CN210215522U - Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material - Google Patents
Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material Download PDFInfo
- Publication number
- CN210215522U CN210215522U CN201920924105.4U CN201920924105U CN210215522U CN 210215522 U CN210215522 U CN 210215522U CN 201920924105 U CN201920924105 U CN 201920924105U CN 210215522 U CN210215522 U CN 210215522U
- Authority
- CN
- China
- Prior art keywords
- workpiece
- magnetic material
- fixing frame
- workpiece fixing
- terbium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model relates to a device for evaporating terbium or dysprosium plated on the surface of a magnetic material, which comprises a vacuum chamber, a workpiece fixing frame positioned in the vacuum chamber, a magnetic material workpiece arranged on the workpiece fixing frame, an electron beam evaporation source positioned in the vacuum chamber and an ion source; the spraying direction of the ion source faces to the magnetic material workpiece, the spraying direction of the electron beam evaporation source faces to the magnetic material workpiece, the electron beam evaporation source and the magnetic material workpiece relatively move or rotate, and the ion source and the magnetic material workpiece relatively move or rotate. The device adopts an electron beam evaporation source for evaporation coating, so that terbium or dysprosium raw materials are bombarded by electron beams in a vacuum environment to generate heat energy to be melted and volatilized and deposit a film on the surface of a magnetic material workpiece.
Description
Technical Field
The utility model relates to a technical field of terbium or dysprosium is plated on the magnetic material surface, especially relates to the equipment of terbium or dysprosium is plated in the evaporation of magnetic material surface.
Background
The prior mature high-performance magnetic material manufacturing process is realized by doping dysprosium or terbium and then sintering, the cost of the prior terbium and dysprosium plating rare metal is high, and the doping sintering method consumes more rare earth metal and has high cost. A new technology for making the magnetic material features that the rare-earth metal film is deposited on the surface of sintered magnetic material and then diffused. At present, the method for depositing the rare earth film on the surface of the magnetic material is realized by adopting a coating method, but the product prepared by the coating process is unstable and has the problems of environmental pollution and the like.
SUMMERY OF THE UTILITY MODEL
To the technical problem who exists among the prior art, the utility model aims at: the device for evaporating and plating terbium or dysprosium on the surface of the magnetic material is provided, an electron beam evaporation source is adopted for evaporation and film plating, terbium or dysprosium raw materials are bombarded by electron beams in a vacuum environment to generate heat energy to be melted and volatilized, and a film is deposited on the surface of a magnetic material workpiece.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the device for evaporating and plating terbium or dysprosium on the surface of a magnetic material comprises a vacuum chamber, a workpiece fixing frame positioned in the vacuum chamber, a magnetic material workpiece arranged on the workpiece fixing frame, an electron beam evaporation source positioned in the vacuum chamber and an ion source; the spraying direction of the ion source faces to the magnetic material workpiece, the spraying direction of the electron beam evaporation source faces to the magnetic material workpiece, the electron beam evaporation source and the magnetic material workpiece relatively move or rotate, and the ion source and the magnetic material workpiece relatively move or rotate.
Further, the method comprises the following steps: the equipment also comprises a rotary driving system positioned outside the vacuum chamber, and the output end of the rotary driving system is connected to the workpiece fixing frame.
Further, the method comprises the following steps: the workpiece fixing frame has magnetism, and the magnetic material workpiece is fixed on the workpiece fixing frame by utilizing the magnetism;
or the magnetic material workpiece is fixed on the workpiece fixing frame through the spring clamp. The magnetic material workpiece is attracted by the magnet, so that the surface of the magnetic material workpiece is coated without shielding, and the product quality is improved. And fast loading and unloading can be realized, and the production efficiency is improved.
Further, the method comprises the following steps: the workpiece fixing frame is provided with a flat plate surface, the magnetic material workpiece is in a plate shape and is fixed on the flat plate surface of the workpiece fixing frame, and the ion source and the electron beam evaporation source are positioned below the magnetic material workpiece.
Further, the method comprises the following steps: the workpiece fixing frame comprises a connecting plate which is rotatably arranged, a plurality of connecting discs which are arranged at the end parts of the connecting plate, and a plurality of workpiece discs which are respectively rotatably arranged at the end parts of the connecting discs; the workpiece disc is flat or pot-shaped, and the magnetic workpiece is fixed on the workpiece disc; the ion source and the electron beam evaporation source are located below the magnetic material workpiece.
Further, the method comprises the following steps: the vacuum chamber, the workpiece fixing frame and the magnetic material workpiece are all spherical, the magnetic material workpiece is fixed on the inner surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located inside the magnetic material workpiece.
Further, the method comprises the following steps: the workpiece fixing frame and the magnetic material workpiece are both cylindrical, the magnetic material workpiece is fixed on the inner surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located inside the magnetic material workpiece.
Further, the method comprises the following steps: the apparatus also includes a quartz crystal thickness gauge for monitoring the thickness of the film.
Further, the method comprises the following steps: the thickness gauge is a quartz crystal thickness gauge. The thickness of the film layer is monitored by the quartz crystal thickness gauge, so that the thickness of the film coating film layer can be monitored in real time, the process stability and the repeatability of the product are improved, and the cost performance of the product is greatly improved.
Further, the method comprises the following steps: the ion source is a Hall source, a Kaufman source and a radio frequency source.
Further, the method comprises the following steps: the workpiece fixing frame and the magnetic material workpiece are both spherical, the magnetic material workpiece is fixed on the outer surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located outside the magnetic material workpiece.
Further, the method comprises the following steps: the vacuum chamber is internally provided with a support, the workpiece fixing frame and the magnetic material workpiece are both multiple and spherical, the magnetic material workpiece is fixed on the outer surface of the workpiece fixing frame, the multiple workpiece fixing frames are uniformly distributed along the circumferential direction, each workpiece fixing frame is installed in a rotating mode, all the workpiece fixing frames are installed on the support, the support is installed in a rotating mode, and the ion source and the electron beam evaporation source are located outside the magnetic material workpiece.
In general, the utility model has the advantages as follows:
an electron beam evaporation source is adopted for evaporation coating, so that terbium or dysprosium raw materials are bombarded by electron beams in a vacuum environment to generate heat energy to be melted and volatilized and deposit a film on the surface of a magnetic material workpiece, an ion source assists in coating the film to spray out argon ions, terbium and dysprosium gaseous molecules are deposited on the surface of the workpiece, and the deposited molecules are reinforced by argon ion bombardment, so that the film has better density and firmness. In the evaporation coating process, the compactness and firmness of the film layer are greatly improved by an ion source-assisted deposition mode, so that the product quality is improved. The electron beam evaporation source is adopted for evaporation coating, and a small amount of raw materials can also realize the coating of terbium and dysprosium films in a vacuum coating mode. The magnetic material workpiece is attracted by the magnet, so that the surface of the magnetic material workpiece is coated without shielding, and the product quality is improved. And fast loading and unloading can be realized, and the production efficiency is improved. The thickness of the film layer is monitored by the quartz crystal thickness gauge, so that the thickness of the film coating film layer can be monitored in real time, the process stability and the repeatability of the product are improved, and the cost performance of the product is greatly improved. The utility model is suitable for a plate terbium or plate dysprosium on the magnetic material surface. The product can be used as a high-performance magnetic material in the fields of automobiles, industrial motors, wind power generation, energy-saving elevators, variable frequency air conditioners, consumer electronics and the like.
Drawings
Fig. 1 is a schematic structural view of a first form of the present apparatus.
Fig. 2 is a schematic structural diagram of a second form of the apparatus.
Fig. 3 is a schematic diagram of the third form of the apparatus.
Fig. 4 is a schematic diagram of the fourth form of the apparatus.
Fig. 5 is a schematic diagram of the fifth form of the apparatus.
Fig. 6 is a schematic structural diagram of a sixth form of the present apparatus.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
To facilitate a uniform view of the various reference numbers within the drawings, reference numbers appearing in the drawings are now described collectively as follows:
the device comprises a vacuum chamber 1, a rotary driving system 2, a workpiece fixing frame 3, a magnetic material workpiece 4, terbium and dysprosium gas molecules 5, argon ions 6, an electron beam evaporation source 7, an ion source 8, a connecting plate 9, a connecting disc 10, a workpiece disc 11 and a rotating shaft 12.
With reference to fig. 1-6, an apparatus for evaporating terbium or dysprosium onto a surface of a magnetic material includes a vacuum chamber, a workpiece holder located in the vacuum chamber, a magnetic material workpiece mounted on the workpiece holder, an electron beam evaporation source located in the vacuum chamber, and an ion source. The equipment also comprises a conventional vacuum-pumping system, an electrical control system and the like, and the content of the vacuum-pumping system and the electrical control system is not described in the utility model. The magnetism material work piece is fixed on the work piece mount through various modes, and the injection direction of ion source is towards the magnetism material work piece, and the injection direction of electron beam evaporation source is towards the magnetism material work piece, electron beam evaporation source and magnetism material work piece relative movement or rotation, ion source and magnetism material work piece relative movement or rotation, the utility model discloses in, electron beam evaporation source and ion source are fixed motionless, and the work piece mount rotates or removes to drive magnetism material work piece and rotate or remove.
The equipment also comprises a rotary driving system positioned outside the vacuum chamber, the rotary driving system is in the prior art, and the output end of the rotary driving system is connected to the workpiece fixing frame. The rotary driving system is arranged outside the vacuum chamber and drives the workpiece fixing frame to rotate, and the workpiece fixing frame further drives the magnetic material workpiece to rotate. The vacuum chamber structure is not limited to vertical or horizontal type, and the rotation driving system is not limited to the top of the vertical vacuum chamber, the side wall of the vertical vacuum chamber, the center of the horizontal vacuum chamber, the eccentricity of the horizontal vacuum chamber, and the like.
The workpiece fixing frame has magnetism, and the magnetic material workpiece is fixed on the workpiece fixing frame by utilizing the magnetism. The magnetic material workpiece is attracted by the magnet, so that the surface of the magnetic material workpiece is coated without shielding, and the product quality is improved. And fast loading and unloading can be realized, and the production efficiency is improved. Or the magnetic material workpiece is also fixed on the workpiece fixing frame through the spring clamp.
The shapes and the installation modes of the workpiece fixing frame and the magnetic material workpiece are various, and six cases are listed as follows for explanation:
the first method is as follows: referring to fig. 1, the workpiece holder has a flat plate surface, the lower surface of the workpiece holder is a flat surface, the magnetic material workpiece is in a plate shape, the magnetic material workpiece is in a flat plate shape, the magnetic material workpiece is fixed on the flat plate surface of the workpiece holder, and the ion source and the electron beam evaporation source are located below the magnetic material workpiece.
The second method is as follows: referring to fig. 2, the workpiece holder includes a rotatably mounted connecting plate, a plurality of connecting plates mounted at ends of the connecting plate, the plurality of connecting plates being uniformly distributed along a circumferential direction, only two of which are shown in fig. 2, a plurality of workpiece disks rotatably mounted at ends of the plurality of connecting plates, one workpiece disk rotatably mounted at an end of one workpiece disk, and the workpiece disks rotatably mounted via a rotating shaft. The workpiece disc is in a flat plate shape or a pot shape, and each connecting disc is fixed at the end part of the connecting plate; each workpiece disk is rotatably mounted on the end of each connecting disk. The magnetic material workpiece is fixed on the workpiece disc. The ion source and the electron beam evaporation source are located below the magnetic material workpiece. The magnetic material workpiece is fixed on a workpiece disc by utilizing magnetism or a spring clamp, and the workpiece disc has magnetism.
The third is: referring to fig. 3, the vacuum chamber, the workpiece holder, and the magnetic workpiece are all spherical, the magnetic workpiece is fixed on the inner surface of the workpiece holder, the workpiece holder is rotatably mounted, the workpiece holder can rotate in any direction of 360 °, the rotary driving system drives the workpiece holder to rotate, the rotary driving system is not shown in fig. 3, and the ion source and the electron beam evaporation source are located inside the magnetic workpiece.
The fourth method is: referring to fig. 4, the workpiece holder and the magnetic material workpiece are both cylindrical, the magnetic material workpiece is fixed on the inner surface of the workpiece holder, the workpiece holder is rotatably mounted along the central axis, the rotary driving system drives the workpiece holder to rotate, and the ion source and the electron beam evaporation source are located inside the magnetic material workpiece.
The fifth method is as follows: referring to fig. 5, the workpiece holder and the magnetic material workpiece are both spherical, the magnetic material workpiece is fixed on the outer surface of the workpiece holder, the workpiece holder is rotatably mounted, the workpiece holder can rotate in any direction of 360 degrees, the rotary driving system drives the workpiece holder to rotate, the rotary driving system is not shown in fig. 5, and the ion source and the electron beam evaporation source are located outside the magnetic material workpiece.
The sixth method is as follows: referring to fig. 6, a support is provided in the vacuum chamber, the support is not shown in fig. 6, the workpiece fixing frames and the magnetic material workpieces are all provided with a plurality of spherical shapes, the number of the workpiece fixing frames is the same as that of the magnetic material workpieces, one magnetic material workpiece is fixed on the outer surface of one workpiece fixing frame, the workpiece fixing frames are uniformly distributed along the circumferential direction, the magnetic material workpieces are also uniformly distributed along the circumferential direction, each workpiece fixing frame is rotatably mounted, that is, each workpiece fixing frame can rotate, all the workpiece fixing frames are mounted on the support in a rotating manner, that is, the support can rotate, so that all the workpiece fixing frames are driven to rotate integrally, and the ion source and the electron beam evaporation source are located outside the magnetic material workpieces.
The shape and structure of the workpiece fixing frame can be in other forms, and the rotation mode is single-disc revolution or multi-disc revolution and rotation and other forms. The electron beam evaporation source is not limited to a central or eccentric position.
The apparatus further comprises a thickness gauge for monitoring the thickness of the film. The thickness gauge is a quartz crystal thickness gauge. The thickness of the film layer is monitored by the quartz crystal thickness gauge, so that the thickness of the film coating film layer can be monitored in real time, the process stability and the repeatability of the product are improved, and the cost performance of the product is greatly improved. The monitoring of the film by the thickness gauge is prior art.
The ion source is a Hall source, a Kaufman source, a radio frequency source and the like. The ion source is an auxiliary coating.
The utility model discloses a theory of operation: the method comprises the steps of evaporating a terbium or dysprosium raw material by an electron beam evaporation source, carrying out evaporation coating by adopting the electron beam evaporation source, realizing that the terbium or dysprosium raw material is bombarded by an electron beam in a vacuum environment to generate heat energy to be melted and volatilized and deposit a film on the surface of a magnetic material workpiece, spraying argon ions out by an ion source assisted coating film, depositing terbium and dysprosium gaseous molecules on the surface of the workpiece, and reinforcing the deposited molecules by argon ion bombardment, thereby obtaining better film density and firmness. In the evaporation coating process, the compactness and firmness of the film layer are greatly improved by an ion source-assisted deposition mode, so that the product quality is improved. The electron beam evaporation source is adopted for evaporation coating, and a small amount of raw materials can also realize the coating of terbium and dysprosium films in a vacuum coating mode.
The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.
Claims (10)
1. The device for evaporating and plating terbium or dysprosium on the surface of the magnetic material is characterized in that: the device comprises a vacuum chamber, a workpiece fixing frame positioned in the vacuum chamber, a magnetic material workpiece arranged on the workpiece fixing frame, an electron beam evaporation source and an ion source positioned in the vacuum chamber; the spraying direction of the ion source faces to the magnetic material workpiece, the spraying direction of the electron beam evaporation source faces to the magnetic material workpiece, the electron beam evaporation source and the magnetic material workpiece relatively move or rotate, and the ion source and the magnetic material workpiece relatively move or rotate.
2. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the equipment also comprises a rotary driving system positioned outside the vacuum chamber, and the output end of the rotary driving system is connected to the workpiece fixing frame.
3. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the workpiece fixing frame has magnetism, and the magnetic material workpiece is fixed on the workpiece fixing frame by utilizing the magnetism;
or the magnetic material workpiece is fixed on the workpiece fixing frame through the spring clamp.
4. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the workpiece fixing frame is provided with a flat plate surface, the magnetic material workpiece is in a plate shape and is fixed on the flat plate surface of the workpiece fixing frame, and the ion source and the electron beam evaporation source are positioned below the magnetic material workpiece.
5. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the workpiece fixing frame comprises a connecting plate which is rotatably arranged, a plurality of connecting discs which are arranged at the end parts of the connecting plate, and a plurality of workpiece discs which are respectively rotatably arranged at the end parts of the connecting discs; the workpiece disc is flat or pot-shaped, and the magnetic workpiece is fixed on the workpiece disc; the ion source and the electron beam evaporation source are located below the magnetic material workpiece.
6. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the vacuum chamber, the workpiece fixing frame and the magnetic material workpiece are all spherical, the magnetic material workpiece is fixed on the inner surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located inside the magnetic material workpiece.
7. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the workpiece fixing frame and the magnetic material workpiece are both cylindrical, the magnetic material workpiece is fixed on the inner surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located inside the magnetic material workpiece.
8. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the apparatus also includes a quartz crystal thickness gauge for monitoring the thickness of the film.
9. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the workpiece fixing frame and the magnetic material workpiece are both spherical, the magnetic material workpiece is fixed on the outer surface of the workpiece fixing frame, the workpiece fixing frame is rotatably installed, and the ion source and the electron beam evaporation source are located outside the magnetic material workpiece.
10. The apparatus for surface evaporation terbium or dysprosium plating of a magnetic material according to claim 1, wherein: the vacuum chamber is internally provided with a support, the workpiece fixing frame and the magnetic material workpiece are both multiple and spherical, the magnetic material workpiece is fixed on the outer surface of the workpiece fixing frame, the multiple workpiece fixing frames are uniformly distributed along the circumferential direction, each workpiece fixing frame is installed in a rotating mode, all the workpiece fixing frames are installed on the support, the support is installed in a rotating mode, and the ion source and the electron beam evaporation source are located outside the magnetic material workpiece.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920924105.4U CN210215522U (en) | 2019-06-19 | 2019-06-19 | Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920924105.4U CN210215522U (en) | 2019-06-19 | 2019-06-19 | Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210215522U true CN210215522U (en) | 2020-03-31 |
Family
ID=69932908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920924105.4U Active CN210215522U (en) | 2019-06-19 | 2019-06-19 | Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210215522U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110129739A (en) * | 2019-06-19 | 2019-08-16 | 广东腾胜科技创新有限公司 | The equipment that terbium or dysprosium are plated in magnetic material surface evaporation |
-
2019
- 2019-06-19 CN CN201920924105.4U patent/CN210215522U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110129739A (en) * | 2019-06-19 | 2019-08-16 | 广东腾胜科技创新有限公司 | The equipment that terbium or dysprosium are plated in magnetic material surface evaporation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100392147C (en) | Pair target twin magnetic controlled sputtering ion plating deposition device | |
| CN1743498A (en) | Rotary magnetic field planar target magnetic-controlled sputtering apparatus | |
| CN110055503B (en) | Magnetron sputtering coating system and method for preparing dysprosium/terbium coating | |
| CN209816265U (en) | Sputtering target base with adjustable target position | |
| CN210215522U (en) | Equipment for evaporating and plating terbium or dysprosium on surface of magnetic material | |
| CN101638774B (en) | Rotatable sample position of magnetron sputtering device | |
| CN101634012B (en) | Ion beam assisting magnetic control sputtering deposition method for surface protection | |
| CN110760808A (en) | Curved surface screen magnetron sputtering subassembly | |
| CN101376964B (en) | Sputtering type film coating apparatus and film coating method | |
| CN109338320B (en) | Process for magnetron sputtering coating on surface of plastic part | |
| JP4321785B2 (en) | Film forming apparatus and film forming method | |
| CN103820766A (en) | Magnetron coating apparatus for neodymium-iron-boron rare-earth permanent magnet devices, and manufacturing method thereof | |
| CN113817999B (en) | Vacuum coating equipment for preparing piezoelectric ceramics | |
| CN211734462U (en) | Curved surface screen magnetron sputtering subassembly | |
| CN101403101A (en) | Quick solid-ceramic coating ion plating apparatus | |
| CN110527966B (en) | Horizontal magnetron sputtering equipment for long pipe coating | |
| CN102064076B (en) | Eccentricity-variable magnetron | |
| CN101353778B (en) | Sputtering type film coating apparatus and film coating method | |
| CN110129739A (en) | The equipment that terbium or dysprosium are plated in magnetic material surface evaporation | |
| CN216192674U (en) | Two-stage overturning powder surface magnetron sputtering deposition coating device | |
| CN112210752A (en) | Magnetron sputtering technology for depositing DLC film and film coating machine | |
| CN108374156A (en) | A kind of rotary magnetic control sputtering device | |
| CN211311574U (en) | Rotating device for coating film on outer surface of hollow cylindrical plated part | |
| CN208378981U (en) | A kind of rotary magnetic control sputtering device | |
| CN211227319U (en) | Steel ball plasma coating clamp |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |