink member 40 has a higher conductivity than the first conductive layer 20A and the second conductive layer 20B corresponding to the other first molding position and the second molding position.

In another aspect, the circuit board assembly 1 has at least two first positions, wherein the first positions are used for forming the first insulating layer 30A. A portion of the first position is located on the first circuit layer 10A, and a portion of the first position is located on the first conductive layer 20A, that is, the first circuit layer 10A and the first conductive layer 20A respectively provide a space for filling the first insulating layer 30A.

The first position penetrates the first wiring layer 10A and the first conductive layer 20A in the height direction, that is, the first position may be filled with a fluid material above, and the first position may not be completely covered with the first wiring layer 10A below. The first insulating layer 30A fills at least a portion of the first location.

Further, the circuit board assembly 1 may further include a second circuit layer 10B, wherein the second circuit layer 10B is formed on the upper surface of the first conductive layer 20A and the upper surface of the first insulating layer 30A. Preferably, the upper surface and the lower surface of the first conductive layer 20A are both a plane, and the upper surface of the first insulating layer 30A is a plane.

At least a portion of the second circuit layer 10B overlaps the first conductive layer 20A, that is, at least a portion of the second circuit layer 10B is conductively connected to the first conductive layer 20A. Further, the first circuit layers 10A and the corresponding second circuit layers 10B are respectively made conductive through the corresponding first conductive layers 20A.

The heat sink member 40 further includes at least a part of the second wiring layer 10B, wherein the heat sink member 40 is formed on at least a part of the second wiring layer 10B, the first conductive layer 20A, and at least a part of the first wiring layer 10A which overlap in a height direction. When the electronic component is mounted on the upper surface of the heat dissipating part 40, that is, at least a part of the upper surface of the second circuit layer 10B, heat generated by the electronic component during operation is first transferred to the first surface of the heat dissipating part 40, that is, at least a part of the upper surface of the second circuit layer 10B, then transferred to the upper surface of the first conductive layer 20A through the lower surface of the second circuit layer 10B, then transferred to the upper surface of the first circuit layer 10A through the lower surface of the first conductive layer 20A, and then transferred to the outside through the lower surface of the first circuit layer 10A.

It is understood that, in some embodiments of the present invention, the heat sink member 40 may be formed on the second circuit layer 10B, the first surface of the heat sink member 40 is the upper surface of the second circuit layer 10B, and the second surface of the heat sink member 40 is a side surface of the second circuit layer 10B.

In other examples of the present invention, the heat sink member 40 may be formed on the second circuit layer 10B and the first conductive layer 10A, the first surface of the heat sink member 40 may be the upper surface of the second circuit layer 10B, and the second surface of the heat sink member 40 may be a side surface of the first conductive layer 20A.

Preferably, the heat dissipation portion 40 is formed at the second circuit layer 10B, the first conductive layer 20A and the first circuit layer 10A, which are overlapped with each other in the height direction, so that heat is directly conducted outward in the height direction.

Further, the circuit board assembly 1 further includes a second conductive layer 20B and a second insulating layer 30B, wherein the second conductive layer 20B is formed on at least a portion of the upper surface of the second circuit layer 10B. The second insulating layer 30B is located on the second conductive layer 20B and the second circuit layer 10B.

The second insulating layer 30B is integrally formed on the second conductive layer 20B and the second circuit layer 10B, which is favorable for the structural strength between the two layers. It should be noted that the second insulating layer 30B has a lower surface, wherein at least a portion of the lower surface is integrally formed on at least a portion of the upper surface of the first insulating layer 30A, so as to facilitate the structural strength between the layers, and thus the structural strength of the whole circuit board assembly 1.

A portion of the second insulating layer 30B separates the second circuit layer 10B in the width direction, so as to prevent the portions of the second circuit layer 10B in the same plane from being electrically connected to each other, thereby causing a short circuit. Specifically, in a top view, the lines of the second line layer 10B may be linear, for example, S-shaped, and the second insulating layer 30B fills the space between the second line layers 10B to prevent contaminants from entering the second line layer 10B or prevent the second line layer 10B from deforming during use or manufacturing process so that the lines of the second line layer 10B are connected to each other to cause a short circuit.

A portion of the second insulating layer 30B separates the second conductive layer 20B in the width direction to prevent the portions of the second conductive layer 20B in the same plane from being electrically connected to each other, thereby causing a short circuit. Specifically, in a top view, the lines of the second conductive layer 20B may be lines arranged in a certain shape, for example, U-shape, and the second insulating layer 30B fills the space between the second conductive layers 20B to prevent contaminants from entering the second conductive layers 20B or the lines of the second conductive layers 20B are interconnected due to deformation of the second conductive layers 20B during use or manufacturing process, thereby causing short circuit.

Further, at least a part of the upper surface of the second conductive layer 20B is exposed, that is, the second insulating layer 30B does not cover at least a part of the upper surface of the second conductive layer 20B. On the other hand, the circuit board assembly 1 has at least two third forming positions, wherein the second circuit layer 10B is formed at the third forming positions. At least a part of the heat dissipation part 40 is formed at least one of the third molding positions. The cross section of the portion of the second circuit layer 10B corresponding to the third molding position where the heat dissipation portion is formed is larger than the cross section of the portions of the second circuit layer 10B corresponding to the other third molding positions. That is, the second circuit layer 10B provides a plurality of conducting positions on the surface, wherein the conducting capability of one conducting position is higher than that of the other conducting positions.

Further, the circuit board assembly 1 has at least two fourth forming positions, wherein the second conductive layer 20A is formed at the fourth forming positions. At least a part of the heat dissipation part 40 is formed at least one of the fourth molding positions. The cross section of the portion of the second conductive layer 20B corresponding to the fourth molding position where the heat sink member 40 is formed is larger than the cross section of the portions of the second conductive layer 20B corresponding to the other fourth molding positions. That is, the second conductive layer 20B provides a plurality of conducting positions on its surface, wherein the conducting capability of one of the conducting positions is stronger than that of the other conducting positions.

Further, the cross sections of the portions of the second circuit layer 10B and the portions of the second conductive layer 20B corresponding to the third molding position and the fourth molding position where the heat sink member 40 is formed are larger than the cross sections of the portions of the second circuit layer 10B and the portions of the second conductive layer 20B corresponding to the other third molding position and the fourth molding position where the heat sink member 40 is formed. That is, the heat sink member 40 has a higher conductivity than the second circuit layer 10B and the second conductive layer 20B corresponding to the other first molding position and the second molding position.

Preferably, the heat dissipation portion 40 is formed at a portion where the first wiring layer 10A, the first conductive layer 20A, the second wiring layer 10B, and the second conductive layer 20B overlap in the height direction. Further, the cross-sectional areas of the first molding position, the second molding position, the third molding position and the fourth molding position corresponding to the heat dissipation portion 40 are respectively larger than the cross-sectional areas of the other first molding position, the second molding position, the third molding position and the fourth molding position.

On the other hand, the circuit board assembly 1 has at least two second positions, wherein the second positions are used for molding the first insulating layer 30A and the second insulating layer 30B. A part of the second position is located on the first line layer 10A, a part of the second position is located on the first conductive layer 20A, and a part of the second position is located on the second line layer 10B, that is, the first line layer 10A and the first conductive layer 20A and the second line layer 10B provide spaces in a height direction for filling the first insulating layer 30A and the second insulating layer 30B, respectively.

The second locations are separated by at least a portion of the first wiring layer 10A and at least a portion of the first conductive layer 20A, and at least a portion of the second wiring layer 10B, wherein each of the second locations penetrates the first wiring layer 10A and the first conductive layer 20A and the second wiring layer 10B in the height direction, that is, the first locations are not completely covered with the second wiring layer 10B above and thus can be filled with a fluid material, and the first locations are not completely covered with the first wiring layer 10A below. The second insulating layer 30B and the ground insulating layer 30 fill at least a portion of the second location.

The first position and at least part of the second position coincide.

The heat sink member 40 further includes the second conductive layer 20B, wherein the second conductive layer 20B is overlapped with at least a portion of the second circuit layer 10B. The heat dissipation portion 40 is formed on the second conductive layer 20B, at least a portion of the second circuit layer 10B, the first conductive layer 20A, and at least a portion of the first circuit layer 10A, which overlap each other. The upper surface of the heat sink member 40 is the upper surface of the second conductive layer 20B, and the lower surface of the heat sink member 40 is at least a part of the lower surface of the first wiring layer 10A.

When the electronic component is supported on the upper surface of the heat dissipation portion 40, heat generated by the electronic component during operation is first transferred to the upper surface of the second conductive layer 20B, then transferred to the upper surface of the second circuit layer 10B through the lower surface of the second conductive layer 20B, then transferred to the upper surface of the first conductive layer 20A through the lower surface of the second circuit layer 10B, then transferred to the upper surface of the first circuit layer 10A through the lower surface of the first conductive layer 20A, then thermally transferred to the lower surface of the first circuit layer 10A through the upper surface of the first circuit layer 10A, and then dissipated to the outside.

On the other hand, the circuit board assembly 1 has at least two third positions, wherein the third positions are used for molding the first insulating layer 30A and the second insulating layer 30B. A portion of the third position is located on the first circuit layer 10A, a portion of the third position is located on the first conductive layer 20A, a portion of the third position is located on the second circuit layer 10B, and a portion of the third position is located on the second conductive layer 20B, that is, the first circuit layer 10A, the first conductive layer 20A, the second circuit layer 10B, and the second conductive layer 20B respectively provide spaces in the height direction for filling a fluid material.

The second molding positions are separated by at least a portion of the first wiring layer 10A, at least a portion of the first conductive layer 20A, at least a portion of the second wiring layer 10B, and at least a portion of the second conductive layer 20B, wherein each of the second molding positions penetrates the first wiring layer 10A, the first conductive layer 20A, the second wiring layer 10B, and the second conductive layer 20B in the height direction, that is, the second molding positions are not completely covered with the second conductive layer 20B above and thus can be filled with a fluid material, and the first molding positions are not completely covered with the first wiring layer 10A below. An insulating material may fill at least a portion of the third location.

