CN210112512U - HDI high density circuit board with good heat dissipation performance - Google Patents
HDI high density circuit board with good heat dissipation performance Download PDFInfo
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- CN210112512U CN210112512U CN201920335594.XU CN201920335594U CN210112512U CN 210112512 U CN210112512 U CN 210112512U CN 201920335594 U CN201920335594 U CN 201920335594U CN 210112512 U CN210112512 U CN 210112512U
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- air guide
- heat dissipation
- hdi
- guide pipes
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 39
- 230000001681 protective effect Effects 0.000 claims description 10
- 238000009423 ventilation Methods 0.000 claims description 8
- 238000003860 storage Methods 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 5
- 230000006698 induction Effects 0.000 claims description 2
- 230000006355 external stress Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
A HDI high-density circuit board with good heat dissipation performance belongs to the technical field of circuit boards and comprises a HDI board body and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a holding box and two air guide pipes which are fixed on one side surface of the holding box and are symmetrically arranged, the heat radiator is fixed in the accommodating box and communicated with the air guide pipes, sliding grooves which are arranged along the length direction of the air guide pipes and used for movably inserting the side edges of the HDI board body are respectively arranged on the opposite inner side walls between the air guide pipes, a clamping area is formed between the sliding grooves for the HDI board body, air exhaust holes which are uniformly distributed along the length direction of the air guide pipes are respectively arranged at the positions of two sides of the sliding grooves on the inner side walls of the air guide pipes, one ends of the air guide pipes extend into the accommodating box and are provided with openings, connecting pipes which are respectively communicated with one ends of the air guide pipes are arranged in the accommodating box, the heat radiator is fixed at one side position of the; the utility model has the advantages of compact structure, high heat dissipation efficiency.
Description
Technical Field
The utility model relates to a circuit board technical field, more specifically relates to a good heat dissipation's HDI high density circuit board.
Background
Technical personnel in this field all know, the HDI board is a high density interconnection circuit board, the HDI board is the new technology that the PCB board trade developed, the HDI board adopts laser beam drilling's technique than traditional PCB board, the diameter that makes the blind hole is more small and exquisite, it is compact, its circuit distribution is more accurate simultaneously, if adopt traditional reliance face passive heat dissipation when high load operation, then damage the circuit easily, for solving the heat dissipation problem of HDI board, need settle radiator fan at the two sides of HDI board or one of them side, but do the whole thickness that can greatly increased HDI board like this, make the HDI board structure compact enough, therefore, need propose effectual scheme, under the prerequisite of guaranteeing the thermal efficiency of loosing, further make the overall structure of HDI board compact, reasonable.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of above-mentioned prior art, the utility model provides a good heat dissipation's HDI high density circuit board for solve the problem that the structure that exists is compact enough among the prior art, radiating efficiency is low.
A HDI high-density circuit board with good heat dissipation performance comprises a HDI board body and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a containing box, two air guide pipes and a heat radiator, the two air guide pipes are fixed on one side face of the containing box and are symmetrically arranged, the heat radiator is fixed in the containing box and is communicated with the air guide pipes, sliding grooves which are arranged along the length direction of the air guide pipes and are used for the side edges of the HDI board body to movably insert are respectively arranged on opposite inner side walls between the air guide pipes, a clamping area is formed between the sliding grooves for the HDI board body, air exhaust holes which are uniformly distributed along the length direction of the air guide pipes are respectively arranged on the inner side walls of the air guide pipes on the two sides of the sliding grooves, one ends of the air guide pipes extend into the containing box and are provided with openings, connecting pipes which are respectively communicated with one ends of the, and an air inlet communicated with the air outlet of the radiator is formed in one side surface, close to the radiator, of the connecting pipe.
Optionally, the heat sink is a centrifugal fan.
Optionally, two ends of the connecting pipe, which are close to one side of the radiator, are respectively provided with a mounting hole into which the air guide pipe extends, and one end of the air guide pipe is hermetically connected with the side wall of the mounting hole.
Optionally, the heat dissipation box in connecting pipe one side position is equipped with the storage tank, the radiator inlays to establish and is fixed in the storage tank, the top surface of heat dissipation box in the storage tank rigidity has the apron, the apron is equipped with a plurality of mounting holes that supply the bolt to pass through along all around, be equipped with a plurality of bar ventilation holes on the apron, be fixed with the dust screen on the ventilation hole respectively, the induction port of radiator with the ventilation hole corresponds switches on.
Optionally, a first protective net is fixed right above the top surface of the HDI plate body, and the first protective net is erected and fixed on the top surfaces of the two air guide pipes;
and a second protective net is fixed under the bottom surface of the HDI plate body, and the second protective net is erected and fixed on the bottom surfaces of the two air guide pipes.
Optionally, a V-shaped guide plate is disposed in the connecting pipe at a position close to the middle of the air inlet.
The utility model has the advantages that:
the utility model provides a good heat dissipation's HDI high density circuit board is through reasonable compact overall arrangement design, arrange radiator and guide duct integration on being close same horizontal plane to reduce the whole thickness of circuit board, the air outlet of radiator and the connecting pipe and the guide duct intercommunication on the holding box, the wind that makes the radiator send out spouts in the hole of airing exhaust on guide duct inner wall through connecting pipe and guide duct, last the heat dissipation simultaneously to HDI board body two sides, whole radiating efficiency has been improved.
Drawings
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail with reference to the accompanying drawings, in which:
fig. 1 is a schematic overall structural diagram of an HDI high-density circuit board with good heat dissipation performance according to the present invention;
FIG. 2 is a schematic structural view of another angle of the HDI high-density circuit board with good heat dissipation performance provided by the present invention;
FIG. 3 is a schematic view of another angle of HDI high density circuit board with good heat dissipation.
In the figure:
101. a containing box; 102. a connecting pipe; 103. a cover plate; 104. a vent hole; 201. an air guide pipe; 202. an air exhaust hole; 203. a chute; 3. an HDI board body; 4. a heat sink; 5. a baffle.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
As shown in fig. 1-3, the utility model provides the following technical solutions:
a HDI high-density circuit board with good heat dissipation performance comprises an HDI board body 3 and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a containing box 101 and two air guide pipes 201 which are fixed on one side surface of the containing box 101 and are symmetrically arranged, and a radiator 4 fixed in the accommodating box 101 and communicated with the air duct 201, wherein opposite inner side walls between the air ducts 201 are respectively provided with a sliding chute 203 which is arranged along the length direction of the air duct 201 and is used for movably inserting the side edge of the HDI board body 3, a clamping area is formed between the sliding chutes 203 for the HDI board body 3, air exhaust holes 202 which are uniformly distributed along the length direction of the air duct 201 are respectively arranged at two sides of the sliding chute 203 on the inner side wall of the air duct 201, one end of the air duct 201 extends into the accommodating box 101 and is provided with an opening, a connecting pipe 102 which is respectively communicated with one end of the air duct 201 is arranged in the accommodating box 101, the radiator 4 is fixed at one side position of the connecting pipe 102, and one side surface of the connecting pipe 102 which.
In the above implementation, specifically, the HDI plate body 3 may be any type of HDI plate commonly found in the market, and in the production and processing process, the HDI plate body 3 is fixed on the chute 203 on the inner side wall of the air duct 201 in an inserting manner, so that the HDI plate body is convenient to mount and dismount, and if further reinforcement is needed, the contact position between the HDI plate body 3 and the chute 203 can be reinforced by using bolts, industrial glue and the like; the air guide pipe 201 and the radiator 4 are arranged on the same horizontal line, so that the whole thickness of the circuit board is reduced as much as possible, and the circuit board is more compact and more reasonable in layout; the air duct 201 and the connecting pipe 102 in the accommodating box 101 are in a connected and communicated state, and the air outlet of the radiator 4 is connected and communicated with the connecting pipe 102, so that air blown out from the radiator 4 can be sprayed out from the air exhaust hole 202 through the connecting pipe 102 and the air duct 201, the whole air exhaust hole 202 close to the top surface of the HDI board body 3 faces the top surface of the HDI board body 3, continuous heat dissipation can be carried out on the top surface of the HDI board body 3, the whole air exhaust hole 202 close to the bottom surface of the HDI board body 3 faces the bottom surface of the HDI board body 3, continuous heat dissipation can be carried out on the bottom surface of the HDI board body 3, therefore, two surfaces of the HDI board can be continuously passed through by heat dissipation airflow at the same; it should be noted that, the HDI board body 3 is generally a rectangular plate structure, so the two air ducts 201 can clamp the HDI board body 3 along the length direction of the HDI board body 3, and the distance between the air holes 202 on the inner side walls of the two air ducts 201 is minimized, so that the HDI board body 3 is easily covered with heat dissipation, and the heat dissipation efficiency is further improved.
Optionally, radiator 4 is centrifugal fan, and centrifugal fan can choose for use the miniature turbofan of MX common on the market, and centrifugal fan is at the during operation, and the blade promotes the air and flows in order to flow with pivot looks vertically direction, admits air along the axis direction, and give vent to anger then perpendicular to axis direction, is applied to the utility model discloses a scheme that describes, but the compactness of greatly increased structure, in a word, centrifugal fan has the flow direction, the characteristics of high wind pressure that change wind, can effectively drum the air current into in guide duct 201 and connecting pipe 102 to order about the air current and spout from first exhaust hole 202 and second exhaust hole 202.
Optionally, two ends of one side of the connecting pipe 102 close to the heat sink 4 are respectively provided with a mounting hole into which the air guide pipe 201 extends, and one end of the air guide pipe 201 is connected with the side wall of the mounting hole in a sealing manner.
Optionally, a receiving groove is formed in one side of the connecting pipe 102 of the heat dissipation box, the heat sink 4 is embedded and fixed in the receiving groove, a cover plate 103 is fixed to the top surface of the heat dissipation box at the position of the receiving groove, a plurality of mounting holes for bolts to pass through are formed in the peripheral edge of the cover plate 103, a plurality of strip-shaped vent holes 104 are formed in the cover plate 103, dust screens are respectively fixed to the vent holes 104, and an air suction port of the heat sink 4 is correspondingly communicated with the vent; specifically, the shape of the accommodating groove is as close as possible to the outer contour of the heat sink 4, so as to improve the efficiency of the use space in the accommodating box 101, and facilitate the installation and the disassembly of the heat sink 4; radiator 4 adopts centrifugal fan, therefore its income wind gap orientation upwards, adds apron 103 in storage tank department to fix radiator 4 better, set up ventilation hole 104 on apron 103, be favorable to the income wind gap of radiator 4 to induced draft, fix the dust screen in ventilation hole department, avoid the dust from getting into like the wind gap in order to improve radiator 4's life.
Optionally, a first protective net is fixed right above the top surface of the HDI board body 3, and the first protective net is erected and fixed on the top surfaces of the two air guide pipes 201; be fixed with the second protection network under HDI board body 3 bottom surfaces, the second protection network erects and is fixed in two guide duct 201 bottom surfaces, because the structure of HDI board is comparatively accurate, and anti dirt, anti external stress ability are relatively poor, therefore based on this design, first protection network and second protection network prevent external stress and dirt-proof effect to HDI board body 3's two sides respectively, are favorable to improving HDI board body 3's life.
Optionally, as shown in fig. 1, a V-shaped flow guide plate 5 is disposed in the connecting pipe 102 near the middle of the air inlet, and the flow guide plate 5 can effectively communicate the air flow generated by the air outlet of the heat sink 4, so as to prevent the air flow at the air outlet from forming a turbulent flow at the air inlet of the connecting pipe 102, and improve the air inlet efficiency.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention. The present invention is not to be limited by the specific embodiments disclosed herein, and other embodiments that fall within the scope of the claims of the present application are intended to be within the scope of the present invention.
Claims (6)
1. The utility model provides a good heat dissipation's HDI high density circuit board which characterized in that:
the HDI plate heat dissipation device comprises an HDI plate body (3) and a heat dissipation mechanism, wherein the heat dissipation mechanism comprises a containing box (101), two air guide pipes (201) which are fixed on one side surface of the containing box (101) and are symmetrically arranged, and a radiator (4) which is fixed in the containing box (101) and is communicated with the air guide pipes (201), sliding chutes (203) which are arranged along the length direction of the air guide pipes (201) and are used for movably inserting the side edges of the HDI plate body (3) are respectively arranged on opposite inner side walls between the air guide pipes (201), clamping areas are formed between the sliding chutes (203) for the HDI plate body (3), air exhaust holes (202) which are uniformly distributed along the length direction of the HDI plate body (201) are respectively arranged at the positions of the two sides of the sliding chutes (203) on the inner side walls of the air guide pipes (201), one end of each air guide pipe (201) extends into the containing box (, the accommodating box (101) is internally provided with a connecting pipe (102) which is respectively communicated with one end of the air guide pipe (201), the radiator (4) is fixed at one side of the connecting pipe (102), and one side surface of the connecting pipe (102) close to the radiator (4) is provided with an air inlet which is communicated with an air outlet of the radiator (4).
2. A HDI high density circuit board with good heat dissipation according to claim 1 wherein:
the radiator (4) is a centrifugal fan.
3. A HDI high density circuit board with good heat dissipation according to claim 1 wherein:
and two ends of one side surface of the connecting pipe (102) close to the radiator (4) are respectively provided with a mounting hole for the air guide pipe (201) to extend into, and one end of the air guide pipe (201) is hermetically connected with the side wall of the mounting hole.
4. A HDI high density circuit board with good heat dissipation according to claim 1 wherein:
holding box (101) in connecting pipe (102) one side position is equipped with the storage tank, radiator (4) inlay to establish and be fixed in the storage tank, the top surface of holding box (101) in the holding tank rigidity has apron (103), apron (103) border all around is equipped with a plurality of mounting holes that supply the bolt to pass through, be equipped with a plurality of bar ventilation holes (104) on apron (103), be fixed with the dust screen on ventilation hole (104) respectively, the induction port of radiator (4) with ventilation hole (104) correspond and switch on.
5. A HDI high density circuit board with good heat dissipation according to claim 1 wherein:
a first protective net is fixed right above the top surface of the HDI plate body (3), and the first protective net is erected and fixed on the top surfaces of the two air guide pipes (201);
and a second protective net is fixed under the bottom surface of the HDI plate body (3), and the second protective net is erected and fixed on the bottom surfaces of the two air guide pipes (201).
6. A HDI high density circuit board with good heat dissipation according to claim 1 wherein:
and a V-shaped guide plate is arranged in the connecting pipe (102) at the position close to the middle of the air inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920335594.XU CN210112512U (en) | 2019-03-15 | 2019-03-15 | HDI high density circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920335594.XU CN210112512U (en) | 2019-03-15 | 2019-03-15 | HDI high density circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210112512U true CN210112512U (en) | 2020-02-21 |
Family
ID=69532468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920335594.XU Expired - Fee Related CN210112512U (en) | 2019-03-15 | 2019-03-15 | HDI high density circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210112512U (en) |
-
2019
- 2019-03-15 CN CN201920335594.XU patent/CN210112512U/en not_active Expired - Fee Related
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200221 |
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| CF01 | Termination of patent right due to non-payment of annual fee |