CN210221881U - Section bar heat-insulating property demonstration equipment - Google Patents
Section bar heat-insulating property demonstration equipment Download PDFInfo
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- CN210221881U CN210221881U CN201920030762.4U CN201920030762U CN210221881U CN 210221881 U CN210221881 U CN 210221881U CN 201920030762 U CN201920030762 U CN 201920030762U CN 210221881 U CN210221881 U CN 210221881U
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Abstract
The utility model relates to a section bar heat insulation performance demonstration device, which comprises a shell, a plurality of first temperature sensors, a power supply and control unit, a semiconductor refrigerating device and a display unit, wherein the power supply and control unit, the semiconductor refrigerating device and the display unit are arranged in the shell; the semiconductor refrigerating device is provided with a cooling plane exposed out of the front panel of the shell so as to carry out contact type cooling on the section bar; the power supply and control unit is electrically connected with the semiconductor refrigerating device, the display unit and the plurality of first temperature sensors, and the first temperature sensors are used for detecting the temperature of the section bar. The utility model discloses portable relatively to can demonstrate section bar heat-proof quality and the good and bad conclusion of heat-proof quality directly perceivedly effectively.
Description
Technical Field
The utility model relates to a section bar heat-proof quality demonstration equipment.
Background
Besides mechanical strength, thermal insulation performance is one of the performance indexes of the profile. How to realize the visual demonstration of the heat-insulating property of the section bar through portable equipment in a normal temperature environment, and objectively, accurately and quickly obtain the conclusion of the heat-insulating property, which is a main problem urgently needed to be solved by the section bar industry at present.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that a section bar heat-proof quality demonstration equipment is provided, portable relatively to can demonstrate effectively directly perceivedly that the section bar heat-proof quality and heat-proof quality are good and bad conclusion.
The technical problem is solved by the following technical scheme:
a section heat insulation performance demonstration device comprises a shell, a plurality of first temperature sensors, a power supply and control unit, a semiconductor refrigerating device and a display unit, wherein the power supply and control unit, the semiconductor refrigerating device and the display unit are arranged in the shell; the semiconductor refrigerating device is provided with a cooling plane exposed out of the front panel of the shell so as to carry out contact type cooling on the section bar; the power supply and control unit is electrically connected with the semiconductor refrigerating device, the display unit and the plurality of first temperature sensors, and the first temperature sensors are used for detecting the temperature of the section bar.
The section heat-insulating property demonstration equipment adopts the semiconductor refrigerating device to provide a cold source, simulates the low-temperature environment in actual use of the section, and when the section heat-insulating property demonstration equipment is used, one or more sections to be tested are connected to a cold supply plane of the semiconductor refrigerating device, the first temperature sensor is connected to the section, the detection value of the first temperature sensor is displayed in real time through the display unit, so that the heat-insulating property of the section can be visually displayed, and the conclusion of the heat-insulating property can be objectively, accurately and quickly obtained when the plurality of sections to be tested are simultaneously detected; the semiconductor refrigerating device used as the refrigerating element has the advantage of small volume, and the semiconductor refrigerating device is used as a cold source, so that the section heat-insulating property demonstration equipment is relatively small in volume and relatively convenient to carry.
Therefore, the utility model provides a section bar heat-proof quality demonstration equipment, portable relatively to can demonstrate section bar heat-proof quality and heat-proof quality conclusion directly perceivedly effectively.
In one embodiment, the semiconductor refrigeration device comprises a low-temperature plate, a semiconductor refrigeration unit and a heat dissipation module; the low-temperature plate is provided with a cooling plane and a cooling plane which are arranged oppositely; the semiconductor refrigeration unit is electrically connected with the power supply and control unit, the semiconductor refrigeration unit is provided with a cold end surface and a hot end surface, and the cold end surface is jointed with the cooled plane of the low-temperature plate; the heat dissipation module is attached to the hot end face of the semiconductor refrigeration unit.
In one embodiment, the heat dissipation module comprises a circulation pipeline, a liquid working medium arranged in the circulation pipeline, and a hot end heat exchange body, a heat exchanger, a water pump and a liquid storage device which are arranged on the circulation pipeline; the hot end heat exchanger is attached to the hot end surface of the semiconductor refrigeration unit; the water pump is electrically connected with the power supply and the control unit.
In one embodiment, the housing is provided with a viewing through hole opposite the water pump.
In one embodiment, the hot end heat exchange body comprises a heat exchange main body, a first sealing ring and a heat exchange plate, the heat exchange main body is provided with a circuitous flow passage communicated with the circulation pipeline, the heat exchange plate is covered on the heat exchange main body, the inner side surface of the heat exchange plate is provided with a heat exchange reinforcing rib extending into the circuitous flow passage, and the sealing ring is arranged between the heat exchange plate and the heat exchange main body.
In one embodiment, the number of the semiconductor refrigeration units is M, and M is an integer greater than 1; the semiconductor refrigerating device also comprises N second temperature sensors electrically connected with the power supply and the control unit, wherein N is an integer less than or equal to M; the second temperature sensor is arranged on a cooling plane of the low-temperature plate; the second temperature sensor corresponds to at least one semiconductor refrigeration unit; the power supply and control unit is provided with M voltage output ends, the voltage output ends are connected with the semiconductor refrigeration units in a one-to-one correspondence mode, the correspondingly connected voltage output ends and the semiconductor refrigeration units correspond to the same second temperature sensor, and the power supply and control unit adjusts the output value of the corresponding voltage output ends according to the detection value of the second temperature sensor.
In one embodiment, the cold plate further comprises a connecting screw, the cold plate is provided with a threaded hole, and the connecting screw is matched with the threaded hole to be used for fixing the section bar to the cold plate.
In one embodiment, the power supply further comprises a third temperature sensor electrically connected with the power supply and control unit, wherein the third temperature sensor is used for detecting the ambient temperature; the display unit is used for displaying the detection values of the first temperature sensor and the third temperature sensor.
In one embodiment, the water receiving box is further included; the water receiving box is arranged on the shell in a foldable mode and is located below the cooling plane.
Drawings
Fig. 1 is a schematic structural diagram of a section bar heat insulation performance demonstration device;
FIG. 2 is an exploded view of the housing;
FIG. 3 is a schematic view of the connection structure of the power supply and control unit and the semiconductor cooling device;
FIG. 4 is an exploded view of the hot side heat exchanger body;
FIG. 5 is a schematic cross-sectional view of a hot side heat exchanger body;
FIG. 6 is an exploded view of the reservoir;
FIG. 7 is a schematic air flow diagram of a heat exchange module;
FIG. 8 is a schematic view of the basic structure of the connection of the section bar, the cryopanel and the semiconductor refrigeration unit;
fig. 9 is a schematic view of the refrigeration area of the cryopanel corresponding to the semiconductor refrigeration unit;
fig. 10 is a schematic view of the lateral heat transfer of two different refrigeration zones of a cryopanel;
FIGS. 11-1 and 11-2 are schematic diagrams illustrating the conduction of the internal cooling capacity of the cryopanel under different conditions of the cold load profile;
FIG. 12 is an exploded view of the cryopanel, the semiconductor refrigeration unit, the hot side heat exchanger, and the low thermal conductivity joining member;
FIG. 13 is an enlarged view of portion A of FIG. 12;
FIG. 14 is a schematic view of a bolt with a washer;
FIG. 15 is a schematic view of the construction of the insulating sleeve gasket;
FIG. 16 is a schematic diagram showing the connection of the power supply and control unit, the semiconductor refrigeration unit, and the temperature sensor;
fig. 17 is a schematic diagram of a semiconductor refrigeration unit in relation to a cryopanel refrigeration zone;
FIG. 18 is a temperature-voltage graph for adjusting the power supply and control unit output;
fig. 19 is a schematic view of the association of the profile with the cryopanel;
fig. 20 is a schematic view of the connection between the low thermal conductive material member and the profile.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to further explain the present invention in detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
With reference to fig. 1 and 3, a profile heat insulation performance demonstration device comprises a housing 100, a plurality of first temperature sensors 200, and a power supply and control unit 300, a semiconductor refrigeration device and a display unit 500 which are arranged in the housing 100; the semiconductor refrigerating device is provided with a cooling plane exposed out of the front panel 113 of the shell 100 to perform contact type cooling on the section; the power supply and control unit 300 is electrically connected to the semiconductor refrigeration device, the display unit 500 and the plurality of first temperature sensors 200, and the first temperature sensors 200 are used for detecting the temperature of the profile. The power and control unit 300 is used to provide power and control signals. The display unit 500 is used for displaying the detection value of the first temperature sensor 200.
The section heat-insulating property demonstration equipment adopts the semiconductor refrigerating device to provide a cold source, simulates the low-temperature environment in actual use of the section, and when the section heat-insulating property demonstration equipment is used, one or more sections to be tested are connected to a cold supply plane of the semiconductor refrigerating device, the first temperature sensor 200 is connected to the section, the detection value of the first temperature sensor 200 is displayed in real time through the display unit 500, so that the heat-insulating property of the section can be intuitively displayed, and the conclusion of the heat-insulating property can be objectively, accurately and quickly obtained when a plurality of sections to be tested are detected at the same; the semiconductor refrigerating device used as the refrigerating element has the advantage of small volume, and the semiconductor refrigerating device is used as a cold source, so that the section heat-insulating property demonstration equipment is relatively small in volume and relatively convenient to carry.
Therefore, the utility model provides a section bar heat-proof quality demonstration equipment, portable relatively to can demonstrate effectively directly perceivedly that section bar heat-proof quality and heat-proof quality are good and bad conclusion.
The semiconductor refrigeration device comprises a low-temperature plate 1, a semiconductor refrigeration unit 2 and a heat dissipation module; the cryopanel 1 is provided with a cooled plane and a cooling plane which are oppositely arranged; the semiconductor refrigeration unit 2 is electrically connected with the power supply and control unit 300, the semiconductor refrigeration unit 2 is provided with a cold end surface and a hot end surface, and the cold end surface is jointed with the cooled plane of the low-temperature plate 1; the heat dissipation module is attached to the hot end face of the semiconductor refrigeration unit 2. The semiconductor refrigeration device adopts the combination of the semiconductor refrigeration unit 2 and the low-temperature board 1 to supply cold to the outside, the heat insulation performance of the section to be tested in a cold receiving test needs to joint the section to be tested with the cold supply plane of the low-temperature board 1, the cold energy generated by the semiconductor refrigeration unit 2 is transferred to the low-temperature board 1 by jointing with certain cold flow density, the cold flow generated by the semiconductor refrigeration unit 2 is converged at the low-temperature board 1 and is transferred to the section to be tested through the cold supply plane of the low-temperature board 1, and certainly, the non-section joint part of the low-temperature board 1 can exchange heat with the environment at the same time.
In practical application, the demonstration device for the heat insulation performance of the section bar needs to provide stable refrigeration temperature to demonstrate the heat insulation performance of the section bar, and certainly, the total production cold quantity of the semiconductor refrigeration unit 2 is larger than the total cold load of the section bar and the heat exchange cold quantity loss between part of the section bar and ambient air.
In some of the embodiments, the semiconductor cooling unit 2 may be a semiconductor Cooler (TEC). The semiconductor refrigerator comprises a cold substrate, a hot substrate, a P-type thermocouple arm and an N-type thermocouple arm, wherein the P-type thermocouple arm and the N-type thermocouple arm are connected between the cold substrate and the hot substrate through a flow guide body. In this embodiment, the outer surfaces of the cold substrate and the hot substrate are the cold end surface and the hot end surface of the semiconductor refrigeration unit 2, respectively.
Some of themIn an embodiment, in order to better improve the refrigerating capacity of the semiconductor refrigerating unit 2, the semiconductor refrigerating unit 2 may include (not shown in the figure) a power connection terminal, a cold end plate, a hot end plate, and a plurality of semiconductor refrigerators disposed between the cold end plate and the hot end plate, where the plurality of semiconductor refrigerators are connected to the power connection terminal in a series or parallel connection manner, and the cold end plate and the hot end plate have the cold end face and the hot end face, respectively. A plurality of the number is equal to 2 or more than 2. In order to ensure that the joint state of each semiconductor refrigerator with the cold end plate and the hot end plate is good, the thickness error range between the semiconductor refrigerators is less than or equal to +/-0.02 mm. The P-type thermocouple arm and the N-type thermocouple arm are made of semiconductor thermoelectric materials, and as the electric conductivity of the semiconductor thermoelectric materials is monotonically reduced along with the temperature, namely the resistance value of the TEC is increased along with the temperature rise, the current is the same for the series connection of the TECs, the larger the resistance value of the TEC is, the larger the calorific value I of the TEC is2RiThe larger the temperature rise of the local hot end of the TEC is, the higher the temperature rise of the local hot end of the TEC is, so that the TEC resistance value is further increased, thereby forming vicious circle change, and therefore, when a plurality of semiconductor refrigerators in the semiconductor refrigeration unit 2 are connected in series, it is required to satisfy that the absolute difference between the resistance values of the plurality of semiconductor refrigerators in the semiconductor refrigeration unit 2 is less than 10% of the resistance value of any one semiconductor refrigerator. Taking the environment temperature of 30 ℃ and the temperature of the low-temperature plate of 1-20 ℃ as an example, the temperature difference between the cold end and the hot end of the semiconductor refrigerator usually exceeds 60 ℃, the higher the height of the couple arm is, the larger the temperature difference is, the more the internal resistance is increased, the generated Joule heat is large, the cold production capacity can be influenced, the cold production capacity and the temperature difference of the semiconductor refrigerator can be considered, and the single-stage semiconductor refrigerator is adopted, and the optimal size range of the couple arm is as follows: the height is 1.9-3.0 mm, and the side length of the cross section is 1.2-4.5 mm.
The cold production capacity of the cold end of the semiconductor refrigerator is calculated as follows:
Qc＝N(αp-αn)ITc-K(Th-Tc)-0.5I2Riformula ①;
N-p-N couple logarithm in formula ①, αp、αn-seebeck coefficient of couple arm material; i-output current; ri-a resistance;
Lp、Ln-the thermocouple arm length; sp、Sn-couple arm cross section; kp、Kn-the material thermal conductivity of the couple arms.
The cold production capacity of the semiconductor refrigerator obtained by the formula ① is closely related to parameters such as couple logarithm, working current, temperature difference of a cold end and a hot end, and when the refrigeration temperature of the cryopanel 1 is determined, the heat dissipation of the hot end of the semiconductor refrigerator has great influence on the cold production capacity of the semiconductor refrigeration unit 2.
Referring to fig. 3, in order to better realize the total output cooling capacity and increase the cooling efficiency of the semiconductor refrigeration unit 2, the heat dissipation at the hot end of the semiconductor refrigeration unit 2 adopts a liquid cooling mode. The heat dissipation module comprises a circulation pipeline 5, a liquid working medium arranged in the circulation pipeline 5, and a hot end heat exchange body 6, a heat exchanger 7, a water pump 8 and a liquid storage device 9 which are arranged on the circulation pipeline 5, wherein the hot end heat exchange body 6 is attached to the hot end face of the semiconductor refrigeration unit 2. According to the scheme, the water pump 8 is used as a power source, the liquid working medium is used as a heat transfer working medium, the liquid working medium flows on the circulating pipeline 5 through the water pump 8, heat generated by the hot end of the semiconductor refrigerating unit 2 can be better taken away, and cold production capacity of the cold end of the semiconductor refrigerating unit 2 is improved. During normal work, the temperature of the liquid working medium is higher than the ambient temperature, and long-term work can cause a small amount of evaporation of part of the liquid working medium in the circulation pipeline 5 to influence the circulation flow of the liquid working medium, so that the liquid storage device 9 is arranged on the circulation pipeline 5. In practical application, the liquid reservoir 9 is higher than the hot-end heat exchanger 6, the heat exchanger 7 and the water pump 8 in the horizontal height, and the bottom of the liquid reservoir 9 is provided with a fluid outlet 911, which mainly ensures that the whole circulation pipeline 5 can be filled with liquid working medium when the liquid in the liquid reservoir 9 is reduced; referring to fig. 6, the upper portion of the reservoir 9 is provided with an air outlet 912, a liquid inlet 913, and a fluid inlet 914. The liquid injection port 913 is usually in a closed state, and only when the liquid working medium in the liquid storage device 9 is insufficient, the liquid injection port 913 is opened to fill and replenish the liquid working medium in the liquid storage device 9.
In order to ensure the transportation and storage in a low-temperature environment (such as less than or equal to minus 20 ℃) under a non-working state and prevent the liquid working medium from solidifying and expanding to cause the leakage of the circulating pipeline 5 and influence the circulation of the liquid working medium, the liquid working medium is preferably ethylene glycol material (the solidification temperature is less than or equal to minus 25 ℃).
The circulation line 5 is preferably a silica gel line or a rubber line.
In some embodiments, with reference to fig. 4 and 5, the hot-end heat exchanger 6 includes a heat exchanger main body 601, a first sealing ring 602, and a heat exchanger plate 603, where the heat exchanger main body 601 is provided with a circuitous flow channel 611, the heat exchanger plate 603 covers the heat exchanger main body 601, a heat exchanger reinforcing rib 631 extending into the circuitous flow channel 611 is disposed on an inner side surface of the heat exchanger plate 603, the heat exchanger reinforcing rib 631 plays a role in improving strength of the heat exchanger plate 603 and increasing a heat exchange area, and the first sealing ring 602 is disposed between the heat exchanger plate 603 and the heat exchanger main body 601. This solution facilitates better conduction of the heat of the hot side heat exchanger 6 to the fluid working medium.
In some embodiments, a viewing through hole 103 is provided for the housing 100 opposite the reservoir 9. The scheme is convenient for users to know the residual quantity of the liquid working medium in the liquid storage device 9.
In some embodiments, referring to fig. 6, the liquid reservoir 9 includes a box 901, a second sealing ring 902 and a box cover 903, the box 901 is provided with the fluid outlet 911, the box cover 903 is provided on the box 901 and is provided with the air vent 912, the liquid injection port 913 and the fluid inlet 914, the second sealing ring 902 is provided between the box 901 and the box cover 903, and the circulation pipeline 5 is connected to the fluid outlet 911 and the fluid inlet 914. The exhaust port 912 is provided to facilitate the discharge of hot gas.
In a further scheme, in order to reduce the influence of heat dissipation on the front-end profile demonstration effect and improve the heat dissipation effect of the semiconductor refrigeration system, the design of a rear heat exchanger of a fan is adopted, air is supplied to the rear end, and air is discharged from two sides of the air deflector. With reference to fig. 7, the heat dissipation module further includes two fans 10 and two air deflectors 13; a heat dissipation air inlet 101 is formed in a back panel 111 of the housing 100, and heat dissipation air outlets 102 are formed in two side panels 112 of the housing 100; the heat exchanger 7 is disposed at the heat dissipation air inlet 101, the two fans 10 are disposed on the heat exchanger 7, and the air deflectors 13 are disposed between the fans 10 and the side panels of the casing 100 to guide air drawn in from the heat dissipation air inlet 101 to be discharged from the heat dissipation air outlet 102. According to the scheme, air with the ambient temperature is sucked by the fan 10 arranged at the rear part of the heat exchanger 7, firstly passes through the heat exchanger 7 for heat exchange, and then is discharged from the side panel. The positive effect of this structure lies in: the fan 10 sucks air, and the air noise is small; the two air deflectors 13 and the two heat-dissipation air outlets 102 are utilized, so that heat dissipation can be accelerated, and the heat exchanger 7 has high heat exchange efficiency, thereby being beneficial to improving the refrigeration effect of the semiconductor refrigeration unit 2; the hot air is discharged from the side panel 112, and the discharged hot air rises, so that the influence on the local environment temperature of the profile arranged on the front panel 113 is small, and the influence of heat on the test is reduced.
From the standpoint of normal use furnishings of the profile thermal insulation performance demonstration apparatus, the casing 100 has a front panel, a back panel, a bottom panel, a top panel, two side panels.
In order to reduce the thermal resistance formed by the joint of the cold end surface of the semiconductor refrigeration unit 2 and the cooled plane of the low-temperature plate 1 and facilitate the transmission of cold energy, the planeness of the cold end surface is preferably less than or equal to 0.01 mm.
The semiconductor refrigeration device adopts the combination of the semiconductor refrigeration unit 2 and the low-temperature board 1 to supply cold to the outside, the heat insulation performance of the section bar to be tested after being cooled needs to be jointed with the cooling plane of the low-temperature board 1, the cold energy generated by the conductor refrigeration unit 2 is transferred to the low-temperature board 1 with certain cold flow density through jointing, the cold flow generated by the semiconductor refrigeration unit 2 is converged at the low-temperature board 1 and is transferred to the section bar to be tested through the cooling plane of the low-temperature board 1, and certainly, the non-section jointing part of the low-temperature board 1 can exchange heat with the environment at the same time. Due to the fact that different materials of different sectional materials to be tested are different and other practical conditions are not consistent, the temperatures of different parts of the low-temperature board 1 can be caused to be inconsistent in the test, and the accuracy and the objectivity of the comparison and detection of the heat insulation performance of the different sectional materials to be tested can be influenced. Therefore, the present designer makes a design such that the temperature of the cooling plane of the cryopanel 1 is relatively stably maintained at the preset temperature value, i.e., such that the cryopanel 1 is relatively maintained at a constant temperature for cooling.
In connection with the description of figure 16,the number of the semiconductor refrigeration units 2 is M (U)TEC-1、UTEC-2、……、 UTEC-M) M is an integer greater than 1; the semiconductor refrigeration device further comprises N second temperature sensors 3 ((NTC) electrically connected to the power supply and control unit 300)1、NTC2、……、NTCN) N is an integer less than or equal to M; the second temperature sensor 3 is arranged on a cooling plane of the cryopanel 1; the second temperature sensor 3 corresponds to at least one of the semiconductor refrigeration units 2; the power supply and control unit 300 is provided with M voltage output ends, the voltage output ends are connected with the semiconductor refrigeration units 2 in a one-to-one correspondence manner, the correspondingly connected voltage output ends and the semiconductor refrigeration units 2 correspond to the same second temperature sensor 3, and the power supply and control unit 300 adjusts the output value of the corresponding voltage output end according to the detection value of the second temperature sensor 3.
The section heat insulation performance demonstration equipment is characterized in that M semiconductor refrigeration units 2 are arranged on a cold receiving plane of a low-temperature board 1 for carrying out partition cold supply, N second temperature sensors 3 are arranged on a cold supply plane of the low-temperature board 1 for carrying out partition temperature monitoring, the input voltages of the M semiconductor refrigeration units 2 are respectively controlled through a power supply and control unit 300, and correspondingly connected voltage output ends and the semiconductor refrigeration units 2 correspond to the same second temperature sensors 3; in application, the profile heat-insulating performance demonstration device adjusts the output values of M voltage output ends by using the detection values of N second temperature sensors 3 as the basis for the power supply and control unit 300 to adjust the output values of M voltage output ends, adjusts the input voltages of M semiconductor refrigeration units 2 to adjust the input voltages of the semiconductor refrigeration units 2 corresponding to the second temperature sensors 3, and adjusts the cooling capacities of the M semiconductor refrigeration units 2 in real time, so that the total cold flow generated by the semiconductor refrigeration units 2, the cold flow at the output profile ends and the cold flow consumed by the non-profile joint part of the low-temperature panel (heat exchange with the environment) reach dynamic balance at a set temperature point, and therefore, the cold supply plane of the low-temperature panel can effectively ensure low and constant temperature under the conditions of different cold load profiles, different environmental temperatures and different positions of the profile joint on the cold supply plane. Therefore, the section heat-insulating property demonstration equipment realizes the low temperature and constant temperature of the low-temperature plate 1 by adopting a partition cold quantity regulation and cold quantity balance control mode.
The second temperature sensor 3 is arranged corresponding to the semiconductor refrigeration unit 2 on the basis of the distance proximity principle, the semiconductor refrigeration unit 2 corresponds to the second temperature sensor 3 with the closest distance, and the semiconductor refrigeration unit 2 alternatively corresponds to the second temperature sensor 3. In the actual arrangement, it is preferable that the second temperature sensors 3 are uniformly arranged on the cooling plane of the cryopanel 1. When M > N, there is one second temperature sensor 3 corresponding to the plurality of semiconductor refrigeration units 2.
The second temperature sensor 3 and the semiconductor refrigeration unit 2 are preferably arranged in the following manner: and M is equal to N, the second temperature sensors 3 correspond to the semiconductor refrigeration units 2 one by one, and the second temperature sensors 3 are just opposite to the centers of the cold end surfaces of the corresponding semiconductor refrigeration units 2.
In order to better achieve the low-temperature constant of the cryopanel 1, the arrangement between the semiconductor refrigeration unit 2 and the cryopanel 1 generally adopts the following two preferred schemes.
The first preferred scheme is that the sum of the areas of the cold end faces of the plurality of semiconductor refrigeration units 2 is equal to the cooled plane of the cryopanel 1, the cold end faces of the plurality of semiconductor refrigeration units 2 are coveringly jointed with the cooled plane of the cryopanel 1, the plurality of semiconductor refrigeration units 2 are not all the same, and for example, the cold end faces and the refrigerating capacity can be different.
The second preferred scheme is that the sum of the areas of the cold end faces of the plurality of semiconductor refrigeration units 2 is equal to the cooled plane of the low-temperature plate 1, the plurality of semiconductor refrigeration units 2 are elements with the same structure, and the cold end faces of the plurality of semiconductor refrigeration units 2 are uniformly jointed with the cooled plane of the low-temperature plate 1.
The third preferred scheme is that the sum of the areas of the cold end surfaces of the plurality of semiconductor refrigeration units 2 is smaller than the cooled plane of the low-temperature plate 1, the plurality of semiconductor refrigeration units 2 are elements with the same structure, and the cold end surfaces of the plurality of semiconductor refrigeration units 2 are uniformly arranged and jointed with the cooled plane of the low-temperature plate 1.
The cryopanel 1 is a metal plate having a thickness H. The heat conduction along the planar extension of the metal plate is defined as transverse heat conduction; heat conduction perpendicular to the planar extent of the metal sheet is defined as longitudinal heat conduction. The cryopanel 1 may be divided into two types based on the magnitude of the thermal resistance of the transverse heat conduction: the first type is a solid metal plate, such as an aluminum plate and a copper plate, and the transverse conduction thermal resistance of the solid metal plate is relatively large; the second type is a metal plate with a built-in phase-change heat pipe, and the transverse conduction thermal resistance of the metal plate is relatively small.
The theory of the cold flow is specifically analyzed and described below for the cold test of the profile by applying the profile thermal insulation performance demonstration device to the profile.
Assuming that the demonstration apparatus engages n profiles (n ≧ 1), the total profile cooling load QLThe calculation formula is as follows:
wherein h isi、SLi、
TaThe heat exchange coefficient of the surface between the ith section and the environment, the surface area of the section (excluding the joint part with the low-temperature plate), the temperature of the section and the temperature of the environment are respectively.
For convenience of technical solution description, fig. 8 shows a basic structure diagram of the combination of the core section of the demonstration device, the cryopanel and the semiconductor refrigeration units TECs.
As shown in fig. 9, it is assumed that M semiconductor refrigeration units (U) are provided on the cooling surface of the cryopanel 1TEC-1、UTEC-2、……、UTEC-M) (physically, it can be considered that m refrigeration areas are simultaneously arranged on the cryopanel 1 and the m semiconductor refrigeration units 2 are in one-to-one correspondence), and the maximum refrigeration capacity of each refrigeration unit is respectively set to be Qc1,Qc2,……,QcmThe bonding areas with the cryopanel 1 are S1,S2,……,Sm(ii) a The total area of the cryopanel at the joint end with the section bar is SA。
First analysisThe constant temperature technology of the entity-like metal low-temperature plate under different section bar working conditions. The cooling surface setting temperature and the ambient temperature of the cryopanel 1 are respectively Tc、TaWhen the total output cold of the TECs of the semiconductor refrigeration units is larger than the total cold requirement of the section bar, the cold balance equation for keeping the low-temperature plate at a constant temperature (neglecting the heat leakage of the low-temperature plate at the non-section bar end) is as follows:
at this time, the cold flow density of each refrigeration unit is respectively
Under the working condition of loading of the low-temperature plate joint profile, the cold flow density changes along with the difference of the positions of the joint profiles and the size of the cold load of the profiles and along with the parameter mj、Qcj、Sj(j ═ 1,2, …, m) and the cold flow density of each semiconductor refrigeration unit was varied
And the cold flows of the m paths of cold flows with different cold flow densities are conducted to the low-temperature plate, and then are adjusted and balanced through the cold flow density of the low-temperature plate, so that the cold flow balance of the section bar load end is automatically realized, and the constant temperature of the low-temperature plate is finally met.
M in formula ③j(j-1, 2, …, m) is a refrigerating capacity weighting coefficient (m) of each semiconductor refrigerating unitjLess than or equal to 1) which represents the cold quantity distribution coefficient of each semiconductor refrigeration unit after cold flow regulation and balance of the low-temperature plate; sp-i(i ═ 1,2, …, n) is the bonding area of each profile to the cryopanel; h isp-aThe second term on the right of the expression ③ represents the heat exchange amount between the non-profile joint part of the cryopanel and the environment for the surface heat exchange coefficient between the non-profile joint part (exposed part) of the profiled end cryopanel and the environment, and the expression ③ shows that the total cooling load of the demonstration device comprises two parts, namely the profiled part and the non-profile part, the property of insulating heat from the profiled part and the environment temperatureDegree, etc.
Because the first-class solid metal low-temperature plate has transverse conduction thermal resistance, the cold m generated by each semiconductor refrigeration unitjQcjAnd (j ═ 1,2, …, m) is composed of two parts of longitudinal conduction cold energy and transverse conduction cold energy. The cold energy transmitted longitudinally mainly meets the cold energy consumed by joining the section bar or the exchange cold energy of the low-temperature plate and the environmental temperature when the section bar is not joined; the transverse cold conduction is the dynamic cold conduction carried out in the temperature equalizing process of the low-temperature plate when the temperature difference exists in each refrigeration area of the low-temperature plate. As shown in FIG. 10, suppose that the average temperature of the jth refrigeration area is higher than that of the (j + 1) th refrigeration area, namely Tj＞Tj+1And the cooling capacity transversely transmitted to the j +1 th refrigerating area by the j th refrigerating area is as follows: kAj,j+1(Tj-Tj+1) Wherein k, Aj,j+1The heat transfer coefficient of the cryopanel and the sectional areas between the jth refrigeration area and the j +1 th refrigeration area (as shown in fig. 10) are respectively, and similarly, the heat conduction exists between the jth refrigeration area and the adjacent area as long as the temperature difference exists. Certainly, as the temperature difference of each refrigerating area is gradually reduced, the transverse cold conduction part between the refrigerating areas is also gradually reduced. Therefore, the refrigerating capacity m of the jth refrigerating areajQcjSatisfies the following conditions:
mjQcj＝Q'Lj+Qj-a+∑kAjΔTjwherein, Q'LjThe section bar cold quantity born by the jth semiconductor refrigeration unit corresponding to the section bar end low-temperature plate is provided; qj-aThe heat exchange quantity between the corresponding low-temperature plate part and the environment of the jth semiconductor refrigeration unit is calculated; sigma kAjΔTjThe sum of the transverse conduction cold quantity between the jth refrigerating area and the peripheral different refrigerating areas is obtained. Q'Lj、Qj-a、∑kAjΔTjThree parameters are not simultaneously existed, and are related to the magnitude of section cold energy load, section joint position and the like, if the section is jointed with the corresponding area of the jth semiconductor refrigeration unit, the cold energy generated by the jth semiconductor refrigeration unit is mainly conducted in the longitudinal direction, namely Q'LjFor dominant heat exchange Q with the environmentj-aThe cold flow generated by the jth semiconductor refrigeration unit mainly meets the cold flow of the section bar cold load and the transverse conduction cold quantity sigma kAjΔTjThe occupancy is also relatively small.
Further analysis is carried out below by taking a profile and joining it centrally to the jth refrigeration unit as an example. The joint structure of one section and the low-temperature cold plate is shown in figures 11-1 and 11-2, the cold flow distribution of the low-temperature cold plate is divided into two conditions, and the figure 11-1 shows that the maximum cold flow density of the jth refrigeration unit is less than or equal to the cold flow density of the section end (namely, the maximum cold flow density of the jth refrigeration unit is less than or equal to the cold flow density of the section end (
) Working condition, namely cold flow state inside the low-temperature plate; FIG. 11-2 shows the maximum cold flow density of the jth refrigeration unit>End cold flow Density of profiles (i.e.
) Working condition, cold flow state in the low-temperature cold plate; corresponds to FIG. 11-1
Under the working condition, the cold flow dynamic balance equation for keeping the low-temperature cold plate at a constant temperature is as follows:
under the working condition, the cold quantity weighting coefficient m j1, extending by taking the jth semiconductor refrigeration unit corresponding to the section bar joint as a center, wherein other weighting coefficients meet the following conditions: 1 is more than or equal to mj+1≥mj+2≥…≥mmAnd 1 is not less than mj-1≥mj-2≥…≥m1The farther the release material is joined to the corresponding position (jth semiconductor refrigeration unit), the more (smaller) the weighting coefficient is decreased.
Corresponds to FIG. 11-2
Under the working condition, the cold flow dynamic balance equation for keeping the low-temperature plate at a constant temperature is as follows:
under the working condition, the cold quantity weighting coefficient mjAnd maximally, extending by taking the jth semiconductor refrigeration unit corresponding to the profile joint as a center, wherein other weighting coefficients meet the following conditions: 1 is more than or equal to mj+1≥mj+2≥…≥mmAnd 1 is not less than mj-1≥mj-2≥…≥m1The farther the release material is joined to the corresponding position (jth semiconductor refrigeration unit), the more (smaller) the weighting coefficient is decreased.
When the low-temperature plate is a metal plate with a built-in phase-change heat pipe in the second type, the cold flow dynamic balance equation when the constant temperature of the low-temperature plate reaches the set temperature is as follows because the transverse conduction thermal resistance of the low-temperature plate is ignored:
and is
For the condition of the formula ⑥, no matter the section bar is jointed at any position of the low-temperature plate, the total cold load is weighted and distributed to each semiconductor refrigeration unit due to the extremely high temperature-equalizing characteristic (the transverse heat conduction coefficient is large enough) of the low-temperature plate, and the weighting coefficients of each semiconductor refrigeration unit are not different.
The above theory is also applicable to the analysis of the working condition of the joint multiple profiles.
The section bar heat-insulating property demonstration equipment is usually used in a scene that the external cooling temperature is lower than-20 ℃, but the low temperature causes strong heat exchange, cold energy loss is easily caused, and the cold source temperature cannot meet the requirement easily. Therefore, the design of the low-temperature board 1 for self heat insulation and low-heat-conductivity connection with the semiconductor refrigeration unit 2, the hot-end heat exchanger 6 and the like is a key technical point of the scheme. First, referring to fig. 12 to 15, the semiconductor refrigeration device further includes a first low thermal conductivity joint member 11, a second low thermal conductivity joint member 12, a thermal insulation sleeve pad 141, and a bolt 14, which are all in a ring shape, a groove 121 and a plurality of limiting reinforcing ribs 122 located in the groove 121 are disposed on a back surface of the first low thermal conductivity joint member 11, the low temperature plate 1 is disposed in the groove 121 and limited between the plurality of limiting reinforcing ribs 122, the plurality of limiting reinforcing ribs 122 play roles of increasing strength and limiting, the second low thermal conductivity joint member 12 and the first low thermal conductivity joint member 11 are fixedly connected and clamp the low temperature plate 1 through a bolt 15, a nut 16 is embedded in the second low thermal conductivity joint member 12, the bolt 14 passes through the hot end heat exchanger 6 to be connected with the nut, the thermal insulation sleeve pad 141 is sleeved on the bolt 14 and is located between the bolt 14 and the hot end heat exchanger 6, in order to increase the contact area, the bolt 14 is also sleeved with a washer 17. According to the scheme, the first low-heat-conductivity joint component 11 and the second low-heat-conductivity joint component 12 are assembled with the low-temperature plate 1, the semiconductor refrigerating unit 2 and the hot-end heat exchanger 6, so that the connection stability among the low-temperature plate 1, the semiconductor refrigerating unit 2 and the hot-end heat exchanger 6 is improved, meanwhile, by means of the low-heat-conductivity joint component, the heat insulation sleeve gasket 141 and the bolts 14, non-contact type mechanical connection between the hot-end heat exchanger 6 and the low-temperature plate 1 is achieved, thermal short circuit is avoided, and cold loss is reduced.
Further, the surface of the cryopanel 1, which is not bonded to the semiconductor refrigeration unit 2 and is not used for bonding to the profile, is provided with a heat insulating material. The main functions of the heat insulating material are to reduce the loss of cold energy of the low-temperature plate 1, reduce the consumption of cold energy outside the section bar and ensure that the cold energy is provided for the section bar to the maximum extent.
To the upperThe cryopanel 1 is a solid metal plate with a thickness H, and in some designs, the sum of the areas of the cold end surfaces of the plurality of semiconductor refrigeration units 2 is smaller than the cooled plane of the cryopanel 1, and in this case, the thickness H of the cryopanel 1 is moderate. The cold plate has a high thickness value, so that the longitudinal transmission of cold energy is influenced; the thickness value is small, the transverse conduction thermal resistance is large, and the transverse conduction of cold quantity is influenced, namely the gathering of the cold quantity produced by each semiconductor refrigeration unit 2 on the low-temperature plate 1 and the secondary distribution of the cold flow to the section bar are influenced. Therefore, the longitudinal and transverse transmission of the cold energy is required to be considered, the thickness of the low-temperature plate 1 needs to meet the temperature-equalizing performance requirement of the low-temperature plate 1, and the thickness corresponds to the temperature-equalizing performance of the low-temperature plate 1. When designed using the above-described third preferred embodiment, as shown in fig. 17, the thickness H of the cryopanel 1 satisfies the formula:
wherein QcjThe refrigerating capacity of the semiconductor refrigerating unit is obtained; k is the thermal conductivity of the cryopanel 1; l is the conduction length of the cold energy along the plane direction of the cryopanel 1; delta T' is the temperature gradient difference from the semiconductor refrigerating unit 2 to the boundary of the refrigerating area along the plane direction of the low-temperature plate 1; d is a sectional width of the cooling area of the cryopanel 1 perpendicular to the plane direction (sectional area is a sectional width D ﹡ sectional thickness).
In order to realize the automatic adjustment and control of the cold quantity and the cold flow density of each semiconductor refrigeration unit 2 in units and in regions according to the cold quantity balance equations ④, ⑤ and ⑥ to meet the constant temperature of the whole low-temperature board 1 after the cold load of the section bar is loaded, the power supply and control unit 300 of the section bar heat insulation performance demonstration device executes the following steps:
m temperature values T of the cryopanel 1 are acquired through M second temperature sensors 3i，i∈[1，M]；
According to M temperature values TiAdjusting the input voltage V of the respective semiconductor refrigeration unit 2 according to the respective predetermined temperature-voltage curvei；
As shown in fig. 18, the preset temperature-voltage curve corresponding to the ith temperature sensor is:
when T isi≤Tc-ΔT，Vi＝V0i-min；
When T isc-ΔT＜Ti＜Tc+ΔT，
When T isi≥Tc+ΔT，Vi＝V0i-max；+ΔT
V0i-min、V0i-maxThe maximum and minimum input voltage values of the semiconductor refrigeration unit 2 corresponding to the ith temperature sensor respectively correspond to the maximum and minimum refrigerating capacity of the semiconductor refrigeration unit 2; t iscThe temperature is set, namely the refrigeration temperature externally provided by the cold source; the temperature error value determines the control accuracy of the cold source temperature, the smaller the value of the delta T, the longer the adjustment period required for reaching the constant temperature, the more the adjustment time, and the control accuracy and the constant temperature time are both considered, and the delta T is usually 1 ℃.
The control method is that the power supply and control unit 300 detects the temperature T according to the temperature value detected by the second temperature sensor 3iTo adjust the input voltage V of the respective semiconductor refrigeration unit 2iThe working current of the semiconductor refrigerator is changed, and the cold quantity and the cold flow density of each semiconductor refrigeration unit 2 are automatically adjusted and controlled in a unit and a region mode according to the cold quantity balance equations ③, ④, ⑤ and ⑥ so as to meet the constant temperature of the whole low-temperature plate 1 after the section cold load is loaded.
Input voltage V of semiconductor refrigeration unit 2iIs provided by the power and control unit 300. In some embodiments, the power and control unit 300 uses Pulse Width Modulation (PWM) to adjust the input voltage V of the semiconductor refrigeration unit 2i。
The section heat insulation performance demonstration device further comprises a third temperature sensor electrically connected with the power supply and control unit 300, and the third temperature sensor is used for detecting the ambient temperature of the environment where the device is located; the display unit 500 is used for displaying the detection values of the first temperature sensor 200 and the third temperature sensor and the cooling temperature value of the equipment. The third temperature sensor is arranged on the shell and exposed in the air. Above-mentioned section bar heat-proof quality demonstration equipment in use, the temperature value of cooling through the display device (the operating condition of simulation section bar promptly), ambient temperature and section bar for the user more directly knows the heat-proof quality of section bar. The cooling temperature value is set by the user in the setting range provided by the profile heat insulation performance demonstration device or in the default setting range provided by the device. The section heat-insulating performance demonstration equipment enables the temperature of a cooling plane to be kept at a cooling temperature value to work by controlling the operation of the semiconductor refrigerating device.
With reference to fig. 1, in some embodiments, the profile thermal insulation performance demonstration apparatus further comprises a water receiving box 600; the water receiving box 600 is retractably installed in the housing 100 and is located below the cooling plane. This solution facilitates the collection of moisture, since the profile will generate moisture on the profile during cooling. Moreover, the water receiving box 600 is arranged in an extending mode, so that the water receiving box 600 can be contained in the shell 100 when the device is not used, and the device is convenient to carry and place.
Referring to fig. 1, in some embodiments, the front panel of the housing 100 is provided with a fan-shaped diversion inclined plane 104 and a diversion trench 105, the fan-shaped diversion inclined plane 104 is located below the cooling plane to collect water and collect the water to the diversion trench 105, and the diversion trench 105 is used for guiding the water to flow to the water-receiving box 600.
With reference to fig. 19, in some embodiments, the apparatus for visually demonstrating the heat insulating performance of the profile further includes a connection screw 18, the cryopanel 1 is provided with a threaded hole 131, and the connection screw 18 is disposed in cooperation with the threaded hole 131 for fixing the profile to the cryopanel 1.
The utility model also provides a detection method is compared to the section bar heat-proof quality of using above-mentioned section bar heat-proof quality demonstration equipment directly perceived, including following step:
s1, joining different to-be-measured sectional materials to a cooling plane of the semiconductor refrigerating device;
s2, as shown in fig. 19, the openings at the two ends of the section bar to be tested are sealed by the low thermal conductive material member 19;
s3, jointing the first temperature sensor 200 to the section bar to be measured;
s4, the power and control unit 300 receives the detected value of the first temperature sensor 200 and compares the detected value with the detected value in real time through the display unit 500.
According to the section heat insulation performance comparison and detection method, different sections to be detected are connected to the cooling plane of the semiconductor refrigerating device for cooling test, the temperature of the sections to be detected is displayed through the display unit 500, and the comparison and detection are visual; because the section bar is hollow, the air flow can influence the objectivity of comparison detection of the section bar, and the two ends of the section bar are sealed when the section bar is in actual use, therefore, the openings at the two ends of the section bar to be detected are blocked by utilizing the low-heat-conductivity material component, the actual use working condition of the section bar is simulated, the cold loss caused by invalid air flow in the section bar is greatly reduced, the comparison detection of the section bar is more objective, meanwhile, the cold load of the semiconductor refrigerating device is reduced, the constant temperature of the cooling surface of the semiconductor refrigerating device is favorably kept, and the heat insulation effect of the comparison detection of different section bars is more accurate. Therefore, the utility model provides an above-mentioned section bar heat-proof quality compares detection method can show the heat-proof quality of different section bars directly perceived effectively, comparatively objectively good and bad.
In the above embodiment, steps S1-S4 are performed sequentially, and are only one specific example of the detection method for comparing the heat insulation performance of the profile. In practical applications, the steps S1-S3 can be adjusted in any order.
In one embodiment, the first temperature sensor 200 is attached to the end surface of the profile to be measured that is remote from the cooling plane. The scheme can more objectively show the heat insulation performance of the section bar.
In the present invention, unless otherwise expressly stated or limited, the terms "connected" and "disposed" are to be construed broadly, e.g., as meaning a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the description of the present invention, it is to be understood that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are merely for convenience of description of the present invention and simplification of description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The technical solutions in the above embodiments can be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or can not be realized, the combination of the technical solutions should not be considered to exist, and the protection scope of the present invention is not further claimed.
It should be noted that, based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without any creative work belong to the protection scope of the present invention.
Claims (10)
1. The profile heat insulation performance demonstration equipment is characterized by comprising a shell, a plurality of first temperature sensors, a power supply and control unit, a semiconductor refrigerating device and a display unit, wherein the power supply and control unit, the semiconductor refrigerating device and the display unit are arranged in the shell; the semiconductor refrigerating device is provided with a refrigerating plane exposed out of the front surface of the shell so as to carry out contact type refrigerating on the section; the power supply and control unit is electrically connected with the semiconductor refrigerating device, the display operation circuit and the plurality of first temperature sensors, and the first temperature sensors are used for detecting the temperature of the section bar.
2. The profile thermal insulation performance demonstration apparatus according to claim 1 wherein said semiconductor refrigeration means comprises a cold plate, a semiconductor refrigeration unit and a heat dissipation module; the low-temperature plate is provided with a cooling plane and a cooling plane which are arranged oppositely; the semiconductor refrigeration unit is electrically connected with the power supply and control unit, the semiconductor refrigeration unit is provided with a cold end surface and a hot end surface, and the cold end surface is jointed with the cooled plane of the low-temperature plate; the heat dissipation module is attached to the hot end face of the semiconductor refrigeration unit.
3. The profile heat insulation performance demonstration device according to claim 2, wherein the heat dissipation module comprises a circulation pipeline, a liquid working medium arranged in the circulation pipeline, and a hot end heat exchange body, a heat exchanger, a water pump and a liquid storage tank which are arranged on the circulation pipeline; the hot end heat exchanger is attached to the hot end surface of the semiconductor refrigeration unit; the water pump is electrically connected with the power supply and the control unit.
4. The profile thermal insulation performance demonstration apparatus according to claim 3 wherein said heat dissipation module further comprises two fans and two air deflectors; the back of the shell is provided with a heat dissipation air inlet, and two side surfaces of the shell are provided with heat dissipation air outlets; the heat exchanger is arranged at the heat dissipation air inlet, the two fans are arranged on the heat exchanger to suck air from the heat dissipation air inlet, and the air deflector is arranged between the fans and the heat dissipation air outlet to guide the air sucked from the heat dissipation air inlet to be discharged from the heat dissipation air outlet.
5. The profile thermal insulation performance demonstration apparatus according to claim 3 wherein said housing is provided with a viewing through hole opposite said water pump.
6. The profile heat insulation performance demonstration device according to claim 3, wherein the hot end heat exchange body comprises a heat exchange main body, a first sealing ring and a heat exchange plate, the heat exchange main body is provided with a circuitous flow passage communicated with the circulation pipeline, the heat exchange plate is covered on the heat exchange main body, the inner side surface of the heat exchange plate is provided with heat exchange reinforcing ribs extending into the circuitous flow passage, and the sealing ring is arranged between the heat exchange plate and the heat exchange main body.
7. The profile thermal insulation performance demonstration apparatus according to claim 2 wherein the number of said semiconductor refrigeration units is N, N being an integer greater than 1; the semiconductor refrigerating device also comprises M second temperature sensors electrically connected with the power supply and the control unit, wherein M is an integer less than or equal to N; the second temperature sensor is arranged on a cooling plane of the low-temperature plate; the second temperature sensor corresponds to at least one semiconductor refrigeration unit; the power supply and control unit is provided with N voltage output ends, the voltage output ends are connected with the semiconductor refrigeration units in a one-to-one correspondence mode, the correspondingly connected voltage output ends and the semiconductor refrigeration units correspond to the same second temperature sensor, and the power supply and control unit adjusts the output value of the corresponding voltage output ends according to the detection value of the second temperature sensor.
8. The profile thermal insulation performance demonstration apparatus according to claim 1, further comprising a third temperature sensor electrically connected to said power supply and control unit, said third temperature sensor being adapted to detect an ambient temperature; the display unit is used for displaying the detection values of the first temperature sensor and the second temperature sensor.
9. The profile thermal insulation performance demonstration apparatus according to any one of claims 1 to 7 further comprising a water receiving box; the water receiving box is arranged on the shell in a foldable mode and is located below the cooling plane.
10. The profile thermal insulation performance demonstration device according to claim 9, wherein the front surface of the housing is provided with a fan-shaped guide slope and a guide groove, the fan-shaped guide slope is positioned below the cold supply plane to collect water and collect the water to the guide groove, and the guide groove is used for guiding the water to flow to the water receiving box.
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| CN109813750A (en) * | 2019-01-08 | 2019-05-28 | 佛山市京木测控科技有限公司 | Profile heat-proof quality demonstration equipment and profile heat-proof quality Determination method |
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| CN109813750A (en) * | 2019-01-08 | 2019-05-28 | 佛山市京木测控科技有限公司 | Profile heat-proof quality demonstration equipment and profile heat-proof quality Determination method |
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