The second position and at least part of the third position coincide.

Further, the circuit board assembly 1 may further include a third circuit layer 10C, wherein the third circuit layer 10C is formed on the upper surface of the second conductive layer 20B and the upper surface of the second insulating layer 30B. Preferably, the upper surface and the lower surface of the second conductive layer 20B are both a plane, and the upper surface of the second insulating layer 30B is a plane.

At least a portion of the third circuit layer 10C overlaps the second conductive layer 20B, that is, at least a portion of the third circuit layer 10C is conductively connected to the second conductive layer 20B.

The circuit board assembly 1 has at least two fourth positions, wherein the fourth position provides a molding position, a portion of the fourth position is located on the first circuit layer 10A, a portion of the fourth position is located on the first conductive layer 20A, a portion of the fourth position is located on the second circuit layer 10B, a portion of the fourth position is located on the second conductive layer 20B, and a portion of the fourth position is located on the third circuit layer 10C, that is, the first circuit layer 10A, the first conductive layer 20A, the second circuit layer 10B, the second conductive layer 20B, and the third circuit layer 10C respectively provide spaces in the height direction for filling with a fluid material.

The second fourth locations are separated by at least a portion of the first wiring layer 10A, at least a portion of the first conductive layer 20A, at least a portion of the second wiring layer 10B, and at least a portion of the second conductive layer 20B, wherein each of the fourth locations penetrates the first wiring layer 10A, the first conductive layer 20A, the second wiring layer 10B, the second conductive layer 20B, and the third wiring layer 10C in the height direction, that is, the fourth locations are not completely covered by the third wiring layer 10C above so as to be injected with the fluid material, and the fourth locations are not completely covered by the third wiring layer 10C below. An insulating material may fill at least a portion of the fourth location.

The second position and at least part of the third position coincide.

The heat dissipation portion 40 further includes at least a portion of the third wiring layer 10C, wherein the heat dissipation portion 40 is formed on at least a portion of the third wiring layer 10C, at least a portion of the second conductive layer 20B, at least a portion of the second wiring layer 10B, at least a portion of the first conductive layer 20A, and at least a portion of the first wiring layer 10A, which overlap in the height direction. When the electronic component is mounted on the first surface of the heat dissipating part 40, that is, at least a part of the upper surface of the third circuit layer 10C, heat generated by the electronic component during operation is first transferred to the first surface of the heat dissipating part 40, that is, at least a part of the upper surface of the third circuit layer 10C, then transferred to the upper surface of the second conductive layer 20B through the lower surface of the third circuit layer 10C, then transferred to the upper surface of the second circuit layer 10B through the lower surface of the second conductive layer 20B, then transferred to the upper surface of the first conductive layer 20A through the lower surface of the second circuit layer 10B, and then transferred to the upper surface of the first circuit layer 10A through the upper surface of the first conductive layer 20A, and then transferred to the outside through the lower surface of the first wiring layer 10A.

On the other hand, the circuit board assembly 1 has at least two fifth forming positions, wherein the third circuit layer 10C is formed at the fifth forming positions. At least a part of the heat dissipation part 40 is formed at least one of the fifth molding positions. The cross section of the portion of the third circuit layer 10C corresponding to the fifth forming position where the heat sink member 40 is formed is larger than the cross sections of the portions of the third circuit layer 10C corresponding to the other fifth forming positions. That is, the third circuit layer 10C provides a plurality of conducting positions on the surface, wherein the conducting capability of one of the conducting positions is stronger than that of the other conducting positions.

In other words, the cross-sectional areas of the first molding position, the second molding position, the third molding position, the fourth molding position and the fifth molding position corresponding to the heat dissipation portion are larger than the cross-sectional areas of the other first molding position, the second molding position, the third molding position, the fourth molding position and the fifth molding position.

The electronic component has a front surface and a back surface, wherein the back surface of the electronic component is communicably connected to the upper surface of the heat dissipating portion 40, and the front surface of the electronic component may be connected to other conductive portions.

It is understood that the heat sink 40 can be designed with a larger area size to facilitate heat dissipation and also to facilitate electrical conduction.

Alternatively, the electronic element may be a light emitting element.

The first surface of the heat sink 40 is the upper surface of the third wiring layer 10C, and the second surface of the heat sink 40 is the first wiring layer

Referring to fig. 2A to 2R, a preferred embodiment of a method for manufacturing the circuit board assembly 1 according to the present invention is shown.

The circuit board assembly 1 manufactured by the manufacturing method not only has better heat dissipation performance and electrical conductivity, but also is suitable for manufacturing the miniaturized circuit board assembly 1. That is, with the circuit board assembly 1, it is suitable to manufacture the circuit board assembly 1 having a smaller size.

Further, the circuit board assembly 1 manufactured by the manufacturing method has a better manufacturing precision, which is beneficial to the performance of the circuit board assembly 1 on one hand and the reduction of assembly tolerance in subsequent assembly on the other hand.

It is more worth mentioning that when the circuit board assembly 1 is a multi-layer structure, no structural cooperation is required between layers to reduce assembly tolerance, and no space is required to be reserved for the connecting members between layers, thereby facilitating miniaturization of the circuit board assembly 1.

Furthermore, when the circuit board assembly 1 is a multi-layer structure, it is not necessary to gradually assemble and align each layer, which is beneficial to improving the production efficiency and the overall product yield.

Specifically, the manufacturing method of the circuit board assembly 1 includes the steps of:

(a) forming a first circuit layer 10A on a substrate 110;

(b) forming a first conductive layer 20A on an upper surface of at least a portion of the first circuit layer 10A; and

(c) a first insulating layer 30A is integrally formed on the first circuit layer 10A and the first conductive layer 20A, and the first conductive layer 20A penetrates the first insulating layer 30A in the height direction.

It is understood that a portion of the first insulating layer 30A may be integrally formed on a portion of the first circuit layer 10A, and then a portion of the first insulating layer 30A is integrally formed on a portion of the first insulating layer 30A and the first conductive layer 20A. That is, the first insulating layer 30A may be integrally formed on the first circuit layer 10A and the first conductive layer 20A at a single time, or may be integrally formed on the first circuit layer 10A and the first conductive layer 20A at different times.

According to an embodiment of the present invention, the method further comprises a step (d):

the substrate 110 is removed until the portion of the first circuit layer 10A overlapping the first conductive layer 20A is exposed to obtain a circuit board assembly 1.

At least part of the conductive portion of the circuit board assembly 1 can directly transmit heat from an electronic component attached to an upper surface of the circuit board assembly 1 to a lower surface of the circuit board assembly 1 in a height direction by means of heat conduction, and then dissipate the heat to the outside.

Referring to fig. 2A, in the step (a), the method further comprises the following steps:

forming an isolation layer 120 on an upper surface of the substrate 110;

forming a first bonding layer 130 on an upper surface of the isolation layer 120; and

the first circuit layer 10A is formed on an upper surface of the first bonding layer 130.

The substrate 110 may be a copper substrate 110, wherein the copper substrate 110 provides a reference surface for the whole manufacturing process. Preferably, the upper surface of the substrate 110 is a plane.

The isolation layer 120 can isolate the substrate 110 from the first bonding layer 130, so as to avoid the influence of subsequent operations on the substrate 110, and the substrate 110 can always provide a reference surface in the manufacturing process. The isolation layer 120 may be a nickel metal layer. The first bonding layer 130 mainly functions as a seed layer, and may be copper or titanium copper, and the first bonding layer 130 can ensure that the first circuit layer 10A is formed in the subsequent process. It is to be understood that the materials of the substrate 110, the isolation layer 120, and the first bonding layer 130 are not limited to the above materials.

The isolation layer 120 covers at least a portion of the upper surface of the substrate 110, and the first bonding layer 130 covers at least a portion of the upper surface of the isolation layer 120. The first bonding layer 130 is formed on the first circuit layer 10A by lamination, exposure, development, and electroplating.

Further, referring to fig. 2B, in the above method, the following steps are further included:

forming a first dry film 140 on the upper surface of the first bonding layer 130;

exposing a portion of the first dry film 140 through a first mask;

removing the exposed first dry film 140 to form a first molding channel 100 between the unexposed first dry film 140; and

the first wiring layer 10A is formed within the first forming passage 100.

It is understood that the first dry film 140 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the first mask, and then the exposed first dry film 140 is removed by development to form the first molding via 100 between the unexposed portions of the first dry film 140, and then the first circuit layer 10A is formed in the first molding via 100 by a plating process. In this example, the material of the first circuit layer 10A is copper. It is to be understood that the manner of forming the first circuit layer 10A is not intended to limit the present invention. The first circuit layer 10A may also be formed by chemical plating, thermal spraying, build-up welding, chemical vapor deposition, or the like.

The first molding passage 100 corresponds to the first molding position.

It is understood that the first circuit layer 10A may be flexibly designed and then the structure and shape of the first circuit layer 10A may be controlled by controlling the exposed region of the first dry film 140. Since the exposed first dry film 140 provides a molding space for the first wiring layer 10A. It can be understood by those skilled in the art that the first dry film 140 and the first wiring layer 10A are not limited to the above-mentioned materials.

Further, referring to fig. 2C and 2D, the first conductive layer 20A may be formed by first disposing a second dry film 240 on an upper surface of the first wiring layer 10A and an upper surface of the first wiring layer 10A of an upper surface of the first dry film 140 that is not exposed, exposing at least a portion of the second dry film 240 through a second mask, then removing the exposed second dry film 240 to form a second molding passage 200 between the second dry films 240 that are not exposed, and then forming the first conductive layer 20A in the second molding passage 200. The first conductive layer 20A overlaps at least a portion of the first circuit layer 10A so that the first conductive layer 20A and at least a portion of the first circuit layer 10A can be electrically connected to each other.

The shape and structure of the first conductive layer 20A are restricted by the second forming channel 200, that is, the second forming channel 200 can be controlled by controlling an exposed region of the second dry film 240 during exposure.

The first conductive layer 20A may be formed on the second forming channel 200 by electroplating or sputtering. The first conductive layer 20A may be made of a metal material having conductive and high thermal conductivity, such as a copper metal material, or may be made of other materials having conductive and heat dissipation functions. Of course, it can be understood by those skilled in the art that the material and the manufacturing method of the first conductive layer 20A are not limited to the above material and manufacturing method.

The second dry film 240 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the second mask, and then the exposed second dry film 240 is removed by development to form the second molding passage 200 between the unexposed portions of the second dry film 240, and then the first conductive layer 20A is formed in the second molding passage 200 by a plating process. The first circuit layer 10A may also be formed by chemical plating, thermal spraying, build-up welding, chemical vapor deposition, or the like.

Further, in the above manufacturing method, the method further includes the steps of:

disposing the second dry film 240 on the upper surface of the first dry film 140 and the upper surface of the first circuit layer 10A;

exposing at least a portion of the second dry film 240 through a second mask;

removing the exposed second dry film 240 to form a second molding passage 200 between the unexposed second dry film 240; and

the first conductive layer 20A overlapping at least a portion of the first wiring layer 10A is formed between the second forming channels 200.

Preferably, the upper surface of the first dry film 140 and the upper surface of the first circuit layer 10A are located on the same plane. Of course, it is understood that the upper surface of the first circuit layer 10A may not be in the same plane as the upper surface of the first dry film 140, for example, the upper surface of the first dry film 140 is opposite to the upper surface of the first circuit layer 10A. In the process of forming the first conductive layer 20A, the height of the first conductive layer 20A may be controlled as desired.

The second molding passage 200 corresponds to the second molding position.

Referring to fig. 2E and 2F, after forming the first conductive layer 20A, a step may be further included: the remaining dry film is removed, and then the first insulating layer 30A is integrally formed on the first conductive layer 20A and the first circuit layer 10A.

According to an embodiment of the present invention, wherein the step (c) further comprises the steps of:

integrally molding the insulating layer 30 on the first wiring layer 10A and the first conductive layer 20A, wherein the insulating layer 30 covers the upper surfaces of the first wiring layer 10A and the first conductive layer 20A; and

the height of the first insulating layer 30A is reduced until at least a portion of the upper surface of the first conductive layer 20A is exposed.

the insulating layer 30 is integrally formed on the first circuit layer 10A and the first conductive layer 20A, wherein an upper surface of the insulating layer 30 and the upper surface of the first circuit layer 10A are located on the same plane.

It is understood that the insulating layer 30 may be integrally formed by a molding process or an injection molding process. The insulating layer 30 can support the first circuit layer 10A and the first conductive layer 20A, so as to prevent the first circuit layer 10A and the first conductive layer 20A from deforming due to extrusion in the using process, and on the other hand, the insulating layer 30 can protect the first circuit layer 10A and the first conductive layer 20A, so as to prevent some contaminants from entering a gap of the first circuit layer 10A or a gap of the first conductive layer 20A and affecting the normal operation of the first circuit layer 10A and the first conductive layer 20A. It can be understood that, by the integral molding process of the insulating layer 30, the bonding strength between the first conductive layer 20A and the first circuit layer 10A is ensured.

Further, in order to manufacture the circuit board assembly 1 having a plurality of layers of circuits, more circuits may be formed on the circuit board assembly 1 at present, and the heat dissipation of the whole circuit board assembly 1 may be ensured.

Referring to fig. 2G and 2H, a second bonding layer 230 is formed on at least a portion of the upper surface of the first conductive layer 20A and at least a portion of the upper surface of the first insulating layer 30A, wherein the second bonding layer 230 may be a seed copper to facilitate a subsequent process. Preferably, the upper surface of the first conductive layer 20A and the upper surface of the first insulating layer 30A are located on the same plane, and the second bonding layer 230 is spread on at least a portion of the upper surface of the first conductive layer 20A and at least a portion of the upper surface of the first insulating layer 30A. Then, a second wiring layer 10B is formed on an upper surface of the second bonding layer 230, wherein at least a portion of the second wiring layer 10B is overlapped with the first conductive layer 20A, wherein the overlapped portion of the second wiring layer 10B is conductively connected to the first conductive layer 20A, and heat from the second wiring layer 10B can be dissipated to the outside through the first conductive layer 20A and the first wiring layer 10A in this order.

The second circuit layer 10B may be formed on the second bonding layer 230 by lamination, exposure, development, and electroplating. The first wiring layer 10A and the second wiring layer 10B may be formed in the same manner or in different manners.

The step of forming the second wiring layer 10B may be:

forming a third dry film 340 on the upper surface of the second bonding layer 230;

exposing a portion of the third dry film 340 through a third mask;

removing the exposed third dry film 340 to form a third molding channel 300 between the unexposed third dry film 340; and

the second circuit layer 10B is formed within the third forming channel 300.

It is understood that the third dry film 340 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the third mask, and then the exposed third dry film 340 is removed by development to form the third molding via 300 between the unexposed portions of the third dry film 340, and then the second circuit layer 10B is formed in the third molding via 300 by a plating process. In this example, the material of the second circuit layer 10B is copper. It is to be understood that the manner of forming the second circuit layer 10B described above is not a limitation to the present invention. The second circuit layer 10B may also be formed by chemical plating, thermal spraying, build-up welding, chemical vapor deposition, or the like.

The third molding passage 300 corresponds to the third molding position.

It is understood that the second circuit layer 10B may be flexibly designed and then the structure and shape of the second circuit layer 10B are controlled by controlling the exposed region of the third dry film 340. Since the exposed third dry film 340 provides a molding space for the second wiring layer 10B. It can be understood by those skilled in the art that the third dry film 340 and the second wiring layer 10B are not limited to the above-mentioned materials.

That is, the first mentioned manufacturing method further includes a step, wherein the step is located after the step (c).

Forming a second bonding layer 230 on at least a portion of the upper surface of the first conductive layer 20A and at least a portion of the upper surface of the first insulating layer 30A; and

the second wiring layer 10B is formed on an upper surface of the second bonding layer 230, wherein at least a portion of the second wiring layer 10B is conductively overlapped with the first conductive layer 20A.

Further, in the above method, at least a part of the upper surface of the second wiring layer 10B is exposed, so that the circuit board assembly 1 obtained in a subsequent process can conduct heat to the first conductive layer 20A through the upper surface of the second wiring layer 10B.

With reference to fig. 2I, fig. 2J, fig. 2K and fig. 2L, according to some embodiments of the present invention, wherein in the above method, the following steps are further included:

forming a second conductive layer 20B on at least a portion of the upper surface of the second circuit layer 10B; and

a second insulating layer 30B is integrally formed on the second conductive layer 20B and the second wiring layer 10B, wherein the second conductive layer 20B penetrates the second insulating layer 30B in the height direction.

It is understood that the fact that the second conductive layer 20B penetrates the second insulating layer 30B in the height direction means that at least a part of an upper surface of the second conductive layer 20B is exposed, and when an electronic component is attached to the upper surface of the second conductive layer 20B, heat generated during the operation of the electronic component can be transferred from the upper surface of the second conductive layer 20B to the lower surface of the second conductive layer 20B and then to the upper surface of the second wiring layer 10B. That is, the second insulating layer 30B does not cause an obstacle to this process.

According to some embodiments of the present invention, wherein in the above method, further comprising the step of:

integrally molding the second insulating layer 30B on the second circuit layer 10B and the second conductive layer 20B, wherein the second insulating layer 30B covers the upper surface of the second conductive layer 20B; and

reducing the height of the second insulating layer 30B to expose the upper surface of the second conductive layer 20B.

the second insulating layer 30B is integrally formed on the second circuit layer 10B and the second conductive layer 20B, wherein an upper surface of the second insulating layer 30B and the upper surface of the second conductive layer 20B are located on the same plane.

The second conductive layer 20B may be formed in the same manner as the first conductive layer 20A, or may be formed in a different manner from the first conductive layer 20A.

According to some embodiments of the present invention, in the above manufacturing method, the method further comprises:

disposing a fourth dry film 440 on the upper surface of the unexposed third dry film 340 and the upper surface of the second circuit layer 10B;

exposing at least a portion of the fourth dry film 440 through the fourth mask;

removing the exposed fourth dry film 440 to form a fourth molding channel 400 between the unexposed fourth dry film 440; and

the second conductive layer 20B overlapping at least a portion of the second circuit layer 10B is formed between the fourth forming channels 400. The second conductive layer 20B may be formed by first disposing the fourth dry film 440 on the upper surface of the third dry film 340 and the upper surface of the second circuit layer 10B, exposing at least a portion of the fourth dry film 440 through a fourth mask, removing the exposed fourth dry film 440 to form a fourth molding channel 400 between the unexposed fourth dry film 440, and then forming the second conductive layer 20B in the fourth molding channel 400. The second conductive layer 20B overlaps at least a portion of the second circuit layer 10B to enable the second conductive layer 20B and at least a portion of the second circuit layer 10B to be in electrical communication with each other.

The fourth forming tunnel 400 corresponds to the fourth forming position.

The shape and structure of the second conductive layer 20B are restricted by the fourth forming channel 400, that is, the fourth forming channel 400 can be controlled by controlling an exposed region of the fourth dry film 440 during exposure.

The second conductive layer 20B may be formed on the fourth forming channel 400 by electroplating or/and sputtering. The material of the two conductive layers 20 may be copper metal material. Of course, it can be understood by those skilled in the art that the material and the manufacturing method of the second conductive layer 20B are not limited to the above material and manufacturing method.

The fourth dry film 440 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the fourth mask, and then the exposed fourth dry film 440 is removed by development to form the fourth molding passage 400 between the unexposed portions of the fourth dry film 440, and then the second conductive layer 20B is formed in the fourth molding passage 400 through an electroplating process. The second conductive layer 20B may also be formed by chemical plating, thermal spraying, overlaying, chemical vapor deposition, or the like.

Preferably, the upper surface of the third dry film 340 and the upper surface of the second circuit layer 10B are located on the same plane. Of course, it is understood that the upper surface of the second circuit layer 10B may not be in the same plane as the upper surface of the third dry film 340, for example, the upper surface of the third dry film 340 is equal to the upper surface of the second circuit layer 10B. In the process of forming the second conductive layer 20B, the height of the second conductive layer 20B may be controlled as desired.

After the second conductive layer 20B is formed, a step of: the remaining dry film is removed, and then the second insulating layer 30B is formed on the second conductive layer 20B and the second wiring layer 10B. The dry films include the remaining third dry film 340 and the remaining fourth dry film 440.

In some embodiments of the present invention, after removing the remaining third dry film 340 and the remaining fourth dry film 440, a portion of the second bonding layer 230 is exposed, a portion of the second bonding layer 230 overlaps the second circuit layer 10B, and the exposed second bonding layer 230 is removed before the second conductive layer 20B and the second circuit layer 10B are integrally formed into the second insulating layer 30B, so that the lower surface of the second insulating layer 30B is connected to the upper surface of the first insulating layer 30A. That is, the second insulating layer 30B may be integrally formed on not only the second circuit layer 10B and the second conductive layer 20B, but also at least a portion of the upper surface of the first insulating layer 30A exposed by removing the second bonding layer 230, so as to facilitate the bonding strength between the layers of the circuit board assembly 1.

Referring to fig. 2M, according to some embodiments of the present invention, the method further comprises the following steps:

providing a third bonding layer 330 on the upper surface of the second conductive layer 20B and the upper surface of the second insulating layer 30B; and

a third circuit layer 10C is formed on at least a portion of the upper surface of the third bonding layer 330.

It is understood that the third bonding layer 330 may be a copper layer, functioning as a seed layer. At least a portion of the third circuit layer 10C overlaps the second conductive layer 20B. Specifically, when an electronic component is disposed on at least a portion of an upper surface of the third circuit layer 10C, heat generated by the electronic component can reach the corresponding third bonding layer 330 through the third circuit layer 10C and then reach the second conductive layer 20B. It is understood that in some examples of the present invention, the third circuit layer 10C is independent from the first circuit layer 10A and the second circuit layer 10B. That is, the shape and design of the third wiring layer 10C are not limited to the shape and design of the first wiring layer 10A or the second wiring layer 10B.

Further, referring to fig. 2N, in the above method, the following steps are further included:

disposing a fifth dry film 540 on the upper surface of the third bonding layer 330;

exposing at least a portion of the fifth dry film 540 through a fifth mask;

removing the exposed fifth mask to form a fifth forming channel 500; and

the third wiring layer 10C is formed in the fifth forming channel 500.

In some embodiments of the present invention, it is understood that the fifth dry film 540 may be implemented as a photoresist, and then a partial region of the photoresist is exposed through the fifth mask, and then the exposed fifth dry film 540 is removed by development to form the fifth molding passage 500 between the unexposed portions of the fifth dry film 540, and then the third circuit layer 10C is formed in the fifth molding passage 500 by an electroplating process. In this example, the material of the third circuit layer 10C is copper. It is understood that the above-mentioned manner of forming the third circuit layer 10C does not limit the present invention. The third circuit layer 10C may also be formed by chemical plating, thermal spraying, build-up welding, chemical vapor deposition, or the like.

The fifth forming tunnel 500 corresponds to the fifth forming position.

It is understood that the third circuit layer 10C may be flexibly designed and then the structure and shape of the third circuit layer 10C are controlled by controlling the exposed region of the third dry film 340. Since the exposed fifth dry film 540 provides a molding space for the third wiring layer 10C. It can be understood by those skilled in the art that the fifth dry film 540 and the third wiring layer 10C are not limited to the above-mentioned materials.

With reference to fig. 2P, 2Q and 2R, further, in the above method, the following steps are included:

forming a protective layer 550 on the upper surface of the third circuit layer 10C;

removing the substrate 110;

removing the isolation layer 120;

removing the protective layer 550; and

the first bonding layer 130 and the second bonding layer 230 are removed, respectively.

In this way, a complete one of the circuit board assemblies 1 can be obtained.

According to some embodiments of the present invention, the substrate 110 may be removed by etching the substrate 110 in an alkaline solution, and the isolation layer 120 may be removed by etching. A protection layer 550 may be formed on the upper surface of the third circuit layer 10C by first disposing a sixth dry film on the upper surface of the third circuit layer 10C and the upper surface of the third bonding layer 330, wherein the sixth dry film completely overlaps the upper surfaces of the third circuit layer 10C and the third bonding layer 330 to protect the third circuit layer 10C during the subsequent etching process to remove the substrate 110. After removing the isolation layer 120, the first bonding layer 130 may be continuously removed, and then the protective layer 550 is removed, and then the third bonding layer 330 is removed. It is also possible to remove the isolation layer 120, then remove the protection layer 550, and then remove the exposed first bonding layer 130 and the third bonding layer 330, respectively. Alternatively, the isolation layer 120 may be removed, the third bonding layer 330 may be removed, the protection layer 550 may be removed, and the first bonding layer 130 may be removed.

The electronic component may be placed on the upper surface of the third wiring layer 10C of the circuit board assembly 1, and when the electronic component is in operation, heat can be conducted from the third wiring layer 10C to the second conductive layer 20B overlapped with at least a part of the third wiring layer 10C, then to the second wiring layer 10B overlapped with the second conductive layer 20B, then to the first conductive layer 20A overlapped with the second wiring layer 10B, then to the first wiring layer 10A overlapped with the first conductive layer 20A, and finally outwardly through the lower surface of the first wiring layer 10A. That is, heat generated from the electronic components may be conducted from the upper surface of the heat sink member 40 to the lower surface of the heat sink member 40 and then transferred to the outside.

The heat sink 40 is formed to overlap the third circuit layer 10C, the second conductive layer 20B, the second circuit layer 10B, the first conductive layer 20A, and the first circuit layer 10A. The upper surface of the heat sink member 40 is the upper surface of the third wiring layer 10C, and the lower surface of the heat sink member 40 is the lower surface of the first wiring layer 10A.

It is understood that the manner of removing the substrate 110 and the isolation layer 120 is not limited to the above-described steps.

According to some examples of the present invention, the protective layer 550 may not be formed on the upper surface of the third circuit layer 10C after the third circuit layer 10C is formed, the substrate 110 is directly removed, the isolation layer 120 is then removed, and then the exposed first bonding layer 130 and the exposed third bonding layer 330 are removed, respectively. According to some embodiments of the present invention, the protective layer 550 may be formed on the upper surface of the third circuit layer 10C after the third circuit layer 10C is formed, the substrate 110 may be directly removed, the first bonding layer 130 may be then removed, the isolation layer 120 may be then removed, and the third bonding layer 330 may be then removed. According to some embodiments of the present invention, the protective layer 550 may be not formed on the upper surface of the third circuit layer 10C after the circuit layer 10 is formed, the substrate 110 is directly removed, the isolation layer 120 is then removed, the third bonding layer 330 is then removed, and the first bonding layer 130 is then removed.

Further, according to some embodiments of the present invention, the manufacturing method may further include the steps of:

forming an upper solder resist layer 60A on a part of the upper surface of the third wiring layer 10C and the exposed upper surface of the second insulating layer 30B; and

a lower solder resist layer 60B is formed on the lower surface of a part of the first wiring layer 10A and the lower surface of the first insulating layer 30A.

Further, according to some examples of the present invention, the manufacturing method may further include the steps of:

performing a surface treatment on the exposed upper surface of the third circuit layer 10C; and

the exposed lower surface of the first wiring layer 10A is subjected to next surface treatment.

It will be understood by those skilled in the art that the number of layers of the circuit board assembly 1 illustrated herein is not intended to limit the present invention, and the circuit board assembly 1 may include one circuit layer 10, may also include two circuit layers 10, the first circuit layer 10A and the second circuit layer 10B, and may also include three or more circuit layers 10, such as the first circuit layer 10A, the second circuit layer 10B, and the third circuit layer 10C, or more.

According to some embodiments of the present invention, the line width a of the circuit board assembly 1 manufactured by the manufacturing method may reach 30 μm to 150 μm, and the line distance B may reach 30 μm to 150 μm.

It is understood that the circuit board assembly 1 manufactured in this manner can ensure a certain processing accuracy in forming the layers, for example, the first wiring layer 10A and the first conductive layer 20A. In the conventional PCB, the lamination alignment precision between each layer is low, and in the present invention, the first conductive layer 20A is directly formed between the first conductive layers 20A located on different layers in a manner of forming a molding channel through exposure and development, and the first conductive layer 20A can be formed on at least a portion of the first wiring layer 10A in an overlapping manner according to the first wiring layer 10A and the first conductive layer 20A designed in advance, without the need of assembling and alignment in assembling.

Further, the connection of each layer need not be with the help of other connecting pieces in circuit board assembly 1, like in traditional PCB circuit board, need form the via hole in order to make things convenient for the intercommunication between each layer, and the utility model provides a need not for the via hole headspace in circuit board assembly 1 to be favorable to whole the reduction of circuit board assembly 1 size.

Further, the layers of the circuit board assembly 1 do not need to be assembled step by step, so that the assembly tolerance between the circuit board assemblies 1 is reduced, for each layer of the circuit board assembly 1, the shape of the conductive part of each layer is controlled through the position of the forming channel, the manufacturing precision of the conductive part is high, and the assembly tolerance of the whole circuit board assembly 1 is reduced.

It is understood that the circuit board assembly 1 may be designed in different structures and layouts according to the requirements and sizes, and the circuit board assembly 1 may also be cut into small circuit board assemblies 1 to meet different requirements, or in this way, a plurality of circuit board assemblies 1 may be formed at a time.

According to another aspect of the present invention, a method of manufacturing a circuit board assembly includes the steps of:

forming at least two first forming spaces by overlapping the first wiring layer 10A on the upper surface of the substrate 110 and overlapping the first conductive layer 20A on an upper surface of the first wiring layer 10A, wherein each of the first forming spaces penetrates the first wiring layer 10A and the first conductive layer 20A in a height direction; and

at least a portion of the first molding space is filled to form the first insulating layer 30A.

It will be appreciated that the circuit board assembly 1 may also be applied to a structured light camera module.

Referring to fig. 3, there is shown another embodiment of the circuit board assembly 1 according to the present invention. The present embodiment is different from the above-described embodiments in that in the present embodiment, each of the wiring layers 10 is overlapped with the conductive layer 20, the insulating layers 30 communicate with each other, and the first wiring layer 10A, the second wiring layer 10B, and the third wiring layer 10C are overlapped with the first conductive layer 20A or the second conductive layer 20B. The first circuit layer 10A, the second circuit layer 10B, and the third circuit layer 10C may be flexibly designed, and may be independent of each other, at least a portion of the first circuit layer 10A overlaps the first conductive layer 20A, at least a portion of the second circuit layer 10B overlaps the second conductive layer 20B, and at least a portion of the third circuit layer 10C overlaps the second conductive layer 20B, so that the circuit board assembly 1 may have a heat dissipation area that is through from top to bottom.

In other words, the circuit board assembly 1 manufactured by the above-described manufacturing method, the first circuit layer 10A, the second circuit layer 10B, and the third circuit layer 10C thereof can be flexibly designed according to the user's needs.

The first circuit layer 10A, the second circuit layer 10B, and the third circuit layer 10C may be formed by a photo etching process, and the first circuit layer 10A, the second circuit layer 10B, and the third circuit layer 10C having different structures may be obtained by controlling a position of a mask and a photo area. It is worth mentioning that the structures between the first circuit layer 10A, the second circuit layer 10B and the third circuit layer 10C can be independently designed, and through the first conductive layer 20A, the second conductive layer 20B conducts the first circuit layer 10A and the second circuit layer 10B, and the second circuit layer 10B and the third circuit layer 10C, there is no need to consider the structure of each layer of circuit board to reserve a conducting space like in the conventional PCB.

Further, for the whole circuit board assembly 1, the first circuit layer 10A exposed outside the circuit board assembly 1, or other circuit layers or conductive layers, conducts electricity. The conducting positions provided by the circuit board assembly 1 may be multiple for the electronic components supported by the circuit board assembly 1, and the conducting positions may be based on a flexible design of the line layers and the conductive layers and thus also be designed very flexibly.

Further, in the circuit board assembly 1 manufactured by the above manufacturing method, the first conductive layer 20A and the second conductive layer 20B are formed by an electroplating process, and compared with an etching process, the electroplating process is manufactured by an additive manufacturing method, so that the loss of raw materials is reduced, and the cost is saved.

Referring to fig. 4, a preferred embodiment of a TOF camera module 1000 in accordance with the present invention is shown.

The TOF camera module 1000 includes a floodlight 110 and a receiving unit 120, wherein the floodlight 110 is configured to generate a light to a subject, the light is reflected by the subject, and the receiving unit 120 receives the reflected light and obtains depth information of the subject according to information of the transmitted light and the reflected light.

The receiving unit 120 includes a lens assembly 121 and a light sensing circuit 122, wherein the lens assembly 121 is used for receiving light, and the light sensing circuit 122 is used for receiving light and converting an optical signal into an electrical signal based on the photoelectric conversion principle.

The receiving unit 120 includes a lens assembly 121 and a light sensing circuit 122, wherein the light sensing circuit 122 includes a light sensing element 1221 and a circuit board 1222, the lens assembly 121 provides an optical path for light to reach the light sensing element 1221 for photoelectric conversion, and the light sensing element 1221 is conductively connected to the circuit board 1222.

The lens assembly 121 of the receiving unit 120 further includes an optical lens 1211 and a base 1212, wherein the optical lens 1211 is held on a photosensitive path of the photosensitive element 1221 by the base 1212. It is understood that the base 1212 is connected to the circuit board 1222, and in this example, the base 1212 is integrally formed with the circuit board 1222.

In the present embodiment, the electronic component is implemented as a light emitting component 2, and the floodlight 110 comprises the light emitting component 2 and the circuit board assembly 1, wherein the light emitting component 2 is supported by the circuit board assembly 1 and is communicably connected to the circuit board assembly 1. The circuit board assembly 1 provides a light path through which the light emitting element 2 can be excited to emit light outwardly when energized.

The light emitting element 2 has a front surface and a back surface, wherein the front surface of the light emitting element 2 is connected to other connectable areas of the circuit board assembly 1 through a wire, and the back surface of the light emitting element 2 is directly supported by the circuit board assembly 1 and is conductively connected to the heat dissipating part of the circuit board assembly 1.

The luminaire 110 further comprises a holder 3 and an optical accessory 4, wherein the holder 3 supports the optical accessory 4 on the circuit board and the optical accessory 4 is held in an optical path of the light emitting element 2. The optical auxiliary element 4 is used to modify or improve the light emitted by the light-emitting element 2, for example, by refracting, diffracting or filtering the light emitted by the light-emitting element 2. The optical auxiliary element 4 may be a refractive lens or a diffractive lens. It will be appreciated by the person skilled in the art that the above examples do not limit the type of optical auxiliary element 4. The bracket 3 has an optical window 31, and the light emitting element 2 cooperates with the bracket 3 and the light emitting element 2 to form the optical window 31, so that light can be emitted outwards through the optical window 31.

The luminaire 110 further comprises at least one electronic component 6, wherein the electronic component 6 is conductively connected to the circuit board assembly 1 and the light emitting element 2,. It is worth mentioning that in the present example, at least part of the electronic component 6 is arranged on the circuit board 1222 of the receiving unit 120 to facilitate downsizing of the luminaire 110.

Further, in some examples of the present invention, the light emitting element 2 may be implemented as a Vertical Cavity Surface Emitter (VCSEL). Upon energization, the VCSEL can be excited to emit laser light.

It should be noted that the vcsel can normally operate only when the vcsel needs to be maintained within a specific temperature range, that is, the heat dissipation performance of the pcb is very important to the operating state of the vcsel. Since the heat sink portion 40 of the circuit board assembly 1 provides a large heat dissipation area, the vertical cavity surface emitter can be supported on an upper surface of the heat sink portion 40 to operate normally.

Further, a back surface of the vertical cavity surface emitter is a cathode, and a front surface of the vertical cavity surface emitter is an anode, when the vertical cavity surface emitter is respectively communicated with the heat dissipation portion 40 and other conductive portions of the circuit board assembly 1, the heat dissipation portion 40 is a cathode, and heat generated by the vertical cavity surface emitter can be directly transmitted to the lower surface of the heat dissipation portion 40 through the upper surface of the heat dissipation portion 40, and then transmitted to the outside.

According to another aspect of the present invention, there is provided a heat dissipation method, comprising the steps of:

guiding heat generated by an electronic component to be transferred from a lower surface of the electronic component to an upper surface of a circuit board assembly 1;

directly thermally conducting the heat in a height direction of the circuit board assembly 1 to a lower surface of the circuit board assembly 1; and

dissipating heat outwards.

According to an embodiment of the present invention, in the above method, heat is transferred from a circuit layer 10 of the circuit assembly to a conductive layer 20 overlapping the circuit layer 10, and then transferred to the circuit layer 10 overlapping the conductive layer 20.

According to an embodiment of the present invention, in the above method, heat is transferred from the upper surface of the circuit board assembly 1 to a lower surface of a conductive layer 20, and then transferred to the circuit layer 10 overlapped with the conductive layer 20.

Referring to fig. 5, an electronic device 3000 according to a preferred embodiment of the present invention, wherein the electronic device 3000 includes the TOF camera module 1000 and an electronic device body 2000, wherein the TOF camera module 1000 is disposed on the electronic device body 2000.

In other examples of the present invention, the electronic device 3000 includes the electronic device body 2000 and a main circuit board, wherein the main circuit board is disposed on the electronic device body 2000 and is conductively connected to the electronic device body 2000.

The electronic device 3000 further comprises the floodlight 110 with a flexible circuit board, wherein the floodlight 110 can be conductively mounted to the main circuit board of the electronic device.

In other examples of the present invention, the electronic device 1000 further comprises a floodlight 110, wherein the floodlight 110 is conductively installed on the main circuit board of the electronic device 1000. Specifically, the circuit board assembly 1 of the floodlight 110 can be conductively connected to the main circuit board of the electronic device 1000.

It is understood that the floodlight 110, the receiving unit 120 and a camera module can be simultaneously mounted on an electronic device body 2000, wherein the floodlight 110, the receiving unit 120 and the camera module can be integrated into a whole by an assembly.

Referring to fig. 6A, according to another aspect of the present invention, there is provided a floodlight 110A with a flexible circuit board 5A, wherein the floodlight 110A can be installed in a receiving unit 120A to constitute a TOF camera module 1000A.

The floodlight 110A comprises the circuit board assembly 1A manufactured according to the above-mentioned manufacturing method, a light emitting element 2A, a support 3A, a flexible circuit board 5A and at least one electronic component 6A, wherein the support 3A forms a light window 31A, the light emitting element 2A is supported on the circuit board assembly 1A in a manner of being conductively connected to the circuit board assembly 1A, the flexible circuit board 5A is conductively connected to the circuit board assembly 1A, and the electronic component 6A is conductively connected to the circuit board assembly 1A and the light emitting element 2A. The floodlight 110A can further comprise an optical auxiliary element 4A, wherein the optical auxiliary element 4A is supported by the bracket 3A, and the light emitted by the light emitting element 2A is emitted outwards under the action of the optical auxiliary element 4A. The flexible printed circuit 5A may be conductively connected to the circuit board assembly 1A by means of conductive paste, or may be conductively connected to the circuit board assembly 1A by means of a card slot.

The receiving unit 120A includes a lens assembly 121A and a light sensing circuit 122A, wherein the light sensing circuit 122A includes a light sensing element 1221A and a circuit board 1222A, the lens assembly 121A provides an optical path for light to reach the light sensing element 1221A for photoelectric conversion, and the light sensing element 1221A is conductively connected to the circuit board 1222A.

The lens assembly 121A of the receiving unit 120A further includes an optical lens 1211A and a base 1212A, wherein the optical lens 1211A is held on a photosensitive path of the photosensitive element 1221A by the base 1212A. It is understood that the base 1212A is connected to the circuit board 1222A, in this example the base 1212A is mounted to the circuit board 1222A.

Further, at least a part of the electronic components 6A of the floodlight 110A is disposed on the circuit board 1222A of the receiving unit 120A to facilitate downsizing of the floodlight 110A.

The floodlight 110A with the flexible wiring board 5A can be mounted to the receiving unit 120A through the flexible wiring board 5A, wherein the circuit board 1222A of the receiving unit 120A is conductively connected to the flexible wiring board 4A.

Referring to fig. 6B, according to another aspect of the present invention, a floodlight 110B is provided, wherein the floodlight 110B can be installed in a receiving unit 120B with a flexible circuit board to form a TOF camera module 1000B.

The floodlight 110B comprises the circuit board assembly 1B manufactured according to the above-described manufacturing method, a light emitting element 2B, a holder 3B, a flexible wiring board 5B, and at least one electronic component 6B, wherein the holder 3B forms a light window 31B, the light emitting element 2B is conductively connected to the circuit board assembly 1B and is supported by the circuit board assembly 1B, and the electronic component 6B is conductively connected to the circuit board assembly 1B and the light emitting element 2B. The floodlight 110B can further comprise an optical auxiliary element 4B, wherein the optical auxiliary element 4B is supported by the bracket 3B, and the light emitted by the light emitting element 2B is emitted outwards under the action of the optical auxiliary element 4B.

The receiving unit 120B includes a lens assembly 121B and a photosensitive assembly 122B, wherein the photosensitive assembly 122B further includes a photosensitive element 1221B and a circuit board 1222B, wherein the lens assembly 121B provides an optical path for light to reach the photosensitive element 1221B for photoelectric conversion, and wherein the photosensitive element 1221B is conductively connected to the circuit board 1222B. The flexible wiring board 5B is conductively connected to the circuit board 1222B. It is understood that the flexible circuit board 5B may be connected to the circuit board 1222B of the receiving unit 120B by a conductive adhesive, and the flexible circuit board 5B may also be connected to the circuit board 1222B of the receiving unit 120B by a card slot.

The lens assembly 121B further includes an optical lens 1211B and a base 1212B, wherein the base 1212B supports the optical lens 1211B on the circuit board 1222B, and in this example, the base 1212B also supports the floodlight 110B on the circuit board 1222B. The electronic component 6B of the luminaire 110B is at least partially accommodated in the base 1212B to facilitate downsizing of the luminaire 110B.

The floodlight 110B is assembled to the receiving unit 120B in such a manner as to be communicably connected to the flexible wiring board 5B of the receiving unit to form the TOF camera module 1000B.

It will be understood by those skilled in the art that the embodiments of the present invention as described above and shown in the drawings are given by way of example only and are not limiting of the present invention. The objects of the present invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments without departing from the principles, embodiments of the present invention may have any deformation or modification.

Claims

1. A circuit board assembly, comprising a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, the cross section of the first conductive layer portion corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer portions corresponding to the other second forming positions, the heat sink has a first surface and a second surface, the first surface is exposed for supporting an electronic component, the second surface can be exposed for dissipating heat.

2. The circuit board assembly of claim 1, wherein the heat sink portion is formed at the first conductive layer and the first circuit layer.

3. The circuit board assembly of claim 1, wherein the circuit board assembly further comprises a second circuit layer formed on the first conductive layer and having at least two third molding locations, wherein at least one of the third molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is greater than the cross-section of the second circuit layer portion corresponding to the other third molding locations.

4. A circuit board assembly according to claim 3, wherein the heat dissipation portion is formed in the second wiring layer, the first conductive layer and the first wiring layer portion which overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

5. The circuit board assembly of claim 3, wherein the circuit board assembly further comprises a second conductive layer formed on the second circuit layer and having at least two fourth molding locations, wherein at least one of the fourth molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding location forming the heat sink portion is greater than the cross-section of the portion of the second conductive layer corresponding to the other fourth molding locations.

6. The circuit board assembly according to claim 5, wherein the heat dissipation portion is formed in the first conductive layer, the second wiring layer, and the second conductive layer portion that overlap in a height direction.

7. The circuit board assembly according to claim 5, wherein the circuit board assembly further comprises a third circuit layer and at least two fifth forming positions, wherein the third circuit layer is formed on the second conductive layer and formed at the fifth forming positions, at least one of the fifth forming positions forms at least part of the heat sink portion, wherein the cross section of the third circuit layer portion corresponding to the fifth forming position forming the heat sink portion is larger than the cross sections of the third circuit layer portions corresponding to the other fifth forming positions.

8. The circuit board assembly according to claim 7, wherein the heat dissipation portion is formed at the locations of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer which overlap in a height direction.

9. The circuit board assembly of any one of claims 1 to 8, wherein the circuit board assembly further has at least two first molding positions, wherein the first circuit layer is molded at the first molding positions, at least one of the first molding positions forming at least a portion of the heat sink, wherein a cross section of the first circuit layer portion corresponding to the first molding position forming the heat sink is larger than cross sections of the first circuit layer portions corresponding to other first molding positions.

10. A circuit board assembly according to any of claims 1 to 8, wherein the circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein the second insulating layer is integrally formed with the second conductive layer and the second circuit layer, wherein the second solder resist layer covers at least part of the second insulating layer.

11. The circuit board assembly of claim 10, wherein said circuit board assembly further comprises a first solder mask layer, wherein said first solder mask layer covers at least a portion of said first insulating layer.

12. A circuit board assembly according to any one of claims 1 to 8, wherein a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:

13. A TOF module of making a video recording, its characterized in that includes:

the floodlight is used for emitting light to a shot object; and

a receiving unit, wherein the receiving unit is used for receiving a reflected light reflected by the photographed object, and obtaining the depth information of the photographed object based on the information of the emitted light and the reflected light, wherein the floodlight comprises a light-emitting element and a circuit board assembly, wherein the circuit assembly comprises a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat dissipation part and at least two second molding positions, wherein the light-emitting element is conductively connected to the heat dissipation part of the circuit board assembly, the first conductive layer is formed on the upper side of the first circuit layer, the first insulating layer is integrally molded on the first circuit layer and the first conductive layer, the first conductive layer is molded on the second molding positions, and at least one of the second molding positions forms at least part of the heat dissipation part, wherein the cross section of the first conductive layer part corresponding to the second molding position forming the heat dissipation part is larger than the cross section of the first conductive layer part corresponding to the other second molding positions, wherein the heat dissipation part has a first surface and a second surface, wherein the first surface is exposed to the outside for supporting an electronic element, and the second surface can be exposed to the outside for dissipating heat.

14. The TOF camera module of claim 13, the heat sink portion being formed over the first conductive layer and the first circuitry layer.

15. The TOF camera module of claim 13, wherein the circuit board assembly further comprises a second circuit layer formed on the top side of the first conductive layer and formed at the third forming location, at least one of the third forming locations forming at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third forming location forming the heat sink portion is larger than the cross-section of the second circuit layer portion corresponding to the other third forming locations.

16. The TOF camera module of claim 15, wherein the heat sink portion is formed on the second circuit layer, the first conductive layer and the first circuit layer portion overlapping in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

17. The TOF camera module of claim 15, wherein the circuit board assembly further comprises a second conductive layer formed on the top side of the second circuit layer and formed at least two fourth forming locations, at least one of the fourth forming locations forming at least a portion of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth forming location forming the heat sink portion is larger than the cross-section of the portion of the second conductive layer corresponding to the other fourth forming locations.

18. The TOF camera module of claim 17, wherein the heat sink portion is formed on the first conductive layer, the second wiring layer, and the second conductive layer portion that overlap in a height direction.

19. The TOF camera module of claim 17, wherein said circuit board assembly further comprises a third circuit layer formed on said second conductive layer and formed at said fifth forming locations, at least one of said fifth forming locations forming at least a portion of said heat sink portion, wherein a cross-section of said third circuit layer portion corresponding to said fifth forming locations forming said heat sink portion is larger than a cross-section of said third circuit layer portion corresponding to other of said fifth forming locations.

20. The TOF camera module of claim 19, wherein the heat sink portion is formed at the locations of the first conductive layer, the second line layer, the second conductive layer, and the third line layer that overlap in a height direction.

21. The TOF camera module of any of claims 13 to 20, wherein said circuit board assembly further has at least two first molding positions, wherein said first circuit layer is molded at said first molding positions, at least one of said first molding positions forming at least a portion of said heat sink portion, wherein a cross-section of a portion of said first circuit layer corresponding to said first molding position forming said heat sink portion is larger than a cross-section of a portion of said first circuit layer corresponding to another of said first molding positions.

22. The TOF camera module of any of claims 13 to 20, wherein said circuit board assembly further comprises a second solder mask layer and a second insulating layer, wherein said second insulating layer is integrally formed with said second conductive layer and said second circuitry layer, wherein said second solder mask layer covers at least a portion of said second insulating layer.

23. The TOF camera module of claim 22, wherein the circuit board assembly further comprises a first solder mask, wherein the first solder mask covers at least a portion of the first insulating layer.

24. The TOF camera module of any of claims 13 to 20, wherein a line width a and a line pitch B of said circuit board assembly respectively satisfy the following condition:

25. An electronic device, comprising:

an electronic device body; and

a TOF module of making a video recording, wherein the TOF module of making a video recording is set up in the electronic equipment body, wherein the TOF module of making a video recording includes:

the floodlight is used for emitting light to a shot object; and

26. The electronic device according to claim 25, wherein the heat dissipation portion is formed over the first conductive layer and the first wiring layer.

27. The electronic device of claim 25, wherein the circuit board assembly further comprises a second circuit layer and at least two third molding locations, wherein the second circuit layer is formed on the first conductive layer and molded at the third molding locations, at least one of the third molding locations forming at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is larger than the cross-section of the second circuit layer portion corresponding to the other third molding locations.

28. The electronic device according to claim 27, wherein the heat dissipation portion is formed in the second wiring layer, the first conductive layer, and the first wiring layer portion which overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

29. The electronic device of claim 27, wherein the circuit board assembly further comprises a second conductive layer and at least two fourth forming locations, wherein the second conductive layer is formed on the second circuit layer and formed at the fourth forming locations, and at least one of the fourth forming locations forms at least a part of the heat sink, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth forming location forming the heat sink is larger than the cross-section of the portion of the second conductive layer corresponding to the other fourth forming locations.

30. The electronic device according to claim 29, wherein the heat dissipation portion is formed in the first conductive layer, the second wiring layer, and the second conductive layer portion which overlap in a height direction.

31. The electronic device of claim 29, wherein the circuit board assembly further comprises a third circuit layer and at least two fifth forming positions, wherein the third circuit layer is formed on the second conductive layer and formed at the fifth forming positions, at least one of the fifth forming positions forms at least part of the heat sink portion, wherein the cross section of the third circuit layer portion corresponding to the fifth forming position forming the heat sink portion is larger than the cross sections of the third circuit layer portions corresponding to the other fifth forming positions.

32. The electronic device according to claim 29, wherein the heat dissipation portion is formed at a position of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer which overlap in a height direction.

33. The electronic device of any of claims 25-32, wherein the circuit board assembly further comprises at least two first molding locations, wherein the first circuit layer is molded at the first molding locations, and at least one of the first molding locations forms at least a portion of the heat sink, wherein the cross-section of the first circuit layer portion corresponding to the first molding location forming the heat sink is larger than the cross-section of the first circuit layer portion corresponding to the other first molding locations.

34. The electronic device of any of claims 25-32, wherein the circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein the second insulating layer is integrally formed with the second conductive layer and the second circuit layer, wherein the second solder resist layer covers at least a portion of the second insulating layer.

35. The electronic device of claim 34, wherein the circuit board assembly further comprises a first solder mask layer, wherein the first solder mask layer covers at least a portion of the first insulating layer.

36. The electronic device according to any one of claims 25 to 32, wherein a line width a and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:

37. The electronic device of any one of claims 25 to 32, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

38. The electronic device of claim 33, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

39. The electronic device of claim 34, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

40. The electronic device of claim 35, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

41. The electronic device of claim 36, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled into a whole by the assembly, and the floodlight and the camera module are mounted together to the electronic device body.

42. A luminaire comprising:

a light emitting element;

a circuit board assembly, wherein the circuit assembly comprises a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, the cross section of the first conductive layer part corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer parts corresponding to the other second forming positions, the heat sink has a first surface and a second surface, the first surface is exposed for supporting an electronic component, the second surface can be exposed for dissipating heat; and

a frame, wherein the frame forms an optical window, the light emitting element is supported on the heat dissipating portion of the circuit board assembly, and the frame is connected to the circuit board assembly.

43. The luminaire of claim 42, the heat sink portion being formed over the first conductive layer and the first circuitry layer.

44. The floodlight of claim 42, wherein the circuit board assembly further comprises a second circuit layer and has at least two third molding locations, wherein the second circuit layer is formed on top of the first conductive layer and molded in the third molding locations, at least one of the third molding locations forming at least part of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is greater than the cross-section of the second circuit layer portion corresponding to the other of the third molding locations.

45. The floodlight of claim 44, wherein the heat dissipation portion is formed in the second circuit layer, the first conductive layer and the first circuit layer portion that overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

46. The floodlight of claim 44, wherein the circuit board assembly further comprises a second conductive layer and has at least two fourth molding positions, wherein the second conductive layer is formed on the second wiring layer and molded in the fourth molding positions, at least one of the fourth molding positions forming at least part of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding position forming the heat sink portion is larger than the cross-sections of the portions of the second conductive layer corresponding to the other fourth molding positions.

47. The floodlight of claim 46, wherein the heat dissipation portion is formed on the first conductive layer, the second wiring layer, and the second conductive layer portion that overlap in a height direction.

48. The floodlight of claim 46, wherein the circuit board assembly further comprises a third circuit layer and has at least two fifth molding positions, wherein the third circuit layer is formed on the second conductive layer and is molded at the fifth molding positions, at least one of the fifth molding positions forms at least part of the heat sink portion, wherein the cross-section of the third circuit layer portion corresponding to the fifth molding position forming the heat sink portion is larger than the cross-section of the third circuit layer portion corresponding to the other fifth molding positions.

49. The floodlight of claim 48, wherein the heat dissipation portion is formed at the location of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer that overlap in a height direction.

50. The luminaire of any one of claims 42 to 49, wherein the circuit board assembly further has at least two first molding positions, wherein the first circuit layers are molded in the first molding positions, at least one of the first molding positions forming at least part of the heat sink portion, wherein the cross-section of the first circuit layer portion corresponding to the first molding position forming the heat sink portion is greater than the cross-section of the first circuit layer portion corresponding to the other first molding positions.

51. The luminaire of any one of claims 42 to 49, wherein the circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein the second insulating layer is integrally formed with the second conductive layer and the second circuitry layer, wherein the second solder resist layer overlies at least a portion of the second insulating layer.

52. The floodlight of claim 51, wherein the circuit board assembly further comprises a first solder mask, wherein the first solder mask covers at least a portion of the first insulating layer.

53. The luminaire of any one of claims 42 to 49, wherein a line width A and a line pitch B of the circuit board assembly satisfy the following conditions, respectively:

54. A TOF module of making a video recording, its characterized in that includes:

a floodlight, wherein the floodlight comprises:

a circuit assembly, wherein the circuit assembly comprises a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, the cross section of the first conductive layer part corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer parts corresponding to the other second forming positions, the heat sink has a first surface and a second surface, the first surface is exposed for supporting an electronic component, the second surface can be exposed for dissipating heat; and

a support, wherein the support forms an optical window, the light emitting element is supported on the circuit board assembly, and the support is connected to the circuit board assembly; and

55. The TOF camera module of claim 54, the heat sink portion being formed over the first conductive layer and the first circuitry layer.

56. The TOF camera module of claim 54, wherein the circuit board assembly further comprises a second circuit layer formed on top of the first conductive layer and formed at the third forming location, at least one of the third forming locations forming at least part of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third forming location forming the heat sink portion is larger than the cross-section of the second circuit layer portion corresponding to the other third forming locations.

57. The TOF camera module of claim 56 wherein the heat sink portion is formed in the second circuit layer, the first conductive layer and the first circuit layer portion overlapping in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

58. The TOF camera module of claim 56, wherein the circuit board assembly further comprises a second conductive layer formed on the top side of the second circuit layer and having at least two fourth molding locations, at least one of the fourth molding locations forming at least a portion of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding location forming the heat sink portion is larger than the cross-section of the portion of the second conductive layer corresponding to the other fourth molding locations.

59. The TOF camera module of claim 58, wherein the heat sink portion is formed on the first conductive layer, the second wiring layer and the second conductive layer portion overlapping in a height direction.

60. The TOF camera module of claim 58, wherein said circuit board assembly further comprises a third circuit layer formed on said second conductive layer and formed at said fifth forming locations, at least one of said fifth forming locations forming at least part of said heat sink portion, wherein a cross-section of said third circuit layer portion corresponding to said fifth forming locations forming said heat sink portion is larger than cross-sections of said third circuit layer portions corresponding to other of said fifth forming locations.

61. The TOF camera module of claim 60, wherein the heat sink portion is formed at the locations of the first conductive layer, the second line layer, the second conductive layer and the third line layer that overlap in a height direction.

62. The TOF camera module of any of claims 54 to 61, wherein said circuit board assembly further has at least two first molding positions, wherein said first circuit layer is molded at said first molding positions, at least one of said first molding positions forming at least a portion of said heat sink portion, wherein a cross-section of a portion of said first circuit layer corresponding to said first molding position forming said heat sink portion is larger than a cross-section of a portion of said first circuit layer corresponding to another of said first molding positions.

63. The TOF camera module of any of claims 54 to 61, wherein said circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein said second insulating layer is integrally formed with said second conductive layer and said second circuitry layer, wherein said second solder resist layer covers at least a portion of said second insulating layer.

64. The TOF camera module of claim 63 wherein the circuit board assembly further comprises a first solder mask, wherein the first solder mask covers at least a portion of the first insulating layer.

65. A TOF camera module according to any one of claims 54 to 61 wherein a line width A and a line pitch B of said circuit board assembly respectively satisfy the following conditions:

66. An electronic device, comprising:

a floodlight, wherein the floodlight comprises:

a light emitting element;

a support, wherein the support forms an optical window, the light emitting element is supported on the circuit board assembly, and the support is connected to the circuit board assembly;

an electronic device body; and

67. The electronic device according to claim 66, wherein the heat dissipation portion is formed over the first conductive layer and the first wiring layer.

68. The electronic device of claim 66, wherein the circuit board assembly further comprises a second circuit layer formed on the first conductive layer and having at least two third molding locations, wherein at least one of the third molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is greater than the cross-section of the second circuit layer portion corresponding to the other third molding locations.

69. The electronic device according to claim 68, wherein the heat dissipation portion is formed in the second wiring layer, the first conductive layer, and the first wiring layer portion which overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

70. The electronic device of claim 68, wherein the circuit board assembly further comprises a second conductive layer formed on the second circuit layer and having at least two fourth molding locations, wherein at least one of the fourth molding locations forms at least a portion of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding location forming the heat sink portion is greater than the cross-section of the portion of the second conductive layer corresponding to the other fourth molding locations.

71. The electronic device according to claim 70, wherein the heat dissipation portion is formed over the first conductive layer, the second wiring layer, and the second conductive layer portion which overlap in a height direction.

72. The electronic device of claim 70, wherein said circuit board assembly further comprises a third circuit layer and at least two fifth forming locations, wherein said third circuit layer is formed on the upper side of said second conductive layer and formed at said fifth forming locations, at least one of said fifth forming locations forming at least part of said heat sink portion, wherein the cross section of said third circuit layer portion corresponding to said fifth forming locations forming said heat sink portion is larger than the cross section of said third circuit layer portion corresponding to the other of said fifth forming locations.

73. The electronic device according to claim 70, wherein the heat dissipation portion is formed at a position of the first conductive layer, the second wiring layer, the second conductive layer, and the third wiring layer which overlap in a height direction.

74. The electronic device of any one of claims 66 to 73, wherein the circuit board assembly further has at least two first molding locations, wherein the first circuit layer is molded at the first molding locations, at least one of the first molding locations forming at least a portion of the heat sink portion, wherein a cross section of the first circuit layer portion corresponding to the first molding location forming the heat sink portion is larger than cross sections of the first circuit layer portions corresponding to other first molding locations.

75. The electronic device of any of claims 66-73, wherein the circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein the second insulating layer is integrally formed with the second conductive layer and the second circuit layer, wherein the second solder resist layer covers at least a portion of the second insulating layer.

76. The electronic device of claim 75, wherein the circuit board assembly further comprises a first solder mask layer, wherein the first solder mask layer overlies at least a portion of the first insulating layer.

77. The electronic device of any of claims 66-73, wherein a line width A and a line pitch B of the circuit board assembly, respectively, satisfy the following condition:

a is more than or equal to 30 mu m and less than or equal to 150 mu m; and B is more than or equal to 30 mu m and less than or equal to 150 mu m. (ii) a

78. The electronic device of any one of claims 66-73, wherein the electronic device includes a camera module, a receiving unit, and an assembly, wherein the camera module is assembled as a single unit from the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

79. The electronic device of claim 74, wherein the electronic device includes a camera module, a receiving unit, and an assembly, wherein the camera module is assembled as a single unit from the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

80. The electronic device of claim 75, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

81. The electronic device of claim 76, wherein the electronic device comprises a camera module, a receiving unit, and an assembly, wherein the camera module is assembled as a single unit from the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

82. The electronic device of claim 77, wherein the electronic device comprises a camera module, a receiving unit and an assembly, wherein the camera module is assembled as a whole by the assembly, and the floodlight and the camera module are mounted together on the electronic device body.

83. A luminaire comprising:

a light emitting element;

a circuit board assembly, wherein the circuit board assembly comprises a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, the cross section of the first conductive layer part corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer parts corresponding to the other second forming positions, the heat sink has a first surface and a second surface, the first surface is exposed for supporting an electronic component, the second surface can be exposed for dissipating heat;

a frame, wherein the frame forms an optical window, the light emitting element is supported on the heat dissipating portion of the circuit board assembly, and the frame is connected to the circuit board assembly; and

84. The floodlight of claim 83, wherein the heat sink portion is formed over the first conductive layer and the first circuit layer.

85. The floodlight of claim 83, wherein the circuit board assembly further comprises a second circuit layer and has at least two third molding locations, wherein the second circuit layer is formed on top of the first conductive layer and molded in the third molding locations, at least one of the third molding locations forming at least a portion of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third molding location forming the heat sink portion is greater than the cross-section of the second circuit layer portion corresponding to the other of the third molding locations.

86. The floodlight of claim 85, wherein the heat dissipation portion is formed in the second circuit layer, the first conductive layer and the first circuit layer portion that overlap in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

87. The floodlight of claim 85, wherein the circuit board assembly further comprises a second conductive layer and has at least two fourth molding positions, wherein the second conductive layer is formed on the second wiring layer and is molded at the fourth molding positions, at least one of the fourth molding positions forms at least part of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth molding position forming the heat sink portion is larger than the cross-section of the portion of the second conductive layer corresponding to the other fourth molding positions.

88. The floodlight of claim 87, wherein the heat dissipation portion is formed in the first conductive layer, the second wiring layer, and the second conductive layer portion that overlap in a height direction.

89. The floodlight of claim 87, wherein the circuit board assembly further comprises a third circuit layer and has at least two fifth molding positions, wherein the third circuit layer is formed on the second conductive layer and is molded at the fifth molding positions, at least one of the fifth molding positions forms at least part of the heat sink portion, wherein the cross-section of the third circuit layer portion corresponding to the fifth molding position forming the heat sink portion is larger than the cross-section of the third circuit layer portion corresponding to the other fifth molding positions.

90. The floodlight of claim 89, wherein the heat dissipation portion is formed at the location of the first conductive layer, the second circuit layer, the second conductive layer, and the third circuit layer that overlap in a height direction.

91. The luminaire of any one of claims 83 to 90, wherein the circuit board assembly further has at least two first molding positions, wherein the first circuit layers are molded in the first molding positions, at least one of the first molding positions forming at least part of the heat sink portion, wherein the cross-section of the first circuit layer portion corresponding to the first molding position forming the heat sink portion is greater than the cross-section of the first circuit layer portion corresponding to the other first molding positions.

92. The luminaire of any one of claims 83 to 90, wherein the circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein the second insulating layer is integrally formed with the second conductive layer and the second circuitry layer, wherein the second solder resist layer overlies at least a portion of the second insulating layer.

93. The floodlight of claim 92, wherein the circuit board assembly further comprises a first solder mask, wherein the first solder mask covers at least a portion of the first insulating layer.

94. The luminaire of any one of claims 83 to 90, wherein a line width A and a line spacing B of the circuit board assemblies respectively satisfy the following conditions:

95. A TOF module of making a video recording, its characterized in that includes:

a floodlight, wherein the floodlight comprises:

a light emitting device, a circuit board assembly, a support and a flexible printed circuit, wherein the circuit board assembly includes a first circuit layer, a first conductive layer, a first insulating layer, a conductive heat sink and at least two second forming positions, wherein the first conductive layer is formed on the first circuit layer, the first insulating layer is integrally formed on the first circuit layer and the first conductive layer, wherein the first conductive layer is formed on the second forming positions, at least one of the second forming positions forms at least a part of the heat sink, wherein the cross section of the first conductive layer portion corresponding to the second forming position forming the heat sink is larger than the cross sections of the first conductive layer portions corresponding to the other second forming positions, wherein the heat sink has a first surface and a second surface, wherein the first surface is exposed for supporting an electronic component and the second surface is capable of being exposed for dissipating heat, wherein the bracket forms an optical window, the light emitting element is supported by the circuit board assembly, the bracket is connected to the circuit board assembly, wherein the flexible circuit board is conductively connected to the circuit board assembly; and

96. The TOF camera module of claim 78, the heat sink portion being formed over the first conductive layer and the first circuitry layer.

97. The TOF camera module of claim 78, wherein the circuit board assembly further comprises a second circuit layer formed on top of the first conductive layer and formed at the third forming location, at least one of the third forming locations forming at least part of the heat sink portion, wherein the cross-section of the second circuit layer portion corresponding to the third forming location forming the heat sink portion is larger than the cross-section of the second circuit layer portion corresponding to the other third forming locations.

98. The TOF camera module of claim 80, wherein the heat sink portion is formed on the second circuit layer, the first conductive layer and the first circuit layer portion overlapping in a height direction; alternatively, the heat dissipation portion is formed in the second circuit layer and the first conductive layer portion which overlap in the height direction.

99. The TOF camera module of claim 80, wherein the circuit board assembly further comprises a second conductive layer formed on the top side of the second circuit layer and formed at least two fourth forming locations, at least one of the fourth forming locations forming at least part of the heat sink portion, wherein the cross-section of the portion of the second conductive layer corresponding to the fourth forming location forming the heat sink portion is larger than the cross-section of the portion of the second conductive layer corresponding to the other fourth forming locations.

100. The TOF camera module of claim 82, wherein the heat sink portion is formed on the first conductive layer, the second line layer and the second conductive layer portion overlapping in a height direction.

101. The TOF camera module of claim 82, wherein said circuit board assembly further comprises a third circuit layer formed on said second conductive layer and formed at said fifth forming locations, at least one of said fifth forming locations forming at least part of said heat sink portion, wherein a cross-section of said third circuit layer portion corresponding to said fifth forming locations forming said heat sink portion is larger than cross-sections of said third circuit layer portions corresponding to other of said fifth forming locations.

102. The TOF camera module of claim 84, wherein the heat sink portion is formed at the locations of the first conductive layer, the second line layer, the second conductive layer and the third line layer that overlap in a height direction.

103. The TOF camera module of any of claims 66 to 85, wherein said circuit board assembly further has at least two first molding positions, wherein said first circuit layer is molded at said first molding positions, at least one of said first molding positions forming at least a portion of said heat sink portion, wherein a cross-section of a portion of said first circuit layer corresponding to said first molding position forming said heat sink portion is larger than a cross-section of a portion of said first circuit layer corresponding to another of said first molding positions.

104. The TOF camera module of any of claims 66 to 85, wherein said circuit board assembly further comprises a second solder resist layer and a second insulating layer, wherein said second insulating layer is integrally formed with said second conductive layer and said second circuitry layer, wherein said second solder resist layer covers at least a portion of said second insulating layer.

105. The TOF camera module of claim 87, wherein the circuit board assembly further comprises a first solder mask, wherein the first solder mask covers at least a portion of the first insulating layer.

106. The TOF camera module of any of claims 66 to 85, wherein a line width a and a line pitch B of said circuit board assembly respectively satisfy the following condition: